CN101638790A - 镁及镁合金的电镀方法 - Google Patents
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Abstract
一种镁及镁合金的电镀方法,其包括如下步骤:提供一镁或镁合金基体,对该基体进行前处理以使其表面清洁;对清洁后的镁或镁合金基体进行粗化处理,以使基体表面粗糙;对粗化后的镁或镁合金基体进行活化处理;对活化后的镁或镁合金基体进行化学镀镍;对化学镀镍后的镁或镁合金基体依次进行第一次电镀镍、电镀铜、第二次电镀镍及电镀铬处理。
Description
技术领域
本发明是关于一种镁及镁合金的电镀方法。
背景技术
镁及镁合金由于其密度小、比强度高、比刚度大、减震性能好,以及具有良好的电磁屏蔽作用及很高的抗电磁干扰能力等优点,在国防军工、交通运输、光学仪器及电子装置壳体等领域均有广泛的应用。但同时镁及镁合金由于电极电势低,化学活性高等特点,其非常容易发生电化学腐蚀,耐腐蚀性很差。这严重阻碍了镁及镁合金的应用。为了克服上述缺陷,通常需要对镁及镁合金进行表面处理,如电镀,以在其表面生成一耐腐蚀、耐磨且具有装饰效果的镀层。
目前对镁及镁合金的电镀存在一定困难,其原因是首先镁及镁合金化学性质活泼,氧化镁会在其表面迅速形成,从而妨碍电镀时金属的沉积;其次,镁及镁合金在镀液中容易与其他金属离子发生置换反应,造成镀层与镁或镁合金表面结合不牢。
发明内容
鉴于此,本发明提供一种镁及镁合金的电镀方法,该方法可在镁或镁合金表面形成耐腐蚀性强、耐摩擦性能好且与镁或镁合金结合力强的电镀层。
一种镁及镁合金的电镀方法,其包括如下步骤:
提供一镁或镁合金基体,对该基体进行前处理以使其表面清洁;
对清洁后的镁或镁合金基体进行粗化处理,以使基体表面粗糙;
对粗化后的镁或镁合金基体进行活化处理;
对活化后的镁或镁合金基体进行化学镀镍;
对化学镀镍后的镁或镁合金基体依次进行第一次电镀镍、电镀铜、第二次电镀镍及电镀铬处理。
本发明对镁及镁合金基体的电镀通过对该基体进行表面粗化处理,以加强镀层与基体的结合力,并通过在基体上进行化学镀镍及两次电镀耐腐蚀的镍金属,大大提升了镁或镁合金基体的耐腐蚀性能力,拓展了镁及镁合金的应用。
具体实施方式
本发明较佳实施方式镁及镁合金的电镀方法包括如下步骤:
提供一镁或镁合金基体。该基体可为手机、数码相机、个人数字助理、笔记本电脑等便携式电子装置的壳体,亦可为其他容器类装置的壳体。
对该镁或镁合金基体进行前处理以使基体表面清洁。该前处理包括先对基体表面进行除油处理,具体方法为:先将基体于含除油粉的溶液中浸置5~15min。该除油粉为常用的对镁或镁合金进行除油清洁的材料,可于市场上购买。该除油粉在溶液中的浓度优选为150~200g/L,除油的溶液温度在75~90℃之间。然后,将所述基体浸渍于含氢氧化钠的溶液中进行除蜡处理。所述氢氧化钠的浓度在100~200g/L之间,该溶液中还可添加除蜡水(可于市场上购买),该除蜡水的浓度优选为40~80g/L。所述除蜡的温度为75~90℃,处理时间4~10分钟。除蜡处理可进一步除去基体表面的污渍。除蜡处理后对所述基体进行水洗。
对所述清洁后的镁或镁合金基体进行粗化处理。将所述基体置于含粗化剂及碳酸钠的溶液中,使基体表面的镁或镁合金发生化学反应,以使基体的表面粗糙化。所述粗化剂可为焦磷酸盐,该焦磷酸盐在溶液中的浓度优选为350~450g/L。碳酸钠在溶液中的浓度优选为50~100g/L。所述粗化的温度为55~65℃,粗化时间10~30分钟。粗化处理后镁或镁合金基体表面变得粗糙,使得后续生成的镀层在基体表面具有更好的附着力。
对粗化后的镁或镁合金基体进行活化处理。将所述基体置于含150~300ml/L氢氟酸的溶液中浸渍约1~5分钟,溶液的温度在30~40℃之间。所述溶液中还可添加一定的活化添加剂。活化后在所述镁或镁合金基体表面上生成一氟化镁膜。
对活化后的镁或镁合金基体进行化学镀镍处理。该化学镀镍用溶液中含有10~30g/L的次亚磷酸钠及20~50g/L的碱式碳酸镍。将所述基体置于该溶液中浸渍约20~60分钟,并使溶液的温度保持在70~90℃。化学镀镍过程中所述溶液首先将基体表面上的氟化镁膜溶解掉,然后溶液中的镍离子被还原成镍沉积在基体表面上,形成一金属镍层。
对化学镀镍后的基体进行电镀处理。为了加强所述基体的耐腐蚀能力及使镀层具有较好的装饰效果,本发明较佳实施方式对镁或镁合金基体进行了多次电镀,该多次电镀包括对所述基体进行第一次电镀镍以在基体上形成一第一镍层、电镀铜以在第一镍层上形成一金属铜层、第二次电镀镍以在所述铜层上形成一第二镍层以及电镀铬以在第二镍层上形成一金属铬层。
所述第一次电镀镍所用电镀液中含有240~300g/L的硫酸镍,30~50g/L的氯化镍及30~50g/L的硼酸。所述电镀的温度在50~55℃之间,电镀的电流密度为1~4A/dm2,电镀时间4~10分钟。第一次电镀镍后在基体表面形成的第一镍层可加强镁或镁合金基体的耐腐蚀性能力。
所述电镀铜所用电镀液中含有180~220g/L的硫酸铜及40~80g/L的硫酸。所述电镀的温度在20~25℃之间,电镀的电流密度为1~3A/dm2,电镀时间5~30分钟。该电镀铜后在第一镍层表面沉积一金属铜层,该铜层与第一镍层之间具有较强的结合力。
第二次电镀镍所用电镀液及电镀条件同第一次电镀镍。该第二次电镀镍后在所述铜层表面沉积一第二镍层,该第二镍层可加强镁或镁合金基体的耐腐蚀性能力。第二镍层与铜层之间具有较强的结合力。
