JPS57152458A - Lectroless copper plating bath - Google Patents
Lectroless copper plating bathInfo
- Publication number
- JPS57152458A JPS57152458A JP3711381A JP3711381A JPS57152458A JP S57152458 A JPS57152458 A JP S57152458A JP 3711381 A JP3711381 A JP 3711381A JP 3711381 A JP3711381 A JP 3711381A JP S57152458 A JPS57152458 A JP S57152458A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- group
- compound
- copper plating
- stabilizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To obtain an electroless copper plating bath having stability over a long time by adding ≥1 kind of compound selected from compounds each having an -SO group or an -SO2 group and heterocyclic sulfonyl compounds as a plating bath stabilizer.
CONSTITUTION: To an electroless copper plating bath contg. soluble copper salt, a copper complexing agent and a copper ion reducing agent is added ≥1 kind of said compound as a plating bath stabilizer. Dimethylsulfoxide and dimethylsulfone are used as a compound having an -SO group and a compound having an -SO2 group, respectively. The heterocyclic sulfonyl compounds include 2,4-dimethylsulfolane. The stabilizer is used generally by about 0.01W50g/l and preferably by about 0.05W10g/l.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711381A JPS5817255B2 (en) | 1981-03-13 | 1981-03-13 | Electroless copper plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3711381A JPS5817255B2 (en) | 1981-03-13 | 1981-03-13 | Electroless copper plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57152458A true JPS57152458A (en) | 1982-09-20 |
JPS5817255B2 JPS5817255B2 (en) | 1983-04-06 |
Family
ID=12488538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3711381A Expired JPS5817255B2 (en) | 1981-03-13 | 1981-03-13 | Electroless copper plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5817255B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4979479A (en) * | 1988-06-23 | 1990-12-25 | Aisan Kogyo Kabushiki Kaisha | Fuel injector and mounting structure thereof |
-
1981
- 1981-03-13 JP JP3711381A patent/JPS5817255B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4979479A (en) * | 1988-06-23 | 1990-12-25 | Aisan Kogyo Kabushiki Kaisha | Fuel injector and mounting structure thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS5817255B2 (en) | 1983-04-06 |
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