Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/806—Optical elements or arrangements associated with the image sensors
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/002—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B13/00—Optical objectives specially designed for the purposes specified below
  • G02B13/16—Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers, or for use with projectors, e.g. objectives for projection TV
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/02—Details
  • G01J1/04—Optical or mechanical part supplementary adjustable parts
  • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
  • G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/02—Details
  • G01J1/04—Optical or mechanical part supplementary adjustable parts
  • G01J1/0488—Optical or mechanical part supplementary adjustable parts with spectral filtering
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
  • G01J3/02—Details
  • G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
  • G01J3/0208—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using focussing or collimating elements, e.g. lenses or mirrors; performing aberration correction
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B13/00—Optical objectives specially designed for the purposes specified below
  • G02B13/22—Telecentric objectives or lens systems
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
  • G02B27/0938—Using specific optical elements
  • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
  • G02B27/0938—Using specific optical elements
  • G02B27/0988—Diaphragms, spatial filters, masks for removing or filtering a part of the beam
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
  • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
  • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
  • G02B27/4244—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application in wavelength selecting devices
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
  • G02B27/4294—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect in multispectral systems, e.g. UV and visible
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
  • G02B27/44—Grating systems; Zone plate systems
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/18—Diffraction gratings
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/18—Diffraction gratings
  • G02B5/1809—Diffraction gratings with pitch less than or comparable to the wavelength
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/18—Diffraction gratings
  • G02B5/1814—Diffraction gratings structurally combined with one or more further optical elements, e.g. lenses, mirrors, prisms or other diffraction gratings
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/18—Diffraction gratings
  • G02B5/1842—Gratings for image generation
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/804—Containers or encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/805—Coatings
  • H10F39/8053—Colour filters

Definitions

• the current disclosure is directed to optical arrangements of metasurface elements, integrated systems incorporating refractive optics, light sources and/or detectors with such metasurface elements, and methods of the manufacture of such optical arrangements and integrated systems.
• the application is directed to optical arrangements of metasurface elements, integrated systems incorporating light sources and/or detectors with such metasurace elements, and methods of the manufacture of such optical arrangements and integrated systems.
• Imaging system including:
• the aperture and the layer of metasurface elements are configured to gather light of a specified operational bandwidth across a specified field of view and shift the incoming light such that it comes to a focus on the at least one image sensor at a zero or near-zero degree chief ray angle.
• the field of view is at least ⁇ 30 degrees.
• the system further includes a narrow bandwidth optical filter disposed between the metasurface elements and the at least one image sensor
• Various embodiments are directed to an imaging system including:
• At least one image sensor At least one image sensor
• a substrate layer having a substrate thickness, the substrate layer configured to be transparent to a target wavelength of light, the substrate layer having a first surface distal the at least one image sensor and a second surface proximal with the at least one image sensor;
• a single layer of a plurality of identical or unique nanostructured elements comprising a metasurface disposed on one of either the first or second surfaces, such that light impinging on the aperture opening passes through at least a portion of the metasurface such that a specified angular deflection is imposed thereby;
• the aperture and the metasurface layer are configured to gather light of a specified operational bandwidth across a specified field of view and shift the incoming light such that it focuses on the at least one image sensor at a zero or near-zero degree chief ray angle.
• the metasurface layer is disposed on the first surface.
• the system further includes a narrow bandwidth optical filter disposed on the second surface between the metasurface elements and the at least one image sensor.
• a narrow bandwidth optical filter disposed on the second surface between the metasurface elements and the at least one image sensor.
• at least a portion of the aperture is interconnected with the first surface.
• the metasurface layer is disposed on the second surface.
• the image sensor is in contact with the second surface.
• the field of view is at least ⁇ 30 degrees.
• At least one image sensor At least one image sensor
• substrate layer having a substrate thickness, the substrate layer configured to be transparent to a target wavelength of light, the substrate layer having a first surface distal the at least one image sensor and a second surface proximal with the at least one image sensor;
• At least one refractive lens disposed above the substrate and configured to focus impinging light on the first surface of the substrate layer; and a single layer of a plurality of identical or unique nanostructured elements comprising a metasurface disposed on one of either the first or second surfaces, such that light impinging on the at least one refractive lens passes through at least a portion of the metasurface elements such that an angular deflection is imposed thereby;
• the distance between the at least one refractive lens and the layer of metasurface elements are separated by a first distance; and wherein the refractive lens and the layer of metasurface elements are configured to gather light of a specified operational bandwidth across a specified field of view and shift the incoming light such that it focuses on the at least one image sensor at a zero or near-zero degree chief ray angle.
