DE602005025976D1 - Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement - Google Patents
Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelementInfo
- Publication number
- DE602005025976D1 DE602005025976D1 DE602005025976T DE602005025976T DE602005025976D1 DE 602005025976 D1 DE602005025976 D1 DE 602005025976D1 DE 602005025976 T DE602005025976 T DE 602005025976T DE 602005025976 T DE602005025976 T DE 602005025976T DE 602005025976 D1 DE602005025976 D1 DE 602005025976D1
- Authority
- DE
- Germany
- Prior art keywords
- silicon carbide
- carbide substrate
- manufacturing
- semiconductor element
- carbon layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract 6
- 229910010271 silicon carbide Inorganic materials 0.000 title abstract 6
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 3
- 229910052799 carbon Inorganic materials 0.000 abstract 3
- 230000004913 activation Effects 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
- H01L21/046—Making n or p doped regions or layers, e.g. using diffusion using ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Carbon And Carbon Compounds (AREA)
- Bipolar Transistors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004030972 | 2004-02-06 | ||
PCT/JP2005/001240 WO2005076327A1 (ja) | 2004-02-06 | 2005-01-28 | 炭化珪素半導体素子及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005025976D1 true DE602005025976D1 (de) | 2011-03-03 |
Family
ID=34836022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005025976T Active DE602005025976D1 (de) | 2004-02-06 | 2005-01-28 | Herstellungsverfahren für ein siliziumcarbidhalbleiterbauelement |
Country Status (8)
Country | Link |
---|---|
US (1) | US7462540B2 (de) |
EP (1) | EP1713117B1 (de) |
JP (1) | JP4418794B2 (de) |
KR (1) | KR20060125700A (de) |
CN (1) | CN100490077C (de) |
AT (1) | ATE496392T1 (de) |
DE (1) | DE602005025976D1 (de) |
WO (1) | WO2005076327A1 (de) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7334918B2 (en) * | 2003-05-07 | 2008-02-26 | Bayco Products, Ltd. | LED lighting array for a portable task light |
JP4418794B2 (ja) * | 2004-02-06 | 2010-02-24 | パナソニック株式会社 | 炭化珪素半導体素子の製造方法 |
US7812441B2 (en) | 2004-10-21 | 2010-10-12 | Siliconix Technology C.V. | Schottky diode with improved surge capability |
TWI278090B (en) | 2004-10-21 | 2007-04-01 | Int Rectifier Corp | Solderable top metal for SiC device |
US7834376B2 (en) * | 2005-03-04 | 2010-11-16 | Siliconix Technology C. V. | Power semiconductor switch |
US9419092B2 (en) * | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
US8368165B2 (en) * | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
JP2007115875A (ja) * | 2005-10-20 | 2007-05-10 | Sumitomo Electric Ind Ltd | 炭化珪素半導体装置およびその製造方法 |
JP4961805B2 (ja) * | 2006-04-03 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
KR101170210B1 (ko) * | 2006-05-01 | 2012-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 탄소 합금된 si 필름을 사용한 초박형 접합 형성 방법 |
