JPS527819A
(en)
*
|
1975-07-10 |
1977-01-21 |
Furukawa Electric Co Ltd:The |
Process for smooth electrodeposition of copper
|
CA1105045A
(en)
*
|
1977-05-04 |
1981-07-14 |
Hans G. Creutz (Deceased) |
Electrodeposition of copper
|
US4134802A
(en)
*
|
1977-10-03 |
1979-01-16 |
Oxy Metal Industries Corporation |
Electrolyte and method for electrodepositing bright metal deposits
|
US4336114A
(en)
*
|
1981-03-26 |
1982-06-22 |
Hooker Chemicals & Plastics Corp. |
Electrodeposition of bright copper
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
US4661288A
(en)
*
|
1982-12-23 |
1987-04-28 |
The Procter & Gamble Company |
Zwitterionic compounds having clay soil removal/anti/redeposition properties useful in detergent compositions
|
US4551506A
(en)
*
|
1982-12-23 |
1985-11-05 |
The Procter & Gamble Company |
Cationic polymers having clay soil removal/anti-redeposition properties useful in detergent compositions
|
US4659802A
(en)
*
|
1982-12-23 |
1987-04-21 |
The Procter & Gamble Company |
Cationic compounds having clay soil removal/anti-redeposition properties useful in detergent compositions
|
AU554236B2
(en)
*
|
1983-06-10 |
1986-08-14 |
Omi International Corp. |
Electrolyte composition and process for electrodepositing copper
|
AU559896B2
(en)
*
|
1983-06-10 |
1987-03-26 |
Omi International Corp. |
Electrolytic copper depositing processes
|
US4548744A
(en)
*
|
1983-07-22 |
1985-10-22 |
Connor Daniel S |
Ethoxylated amine oxides having clay soil removal/anti-redeposition properties useful in detergent compositions
|
US4555315A
(en)
*
|
1984-05-29 |
1985-11-26 |
Omi International Corporation |
High speed copper electroplating process and bath therefor
|
US4673469A
(en)
*
|
1984-06-08 |
1987-06-16 |
Mcgean-Rohco, Inc. |
Method of plating plastics
|
US4948474A
(en)
*
|
1987-09-18 |
1990-08-14 |
Pennsylvania Research Corporation |
Copper electroplating solutions and methods
|
US4786746A
(en)
*
|
1987-09-18 |
1988-11-22 |
Pennsylvania Research Corporation |
Copper electroplating solutions and methods of making and using them
|
US6375741B2
(en)
|
1991-03-06 |
2002-04-23 |
Timothy J. Reardon |
Semiconductor processing spray coating apparatus
|
DE4032864A1
(de)
*
|
1990-10-13 |
1992-04-16 |
Schering Ag |
Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
|
US5328589A
(en)
*
|
1992-12-23 |
1994-07-12 |
Enthone-Omi, Inc. |
Functional fluid additives for acid copper electroplating baths
|
US5849170A
(en)
*
|
1995-06-19 |
1998-12-15 |
Djokic; Stojan |
Electroless/electrolytic methods for the preparation of metallized ceramic substrates
|
US6709562B1
(en)
|
1995-12-29 |
2004-03-23 |
International Business Machines Corporation |
Method of making electroplated interconnection structures on integrated circuit chips
|
US6946716B2
(en)
*
|
1995-12-29 |
2005-09-20 |
International Business Machines Corporation |
Electroplated interconnection structures on integrated circuit chips
|
US5730854A
(en)
*
|
1996-05-30 |
1998-03-24 |
Enthone-Omi, Inc. |
Alkoxylated dimercaptans as copper additives and de-polarizing additives
|
US6203582B1
(en)
*
|
1996-07-15 |
2001-03-20 |
Semitool, Inc. |
Modular semiconductor workpiece processing tool
|
US6276072B1
(en)
*
|
1997-07-10 |
2001-08-21 |
Applied Materials, Inc. |
Method and apparatus for heating and cooling substrates
|
US6936153B1
(en)
|
1997-09-30 |
2005-08-30 |
Semitool, Inc. |
Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face
|
US6454926B1
(en)
*
|
1997-09-30 |
2002-09-24 |
Semitool Inc. |
Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas
|
DE19758121C2
(de)
*
|
1997-12-17 |
2000-04-06 |
Atotech Deutschland Gmbh |
Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
|
EP1019954B1
(en)
*
|
1998-02-04 |
2013-05-15 |
Applied Materials, Inc. |