• the system further includes an airgap between the second surface of the substrate and the image sensor.
• a spacer layer is disposed within the airgap.
• the metasurface layer is disposed on the first surface.
• the system further includes a narrow bandwidth optical filter disposed on the second surface between the metasurface elements and the at least one image sensor.
• At least a portion of at least one of the refractive lenses is interconnected with the first surface.
• the metasurface layer is disposed on the second surface.
• the image sensor is in contact with the second surface.
• the field of view is at least ⁇ 30 degrees.
• the at least one refractive lens is selected from the group consisting of plano-convex, convex-piano, bi-convex, bi-concave, plano concave, or concave-piano.
• the system includes at least two refractive lenses comprising a convex-concave lens and concave-convex lens.
• the system includes at least three refractive lenses comprising a convex-concave lens, a bi-convex lens and a concave-piano lens.
• At least the imaging sensor and metasurface have rectangular geometries.
• the at least one refractive lense proximal to the metasurface has a circular geometry.
• the image sensor is characterized by a vertical, v, and a horizontal, h, dimension
• FIG. 1 provides a schematic illustrating an aperture-metasurface imaging system incorporating a cover glass above the image sensor in accordance with embodiments of the invention.
• FIG. 2 provides a schematic illustrating a ray tracing diagram including the chief ray angle at the image sensor plane for the aperture-metasurface imaging system of FIG. 1 in accordance with embodiments of the invention.
• FIG. 3 provides a schematic illustrating an aperture-metasurface imaging system with an air gap between the aperture and metasurface in accordance with embodiments of the invention.
• FIG. 4 provides a schematic illustrating a ray tracing diagram including the chief ray angle at the image sensor plane for the aperture-metasurface imaging system of FIG. 3 in accordance with embodiments of the invention.
• FIG. 8A provides a data graphs showing the relative illumination versus field of view for an aperture-metasurface imaging system in accordance with embodiments of the invention.
• FIG. 8B provides a data graph showing the field of view versus degree of distortion for an aperture-metasurface imaging system in accordance with embodiments of the invention.
• FIGs. 10A and 10B provide schematics illustrating multiple refractive element and metasurface hybrid imaging systems in accordance with embodiments of the invention.
• FIG. 12A provides a schematic of a spacer wafer in accordance with embodiments of the invention.
• FIG. 16 provides a schematic illustrating an imaging system incorporating a rectangular metasurface lens element in accordance with embodiments of the invention.
• FIGs. 17A and 17B provide schematics illustrating the relative dimensions of an imaging sense (FIG. 17A) and a rectangular metasruface lens element (FIG. 17B) in accordance with embodiments of the invention.
• hybrid imaging systems incorporating conventional optical elements and metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements are provided.
• Many embodiments are directed to systems and methods for integrating apertures with metasurface elements in illumination sources and sensors.
• Various embodiments are directed to systems and methods for integrating refractive optics with metasurface elements in illumination sources and sensors.
• the metasurface element may be free standing or may be embedded within another material.
• the selection of the embedding material includes the appropriate selection of refractive index and absorption characteristics.
• the embedding material may provide mechanical stability and protection as well as an additional design degree of freedom that enables the metasurface to perform a desired optical function.
• a spacing layer of a defined thickness may be deposited on the CMOS image sensor, LED, VCSEL, etc., to implement an optical distance appropriate for a desired camera design, illuminator design or optimal system performance.
• the spacing layer material may be organic or inorganic and may have a lower refractive index than the dielectric elements comprising the metasurface.
• the thickness of the spacing layer may be modified to provide appropriate optical spacing for the specific optical system.
• a sequence may include: (i) sensor or illuminator, (ii) optional microlens array/collimator, optional filter, optional spacing layer, optional metasurface element, optional additional spacing layer, optional refractive optic or aperture elements, optional anti-reflection (AR) layer, optional protection layer.
• a sequence of elements may include: (i) sensor or illuminator, (ii) optional microlens array/collimator, optional filter, optional spacing layer, optional metasurface element, optional additional spacing layer, and optional refractive element or aperture.
• the system typically to form an optical system that is corrected for aberrations over a selected field of view, the system must comprise multiple optical surface or multiple optical elements (e.g., two or more). This is true for both conventional refractive optical systems and metasurface optical systems. Specifically, only optical systems with two or more metasurfaces and sufficiently low aberrations over some field of view have been demonstrated.
