JPS527819A - Process for smooth electrodeposition of copper - Google Patents

Process for smooth electrodeposition of copper

Info

Publication number
JPS527819A
JPS527819A JP50084813A JP8481375A JPS527819A JP S527819 A JPS527819 A JP S527819A JP 50084813 A JP50084813 A JP 50084813A JP 8481375 A JP8481375 A JP 8481375A JP S527819 A JPS527819 A JP S527819A
Authority
JP
Japan
Prior art keywords
copper
smooth electrodeposition
electrodeposition
smooth
electrolyte containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50084813A
Other languages
Japanese (ja)
Inventor
Kazuya Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP50084813A priority Critical patent/JPS527819A/en
Publication of JPS527819A publication Critical patent/JPS527819A/en
Pending legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

PURPOSE: Process for smooth electrodeposition of copper by use of electrolyte containing stable efficient additives.
COPYRIGHT: (C)1977,JPO&Japio
JP50084813A 1975-07-10 1975-07-10 Process for smooth electrodeposition of copper Pending JPS527819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50084813A JPS527819A (en) 1975-07-10 1975-07-10 Process for smooth electrodeposition of copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50084813A JPS527819A (en) 1975-07-10 1975-07-10 Process for smooth electrodeposition of copper

Publications (1)

Publication Number Publication Date
JPS527819A true JPS527819A (en) 1977-01-21

Family

ID=13841159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50084813A Pending JPS527819A (en) 1975-07-10 1975-07-10 Process for smooth electrodeposition of copper

Country Status (1)

Country Link
JP (1) JPS527819A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2389689A1 (en) * 1977-05-04 1978-12-01 Oxy Metal Industries Corp
JP2007131909A (en) * 2005-11-10 2007-05-31 Mitsui Mining & Smelting Co Ltd Copper electrolytic solution used for producing electrolytic copper foil, and electrolytic copper foil obtained by using the copper electrolytic solution
JP2007517140A (en) * 2003-12-22 2007-06-28 エントン インコーポレイテッド Copper electrodeposition in microelectronics.
WO2009151124A1 (en) * 2008-06-12 2009-12-17 古河電気工業株式会社 Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings
WO2010004988A1 (en) * 2008-07-07 2010-01-14 古河電気工業株式会社 Electrolytic copper foil and copper-clad laminate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123439A (en) * 1974-08-22 1976-02-25 Nippon Steel Corp Kotakumetsukiitano seizohoho
JPS51104442A (en) * 1975-03-11 1976-09-16 Oxy Metal Industries Corp Denchakuyososeibutsuoyobihoho

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123439A (en) * 1974-08-22 1976-02-25 Nippon Steel Corp Kotakumetsukiitano seizohoho
JPS51104442A (en) * 1975-03-11 1976-09-16 Oxy Metal Industries Corp Denchakuyososeibutsuoyobihoho

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2389689A1 (en) * 1977-05-04 1978-12-01 Oxy Metal Industries Corp
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
US8608933B2 (en) 2002-03-05 2013-12-17 Enthone Inc. Copper electrodeposition in microelectronics
US9493884B2 (en) 2002-03-05 2016-11-15 Enthone Inc. Copper electrodeposition in microelectronics
JP2007517140A (en) * 2003-12-22 2007-06-28 エントン インコーポレイテッド Copper electrodeposition in microelectronics.
JP2007131909A (en) * 2005-11-10 2007-05-31 Mitsui Mining & Smelting Co Ltd Copper electrolytic solution used for producing electrolytic copper foil, and electrolytic copper foil obtained by using the copper electrolytic solution
WO2009151124A1 (en) * 2008-06-12 2009-12-17 古河電気工業株式会社 Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings
JP2010018885A (en) * 2008-06-12 2010-01-28 Furukawa Electric Co Ltd:The Electrolytic copper coating film, method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coating film
KR101274544B1 (en) * 2008-06-12 2013-06-17 이시하라 야쿠힌 가부시끼가이샤 Electrolytic copper coating and method of manufacture therefor, and copper electrolyte for manufacturing electrolytic copper coatings
WO2010004988A1 (en) * 2008-07-07 2010-01-14 古河電気工業株式会社 Electrolytic copper foil and copper-clad laminate
JP2010037654A (en) * 2008-07-07 2010-02-18 Furukawa Electric Co Ltd:The Electrolytic copper foil and copper clad laminate
KR101295138B1 (en) * 2008-07-07 2013-08-09 후루카와 덴끼고교 가부시키가이샤 Electrolytic copper foil and copper-clad laminate

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