ES8601337A1 - Un procedimiento para electrodepositar una chapa de cobre de ingenieria altamente nivelada, ductil, brillante, de dureza sustancialmente uniforme y no recogible, sobre un substrato conductor - Google Patents

Un procedimiento para electrodepositar una chapa de cobre de ingenieria altamente nivelada, ductil, brillante, de dureza sustancialmente uniforme y no recogible, sobre un substrato conductor

Info

Publication number
ES8601337A1
ES8601337A1 ES533253A ES533253A ES8601337A1 ES 8601337 A1 ES8601337 A1 ES 8601337A1 ES 533253 A ES533253 A ES 533253A ES 533253 A ES533253 A ES 533253A ES 8601337 A1 ES8601337 A1 ES 8601337A1
Authority
ES
Spain
Prior art keywords
copper
organic
bath
compounds
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES533253A
Other languages
English (en)
Other versions
ES533253A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of ES8601337A1 publication Critical patent/ES8601337A1/es
Publication of ES533253A0 publication Critical patent/ES533253A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROCEDIMIENTO PARA LA ELECTRODEPOSICION DE UN DEPOSITO DE COBRE ALTAMENTE NIVELADO DUCTIL Y BRILLANTE DE DUREZA SUSTANCIALMENTE UNIFORME Y NO RECOCIBLE SOBRE UN SUSTRATO CONDUCTOR. CONSISTE EN SUMERGIR EL SUSTRATO CONDUCTOR EN UN ELECTROLITO ACUOSO ACIDO DE COBRE QUE CONTENGA UNA COMBINACION CONTROLADA DE AGENTES ABRILLANTADORES ORGANICOS SOLUBLES Y COMPARTIBLES EN EL BAÑO LA CUAL ESTA CONSTITUIDA POR UN COMPUESTO DE POLIETER ORGANICO Y MEZCLAS DE LOS MISMOS POR UN COMPUESTO DE SULFURO ORGANICO Y MEZCLAS DE LOS MISMOS Y POR UN COMPUESTO SELECCIONADO ENTRE UN COMPUESTO DE FORMULA ESTRUCTURAL (I) EN LA QUE R1 Y R2 SIGNIFICAN HIDROGENO METILO O ETILO; X ES UN ANION DE CLORURO BROMURO O YODURO; Y ES H O -NH2; Y Z ES UN RADICAL AROMATICO DE TIPO FENILO O ALQUILAMINO Y UN COMPUESTO DE FTALOCIANINA SUSTITUIDA DE FORMULA GENERAL (II).
ES533253A 1983-06-10 1984-06-08 Un procedimiento para electrodepositar una chapa de cobre de ingenieria altamente nivelada, ductil, brillante, de dureza sustancialmente uniforme y no recogible, sobre un substrato conductor Granted ES533253A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10

Publications (2)

Publication Number Publication Date
ES8601337A1 true ES8601337A1 (es) 1985-10-16
ES533253A0 ES533253A0 (es) 1985-10-16

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533253A Granted ES533253A0 (es) 1983-06-10 1984-06-08 Un procedimiento para electrodepositar una chapa de cobre de ingenieria altamente nivelada, ductil, brillante, de dureza sustancialmente uniforme y no recogible, sobre un substrato conductor

Country Status (10)

Country Link
JP (1) JPS609891A (es)
AU (1) AU559896B2 (es)
BR (1) BR8402812A (es)
CA (1) CA1255622A (es)
DE (1) DE3421017A1 (es)
ES (1) ES533253A0 (es)
FR (1) FR2547836A1 (es)
GB (1) GB2141141B (es)
IT (1) IT1177790B (es)
NL (1) NL8401842A (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
DE502006009414D1 (de) * 2006-01-06 2011-06-09 Enthone Elektrolyt und verfahren zur abscheidung einer matten metallschicht
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (es) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
AU559896B2 (en) 1987-03-26
CA1255622A (en) 1989-06-13
GB2141141B (en) 1987-01-07
GB8414863D0 (en) 1984-07-18
IT8448356A0 (it) 1984-06-08
DE3421017A1 (de) 1984-12-13
IT1177790B (it) 1987-08-26
GB2141141A (en) 1984-12-12
BR8402812A (pt) 1985-05-21
AU2903484A (en) 1984-12-13
JPS609891A (ja) 1985-01-18
FR2547836A1 (fr) 1984-12-28
DE3421017C2 (es) 1987-08-27
ES533253A0 (es) 1985-10-16
JPS6112037B2 (es) 1986-04-05
NL8401842A (nl) 1985-01-02

Similar Documents

Publication Publication Date Title
AU548506B2 (en) Acid copper plating bath
FR2667478B1 (fr) Machine-outil, notamment pour l'usinage de plaques de circuits imprimes.
PT73982B (en) Process for preparing 3-aryloxy-3-phenylpropylamines
IL103895A (en) Displacement metal aqueous plating solution comprising imidazole- 2-thione complexing agent and its use
NO970495L (no) Aryltioforbindelser som anti-bakterielle og antivirale midler
GB1354840A (en) Electro deposition of copper from acidic baths
DE69110208D1 (de) Kupferplattieren von Tiefdruckzylindern.
AR241531A1 (es) Un procedimiento para la preparacion derivados de 2-indolinona, y sus sales farmaceuticamente aceptables.
US4334966A (en) Method of copper plating gravure cylinders
ES8601337A1 (es) Un procedimiento para electrodepositar una chapa de cobre de ingenieria altamente nivelada, ductil, brillante, de dureza sustancialmente uniforme y no recogible, sobre un substrato conductor
SE7907531L (sv) Stromlos kopparbeleggning
AU583543B2 (en) New adamantanamine derivatives, processes for their preparation and drugs in which they are present
GB1000669A (en) Baths for the production of electrolytic metal coatings
JPS5743995A (en) Silver plating liquid and silver plating method
GR79611B (es)
JPS5418875A (en) Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate
JPS57140891A (en) Pretreating solution for silver plating
ES8707539A1 (es) Un procedimiento para preparar derivados de penem
ES456691A1 (es) Un procedimiento de galvanizacion.
GB1097848A (en) Electroless copper deposition
ES8302093A1 (es) Un procedimiento para obtener nuevos compuestos de beta-lac-tama
EP0499638A4 (en) Electroplating bath using organic solvent for plating permanent magnet of r 2?t 14?b intermetallic compound.
ES8500909A1 (es) Procedimiento para preparar derivados de bencimidazol
EP0429751A3 (en) Substituted 3-amino-sydnonimines, process for their preparation and their use
JPS57152458A (en) Lectroless copper plating bath