NL7804874A - ELECTROLYTIC DEPOSITION OF COPPER. - Google Patents

ELECTROLYTIC DEPOSITION OF COPPER.

Info

Publication number
NL7804874A
NL7804874A NL7804874A NL7804874A NL7804874A NL 7804874 A NL7804874 A NL 7804874A NL 7804874 A NL7804874 A NL 7804874A NL 7804874 A NL7804874 A NL 7804874A NL 7804874 A NL7804874 A NL 7804874A
Authority
NL
Netherlands
Prior art keywords
copper
electrolytic deposition
electrolytic
deposition
Prior art date
Application number
NL7804874A
Other languages
Dutch (nl)
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of NL7804874A publication Critical patent/NL7804874A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
NL7804874A 1977-05-04 1978-05-05 ELECTROLYTIC DEPOSITION OF COPPER. NL7804874A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
NL7804874A true NL7804874A (en) 1978-11-07

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7804874A NL7804874A (en) 1977-05-04 1978-05-05 ELECTROLYTIC DEPOSITION OF COPPER.

Country Status (7)

Country Link
JP (1) JPS5448646A (en)
AR (1) AR224861A1 (en)
CA (1) CA1105045A (en)
DE (1) DE2818725A1 (en)
FR (1) FR2389689B1 (en)
GB (1) GB1597519A (en)
NL (1) NL7804874A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0111965B1 (en) * 1982-12-23 1989-07-26 THE PROCTER & GAMBLE COMPANY Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
MY156690A (en) * 2010-03-18 2016-03-15 Basf Se Composition for metal electroplating comprising leveling agent
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (en) * 2014-09-15 2020-11-21 美商麥德美樂思公司 Levelers for copper deposition in microelectronics
KR102339867B1 (en) * 2021-07-30 2021-12-16 와이엠티 주식회사 Leveler and electroplating composition for filling via hole

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
ES440918A1 (en) * 1975-03-11 1977-06-01 Oxy Metal Industries Corp Electrodeposition of copper
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Also Published As

Publication number Publication date
FR2389689B1 (en) 1983-04-22
GB1597519A (en) 1981-09-09
CA1105045A (en) 1981-07-14
DE2818725A1 (en) 1978-11-16
JPS5448646A (en) 1979-04-17
AR224861A1 (en) 1982-01-29
FR2389689A1 (en) 1978-12-01

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Legal Events

Date Code Title Description
BB A search report has been drawn up
BC A request for examination has been filed
BV The patent application has lapsed