WO2008016619A1 (en) * | 2006-07-31 | 2008-02-07 | Vishay-Siliconix | Molybdenum barrier metal for sic schottky diode and process of manufacture |
CN101501859B (zh) * | 2006-08-17 | 2011-05-25 | 克里公司 | 高功率绝缘栅双极晶体管 |
WO2008120469A1 (ja) * | 2007-03-29 | 2008-10-09 | Panasonic Corporation | 炭化珪素半導体素子の製造方法 |
JP5190451B2 (ja) * | 2007-04-20 | 2013-04-24 | キヤノンアネルバ株式会社 | 炭化ケイ素基板を有する半導体デバイスのアニール方法 |
JP2008283143A (ja) * | 2007-05-14 | 2008-11-20 | Ulvac Japan Ltd | 処理装置、トランジスタ製造方法 |
JP4600438B2 (ja) * | 2007-06-21 | 2010-12-15 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
US20100321363A1 (en) * | 2007-06-22 | 2010-12-23 | Panasonic Corporation | Plasma display panel driving device and plasma display |
US8039204B2 (en) * | 2007-07-25 | 2011-10-18 | Mitsubishi Electric Corporation | Manufacturing method of silicon carbide semiconductor apparatus |
US7820534B2 (en) | 2007-08-10 | 2010-10-26 | Mitsubishi Electric Corporation | Method of manufacturing silicon carbide semiconductor device |
JP2009206413A (ja) * | 2008-02-29 | 2009-09-10 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
JP2009212365A (ja) * | 2008-03-05 | 2009-09-17 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
JP4935741B2 (ja) * | 2008-04-02 | 2012-05-23 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP4480775B2 (ja) * | 2008-04-23 | 2010-06-16 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
DE102008023609A1 (de) * | 2008-05-15 | 2009-11-19 | Siced Electronics Development Gmbh & Co. Kg | Verfahren zum thermischen Ausheilen und elektrischen Aktivieren implantierter Siliziumcarbidhalbleiter |
KR101063914B1 (ko) * | 2008-08-08 | 2011-09-14 | 한국전기연구원 | 탄화규소에 내열금속카바이드를 오믹 접촉 형성시키는 방법및 이를 이용한 전력용 반도체 소자 |
JP5518326B2 (ja) * | 2008-12-26 | 2014-06-11 | 昭和電工株式会社 | 炭化珪素半導体装置の製造方法 |
JP5406279B2 (ja) * | 2009-03-26 | 2014-02-05 | キヤノンアネルバ株式会社 | 基板処理方法および結晶性炭化ケイ素(SiC)基板の製造方法 |
JP5525940B2 (ja) * | 2009-07-21 | 2014-06-18 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
US8242030B2 (en) * | 2009-09-25 | 2012-08-14 | International Business Machines Corporation | Activation of graphene buffer layers on silicon carbide by ultra low temperature oxidation |
US20120076927A1 (en) * | 2010-02-01 | 2012-03-29 | United States Government As Represented By The Secretary Of The Army | Method of improving the thermo-mechanical properties of fiber-reinforced silicon carbide matrix composites |
JP5220049B2 (ja) * | 2010-03-09 | 2013-06-26 | 三菱電機株式会社 | 炭化珪素半導体装置の製造方法 |
JP5766495B2 (ja) * | 2010-05-18 | 2015-08-19 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
JP2010239152A (ja) * | 2010-06-23 | 2010-10-21 | Mitsubishi Electric Corp | 炭化珪素半導体装置 |
JP5954856B2 (ja) | 2011-02-01 | 2016-07-20 | ルネサスエレクトロニクス株式会社 | 縦チャネル型ノーマリオフ型パワーjfetの製造方法 |
JP5799458B2 (ja) * | 2011-03-29 | 2015-10-28 | 学校法人関西学院 | 半導体素子の製造方法 |
WO2012157679A1 (ja) * | 2011-05-18 | 2012-11-22 | ローム株式会社 | 半導体装置およびその製造方法 |
JP5759293B2 (ja) * | 2011-07-20 | 2015-08-05 | 住友電気工業株式会社 | 半導体装置の製造方法 |
DE112012003260T5 (de) * | 2011-08-05 | 2014-05-15 | Sumitomo Electric Industries, Ltd. | Substrat, Halbleitervorrichtung und Verfahren zur Herstellung derselben |
JP5802492B2 (ja) * | 2011-09-09 | 2015-10-28 | 株式会社東芝 | 半導体素子及びその製造方法 |
JP5977986B2 (ja) | 2011-11-08 | 2016-08-24 | 株式会社日立ハイテクノロジーズ | 熱処理装置 |
JP5539302B2 (ja) * | 2011-12-21 | 2014-07-02 | 三菱電機株式会社 | カーボン膜除去方法 |
DE112012005837T5 (de) * | 2012-03-30 | 2014-10-30 | Hitachi, Ltd. | Verfahren zur Herstellung einer Siliziumkarbid-Halbleitervorrichtung |
JP2015065289A (ja) | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP2015065318A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
JP2015065316A (ja) * | 2013-09-25 | 2015-04-09 | 住友電気工業株式会社 | 炭化珪素半導体装置の製造方法 |
WO2015072210A1 (ja) * | 2013-11-13 | 2015-05-21 | 三菱電機株式会社 | 半導体装置の製造方法 |
WO2015146161A1 (ja) * | 2014-03-24 | 2015-10-01 | キヤノンアネルバ株式会社 | 半導体基板の熱処理方法、半導体基板の製造方法、熱処理装置、及び基板処理システム |
US10403509B2 (en) * | 2014-04-04 | 2019-09-03 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Basal plane dislocation elimination in 4H—SiC by pulsed rapid thermal annealing |
US20160045881A1 (en) * | 2014-08-15 | 2016-02-18 | Rec Silicon Inc | High-purity silicon to form silicon carbide for use in a fluidized bed reactor |
JP6472016B2 (ja) * | 2014-09-25 | 2019-02-20 | 国立研究開発法人産業技術総合研究所 | 炭化珪素半導体装置の製造方法 |
CN104766798A (zh) * | 2015-03-27 | 2015-07-08 | 西安电子科技大学 | 改善SiC/SiO2界面粗糙度的方法 |
JP2015159309A (ja) * | 2015-04-07 | 2015-09-03 | ルネサスエレクトロニクス株式会社 | パワーjfet |
CN105470119B (zh) * | 2015-11-19 | 2018-09-11 | 泰科天润半导体科技(北京)有限公司 | 一种碳化硅器件的正面欧姆接触的加工方法 |
CN105448673B (zh) * | 2016-01-04 | 2018-05-18 | 株洲南车时代电气股份有限公司 | 一种碳化硅器件背面欧姆接触的制作方法 |
CN113644119A (zh) * | 2021-07-14 | 2021-11-12 | 深圳市森国科科技股份有限公司 | 碳化硅肖特基二极管及其制造方法、装置及存储介质 |
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JPH0693441B2 (ja) * | 1989-09-22 | 1994-11-16 | 株式会社東芝 | 半導体集積回路装置の加熱処理方法 |
KR0179677B1 (ko) * | 1993-12-28 | 1999-04-15 | 사토 후미오 | 반도체장치 및 그 제조방법 |
JP3721588B2 (ja) * | 1994-10-04 | 2005-11-30 | 富士電機デバイステクノロジー株式会社 | 炭化けい素半導体素子の製造方法 |
JP3647515B2 (ja) * | 1995-08-28 | 2005-05-11 | 株式会社デンソー | p型炭化珪素半導体の製造方法 |
US6573534B1 (en) * | 1995-09-06 | 2003-06-03 | Denso Corporation | Silicon carbide semiconductor device |
JP3206727B2 (ja) * | 1997-02-20 | 2001-09-10 | 富士電機株式会社 | 炭化けい素縦型mosfetおよびその製造方法 |
JP3180895B2 (ja) * | 1997-08-18 | 2001-06-25 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
EP1019953A1 (de) * | 1997-09-30 | 2000-07-19 | Infineon Technologies AG | Verfahren zum thermischen ausheilen von durch implantation dotierten siliziumcarbid-halbleitern |
JP3216804B2 (ja) * | 1998-01-06 | 2001-10-09 | 富士電機株式会社 | 炭化けい素縦形fetの製造方法および炭化けい素縦形fet |
JP3956487B2 (ja) | 1998-06-22 | 2007-08-08 | 富士電機デバイステクノロジー株式会社 | 炭化けい素半導体素子の製造方法 |
JP3460585B2 (ja) * | 1998-07-07 | 2003-10-27 | 富士電機株式会社 | 炭化けい素mos半導体素子の製造方法 |
