JPS527819A - Process for smooth electrodeposition of copper - Google Patents
Process for smooth electrodeposition of copperInfo
- Publication number
- JPS527819A JPS527819A JP50084813A JP8481375A JPS527819A JP S527819 A JPS527819 A JP S527819A JP 50084813 A JP50084813 A JP 50084813A JP 8481375 A JP8481375 A JP 8481375A JP S527819 A JPS527819 A JP S527819A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- smooth electrodeposition
- electrodeposition
- smooth
- electrolyte containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
PURPOSE: Process for smooth electrodeposition of copper by use of electrolyte containing stable efficient additives.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50084813A JPS527819A (en) | 1975-07-10 | 1975-07-10 | Process for smooth electrodeposition of copper |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50084813A JPS527819A (en) | 1975-07-10 | 1975-07-10 | Process for smooth electrodeposition of copper |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS527819A true JPS527819A (en) | 1977-01-21 |
Family
ID=13841159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50084813A Pending JPS527819A (en) | 1975-07-10 | 1975-07-10 | Process for smooth electrodeposition of copper |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS527819A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2389689A1 (en) * | 1977-05-04 | 1978-12-01 | Oxy Metal Industries Corp | |
JP2007131909A (en) * | 2005-11-10 | 2007-05-31 | Mitsui Mining & Smelting Co Ltd | Copper electrolytic solution used for producing electrolytic copper foil, and electrolytic copper foil obtained by using the copper electrolytic solution |
JP2007517140A (en) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | Copper electrodeposition in microelectronics. |
WO2009151124A1 (en) * | 2008-06-12 | 2009-12-17 | 古河電気工業株式会社 | Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings |
WO2010004988A1 (en) * | 2008-07-07 | 2010-01-14 | 古河電気工業株式会社 | Electrolytic copper foil and copper-clad laminate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123439A (en) * | 1974-08-22 | 1976-02-25 | Nippon Steel Corp | Kotakumetsukiitano seizohoho |
JPS51104442A (en) * | 1975-03-11 | 1976-09-16 | Oxy Metal Industries Corp | Denchakuyososeibutsuoyobihoho |
-
1975
- 1975-07-10 JP JP50084813A patent/JPS527819A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123439A (en) * | 1974-08-22 | 1976-02-25 | Nippon Steel Corp | Kotakumetsukiitano seizohoho |
JPS51104442A (en) * | 1975-03-11 | 1976-09-16 | Oxy Metal Industries Corp | Denchakuyososeibutsuoyobihoho |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2389689A1 (en) * | 1977-05-04 | 1978-12-01 | Oxy Metal Industries Corp | |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US8608933B2 (en) | 2002-03-05 | 2013-12-17 | Enthone Inc. | Copper electrodeposition in microelectronics |
US9493884B2 (en) | 2002-03-05 | 2016-11-15 | Enthone Inc. | Copper electrodeposition in microelectronics |
JP2007517140A (en) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | Copper electrodeposition in microelectronics. |
JP2007131909A (en) * | 2005-11-10 | 2007-05-31 | Mitsui Mining & Smelting Co Ltd | Copper electrolytic solution used for producing electrolytic copper foil, and electrolytic copper foil obtained by using the copper electrolytic solution |
WO2009151124A1 (en) * | 2008-06-12 | 2009-12-17 | 古河電気工業株式会社 | Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings |
JP2010018885A (en) * | 2008-06-12 | 2010-01-28 | Furukawa Electric Co Ltd:The | Electrolytic copper coating film, method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coating film |
KR101274544B1 (en) * | 2008-06-12 | 2013-06-17 | 이시하라 야쿠힌 가부시끼가이샤 | Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings |
WO2010004988A1 (en) * | 2008-07-07 | 2010-01-14 | 古河電気工業株式会社 | Electrolytic copper foil and copper-clad laminate |
JP2010037654A (en) * | 2008-07-07 | 2010-02-18 | Furukawa Electric Co Ltd:The | Electrolytic copper foil and copper clad laminate |
KR101295138B1 (en) * | 2008-07-07 | 2013-08-09 | 후루카와 덴끼고교 가부시키가이샤 | Electrolytic copper foil and copper-clad laminate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS525204A (en) | Hearing aid | |
JPS5235395A (en) | Polishing device of cathode for metal electrolytic refining | |
JPS51126894A (en) | Voltammetry apparatus | |
JPS527819A (en) | Process for smooth electrodeposition of copper | |
JPS52250A (en) | Process for preparation of 8-exo-hydroxy-endo-tricyclo-(5,2,2,02,6) ) unde cane | |
JPS51143633A (en) | Process for preparation of novel epoxy compounds | |
JPS51125356A (en) | Process for preparing 4-hydroxycyclopent -2-ene-1-one | |
JPS522986A (en) | Semi submerged boat | |
JPS51141855A (en) | Process for preparing exo-hydroxy-endo-tricyclo-(5,2,2,02,6)undecane | |
JPS525684A (en) | Indicator | |
JPS5223086A (en) | Novel method of preparing 2,3- dioxopiperazine | |
JPS5249249A (en) | Method for electro-plating with aluminium | |
JPS51126892A (en) | Sludge densitometer | |
JPS523007A (en) | Process for preparation of 1,1,1-trihalo-methyl-3-pentene | |
JPS5346968A (en) | Novel hexadecapeptides | |
JPS51139688A (en) | Process for preparing new alkaloid tm-64 substance by fermentation | |
JPS5224537A (en) | Slide preparing device | |
JPS5257156A (en) | Process for preparing 5,6_trans-24-hydroxycholecalciferol | |
JPS51115439A (en) | Method for preparing 3-hydroxyphenetylamine-2-carboxylic acid | |
JPS5241385A (en) | Fish-hold cooling apparatus for small fishing vessels | |
JPS5257155A (en) | Process for preparing cyclic compounds | |
JPS53523A (en) | Equalizer | |
JPS51127060A (en) | Process for preparing 4-homoisotwistane- exo-2-ol | |
JPS51114314A (en) | Reclamation of worn conduction terminal for aluminium electrolytic cel l | |
JPS525734A (en) | Process for preparation of 5**aminoo3**5* dideoxyribostamycin |