JPS57152458A - Lectroless copper plating bath - Google Patents

Lectroless copper plating bath

Info

Publication number
JPS57152458A
JPS57152458A JP3711381A JP3711381A JPS57152458A JP S57152458 A JPS57152458 A JP S57152458A JP 3711381 A JP3711381 A JP 3711381A JP 3711381 A JP3711381 A JP 3711381A JP S57152458 A JPS57152458 A JP S57152458A
Authority
JP
Japan
Prior art keywords
plating bath
group
compound
copper plating
stabilizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3711381A
Other languages
Japanese (ja)
Other versions
JPS5817255B2 (en
Inventor
Yasunori Zairi
Toshiyuki Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Original Assignee
OKUNO SEIYAKU KOGYO KK
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OKUNO SEIYAKU KOGYO KK, Okuno Chemical Industries Co Ltd filed Critical OKUNO SEIYAKU KOGYO KK
Priority to JP3711381A priority Critical patent/JPS5817255B2/en
Publication of JPS57152458A publication Critical patent/JPS57152458A/en
Publication of JPS5817255B2 publication Critical patent/JPS5817255B2/en
Expired legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To obtain an electroless copper plating bath having stability over a long time by adding ≥1 kind of compound selected from compounds each having an -SO group or an -SO2 group and heterocyclic sulfonyl compounds as a plating bath stabilizer.
CONSTITUTION: To an electroless copper plating bath contg. soluble copper salt, a copper complexing agent and a copper ion reducing agent is added ≥1 kind of said compound as a plating bath stabilizer. Dimethylsulfoxide and dimethylsulfone are used as a compound having an -SO group and a compound having an -SO2 group, respectively. The heterocyclic sulfonyl compounds include 2,4-dimethylsulfolane. The stabilizer is used generally by about 0.01W50g/l and preferably by about 0.05W10g/l.
COPYRIGHT: (C)1982,JPO&Japio
JP3711381A 1981-03-13 1981-03-13 Electroless copper plating bath Expired JPS5817255B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3711381A JPS5817255B2 (en) 1981-03-13 1981-03-13 Electroless copper plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3711381A JPS5817255B2 (en) 1981-03-13 1981-03-13 Electroless copper plating bath

Publications (2)

Publication Number Publication Date
JPS57152458A true JPS57152458A (en) 1982-09-20
JPS5817255B2 JPS5817255B2 (en) 1983-04-06

Family

ID=12488538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3711381A Expired JPS5817255B2 (en) 1981-03-13 1981-03-13 Electroless copper plating bath

Country Status (1)

Country Link
JP (1) JPS5817255B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979479A (en) * 1988-06-23 1990-12-25 Aisan Kogyo Kabushiki Kaisha Fuel injector and mounting structure thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979479A (en) * 1988-06-23 1990-12-25 Aisan Kogyo Kabushiki Kaisha Fuel injector and mounting structure thereof

Also Published As

Publication number Publication date
JPS5817255B2 (en) 1983-04-06

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