Method and apparatus for low-temperature annealing of electroplated copper micro-structures in the production of a microelectronic device
|
US7244677B2
(en)
|
1998-02-04 |
2007-07-17 |
Semitool. Inc. |
Method for filling recessed micro-structures with metallization in the production of a microelectronic device
|
US6632292B1
(en)
|
1998-03-13 |
2003-10-14 |
Semitool, Inc. |
Selective treatment of microelectronic workpiece surfaces
|
DE69929967T2
(de)
*
|
1998-04-21 |
2007-05-24 |
Applied Materials, Inc., Santa Clara |
Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
|
US6113771A
(en)
|
1998-04-21 |
2000-09-05 |
Applied Materials, Inc. |
Electro deposition chemistry
|
US6416647B1
(en)
|
1998-04-21 |
2002-07-09 |
Applied Materials, Inc. |
Electro-chemical deposition cell for face-up processing of single semiconductor substrates
|
US6994776B2
(en)
*
|
1998-06-01 |
2006-02-07 |
Semitool Inc. |
Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device
|
US6290865B1
(en)
|
1998-11-30 |
2001-09-18 |
Applied Materials, Inc. |
Spin-rinse-drying process for electroplated semiconductor wafers
|
US6254760B1
(en)
|
1999-03-05 |
2001-07-03 |
Applied Materials, Inc. |
Electro-chemical deposition system and method
|
US6258220B1
(en)
|
1998-11-30 |
2001-07-10 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6267853B1
(en)
|
1999-07-09 |
2001-07-31 |
Applied Materials, Inc. |
Electro-chemical deposition system
|
US6228233B1
(en)
|
1998-11-30 |
2001-05-08 |
Applied Materials, Inc. |
Inflatable compliant bladder assembly
|
US6534116B2
(en)
*
|
2000-08-10 |
2003-03-18 |
Nutool, Inc. |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
|
US6413388B1
(en)
*
|
2000-02-23 |
2002-07-02 |
Nutool Inc. |
Pad designs and structures for a versatile materials processing apparatus
|
US6379522B1
(en)
|
1999-01-11 |
2002-04-30 |
Applied Materials, Inc. |
Electrodeposition chemistry for filling of apertures with reflective metal
|
US6544399B1
(en)
|
1999-01-11 |
2003-04-08 |
Applied Materials, Inc. |
Electrodeposition chemistry for filling apertures with reflective metal
|
US7192494B2
(en)
*
|
1999-03-05 |
2007-03-20 |
Applied Materials, Inc. |
Method and apparatus for annealing copper films
|
US6136163A
(en)
*
|
1999-03-05 |
2000-10-24 |
Applied Materials, Inc. |
Apparatus for electro-chemical deposition with thermal anneal chamber
|
US6551484B2
(en)
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Reverse voltage bias for electro-chemical plating system and method
|
US6837978B1
(en)
|
1999-04-08 |
2005-01-04 |
Applied Materials, Inc. |
Deposition uniformity control for electroplating apparatus, and associated method
|
US6557237B1
(en)
|
1999-04-08 |
2003-05-06 |
Applied Materials, Inc. |
Removable modular cell for electro-chemical plating and method
|
US6662673B1
(en)
|
1999-04-08 |
2003-12-16 |
Applied Materials, Inc. |
Linear motion apparatus and associated method
|
US6582578B1
(en)
|
1999-04-08 |
2003-06-24 |
Applied Materials, Inc. |
Method and associated apparatus for tilting a substrate upon entry for metal deposition
|
US6585876B2
(en)
|
1999-04-08 |
2003-07-01 |
Applied Materials Inc. |
Flow diffuser to be used in electro-chemical plating system and method
|
US6571657B1
(en)
|
1999-04-08 |
2003-06-03 |
Applied Materials Inc. |
Multiple blade robot adjustment apparatus and associated method
|
US6551488B1
(en)
*
|
1999-04-08 |
2003-04-22 |
Applied Materials, Inc. |
Segmenting of processing system into wet and dry areas
|
US20060157355A1
(en)
*
|
2000-03-21 |
2006-07-20 |
Semitool, Inc. |
Electrolytic process using anion permeable barrier
|
US8236159B2
(en)
*
|
1999-04-13 |
2012-08-07 |
Applied Materials Inc. |
Electrolytic process using cation permeable barrier
|
US8852417B2
(en)
|
1999-04-13 |
2014-10-07 |
Applied Materials, Inc. |