JP3344562B2 (ja) * | 1998-07-21 | 2002-11-11 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
JP3760688B2 (ja) | 1999-08-26 | 2006-03-29 | 富士電機ホールディングス株式会社 | 炭化けい素半導体素子の製造方法 |
JP4560179B2 (ja) | 2000-06-22 | 2010-10-13 | クボタ松下電工外装株式会社 | 窯業系基材切削部の補強方法 |
JP2002016013A (ja) * | 2000-06-27 | 2002-01-18 | Nissan Motor Co Ltd | 炭化珪素半導体装置の製造方法 |
JP2002089551A (ja) | 2000-09-18 | 2002-03-27 | Sumitomo Metal Mining Co Ltd | エンコーダ付き転がり軸受け |
JP4581240B2 (ja) * | 2000-12-12 | 2010-11-17 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
JP4595224B2 (ja) * | 2001-03-27 | 2010-12-08 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
JP4961633B2 (ja) | 2001-04-18 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
EP1306890A2 (de) | 2001-10-25 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Halbleitersubstrat und -bauelement aus SiC und Verfahren zu deren Herstellung |
DE10393777T5 (de) * | 2002-11-25 | 2005-10-20 | National Institute Of Advanced Industrial Science And Technology | Halbleitervorrichtung und elektrischer Leistungswandler, Ansteuerungsinverter, Mehrzweckinverter und Höchstleistungs-Hochfrequenz-Kommunikationsgerät unter Verwendung der Halbleitervorrichtung |
JP4015068B2 (ja) * | 2003-06-17 | 2007-11-28 | 株式会社東芝 | 半導体装置の製造方法 |
US7473929B2 (en) * | 2003-07-02 | 2009-01-06 | Panasonic Corporation | Semiconductor device and method for fabricating the same |
JP2005197464A (ja) * | 2004-01-07 | 2005-07-21 | Rohm Co Ltd | 半導体装置の製造方法 |
JP4418794B2 (ja) * | 2004-02-06 | 2010-02-24 | パナソニック株式会社 | 炭化珪素半導体素子の製造方法 |
US7195996B2 (en) * | 2005-08-09 | 2007-03-27 | New Japan Radio Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
JP4961805B2 (ja) * | 2006-04-03 | 2012-06-27 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
-
2005
- 2005-01-28 JP JP2005517659A patent/JP4418794B2/ja not_active Expired - Fee Related
- 2005-01-28 WO PCT/JP2005/001240 patent/WO2005076327A1/ja not_active Application Discontinuation
- 2005-01-28 KR KR1020067004595A patent/KR20060125700A/ko not_active Application Discontinuation
- 2005-01-28 EP EP05709466A patent/EP1713117B1/de not_active Not-in-force
- 2005-01-28 US US10/553,845 patent/US7462540B2/en not_active Expired - Fee Related
- 2005-01-28 AT AT05709466T patent/ATE496392T1/de not_active IP Right Cessation
- 2005-01-28 DE DE602005025976T patent/DE602005025976D1/de active Active
- 2005-01-28 CN CNB2005800003598A patent/CN100490077C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100490077C (zh) | 2009-05-20 |
WO2005076327A1 (ja) | 2005-08-18 |
US7462540B2 (en) | 2008-12-09 |
EP1713117B1 (de) | 2011-01-19 |
CN1788335A (zh) | 2006-06-14 |
JP4418794B2 (ja) | 2010-02-24 |
EP1713117A4 (de) | 2009-07-22 |
KR20060125700A (ko) | 2006-12-06 |
ATE496392T1 (de) | 2011-02-15 |
US20060220027A1 (en) | 2006-10-05 |
JPWO2005076327A1 (ja) | 2007-08-02 |
EP1713117A1 (de) | 2006-10-18 |
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