DE69110208D1 - Kupferplattieren von Tiefdruckzylindern. - Google Patents

Kupferplattieren von Tiefdruckzylindern.

Info

Publication number
DE69110208D1
DE69110208D1 DE69110208T DE69110208T DE69110208D1 DE 69110208 D1 DE69110208 D1 DE 69110208D1 DE 69110208 T DE69110208 T DE 69110208T DE 69110208 T DE69110208 T DE 69110208T DE 69110208 D1 DE69110208 D1 DE 69110208D1
Authority
DE
Germany
Prior art keywords
copper plating
gravure cylinders
gravure
cylinders
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69110208T
Other languages
English (en)
Other versions
DE69110208T2 (de
Inventor
C Richard Frisby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Mcgean Rohco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mcgean Rohco Inc filed Critical Mcgean Rohco Inc
Application granted granted Critical
Publication of DE69110208D1 publication Critical patent/DE69110208D1/de
Publication of DE69110208T2 publication Critical patent/DE69110208T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69110208T 1990-08-03 1991-06-26 Kupferplattieren von Tiefdruckzylindern. Expired - Fee Related DE69110208T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56239890A 1990-08-03 1990-08-03

Publications (2)

Publication Number Publication Date
DE69110208D1 true DE69110208D1 (de) 1995-07-13
DE69110208T2 DE69110208T2 (de) 1995-10-19

Family

ID=24246141

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69110208T Expired - Fee Related DE69110208T2 (de) 1990-08-03 1991-06-26 Kupferplattieren von Tiefdruckzylindern.

Country Status (4)

Country Link
US (1) US5417841A (de)
EP (1) EP0469724B1 (de)
JP (1) JPH05214586A (de)
DE (1) DE69110208T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730854A (en) * 1996-05-30 1998-03-24 Enthone-Omi, Inc. Alkoxylated dimercaptans as copper additives and de-polarizing additives
US7556722B2 (en) * 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
US6406609B1 (en) * 2000-02-25 2002-06-18 Agere Systems Guardian Corp. Method of fabricating an integrated circuit
EP1148156A3 (de) * 2000-04-11 2004-02-04 Shipley Company LLC Elektroplattierung von Kupfer
DE50106133D1 (de) * 2000-09-20 2005-06-09 Schloetter Fa Dr Ing Max Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
US6676823B1 (en) 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating
US20050284766A1 (en) * 2004-06-25 2005-12-29 Herdman Roderick D Pulse reverse electrolysis of acidic copper electroplating solutions
US7329334B2 (en) * 2004-09-16 2008-02-12 Herdman Roderick D Controlling the hardness of electrodeposited copper coatings by variation of current profile
US7153408B1 (en) 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
US8901060B2 (en) * 2008-11-17 2014-12-02 Basf Se Use of thioglycol ethoxylate as a corrosion inhibitor
GR1007354B (el) 2009-12-15 2011-07-20 Icr Ιωαννου Αβεε, Κατασκευη κυλινδρου βαθυτυπιας με βαση απο αλουμινιο
EP2719544B1 (de) * 2012-10-10 2015-12-16 Artio Sarl Verfahren zur Herstellung eines Rotationstiefdruckzylinders
EP2943350B1 (de) 2013-01-08 2018-08-01 Paramount International Services Ltd Verfahren zur erneuerung von tiefdruckzylindern, tiefdruckzylinder und deren verwendung
JP6142165B2 (ja) * 2013-03-25 2017-06-07 石原ケミカル株式会社 電気銅メッキ浴、電気銅メッキ方法並びに当該メッキ浴を用いて銅皮膜を形成した電子部品の製造方法
EP3038830B1 (de) * 2013-08-29 2017-06-14 Paramount International Services Ltd Verfahren zur herstellung eines rotationstiefdruckzylinders
JP6402399B2 (ja) * 2014-05-09 2018-10-10 藤倉ゴム工業株式会社 Ｃｆｒｐ円筒のメッキ方法及び外面メッキ層を有するｃｆｒｐ円筒
US10440434B2 (en) 2016-10-28 2019-10-08 International Business Machines Corporation Experience-directed dynamic steganographic content switching
CN106637312A (zh) * 2017-03-07 2017-05-10 龙游运申制版有限公司 一种版辊镀铜液及其制备方法
CN110870590B (zh) * 2018-08-14 2022-04-29 常州市派腾电子技术服务有限公司 发烟装置、电子烟及控制方法
KR20210094558A (ko) 2018-11-07 2021-07-29 코벤트야 인크. 새틴 구리조 및 새틴 구리층 침착 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2424887A (en) 1941-10-11 1947-07-29 Houdaille Hershey Corp Method and electrolyte for the electrodeposition of metals
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating
US3798138A (en) * 1971-07-21 1974-03-19 Lea Ronal Inc Electrodeposition of copper
US3751289A (en) * 1971-08-20 1973-08-07 M & T Chemicals Inc Method of preparing surfaces for electroplating
US4229268A (en) * 1979-07-09 1980-10-21 Rohco, Inc. Acid zinc plating baths and methods for electrodepositing bright zinc deposits
US4334966A (en) 1981-05-19 1982-06-15 Mcgean Chemical Company, Inc. Method of copper plating gravure cylinders
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4781801A (en) 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
US4832802A (en) * 1988-06-10 1989-05-23 Mcgean-Rohco, Inc. Acid zinc-nickel plating baths and methods for electrodepositing bright and ductile zinc-nickel alloys and additive composition therefor

Also Published As

Publication number Publication date
DE69110208T2 (de) 1995-10-19
EP0469724A1 (de) 1992-02-05
EP0469724B1 (de) 1995-06-07
US5417841A (en) 1995-05-23
JPH05214586A (ja) 1993-08-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ATOTECH DEUTSCHLAND GMBH, 10553 BERLIN, DE

8339 Ceased/non-payment of the annual fee