• Various embodiments are directed to imaging systems that integrate an aperture and a single metasurface element, that allow for the combined system to achieve high quality imaging over a large field of view, telecentricity (e.g., near 0 degree of incidence at the image sensor plane) over a large field of view, and with no fall-off in relative illumination.
• metasurface imaging systems implement multiple metasurface elements to provide enough degrees of freedom to adequately control these parameters (CRA, FOV and minimizing distortion).
• CRA CRA
• FOV FOV
• various embodiments show that by combining an aperture with a single metasurface, an imaging system with a wide FOV, controllable distortion and controllable CRA can be realized in accordance with embodiments.
• the system (10a to 10d) generally comprises an aperture structure (12a to 12d) disposed a set distance (13a to 13d) away from a metasurface layer (14a to 14d), which itself is set a distance (15a to 15d) away from an image sensor (16a to 16d).
• the distance between the aperture and metasurface layer, and the distance between the metasurface layer and the imaging system may take the form of an air gap or an optically transmissive material (e.g., substrate etc.).
• Embodiments of nanostructures generally comprise identical or unique three dimension elements (e.g., square, round, triangular, oval, etc.) having feature sizes smaller than the wavelength of light within the specified operational bandwidth and configured to impose a phase shift on impinging light within the plane of plurality separated by macroscopic distances (distances of 10 or more wavelengths), such that in combination the metasurface layer performs a single optical function.
• Each individual metasurface in the optical system may be configured to have some specific 2D phase and transmission function, ⁇
• each metasurface may have a unique distribution of phase and transmission
• the nanostructure elements that comprise any metasurface embedded in the same material, with the same base composition and at a specific wavelength are identical.
• the transmission can be configured to be maximized (near 1 ) and uniform across the metasurface while the phase can be configured to take on values between 0 and 2TT.
• a set of in-plane dimensions of the comprising nanostructures may be configured such that phase delays from 0 to 2p can be imprinted on an incident light field.
• the only variable from design to design is the distribution of suitable nanostructure elements across the metasurface.
• Metasurface layers may be designed to be freestanding, i.e. , the metasurface elements protrude from the end of the substrate with only air gaps separating them, the process is complete at this step.
• metasurfaces may be further configured to have an AR coating or mechanical protection.
• the metasurface constituent elements and substrate faces may be coated in some material or layers of material.
• the elements which can be any material with desired optical properties, are embedded in a lower-index of refraction medium.
• the low-index medium completely encapsulates the metasurfaces and extends some thickness above the metasurface elements.
• the low-index medium acts as a protective barrier to the metasurface elements (i.e. , provide mechanical stability) and provides an additional design degree of freedom for the system that allows for certain properties to be optimized, e.g., overall transmission or efficiency of the metasurface.
• Metasurface layers or metasurface systems can be fabricated in mass production using any suitable fabrication techniques, including, for example, lithography, machining, etching, and standard CMOS fabrication techniques, as has been previously described in U.S. Patent Application No. 16/120, 174, filed August 31 , 2018, the disclosure of which is incorporated herein by reference.
• the metasurface substrate may be any low-index material, e.g., polymer, S1O2, glass.
• the metasurface elements may also be any material which has been optimized for a specific bandwidth, e.g., silicon, Ti02, alumina, metal, etc.
• the imaging system may take the form of a single monolithic image sensor or a pixel array.
• image sensors and pixel arrays may take any suitable form including, for example, CMOS sensors.
• FIG. 1 provides a schematic illustration of an implementation of various embodiments of such hybrid aperture/metasurface imaging systems.
• a substrate layer (24a) transparent at the wavelength of interest and having a thickness (tsub) is provided having an aperture structure (12a) which is opaque to light at the wavelength of interest and completely transparent to light at that wavelength of interest over a distance, (d ap ) disposed on a first side distal to the imager (16a), and a metasurface layer (14a) composed of nanostructures (22a) with equal height disposed on a second side proximal to the imager (16a).
• the aperture structure (12a) and metasurface layer (14a) are separated by a first distance (13a) defined by the substrate thickness (tsub). Further in such embodiments, the aperture structure (12a) and metasurface layers (14a) may be deposited directly on the substrate (24a) or bonded via adhesive. Between the metasurface layer (14a) and the imager (16a) is disposed a distance (15a) defining the back-focal length formed by an air gap (tair).
• many embodiments of such imaging systems may further comprise an optional cover glass or filter (26) which does not impact the imaging performance of the device but provides other functionality (e.g., either optical or structural).
• the aperture imparts no optical function (does not deflect the light rays) but rather only limits the lateral extent of the light ray bundle that may enter the imaging system, or equivalently sets the entrance aperture or the f/# of the system.
• the metasurface layer may comprise the only functional optical layer that significantly deflects the light rays to form a focused image in such embodiments.
• the metasurface layer may act as an arbitrary phase mask, imparting any value from 0 to 2p phase shift on the incident light at an arbitrary radial position of the lens.
• FIG. 2 a ray-tracing diagram through an exemplary embodiment of a system comprising a single aperture (12a) and a single metasurface (14a) combined on a single substrate (24a) in accordance with the embodiment illustrated in FIG. 1 is provided.
• these metasurface elements could be fabricated using methods as described herein or in previously cited U.S. Pat. App. No.
• the aperture and metasurface elements have been configured such that in combination they are able to form a good image across a wide FOV ( ⁇ 40 degrees in this example, however, it will be understood that this is not a limiting case).
• Embodiments of such a single aperture and single metasurface system, as shown, have been surprisingly found to naturally produce focused rays at the image plane that are telecentric (i.e. , having 0 degree CRA).
• the metasurface layers (14b) and the imager (16b) may be directly bonded via adhesive or other suitable means. Between the metasurface layer (14b) and the imager (16b) is disposed a distance (15b) defining the back-focal length formed by the substrate thickness (tsub). This distance is used as a free parameter to design imaging systems with optimal performance and will change based on the desired f/# or field of view of the imaging system, for example. In such embodiments such imaging systems do not require the optional cover glass or filter used in the embodiment shown in FIG. 1 as the substrate (24b) provides such dual functionality.
• the aperture structure (12b), which is opaque to light at the wavelength of interest and completely transparent to light at that wavelength of interest over a distance, (d ap ), and metasurface layer (14b) are separated by a first distance (13b) defined by and airgap (tair).
• the aperture and metasurface elements have been configured such that in combination they are able to form a good image across a wide FOV ( ⁇ 40 degrees in this example, however, it will be understood that this is not a limiting case).
• Embodiments of such a single aperture and single metasurface system, as shown, have been surprisingly found to naturally produce focused rays at the image plane that are telecentric (i.e., having 0 degree CRA).
• the metasurface layers (14c) and the imager (16c) may be deposited directly on the substrate (24c) or bonded via adhesive. Such embodiments may also comprise suitable spacers (30) to support the substrate (24c) and maintain the distance between the substrate and the image sensor (16c). Between the metasurface layer (14c) and the imager (16c) is disposed a distance (15c) defining the back-focal length formed by the combination of the substrate thickness (tsub) and a spacer height (tspacer).
• the spacers (30) can be either fixed to the image sensor (16c) and substrate layer (24c), leading to a fixed distance for (tspacer) or the substrate can be placed into a standard optical barrel and (tspacer) can be adjustable post assembly. Such embodiments allow for the surface (34) of the substrate (24c) proximal to the image sensor (16c) to remain unpatterned, allowing for the direct integration of an optional optical filter thereon.
• the metasurface layer (14d) may also be disposed on the surface of the substrate (24d) proximal to the image sensor (16d) facing the air gap (32) supported by spacers (30’).
• Such an implementation allows for the protection of the metasurface elements from environmental contamination.
• such embodiments allow for the surface (34’) of the metasurface substrate (24d) distal to the image sensor (16d) to remain unpatterned, allowing for the direct integration of an optional optical filter on the substrate.
• the spacer (30’) can be either fixed to the image sensor (16d) and substrate (24d), leading to a fixed distance for (tspacer) or the substrate (24d) can be placed into a standard optical barrel and (tspacer) can be adjustable post assembly.
• embodiments illustrated in FIGs. 5 and 6 illustrate that the metasurface elements may be arranged to face inward or outward with respect to the air gap between the substrate and image sensor.
• Production of the metasurface system illustrated in FIGs. 5 and 6 can follow processes described, for example, in U.S. Pat. App. No. 16/120,174.
• the spacer layers may be any low-index material, e.g., polymer, S1O2, glass.
• FIGs. 3, 5 and 6 Although embodiments of hybrid aperture/metasurface imaging systems incorporating an airgap between the aperture and metasurface substrate have been shown in FIGs. 3, 5 and 6, these embodiments would require a separate supporting structure to secure the aperture and ensure the aperture distance (tair) remains constant.
• the aperture structure (12e) may also be attached directly to the substrate layer (24e).
• An exemplary embodiment of such an imaging system is illustrated in FIG. 7.
• the top aperture (12e) has an aperture body (36) with width d ap ,top that sets the entrance aperture of the system, has an aperture offset from the substrate by a distance (tap), and that is angled with a minimum angle set by the half field of view of the imaging system to a width of the aperture after a distance along the optical axis set by (tap) is set by the width of the metasurface layer and is given by (d ap , bottom).
• the metasurface layer (14e) is disposed on a surface of the substrate (24e) distal from the image sensor (16e)
• the metasurface layer may also be disposed on the surface (34”) of the substrate proximal to the image sensor.
• the exemplary embodiment incorporates a spacer structure (30”) and airgap between the substrate (24e) and image sensor (16e)
• embodiments may omit this element and mount the substrate directly atop the image sensor.
• An attribute of embodiments of such telecentric designs is that the metasurface imaging system provides a more uniform illumination at the image sensor (referred to by those in the art as “relative illumination”).
• relative illumination A data plot of relative illumination for an exemplary system according to embodiments is provided in FIG. 8A, and demonstrates that relative illumination for the aperture/metasurface imaging system is maintained at 100% across the entire field of view, which is a substantial improvement over conventional systems, which can have a difference between center and edge of 50% or more. Accordingly, embodiments of imaging systems are able to collect more total illumination across the full field of view.
• Embodiments of the metasurface system also provide an additional design variation with respect to traditional refractive lens systems.
• CMOS image sensors require a microlens to be associated with each pixel. Because there is a large variation in CRA across a given sensor plane that is inherent to refractive optical systems, the microlens array on the CIS also requires a complex CRA specification. However, in embodiments of metasurface systems as described herein, the CRA of the microlens array may be configured to be a constant 0 degrees across the CIS allowing for greater simplicity in the design and fabrication of the microlens array. Alternatively, in certain implementations the microlens array may be completely removed from the CIS, saving a process step in CIS production.
• aperture metasurface systems with 0 CRA allow one to limit a persistent problem in traditional imaging systems known by those in the art as“pixel crosstalk”.
• Traditional refractive systems that send light into the image sensor are prone to light coupling into neighboring pixels, which adds noise to the system.
• FIG. 8B provides a data plot illustrating distortion as a function of field at the CMOS image sensor for an imaging system based on the embodiment shown in FIG. 1 .
• FIG. 8B provides a data plot illustrating distortion as a function of field at the CMOS image sensor for an imaging system based on the embodiment shown in FIG. 1 .
• FIG. 8C shows a plot of the modulus transfer function over the field of view for an embodiment of an imaging system as shown in FIG. 1.
• FIG. 8D provides a standard test image illustrating the grid distortion for an imaging system based on the embodiment shown in FIGs. 8A to 8C. As shown, at the edge of the field of view the quality drops off.
• embodiments of the invention show that all of the wavelengths of light are tightly bundled indicating that the distortion can be corrected simply using known image processing software.
• FIG. 9 provides a schematic illustration of an implementation of various embodiments of such hybrid refractive lens/metasurface imaging systems.
• the hybrid imaging surface consists of at least one of each of the following: a refractive lens with one or more surface of curvature and a metasurface layer on a substrate where all of the elements comprising the metasurface are the same height.
• the hybrid optical system may be comprised of any number of refractive elements and multiple metasurface layers.
• FIG. 9 An exemplary embodiment of a hybrid refractive element/metasurface imaging system is illustrated in FIG. 9.
• the system includes at least one refractive optic (38) disposed a set distance away from a substrate layer (40) transparent at the wavelength of interest and having a thickness (tsub) having a metasurface layer (42) composed of nanostructures (44) with equal height disposed on a first surface (45) thereof that is distal to the image sensor (46), and an optional optical filter (48) disposed on a second side (47) of the substrate proximal to the imager.
• a dielectric material with an index of refraction lower than that of the constituent image sensor material may be deposited and planarized such that a single metasurface can be patterned on top of the dielectric material.
• each image sensor in the array has a unique metasurface patterned on its facet.
• the combined system may be optimized to achieve a desired performance.
• integration of a metasurface with an image sensor array may be accomplished using wafer level optics processes.
• the spacer layer may be air rather than a solid dielectric, illustrations of exemplary embodiments of such devices are shown in FIGs. 13 and 14.
• FIG. 14 illustrates and exemplary embodiment that excludes a spacer.
• the thickness of the lens die (84) determines the distance between the image sensor active area (86) and the metasurface area (88).
• the image sensor die (90) and lens die (84) can be directly attached, using adhesive, solder, fusion bond, bump bond, etc. Alternatively the image sensor wafer and lens wafer can be attached directly at the wafer level as previously described.
• the refractive lenses (91 ) of hybrid systems may first be assembled in a lens barrel (92), as is already known in the art.
• the metasurface element (94) can then be combined with the CMOS image sensor element (96) as described above with respect to FIGs. 13 and 14, above. These two sub components are then assembled together to form the final system.
• the refractive lenses may be configured to thread into a housing (98) such that the distance between the refractive elements and metasurface (t gap ) may be adjusted.
• the metasurface lens element may be formed in a rectangular configuration.
• Advantages of such rectangular or not circular lenses include: limiting the total area of the lens, eliminating portions of the lens that would otherwise have light impinge upon it that does not subsequently form an image on the image sensor, and simplifying post processing of lens wafers.
• Particular embodiments of rectangular metasurface lenses and the imaging systems are described here.
• metasurface lens systems having non-circular configurations have the following commonalities: an entrance aperture which is the stop of the lens system and a metasurface lens which is the final, active optical surface before the image sensor plane.
• the entrance aperture (and optical stop) can be circular in cross-section, as it would be in a traditional optical system, while the metasurface lens can be patterned as a rectangle or other arbitrary shape.
• FIG. 16 provides an illustration of an exemplary embodiment of a clear aperture metasurface, where the imaging system (100) is comprised of a rectangular image sensor (102) offset from a single rectangular metasurface (104), and a circular entrance aperture (106) offset from the rectangular metasurface lens (104).
• the optical systems are comprised of an entrance aperture, at least one refractive lens and a metasurface lens which is the last optical lens element in the system before the image sensor.
• the entrance aperture and the at least one refractive lens can still have a circular or radially symmetric cross section.
• embodiments of such hybrid systems would be comprised of a circular aperture (106) offset from at least one circular refractive lens (not shown) which is then offset from the rectangular metasurface lens (104), as shown in FIG. 16.
• the metasurface lens has rectangular dimensions which are configured to match a specific image sensor.
• the entrance aperture (and stop of the optical system) could also be rectangular or the at least one refractive lens could also be rectangular as long as at least the metasurface lens element, which is the last lens element before the image sensor, has a rectangular cross section.
• the dimensions of the rectangular lens in the system can be fully characterized by the dimensions of the image sensor in the system and the specifications of the lens.
• an image sensor is characterized by its vertical and horizontal dimensions, v and h, respectively.
• N f/D
• Such definitions of the lens dimensions will result in an image that almost perfectly fills the sensor geometry.
• This oversizing of the image allows for greater tolerance in the final assembly of the lens system.
• a typical oversizing range may be to take the nominal rectangular lens dimension, as given above, and increase each dimension by 40 microns.
• FIGs. 18A to 18B An example of such a system is shown in FIGs. 18A to 18B.
• Fig. 18A shows a single image sensor die (1 10) around which a single spacer (1 12) can be placed as shown in FIG. 18B.
• the spacer sets the distance between the rectangular metasurfaces (1 14), shown in FIG. 18C and the image sensor (1 10).
• the last element in the assembly contains a set of circular apertures (1 16) disposed in association with an additional spacing layer (1 18) to set the distance between the rectangular metasurface and the circular aperture.
• a cut away of the full assembly is shown in FIG. 18D.
• FIGs. 18A to FIG. 18D exemplify a 2x2 array of circular apertures over a rectangular metasurface
• the grid of circular apertures and rectangular metasurface lenses may be arrayed in any fashion, either symmetric or asymmetric, e.g., 3x3 or 5x2.
• each individual rectangular metasurface and circular aperture comprising the system may have unique dimensions relative to the other aperture metasurface pairs in the system.
• each aperture diameter in the array can generally be unique or each rectangular lens may be unique. Flowever, the distance between the metasurface lens and the image sensor and the metasurface lens and the circular apertures is generally fixed for the entire system.
• each sub camera can have a unique f/#, field-of-view, resolution, etc.

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