Electrolytic process using anion permeable barrier
|
US20030213772A9
(en)
*
|
1999-07-09 |
2003-11-20 |
Mok Yeuk-Fai Edwin |
Integrated semiconductor substrate bevel cleaning apparatus and method
|
US6516815B1
(en)
|
1999-07-09 |
2003-02-11 |
Applied Materials, Inc. |
Edge bead removal/spin rinse dry (EBR/SRD) module
|
US6406609B1
(en)
*
|
2000-02-25 |
2002-06-18 |
Agere Systems Guardian Corp. |
Method of fabricating an integrated circuit
|
US20060189129A1
(en)
*
|
2000-03-21 |
2006-08-24 |
Semitool, Inc. |
Method for applying metal features onto barrier layers using ion permeable barriers
|
US6913680B1
(en)
|
2000-05-02 |
2005-07-05 |
Applied Materials, Inc. |
Method of application of electrical biasing to enhance metal deposition
|
EP1337693A2
(en)
|
2000-05-23 |
2003-08-27 |
Applied Materials, Inc. |
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
|
US20040079633A1
(en)
*
|
2000-07-05 |
2004-04-29 |
Applied Materials, Inc. |
Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
|
US6576110B2
(en)
|
2000-07-07 |
2003-06-10 |
Applied Materials, Inc. |
Coated anode apparatus and associated method
|
US20020112964A1
(en)
*
|
2000-07-12 |
2002-08-22 |
Applied Materials, Inc. |
Process window for gap-fill on very high aspect ratio structures using additives in low acid copper baths
|
US6921551B2
(en)
|
2000-08-10 |
2005-07-26 |
Asm Nutool, Inc. |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
|
US6436267B1
(en)
|
2000-08-29 |
2002-08-20 |
Applied Materials, Inc. |
Method for achieving copper fill of high aspect ratio interconnect features
|
US20040170753A1
(en)
*
|
2000-12-18 |
2004-09-02 |
Basol Bulent M. |
Electrochemical mechanical processing using low temperature process environment
|
US6610189B2
(en)
|
2001-01-03 |
2003-08-26 |
Applied Materials, Inc. |
Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
|
US7172497B2
(en)
*
|
2001-01-05 |
2007-02-06 |
Asm Nutool, Inc. |
Fabrication of semiconductor interconnect structures
|
US6478937B2
(en)
|
2001-01-19 |
2002-11-12 |
Applied Material, Inc. |
Substrate holder system with substrate extension apparatus and associated method
|
EP1260614B1
(en)
|
2001-05-24 |
2008-04-23 |
Shipley Co. L.L.C. |
Tin plating
|
US6824612B2
(en)
|
2001-12-26 |
2004-11-30 |
Applied Materials, Inc. |
Electroless plating system
|
US6770565B2
(en)
|
2002-01-08 |
2004-08-03 |
Applied Materials Inc. |
System for planarizing metal conductive layers
|
WO2003060959A2
(en)
*
|
2002-01-10 |
2003-07-24 |
Semitool, Inc. |
Method for applying metal features onto barrier layers using electrochemical deposition
|
US20030146102A1
(en)
*
|
2002-02-05 |
2003-08-07 |
Applied Materials, Inc. |
Method for forming copper interconnects
|
US8002962B2
(en)
|
2002-03-05 |
2011-08-23 |
Enthone Inc. |
Copper electrodeposition in microelectronics
|
US7316772B2
(en)
*
|
2002-03-05 |
2008-01-08 |
Enthone Inc. |
Defect reduction in electrodeposited copper for semiconductor applications
|
US6911136B2
(en)
*
|
2002-04-29 |
2005-06-28 |
Applied Materials, Inc. |
Method for regulating the electrical power applied to a substrate during an immersion process
|
US7189313B2
(en)
*
|
2002-05-09 |
2007-03-13 |
Applied Materials, Inc. |
Substrate support with fluid retention band
|
JP4115240B2
(ja)
*
|
2002-10-21 |
2008-07-09 |
日鉱金属株式会社 |
特定骨格を有する四級アミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
|
US7138039B2
(en)
*
|
2003-01-21 |
2006-11-21 |
Applied Materials, Inc. |
Liquid isolation of contact rings
|
US7087144B2
(en)
*
|
2003-01-31 |
2006-08-08 |
Applied Materials, Inc. |
Contact ring with embedded flexible contacts
|
US7025861B2
(en)
|
2003-02-06 |
2006-04-11 |
Applied Materials |
Contact plating apparatus
|
US20040200725A1
(en)
*
|
2003-04-09 |
2004-10-14 |
Applied Materials Inc. |
Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
|
US20040211657A1
(en)
*
|
2003-04-11 |
2004-10-28 |
Ingelbrecht Hugo Gerard Eduard |
Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom
|
US7205153B2
(en)
|
2003-04-11 |
2007-04-17 |
Applied Materials, Inc. |
Analytical reagent for acid copper sulfate solutions
|
US20040206373A1
(en)
*
|
2003-04-18 |
2004-10-21 |
Applied Materials, Inc. |
Spin rinse dry cell
|
US20040206628A1
(en)
*
|
2003-04-18 |
2004-10-21 |
Applied Materials, Inc. |
Electrical bias during wafer exit from electrolyte bath
|
US7311810B2
(en)
*
|
2003-04-18 |
2007-12-25 |
Applied Materials, Inc. |
Two position anneal chamber
|
US7128822B2
(en)
|
2003-06-04 |
2006-10-31 |
Shipley Company, L.L.C. |
Leveler compounds
|
DE10337669B4
(de)
*
|
2003-08-08 |
2006-04-27 |
Atotech Deutschland Gmbh |
Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
|
US20050092602A1
(en)
*
|
2003-10-29 |
2005-05-05 |
Harald Herchen |
Electrochemical plating cell having a membrane stack
|
US20050092601A1
(en)
*
|
2003-10-29 |
2005-05-05 |
Harald Herchen |
Electrochemical plating cell having a diffusion member
|
US20050218000A1
(en)
*
|
2004-04-06 |
2005-10-06 |
Applied Materials, Inc. |
Conditioning of contact leads for metal plating systems
|
US20050230262A1
(en)
*
|
2004-04-20 |
2005-10-20 |
Semitool, Inc. |
Electrochemical methods for the formation of protective features on metallized features
|
US7285195B2
(en)
*
|
2004-06-24 |
2007-10-23 |
Applied Materials, Inc. |
Electric field reducing thrust plate
|
US20060102467A1
(en)
*
|
2004-11-15 |
2006-05-18 |
Harald Herchen |
Current collimation for thin seed and direct plating
|
DE102005011708B3
(de)
*
|
2005-03-11 |
2007-03-01 |
Atotech Deutschland Gmbh |
Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
|
US20070014958A1
(en)
*
|
2005-07-08 |
2007-01-18 |
Chaplin Ernest R |
Hanger labels, label assemblies and methods for forming the same
|
US7851222B2
(en)
*
|
2005-07-26 |
2010-12-14 |
Applied Materials, Inc. |
System and methods for measuring chemical concentrations of a plating solution
|
US8500985B2
(en)
|
2006-07-21 |
2013-08-06 |
Novellus Systems, Inc. |
Photoresist-free metal deposition
|
US7732329B2
(en)
*
|
2006-08-30 |
2010-06-08 |
Ipgrip, Llc |
Method and apparatus for workpiece surface modification for selective material deposition
|
TWI341554B
(en)
*
|
2007-08-02 |
2011-05-01 |
Enthone |
Copper metallization of through silicon via
|
EP2199315B1
(en)
*
|
2008-12-19 |
2013-12-11 |
Basf Se |
Composition for metal electroplating comprising leveling agent
|
WO2010092579A1
(en)
|
2009-02-12 |
2010-08-19 |
Technion Research & Development Foundation Ltd. |
A process for electroplating of copper
|
MY156690A
(en)
|
2010-03-18 |
2016-03-15 |
Basf Se |
Composition for metal electroplating comprising leveling agent
|
CN103397354B
(zh)
*
|
2013-08-08 |
2016-10-26 |
上海新阳半导体材料股份有限公司 |
一种用于减少硅通孔技术镀铜退火后空洞的添加剂
|
US9273407B2
(en)
|
2014-03-17 |
2016-03-01 |
Hong Kong Applied Science and Technology Research Institute Company Limited |
Additive for electrodeposition
|
DE102014208733A1
(de)
|
2014-05-09 |
2015-11-12 |
Dr. Hesse Gmbh & Cie Kg |
Verfahren zum elektrolytischen Abscheiden von Kupfer aus Wasser basierenden Elektrolyten
|
TWI710671B
(zh)
*
|
2014-09-15 |
2020-11-21 |
美商麥德美樂思公司 |
微電子技術中銅沈積用之平整劑
|
US20160312372A1
(en)
*
|
2015-04-27 |
2016-10-27 |
Rohm And Haas Electronic Materials Llc |
Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits
|
ES2761883T3
(es)
|
2017-06-16 |
2020-05-21 |
Atotech Deutschland Gmbh |
Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre
|
CN110644021B
(zh)
*
|
2019-09-16 |
2021-07-06 |
铜陵市华创新材料有限公司 |
一种锂离子电池用4.5μm电解铜箔、制备方法及添加剂
|
CN112030199B
(zh)
*
|
2020-08-27 |
2021-11-12 |
江苏艾森半导体材料股份有限公司 |
一种用于先进封装的高速电镀铜添加剂及电镀液
|