所述电镀铬所用电镀液中含有240~300g/L的硫酸铬及70~90g/L的硼酸。所述电镀的温度在30~50℃之间,电镀的电流密度为5~15A/dm2,电镀时间1~15分钟。该电镀铬后形成的金属铬层与第二镍层之间具有较强的结合力,且铬层的表面摩擦系数低,抗磨损性能优良并具有良好的光泽度。
所述每一电镀过程结束后均需要对基体进行水洗处理,以除去基体上残留的电解液。
对电镀后的镁或镁合金基体进行中和处理。将电镀后的基体于含20~50ml/L的硫酸及50~100ml/L的双氧水的溶液中浸渍1~3分钟,以中和除去基体上残留的铬化合物。该中和处理的温度可在20~30℃之间。中和处理后对该基体进行水洗处理。
本发明对镁及镁合金基体的电镀通过对该基体进行表面粗化处理,加强了镀层与基体的结合力,并通过在基体上进行化学镀镍及两次电镀耐腐蚀的镍层,大大提升了镁及镁合金基体的耐腐蚀性能力,拓展了镁及镁合金的应用。同时本发明所使用的各电解液中化学成分少,电解液性能易于控制,使得电镀工艺稳定,可操作性强。
Claims (10)
1.一种镁及镁合金的电镀方法,其包括如下步骤:
提供一镁或镁合金基体,对该基体进行前处理以使其表面清洁;
对清洁后的镁或镁合金基体进行粗化处理,以使基体表面粗糙;
对粗化后的镁或镁合金基体进行活化处理;
对活化后的镁或镁合金基体进行化学镀镍;
对化学镀镍后的镁或镁合金基体依次进行第一次电镀镍、电镀铜、第二次电镀镍及电镀铬处理。
2.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述粗化处理用溶液中含粗化剂及碳酸钠,该粗化剂为焦磷酸盐,其在溶液中的浓度为350~450g/L,碳酸钠在溶液中的浓度为50~100g/L,粗化的温度为55~65℃,粗化时间10~30分钟。
3.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述活化处理用溶液中含150~300ml/L氢氟酸,该溶液的温度在30~40℃之间,活化时间1~5分钟。
4.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述化学镀镍用溶液中含有10~30g/L的次亚磷酸钠及20~50g/L的碱式碳酸镍,溶液温度为70~90℃,化学镀镍时间20~60分钟。
5.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述第一次电镀镍所用电镀液中含有240~300g/L的硫酸镍、30~50g/L的氯化镍及30~50g/L的硼酸;所述电镀的温度在50~55℃之间,电镀的电流密度为1~4A/dm2,电镀时间4~10分钟。
6.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述电镀铜用电镀液中含有180~220g/L的硫酸铜及40~80g/L的硫酸;所述电镀的温度在20~25℃之间,电镀的电流密度为1~3A/dm2,电镀时间5~30分钟。
7.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述第二次电镀镍所用电镀液中含有240~300g/L的硫酸镍、30~50g/L的氯化镍及30~50g/L的硼酸;所述电镀的温度在50~55℃之间,电镀的电流密度为1~4A/dm2,电镀时间4~10分钟。
8.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述电镀铬所用电镀液中含有240~300g/L的硫酸铬及70~90g/L的硼酸;该电镀的温度在30~50℃之间,电镀的电流密度为5~15A/dm2,电镀时间1~15分钟。
9.如权利要求8所述的镁及镁合金的电镀方法,其特征在于:对电镀铬后的镁或镁合金基体进行中和处理,该中和处理用溶液中含20~50ml/L的硫酸及50~100ml/L的双氧水,中和时间1~3分钟,中和处理的温度在20~30℃之间。
10.如权利要求1所述的镁及镁合金的电镀方法,其特征在于:所述前处理包括对基体进行除油、除蜡及水洗步骤。
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US12/498,455 US20100025255A1 (en) | 2008-07-30 | 2009-07-07 | Electroplating method for magnesium and magnesium alloy |
EP09166146A EP2149621A1 (en) | 2008-07-30 | 2009-07-22 | Electroplating Method For Magnesium And Magnesium Alloy |
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US (1) | US20100025255A1 (zh) |
EP (1) | EP2149621A1 (zh) |
CN (1) | CN101638790A (zh) |
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US20100025255A1 (en) | 2010-02-04 |
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