ATE26312T1 - Saure glanzmittel und einebnungsmittel enthaltende baeder zum elektrolytischen aufbringen von kupfer. - Google Patents

Saure glanzmittel und einebnungsmittel enthaltende baeder zum elektrolytischen aufbringen von kupfer.

Info

Publication number
ATE26312T1
ATE26312T1 AT82303273T AT82303273T ATE26312T1 AT E26312 T1 ATE26312 T1 AT E26312T1 AT 82303273 T AT82303273 T AT 82303273T AT 82303273 T AT82303273 T AT 82303273T AT E26312 T1 ATE26312 T1 AT E26312T1
Authority
AT
Austria
Prior art keywords
agents
sub
flashing
electrolytic copper
containing acidic
Prior art date
Application number
AT82303273T
Other languages
English (en)
Inventor
Angus Alexander Watson
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Application granted granted Critical
Publication of ATE26312T1 publication Critical patent/ATE26312T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Paints Or Removers (AREA)
  • Electrolytic Production Of Metals (AREA)
AT82303273T 1981-06-24 1982-06-23 Saure glanzmittel und einebnungsmittel enthaltende baeder zum elektrolytischen aufbringen von kupfer. ATE26312T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/277,057 US4376685A (en) 1981-06-24 1981-06-24 Acid copper electroplating baths containing brightening and leveling additives
EP82303273A EP0068807B1 (de) 1981-06-24 1982-06-23 Saure Glanzmittel und Einebnungsmittel enthaltende Bäder zum elektrolytischen Aufbringen von Kupfer

Publications (1)

Publication Number Publication Date
ATE26312T1 true ATE26312T1 (de) 1987-04-15

Family

ID=23059225

Family Applications (1)

Application Number Title Priority Date Filing Date
AT82303273T ATE26312T1 (de) 1981-06-24 1982-06-23 Saure glanzmittel und einebnungsmittel enthaltende baeder zum elektrolytischen aufbringen von kupfer.

Country Status (7)

Country Link
US (1) US4376685A (de)
EP (1) EP0068807B1 (de)
JP (1) JPS583991A (de)
AT (1) ATE26312T1 (de)
AU (1) AU548506B2 (de)
CA (1) CA1194832A (de)
DE (1) DE3275936D1 (de)

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DE3275936D1 (en) 1987-05-07
AU8389482A (en) 1983-01-06
CA1194832A (en) 1985-10-08
US4376685A (en) 1983-03-15
EP0068807B1 (de) 1987-04-01
JPS583991A (ja) 1983-01-10
EP0068807A2 (de) 1983-01-05
EP0068807A3 (en) 1984-07-25
JPH0340113B2 (de) 1991-06-17
AU548506B2 (en) 1985-12-12

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