FR2389689A1 - - Google Patents

Info

Publication number
FR2389689A1
FR2389689A1 FR7811498A FR7811498A FR2389689A1 FR 2389689 A1 FR2389689 A1 FR 2389689A1 FR 7811498 A FR7811498 A FR 7811498A FR 7811498 A FR7811498 A FR 7811498A FR 2389689 A1 FR2389689 A1 FR 2389689A1
Authority
FR
France
Prior art keywords
copper
baths
polyalkanolamine
providing
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7811498A
Other languages
French (fr)
Other versions
FR2389689B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2389689A1 publication Critical patent/FR2389689A1/fr
Application granted granted Critical
Publication of FR2389689B1 publication Critical patent/FR2389689B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Abstract

Procédé et bains pour le dépôt électrolytique de cuivre. On dépose du cuivre par voie électrolytique à partir de bains acides aqueux de revêtement de cuivre, dans lesquels on dissout environ 0,04 à environ 1 000 milligrammes par litre d'un poly (sel d'alcanolammonium quaternaire), formé en tant que produit réactionnel d'une polyalcanolamine avec un agent d'alkylation ou de transformation en dérivé quaternaire; le constituant de polyalcanolamine, typiquement, est formé en tant que produit réactionnel d'une polyalkylèneimine (par exemple la polyéthylèneimine) avec un oxyde d'alkylène. La présente invention est particulièrement utile pour fournir des bains pour le dépôt électrolytique de cuivre, en fournissant des revêtements ductiles, brillants et bien uniformisés.Process and baths for the electrolytic deposition of copper. Copper is electrolytically deposited from aqueous acidic copper coating baths in which about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as a product are dissolved. reacting a polyalkanolamine with an alkylating or quaternary derivative agent; the polyalkanolamine component, typically, is formed as a reaction product of a polyalkyleneimine (eg, polyethyleneimine) with an alkylene oxide. The present invention is particularly useful for providing baths for the electroplating of copper, providing ductile, shiny and well-uniformed coatings.

FR7811498A 1977-05-04 1978-04-19 Expired FR2389689B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (2)

Publication Number Publication Date
FR2389689A1 true FR2389689A1 (en) 1978-12-01
FR2389689B1 FR2389689B1 (en) 1983-04-22

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7811498A Expired FR2389689B1 (en) 1977-05-04 1978-04-19

Country Status (7)

Country Link
JP (1) JPS5448646A (en)
AR (1) AR224861A1 (en)
CA (1) CA1105045A (en)
DE (1) DE2818725A1 (en)
FR (1) FR2389689B1 (en)
GB (1) GB1597519A (en)
NL (1) NL7804874A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547836A1 (en) * 1983-06-10 1984-12-28 Omi Int Corp PROCESS FOR THE ELECTROLYTIC DEPOSITION OF COPPER USING AN ELECTROLYTE CONTAINING IN PARTICULAR A SUBSTITUTED PHTALOCYANINE COMPOUND AND A REACTIONAL POLYETHYLENEIMINE ALKYL PRODUCT

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0111965B1 (en) * 1982-12-23 1989-07-26 THE PROCTER & GAMBLE COMPANY Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
TWI500823B (en) * 2010-03-18 2015-09-21 Basf Se Composition for metal electroplating comprising leveling agent
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (en) * 2014-09-15 2020-11-21 美商麥德美樂思公司 Levelers for copper deposition in microelectronics
KR102339867B1 (en) * 2021-07-30 2021-12-16 와이엠티 주식회사 Leveler and electroplating composition for filling via hole

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
FR2079372A1 (en) * 1970-02-12 1971-11-12 Udylite Corp
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
FR2303871A1 (en) * 1975-03-11 1976-10-08 Oxy Metal Industries Corp PROCESS FOR OBTAINING BRIGHT AND WELL-EQUALIZED ELECTROLYTIC COPPER DEPOSITS, AND BATHS USED FOR THIS PURPOSE
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
FR2079372A1 (en) * 1970-02-12 1971-11-12 Udylite Corp
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
FR2303871A1 (en) * 1975-03-11 1976-10-08 Oxy Metal Industries Corp PROCESS FOR OBTAINING BRIGHT AND WELL-EQUALIZED ELECTROLYTIC COPPER DEPOSITS, AND BATHS USED FOR THIS PURPOSE
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2547836A1 (en) * 1983-06-10 1984-12-28 Omi Int Corp PROCESS FOR THE ELECTROLYTIC DEPOSITION OF COPPER USING AN ELECTROLYTE CONTAINING IN PARTICULAR A SUBSTITUTED PHTALOCYANINE COMPOUND AND A REACTIONAL POLYETHYLENEIMINE ALKYL PRODUCT

Also Published As

Publication number Publication date
DE2818725A1 (en) 1978-11-16
AR224861A1 (en) 1982-01-29
JPS5448646A (en) 1979-04-17
GB1597519A (en) 1981-09-09
CA1105045A (en) 1981-07-14
FR2389689B1 (en) 1983-04-22
NL7804874A (en) 1978-11-07

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse