DE68902551D1 - Stromlose kupferplattierloesung. - Google Patents

Stromlose kupferplattierloesung.

Info

Publication number
DE68902551D1
DE68902551D1 DE8989101914T DE68902551T DE68902551D1 DE 68902551 D1 DE68902551 D1 DE 68902551D1 DE 8989101914 T DE8989101914 T DE 8989101914T DE 68902551 T DE68902551 T DE 68902551T DE 68902551 D1 DE68902551 D1 DE 68902551D1
Authority
DE
Germany
Prior art keywords
plating solution
copper plating
current copper
current
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989101914T
Other languages
English (en)
Other versions
DE68902551T2 (de
Inventor
Rangarajan Jagannathan
Mahadevaiyer Krishnan
Gregory P Wandy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68902551D1 publication Critical patent/DE68902551D1/de
Application granted granted Critical
Publication of DE68902551T2 publication Critical patent/DE68902551T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
DE8989101914T 1988-03-08 1989-02-03 Stromlose kupferplattierloesung. Expired - Fee Related DE68902551T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/165,663 US4818286A (en) 1988-03-08 1988-03-08 Electroless copper plating bath

Publications (2)

Publication Number Publication Date
DE68902551D1 true DE68902551D1 (de) 1992-10-01
DE68902551T2 DE68902551T2 (de) 1993-04-29

Family

ID=22599909

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989101914T Expired - Fee Related DE68902551T2 (de) 1988-03-08 1989-02-03 Stromlose kupferplattierloesung.

Country Status (4)

Country Link
US (1) US4818286A (de)
EP (1) EP0331907B1 (de)
JP (1) JPH01242781A (de)
DE (1) DE68902551T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4877450A (en) * 1989-02-23 1989-10-31 Learonal, Inc. Formaldehyde-free electroless copper plating solutions
US5102456A (en) * 1989-04-28 1992-04-07 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
PT616053E (pt) * 1993-03-18 2001-07-31 Atotech Usa Inc Metedo e composicao para revestimento por imersao sem formaldeiro com auto acelaracao e reabastecimento
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
DE69624846T2 (de) * 1996-06-03 2003-03-20 Ebara Udylite Kk Lösung für stromlose kupferplattierung und verfahren zur stromlosen kupferplattierung
US9153449B2 (en) 2012-03-19 2015-10-06 Lam Research Corporation Electroless gap fill
US9611550B2 (en) 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
JP2018119193A (ja) * 2017-01-26 2018-08-02 新日鐵住金株式会社 ゴム製品補強用鋼線、ゴム製品補強用スチールコード及びゴム製品補強用鋼線の製造方法
JP6733016B1 (ja) * 2019-07-17 2020-07-29 上村工業株式会社 無電解銅めっき浴

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431120A (en) * 1966-06-07 1969-03-04 Allied Res Prod Inc Metal plating by chemical reduction with amineboranes
US4002786A (en) * 1967-10-16 1977-01-11 Matsushita Electric Industrial Co., Ltd. Method for electroless copper plating
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
JPS5627594B2 (de) * 1975-03-14 1981-06-25
US4303443A (en) * 1979-06-15 1981-12-01 Hitachi, Ltd. Electroless copper plating solution
US4548644A (en) * 1982-09-28 1985-10-22 Hitachi Chemical Company, Ltd. Electroless copper deposition solution
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
KR890004583B1 (ko) * 1984-06-29 1989-11-16 히다찌가세이고오교 가부시끼가이샤 금속표면 처리공정
US4577762A (en) * 1985-06-27 1986-03-25 James River Corporation Of Virginia Reclosable package and carton blank and process for making the same
US4640718A (en) * 1985-10-29 1987-02-03 International Business Machines Corporation Process for accelerating Pd/Sn seeds for electroless copper plating
US4684550A (en) * 1986-04-25 1987-08-04 Mine Safety Appliances Company Electroless copper plating and bath therefor

Also Published As

Publication number Publication date
EP0331907A1 (de) 1989-09-13
EP0331907B1 (de) 1992-08-26
JPH022952B2 (de) 1990-01-19
JPH01242781A (ja) 1989-09-27
US4818286A (en) 1989-04-04
DE68902551T2 (de) 1993-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee