FR2389689B1 - - Google Patents

Info

Publication number
FR2389689B1
FR2389689B1 FR7811498A FR7811498A FR2389689B1 FR 2389689 B1 FR2389689 B1 FR 2389689B1 FR 7811498 A FR7811498 A FR 7811498A FR 7811498 A FR7811498 A FR 7811498A FR 2389689 B1 FR2389689 B1 FR 2389689B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7811498A
Other languages
French (fr)
Other versions
FR2389689A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2389689A1 publication Critical patent/FR2389689A1/fr
Application granted granted Critical
Publication of FR2389689B1 publication Critical patent/FR2389689B1/fr
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
FR7811498A 1977-05-04 1978-04-19 Expired FR2389689B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (2)

Publication Number Publication Date
FR2389689A1 FR2389689A1 (en) 1978-12-01
FR2389689B1 true FR2389689B1 (en) 1983-04-22

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7811498A Expired FR2389689B1 (en) 1977-05-04 1978-04-19

Country Status (7)

Country Link
JP (1) JPS5448646A (en)
AR (1) AR224861A1 (en)
CA (1) CA1105045A (en)
DE (1) DE2818725A1 (en)
FR (1) FR2389689B1 (en)
GB (1) GB1597519A (en)
NL (1) NL7804874A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0111965B1 (en) * 1982-12-23 1989-07-26 THE PROCTER & GAMBLE COMPANY Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
US9834677B2 (en) * 2010-03-18 2017-12-05 Basf Se Composition for metal electroplating comprising leveling agent
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (en) * 2014-09-15 2020-11-21 美商麥德美樂思公司 Levelers for copper deposition in microelectronics
KR102339867B1 (en) * 2021-07-30 2021-12-16 와이엠티 주식회사 Leveler and electroplating composition for filling via hole

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Also Published As

Publication number Publication date
NL7804874A (en) 1978-11-07
GB1597519A (en) 1981-09-09
JPS5448646A (en) 1979-04-17
CA1105045A (en) 1981-07-14
FR2389689A1 (en) 1978-12-01
AR224861A1 (en) 1982-01-29
DE2818725A1 (en) 1978-11-16

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Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse