WO2013176238A1 - 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置 - Google Patents

硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置 Download PDF

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WO2013176238A1
WO2013176238A1 PCT/JP2013/064425 JP2013064425W WO2013176238A1 WO 2013176238 A1 WO2013176238 A1 WO 2013176238A1 JP 2013064425 W JP2013064425 W JP 2013064425W WO 2013176238 A1 WO2013176238 A1 WO 2013176238A1
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group
ladder
formula
resin composition
curable resin
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PCT/JP2013/064425
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English (en)
French (fr)
Japanese (ja)
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恵明 禿
章博 桑名
伸彦 原田
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株式会社ダイセル
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Priority to JP2014516858A priority Critical patent/JP5667326B2/ja
Priority to EP13793786.8A priority patent/EP2857457B1/en
Priority to CN201380026369.3A priority patent/CN104321385B/zh
Priority to KR1020147030531A priority patent/KR101545111B1/ko
Priority to US14/395,016 priority patent/US9447277B2/en
Publication of WO2013176238A1 publication Critical patent/WO2013176238A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a curable resin composition and a cured product thereof, a sealant containing the curable resin composition, and an optical semiconductor device obtained by sealing an optical semiconductor element using the sealant.
  • a material having a heat resistance of 150 ° C. or higher is required as a material for covering a semiconductor element in a semiconductor device having a high heat resistance and a high withstand voltage.
  • a material (sealing material) that covers an optical material such as an optical semiconductor element is required to be excellent in various physical properties such as transparency and flexibility in addition to heat resistance.
  • silicon-based materials such as phenyl silicone are mainly used as a sealing material in a backlight unit of a liquid crystal display.
  • Patent Document 1 discloses a cage structure containing an aliphatic carbon-carbon unsaturated bond and no H-Si bond as an optical element sealing resin composition excellent in transparency, UV resistance, and heat-resistant colorability. And at least one selected from the group consisting of a liquid silsesquioxane having a liquid structure and a liquid silsesquioxane having a cage structure containing an H-Si bond and no aliphatic carbon-carbon unsaturated bond A resin composition for sealing an optical element containing silsesquioxane as a resin component is disclosed.
  • the cured product of the resin composition containing a cage silsesquioxane is relatively hard and lacks flexibility, and thus has a problem that cracks and cracks are likely to occur.
  • Patent Document 2 discloses an organic compound such as triallyl isocyanurate containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and at least two SiH groups in one molecule.
  • a curable composition containing a chain-containing and / or cyclic polyorganosiloxane-containing compound and a hydrosilylation catalyst as an essential component is disclosed.
  • the physical properties such as crack resistance of these materials are still not satisfactory.
  • the sealing material of the optical semiconductor element is to have a high barrier property to corrosive gases such as SO X gas is demanded.
  • a metal material such as an electrode in an optical semiconductor device is easily corroded by a corrosive gas, and such corrosion causes a problem that the current-carrying characteristics of the optical semiconductor device (for example, current-carrying characteristics in a high-temperature environment) deteriorate over time. This is because it occurs.
  • the phenyl silicone-based sealing material widely used as a sealing material for optical semiconductor elements has a problem that the barrier property against the corrosive gas is particularly insufficient.
  • the object of the present invention is a material (silicon-based material) excellent in heat resistance, transparency and flexibility, and particularly a cured product excellent in barrier properties against corrosive gas (for example, sulfur oxide). It is providing the curable resin composition which can form.
  • Another object of the present invention is a material excellent in heat resistance, transparency and flexibility, and in particular, a material excellent in barrier properties against a corrosive gas (for example, sulfur oxide) (cured product). Is to provide.
  • another object of the present invention is to provide a sealing agent containing the curable resin composition, and an optical semiconductor device obtained by sealing an optical semiconductor element using the sealing agent. is there.
  • the inventor has disclosed a curable resin composition containing, as an essential component, a polyorganosilsesquioxane having a specific structure and having a molecular weight and molecular weight dispersity controlled within a specific range.
  • the present inventors have found that a cured product having excellent barrier properties against sulfur oxides and the like can be formed.
  • the present invention is a composition
  • Compound ⁇ U> has an aliphatic carbon-carbon unsaturated bond
  • Ladder-type silsesquioxane [A1] which is .40, ladder-type silsesquioxane [B1] having an aliphatic carbon-carbon unsaturated bond other than ladder-type silsesquioxane [A1], aliphatic carbon-carbon It is at least one selected from the group consisting of linear or branched silicone [C1] having an unsaturated bond and cyclic siloxane [E1] having an aliphatic carbon-carbon unsaturated bond, Lad
  • ladder-type silsesquioxane A part or all of the molecular chain terminal of the ladder-type silsesquioxane has the following formula (b-1) [In formula (b-1), R 11 represents a monovalent group containing an aliphatic carbon-carbon double bond. ]
  • the unit structure represented by the following formula (b-2) [In Formula (b-2), R 12 are the same or different and each represents a monovalent hydrocarbon group.
  • the curable resin composition is a ladder-type silsesquioxane having a polyorganosilsesquioxane residue containing a unit structure represented by:
  • ladder-type silsesquioxane [B2] In part or all of the molecular chain terminal of the ladder-type silsesquioxane, the following formula (b-3) [In formula (b-3), X represents a single bond or a linking group.
  • Plural R 13 s are the same or different and each represents a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent sulfur atom-containing group. .
  • a plurality of R 14 are the same or different and each represents a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent sulfur atom-containing group. . n1 represents an integer of 1 to 100.
  • the unit structure represented by the following formula (b-4) [In Formula (b-4), R 15 are the same or different and each represents a monovalent hydrocarbon group.
  • the curable resin composition is a ladder-type silsesquioxane having a polyorganosilsesquioxane residue containing a unit structure represented by:
  • the silicone [C1] is represented by the following formula (c-1a)
  • R 21 to R 26 are the same or different and each represents a hydrogen atom, a monovalent hydrocarbon group, or a monovalent heterocyclic group. However, at least one of R 21 to R 26 is a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • R 27 represents a divalent hydrocarbon group.
  • s1 and s2 each represent an integer of 1 or more.
  • the silicone [C2] is represented by the following formula (c-1b) [In Formula (c-1b), R 21 to R 26 are the same or different and each represents a hydrogen atom, a monovalent hydrocarbon group, or a monovalent heterocyclic group. However, one or more of R 21 to R 26 are hydrogen atoms. R 27 represents a divalent hydrocarbon group. s1 and s2 each represent an integer of 1 or more. ] The said curable resin composition which is silicone containing the structure represented by these is provided.
  • the curable resin composition containing a hydrosilylation catalyst is provided.
  • the isocyanuric acid compound [D] is represented by the following formula (d-2) [In the formula (d-2), R 32 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond. R 33 is the same or different and represents a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms. ] A compound represented by formula (d-3): [In formula (d-3), R 34 is the same or different and represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond. R 35 represents a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms.
  • the curable resin composition is at least one compound selected from the group consisting of compounds represented by:
  • isocyanuric acid compound [D] is monoallyl diglycidyl isocyanuric acid, 1-allyl-3,5-bis (2-methylepoxypropyl) isocyanuric acid, 1- (2-methylpropenyl) -3,5-di.
  • Glycidyl isocyanuric acid 1- (2-methylpropenyl) -3,5-bis (2-methylepoxypropyl) isocyanuric acid, diallyl monoglycidyl isocyanuric acid, 1,3-diallyl-5- (2-methylepoxypropyl) isocyanuric Acid, 1,3-bis (2-methylpropenyl) -5-glycidyl isocyanuric acid, 1,3-bis (2-methylpropenyl) -5- (2-methylepoxypropyl) isocyanuric acid, triallyl isocyanuric acid, tris (2-methylpropenyl) isocyanuric acid, triglycidyl isocyanuric acid, di Chill allyl isocyanurate, diallyl isocyanuric acid, ethyl diallyl isocyanurate, propyl diallyl isocyanuric acid, butyl diallyl isocyanuric acid, phenyl diallyl is
  • the curable resin composition containing a silane coupling agent is provided.
  • curable resin composition which is a resin composition for optical semiconductor encapsulation is provided.
  • the present invention also provides a cured product obtained by curing the curable resin composition.
  • this invention provides the sealing agent containing the said curable resin composition.
  • the present invention also provides an optical semiconductor device obtained by sealing an optical semiconductor element using the above-described sealing agent.
  • the curable resin composition of the present invention has the above configuration, a cured product (silicon-based material) excellent in heat resistance, transparency and flexibility can be formed.
  • the cured product has the property of being excellent in barrier properties against corrosive gases (for example, SO X gas).
  • the curable resin composition of the present invention can be preferably used as a resin composition for optical semiconductor encapsulation, specifically, as an encapsulant for an optical semiconductor element (LED element).
  • An optical semiconductor device obtained by encapsulating an optical semiconductor element using a material has excellent quality and durability.
  • the curable resin composition of the present invention is useful for use as a sealing agent for next-generation light sources, for which heat resistance to an unprecedented high temperature (for example, 180 ° C.
  • the cured product obtained by curing the curable resin composition of the present invention has excellent thermal shock resistance (thermal shock such as a cold cycle is applied) when the curable resin composition has a specific configuration. Even when it is applied, it exhibits a characteristic that it is difficult for cracks to occur.
  • FIG. 1 shows a ladder-type phenylmethylvinylsilsesquide having a vinyl group and a trimethylsilyl group at the terminal, which is a raw material for a ladder-type silsesquioxane having a SiH-containing group and a TMS group at the terminal obtained in Production Example 1. It is a chart of 1 H-NMR spectrum of oxane.
  • FIG. 2 is a chart of 1 H-NMR spectrum of a ladder-type silsesquioxane having a SiH-containing group and a TMS group at the terminal obtained in Production Example 1.
  • FIG. 3 is a chart of 1 H-NMR spectrum of the polyorganosilsesquioxane having a vinyl group obtained in Production Example 2.
  • FIG. 1 shows a ladder-type phenylmethylvinylsilsesquide having a vinyl group and a trimethylsilyl group at the terminal, which is a raw material for a ladder-type silsesquioxane
  • FIG. 4 is a chart of 1 H-NMR spectrum of the polyorganosilsesquioxane having a hydrosilyl group obtained in Production Example 3.
  • FIG. 5 is a diagram showing a sample electrode state (example) corresponding to each of cases where the barrier property against corrosive gas is A to D.
  • FIG. 5 is a diagram showing a sample electrode state (example) corresponding to each of cases where the barrier property against corrosive gas is A to D.
  • the curable resin composition of the present invention includes a compound ⁇ H> having a hydrosilyl group (sometimes simply referred to as “compound ⁇ H>”) and a compound ⁇ U> having an aliphatic carbon-carbon unsaturated bond (simply The composition may include at least “compound ⁇ U>”. Further, the compound ⁇ U> in the curable resin composition of the present invention has an aliphatic carbon-carbon unsaturated bond other than the following ladder-type silsesquioxane [A1] and ladder-type silsesquioxane [A1].
  • the compound ⁇ H> is at least one selected from the group, and the ladder-type silsesquioxane [A2] and ladder-type silsesquioxane [A2] other than the ladder-type silsesquioxane [A2] described below [ B2], a linear or branched silicone having a hydrosilyl group [C2], and a cyclic siloxane having a hydrosilyl group [E2] It is at least one.
  • the curable resin composition of the present invention is a composition containing one or both of the following ladder-type silsesquioxane [A1] and ladder-type silsesquioxane [A2] as an essential component.
  • Ladder-type silsesquioxane [A1] has an aliphatic carbon-carbon unsaturated bond, has a number average molecular weight of 500 to 1500 in terms of standard polystyrene by gel permeation chromatography, and has a molecular weight dispersity (Mw / Mn).
  • the preferable aspect of the curable resin composition of this invention is shown below.
  • the curable resin composition of this invention is not limited to the following aspects.
  • First aspect A curable resin composition containing at least ladder-type silsesquioxane [A1] as compound ⁇ U> and at least ladder-type silsesquioxane [A2] as compound ⁇ H>.
  • Second aspect Curable resin composition containing at least ladder-type silsesquioxane [B1] as compound ⁇ U> and at least ladder-type silsesquioxane [A2] as compound ⁇ H>.
  • curable resin composition containing at least cyclic siloxane [E1] as compound ⁇ U> and at least ladder-type silsesquioxane [A2] as compound ⁇ H>.
  • curable resin composition containing at least ladder-type silsesquioxane [A1] as compound ⁇ U> and at least cyclic siloxane [E2] as compound ⁇ H>.
  • the ladder-type silsesquioxane [A1] and the ladder-type silsesquioxane [A2] may be collectively referred to as “polyorganosilsesquioxane [A]”.
  • the ladder-type silsesquioxane [B1] and the ladder-type silsesquioxane [B2] may be collectively referred to as “ladder-type silsesquioxane [B]”.
  • the above silicone [C1] and silicone [C2] may be collectively referred to as “silicone [C]”.
  • the cyclic siloxane [E1] and the cyclic siloxane [E2] may be collectively referred to as “cyclic siloxane [E]”.
  • the polyorganosilsesquioxane [A] in the curable resin composition of the present invention has an aliphatic carbon-carbon unsaturated bond or a hydrosilyl group in the molecule, and is a number average in terms of standard polystyrene by gel permeation chromatography.
  • Ladder-type silsesquioxane having a molecular weight of 500 to 1500 and a molecular weight dispersity (Mw / Mn) of 1.00 to 1.40 (ladder-type silsesquioxane [A1], ladder-type silsesquioxane [A2] ).
  • the polyorganosilsesquioxane [A] is generally a ladder-type polyorganosilsesquioxane skeleton (ladder-type) represented by an empirical formula (basic structural formula) R A SiO 1.5 as a silsesquioxane skeleton.
  • R A in the above empirical formula represents a hydrogen atom or a monovalent organic group, and examples of the monovalent organic group include those exemplified as R 1a to R 1f in formula (a-1) described later. And a monovalent hydrocarbon group and a monovalent heterocyclic group.
  • polyorganosilsesquioxane [A] is, around 1050 cm -1 in the FT-IR spectrum (e.g., 1000 ⁇ 1100 cm -1) and 1150cm around -1 (e.g., 1200 cm -1 from more than 1100 cm -1), respectively having an intrinsic absorption peak (i.e., 1000 to have at least two absorption peaks at 1200 cm -1) [reference is confirmed by the fact that: R. H. Raney, M.M. Itoh, A.D. Sakakibara and T. Suzuki, Chem. Rev. 95, 1409 (1995)].
  • the FT-IR spectrum of polyorganosilsesquioxane [A] can be measured with the following apparatus and conditions, for example.
  • Measuring device Trade name “FT-720” (manufactured by Horiba, Ltd.) Measurement method: Transmission method Resolution: 4 cm ⁇ 1 Measurement wavenumber range: 400 to 4000 cm ⁇ 1 Integration count: 16 times
  • the polyorganosilsesquioxane [A] may contain other silsesquioxane skeletons as the silsesquioxane skeleton in addition to the ladder-type silsesquioxane skeleton. It may have a silsesquioxane skeleton having a random structure.
  • Polyorganosilsesquioxane [A] has a number average molecular weight (Mn) in terms of standard polystyrene by gel permeation chromatography of 500 to 1500, preferably 550 to 1450, more preferably 600 to 1400.
  • Mn number average molecular weight
  • the number average molecular weight is less than 500, for example, the physical properties (heat resistance, gas barrier properties, etc.) of the cured product tend to be lowered.
  • the number average molecular weight exceeds 1500, it tends to be a solid at room temperature, and the handleability tends to decrease. Moreover, compatibility with other components may deteriorate.
  • Polyorganosilsesquioxane [A] has a molecular weight dispersity (Mw / Mn) in terms of standard polystyrene by gel permeation chromatography of 1.00 to 1.40, preferably 1.35 or less (for example, 1 .05 to 1.35), more preferably 1.30 or less (for example, 1.10 to 1.30).
  • Mw / Mn molecular weight dispersity
  • the molecular weight dispersity exceeds 1.40, for example, low-molecular siloxane increases, and the adhesion and gas barrier properties tend to decrease.
  • the molecular weight dispersity for example, by setting the molecular weight dispersity to 1.05 or more, it tends to be liquid at room temperature, and the handleability may be improved.
  • the number average molecular weight and molecular weight dispersion degree of polyorganosilsesquioxane [A] can be measured with the following apparatus and conditions, for example.
  • Measuring device Product name “LC-20AD” (manufactured by Shimadzu Corporation) Columns: Shodex KF-801 ⁇ 2, KF-802, and KF-803 (manufactured by Showa Denko KK) Measurement temperature: 40 ° C Eluent: THF, sample concentration 0.1 to 0.2% by weight Flow rate: 1 mL / min Detector: UV-VIS detector (trade name “SPD-20A”, manufactured by Shimadzu Corporation) Molecular weight: Standard polystyrene conversion
  • the 5% weight loss temperature (T d5 ) of the polyorganosilsesquioxane [A] in a nitrogen atmosphere is not particularly limited, but is preferably 150 ° C. or higher, more preferably 240 ° C. or higher, and still more preferably 260 to 500 ° C. Particularly preferably, the temperature is 262 ° C. or higher, and most preferably 265 ° C. or higher. If the 5% weight loss temperature is less than 150 ° C. (particularly less than 240 ° C.), the required heat resistance may not be satisfied depending on the application.
  • the 5% weight reduction temperature is a temperature at the time when 5% of the weight before heating is reduced when heated at a constant temperature rising temperature, and serves as an index of heat resistance. The 5% weight loss temperature can be measured, for example, by TGA (thermogravimetric analysis) under a nitrogen atmosphere under a temperature increase rate of 20 ° C./min.
  • the polyorganosilsesquioxane [A] is not particularly limited, but is preferably liquid at room temperature (25 ° C.).
  • the viscosity of polyorganosilsesquioxane [A] at 25 ° C. is not particularly limited, but is preferably 30,000 Pa ⁇ s or less (for example, 1 to 30,000 Pa ⁇ s), more preferably 25 10000 Pa ⁇ s or less, more preferably 10,000 Pa ⁇ s or less.
  • the viscosity is measured using, for example, a viscometer (trade name “MCR301”, manufactured by Anton Paar) under conditions of a swing angle of 5%, a frequency of 0.1 to 100 (1 / s), and a temperature of 25 ° C. be able to.
  • the polyorganosilsesquioxane [A] is, for example, represented by the following formula (a-1), and has a hydrosilyl group or an aliphatic carbon-carbon unsaturated bond in the molecule, and is obtained by gel permeation chromatography.
  • Ladder-type silsesquioxane (ladder-type silsesquioxane [A1]) having a number average molecular weight (Mn) of 500 to 1500 in terms of standard polystyrene and a molecular weight dispersity (Mw / Mn) of 1.00 to 1.40, Ladder type silsesquioxane [A2]).
  • R 1a to R 1f are each a hydrogen atom, a monovalent hydrocarbon group, or one A valent heterocyclic group is shown.
  • R 1a to R 1f may be the same group or different groups.
  • the monovalent hydrocarbon group include a monovalent aliphatic hydrocarbon group; a monovalent alicyclic hydrocarbon group; a monovalent aromatic hydrocarbon group; an aliphatic hydrocarbon group and an alicyclic carbon group. And a monovalent group in which two or more of a hydrogen group and an aromatic hydrocarbon group are bonded.
  • the monovalent heterocyclic group include a pyridyl group, a furyl group, a thienyl group, and the like.
  • Examples of the monovalent aliphatic hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group.
  • Examples of the alkyl group include linear or branched C 1-20 such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, hexyl group, octyl group, isooctyl group, decyl group, and dodecyl group.
  • Examples thereof include an alkyl group (preferably a C 1-10 alkyl group, more preferably a C 1-4 alkyl group).
  • alkenyl group examples include vinyl group, allyl group, methallyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 1-pentenyl group and 2-pentenyl group.
  • C 2-20 alkenyl groups preferably C 2-10 alkenyl groups, more preferably C 2-4 alkenyl groups
  • alkynyl group examples include C 2-20 alkynyl groups such as ethynyl group and propynyl group (preferably C 2-10 alkynyl group, more preferably C 2-4 alkynyl group).
  • the monovalent alicyclic hydrocarbon group described above for example, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, a cycloalkyl group of C 3-12, such as cyclododecyl; such as cyclohexenyl group C 3- 12 cycloalkenyl groups; C 4-15 bridged cyclic hydrocarbon groups such as bicycloheptanyl group and bicycloheptenyl group.
  • C6-14 aryl groups (especially C6-10 aryl group), such as a phenyl group, a naphthyl group, an anthryl group, etc. are mentioned, for example.
  • Examples of the group in which an aliphatic hydrocarbon group and an alicyclic hydrocarbon group are bonded include a cyclohexylmethyl group and a methylcyclohexyl group.
  • Examples of the group in which an aliphatic hydrocarbon group and an aromatic hydrocarbon group are bonded include a C 7-18 aralkyl group (particularly a C 7-10 aralkyl group) such as a benzyl group and a phenethyl group, and a C 6-10 such as a cinnamyl group.
  • C 1-4 alkyl-substituted aryl groups such as aryl-C 2-6 alkenyl group and tolyl group, C 2-4 alkenyl-substituted aryl groups such as styryl group, and the like.
  • the monovalent hydrocarbon group may have a substituent. That is, the monovalent hydrocarbon group may be a monovalent hydrocarbon group in which at least one hydrogen atom of the monovalent hydrocarbon group exemplified above is replaced with a substituent.
  • the substituent preferably has 0 to 20 carbon atoms, and more preferably 0 to 10 carbon atoms.
  • substituents include a halogen atom; a hydroxyl group; an alkoxy group; an alkenyloxy group; an aryloxy group; an aralkyloxy group; an acyloxy group; a mercapto group; an alkylthio group; Aroxy group; carboxyl group; alkoxycarbonyl group; aryloxycarbonyl group; aralkyloxycarbonyl group; amino group; mono or dialkylamino group; mono or diphenylamino group; acylamino group; epoxy group-containing group; Group; oxo group; isocyanate group; a group in which two or more of these are bonded via a C 1-6 alkylene group as necessary.
  • alkoxy group examples include a C 1-6 alkoxy group (preferably a C 1-4 alkoxy group) such as a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group, a butoxy group, and an isobutyloxy group.
  • alkenyloxy group examples include C 2-6 alkenyloxy groups (preferably C 2-4 alkenyloxy groups) such as an allyloxy group.
  • Examples of the aryloxy group include substitution of a C 1-4 alkyl group, a C 2-4 alkenyl group, a halogen atom, a C 1-4 alkoxy group and the like on the aromatic ring such as a phenoxy group, a tolyloxy group, and a naphthyloxy group. And a C 6-14 aryloxy group which may have a group.
  • Examples of the aralkyloxy group for example, benzyloxy group, etc. C 7-18 aralkyloxy groups such as phenethyloxy group.
  • Examples of the acyloxy group include C 1-12 acyloxy groups such as an acetyloxy group, a propionyloxy group, a (meth) acryloyloxy group, and a benzoyloxy group.
  • alkylthio group examples include a C 1-6 alkylthio group (preferably a C 1-4 alkylthio group) such as a methylthio group and an ethylthio group.
  • alkenylthio group examples include a C 2-6 alkenylthio group (preferably a C 2-4 alkenylthio group) such as an allylthio group.
  • arylthio group examples include, for example, a phenylthio group, a tolylthio group, a naphthylthio group, and the like, and a substituent such as a C 1-4 alkyl group, a C 2-4 alkenyl group, a halogen atom, and a C 1-4 alkoxy group on the aromatic ring. Examples thereof include a C 6-14 arylthio group which may have.
  • aralkylthio group examples include C 7-18 aralkylthio groups such as a benzylthio group and a phenethylthio group.
  • alkoxycarbonyl group examples include C 1-6 alkoxy-carbonyl groups such as a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, and a butoxycarbonyl group.
  • aryloxycarbonyl group examples include C 6-14 aryloxy-carbonyl groups such as a phenoxycarbonyl group, a tolyloxycarbonyl group, and a naphthyloxycarbonyl group.
  • aralkyloxycarbonyl group examples include a C 7-18 aralkyloxy-carbonyl group such as a benzyloxycarbonyl group.
  • Examples of the mono- or dialkylamino group include mono- or di-C 1-6 alkylamino groups such as a methylamino group, an ethylamino group, a dimethylamino group, and a diethylamino group.
  • Examples of the acylamino group include C 1-11 acylamino groups such as an acetylamino group, a propionylamino group, and a benzoylamino group.
  • Examples of the epoxy group-containing group include a glycidyl group, a glycidyloxy group, and a 3,4-epoxycyclohexyl group.
  • As said oxetanyl group containing group an ethyl oxetanyloxy group etc. are mentioned, for example.
  • As said acyl group an acetyl group, a propionyl group, a benzoyl group etc. are mentioned, for example.
  • Examples of the halogen atom include a chlorine atom, a bromine atom, and an iodine atom.
  • the monovalent heterocyclic group may have a substituent.
  • substituent the thing similar to the substituent which the said monovalent hydrocarbon group may have is illustrated.
  • the monovalent hydrocarbon group and monovalent heterocyclic group more specifically, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, hexyl group, octyl group, decyl group, Phenyl group, naphthyl group, anthryl group, benzyl group, phenethyl group, pyridyl group, furyl group, thienyl group, vinyl group, allyl group, styryl group (for example, p-styryl group), hydrocarbon group having a substituent (for example, 2- (3,4-epoxycyclohexyl) ethyl group, 3-glycidylpropyl group, 3-methacryloxypropyl group, 3-acryloxypropyl group, N-2- (aminoethyl) -3-aminopropyl group, 3 -Aminopropyl group, N-phenyl-3-aminoprop
  • polyorganosilsesquioxane [A] is an aromatic hydrocarbon group (monovalent aromatic hydrocarbon group) and aliphatic as R 1a to R 1f in the above formula (a-1). It is preferable to have at least one group selected from the group consisting of hydrocarbon groups (monovalent aliphatic hydrocarbon groups), more preferably selected from the group consisting of alkyl groups, aryl groups, and alkenyl groups. It has at least one group, and more preferably has at least one group selected from the group consisting of a phenyl group, a vinyl group, and a methyl group.
  • R 1a to R 1f hydrogen atom, monovalent hydrocarbon group, monovalent heterocyclic group
  • a-1 polyorganosilsesquioxane
  • the ratio of the phenyl group, vinyl group and methyl group (total content) is not particularly limited, but is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, and still more preferably 80 to 100% by weight. It is.
  • R 1a to R 1f hydrocarbon group, monovalent heterocyclic group
  • the ratio (content) of the phenyl group is not particularly limited, but is preferably 0 to 100% by weight, more preferably 1 to 100% by weight, and further preferably 5 to 100% by weight.
  • R 1a to R 1f hydrocarbon group, monovalent heterocyclic group
  • the ratio (content) of the vinyl group is not particularly limited, but is preferably 0 to 100% by weight, more preferably 1 to 100% by weight, still more preferably 5 to 90% by weight, and particularly preferably 10 to 80% by weight. %.
  • R 1a to R 1f hydrocarbon group, monovalent heterocyclic group
  • the ratio (content) of the methyl group is not particularly limited, but is preferably 0 to 100% by weight, more preferably 1 to 100% by weight, and further preferably 5 to 100% by weight.
  • composition of R 1a to R 1f (hydrogen atom, monovalent hydrocarbon group, monovalent heterocyclic group) in the above formula (a-1) of polyorganosilsesquioxane [A] (for example, phenyl
  • the ratio of groups, vinyl groups, methyl groups, etc. can be calculated by, for example, NMR spectrum (eg, 1 H-NMR spectrum) measurement.
  • R a to R d are each a hydrogen atom, a linear or branched alkyl group, and the following formula (a- The monovalent group represented by 2), the monovalent group represented by the following formula (a-3), or the monovalent group represented by the following formula (a-4) is shown.
  • R 2a and R 2b each represent a hydrogen atom or a monovalent hydrocarbon group.
  • Examples of the monovalent hydrocarbon group for R 2a and R 2b are the same as the monovalent hydrocarbon group for R 1a to R 1f .
  • R 2a and R 2b a monovalent aliphatic hydrocarbon group is preferable, and an alkyl group is more preferable.
  • R 2a and R 2b may be the same group or different groups.
  • R 2c and R 2d each represent a monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group for R 2c and R 2d are the same as the monovalent hydrocarbon group for R 1a to R 1f .
  • R 2c and R 2d a monovalent aliphatic hydrocarbon group is preferable, and an alkyl group is more preferable.
  • R 2c and R 2d may be the same group or different groups.
  • p1 represents an integer of 0 or more. p1 is preferably 0 to 5, more preferably 0 to 3, and still more preferably 0.
  • R 3a and R 3b each represent a hydrogen atom or a monovalent hydrocarbon group.
  • Examples of the monovalent hydrocarbon group for R 3a and R 3b are the same as the monovalent hydrocarbon group for R 1a to R 1f .
  • R 3a and R 3b a monovalent aliphatic hydrocarbon group is preferable, and an alkyl group is more preferable.
  • R 3a and R 3b may be the same group or different groups.
  • R 3c and R 3d each represent a monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group for R 3c and R 3d are the same as the monovalent hydrocarbon group for R 1a to R 1f .
  • R 3c and R 3d a monovalent aliphatic hydrocarbon group is preferable, and an alkyl group is more preferable.
  • R 3c and R 3d may be the same group or different groups.
  • R 3e represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • p2 represents an integer of 0 or more. p2 is preferably 0 to 5, more preferably 0 to 3, and still more preferably 0.
  • Examples of the monovalent group containing an aliphatic carbon-carbon unsaturated bond include a vinyl group, allyl group, methallyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3- Alkenyl groups such as butenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group and 5-hexenyl group; alkynyl groups such as ethynyl group and propynyl group; cycloalkenyl groups such as cyclohexenyl group Other groups having the above alkenyl group, alkynyl group, cycloalkenyl group (for example, acrylic group, methacryl group, 2-allylphenyl group, 3-allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group); 3- (allyloxy) phenyl group, 4- (allyloxy) pheny
  • R 4a and R 4b each represent a hydrogen atom or a monovalent hydrocarbon group.
  • Examples of the monovalent hydrocarbon group for R 4a and R 4b are the same as the monovalent hydrocarbon group for R 1a to R 1f .
  • R 4a and R 4b a monovalent aliphatic hydrocarbon group is preferable, and an alkyl group is more preferable.
  • R 4a and R 4b may be the same group or different groups.
  • R 4c to R 4e each represent a monovalent saturated aliphatic hydrocarbon group.
  • Examples of the monovalent saturated aliphatic hydrocarbon group for R 4 c to R 4e include the same monovalent saturated aliphatic hydrocarbon groups as R 1a to R 1f (for example, an alkyl group and a cycloalkyl group). Is done. Among these, as R 4c to R 4e , an alkyl group is preferable. R 4c to R 4e may be the same group or different groups.
  • p3 represents an integer of 0 or more. p3 is preferably 0 to 5, more preferably 0 to 3, and still more preferably 0.
  • n represents an integer of 0 or more.
  • the n is usually an even number of 0 or more (for example, an even number of 2 or more).
  • the n is not particularly limited as long as the number average molecular weight of the polyorganosilsesquioxane [A] is controlled to 500 to 1500 and the molecular weight dispersity is controlled to 1.00 to 1.40.
  • the polyorganosilsesquioxane [A] exceeds 1.00, the polyorganosilsesquioxane [A] is generally represented by the formula (a-1).
  • the polyorganosilsesquioxane [A] preferably contains a component having n of 1 or more (particularly 2 or more) as an essential component.
  • examples of the ladder-type silsesquioxane [A1] include R 1a to R 1f in the above formula (a-1). Any one of which is a group containing an aliphatic carbon-carbon unsaturated bond (for example, an alkenyl group, an alkynyl group, a cycloalkenyl group, etc.), and any of R 2a to R 2d is an aliphatic carbon-carbon unsaturated bond A group having a monovalent group represented by the formula (a-2), a group having a monovalent group represented by the formula (a-3), or any of R 4a and R 4b Examples thereof include those having a monovalent group represented by the formula (a-4) which is a group containing an aliphatic carbon-carbon unsaturated bond.
  • the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond, it has excellent reactivity (reactivity in hydrosilylation reaction) with respect to a compound having a hydrosilyl group (compound ⁇ H>).
  • the number of groups (for example, alkenyl groups) containing an aliphatic carbon-carbon unsaturated bond in the ladder-type silsesquioxane [A1] is not particularly limited as long as it is 1 or more, but 2 or more. (For example, 2 to 50) is preferable, and 2 to 30 is more preferable.
  • aliphatic carbon having the ladder-type silsesquioxane [A1] can be calculated by 1 H-NMR spectrum measurement and the like.
  • the ladder-type silsesquioxane [A1] may have a hydrosilyl group in the molecule.
  • the ladder-type silsesquioxane [A1] is replaced with the ladder-type silsesquioxane [A2]. ] May be used.
  • examples of the ladder-type silsesquioxane [A2] include R 1a to R 1f in the above formula (a-1). Any one of which is a hydrogen atom, one having a monovalent group represented by formula (a-2), or any one of R 3a and R 3b represented by formula (a-3) And those having a monovalent group represented by the formula (a-4) in which one of R 4a and R 4b is a hydrogen atom.
  • the ladder-type silsesquioxane [A2] has excellent reactivity (reactivity in hydrosilylation reaction) with respect to a compound having an aliphatic carbon-carbon unsaturated bond (compound ⁇ U>).
  • the number of hydrosilyl groups in the molecule of the ladder-type silsesquioxane [A2] is not particularly limited as long as it is 1 or more, but is preferably 2 or more (for example, 2 to 50), more preferably 2 ⁇ 30.
  • the number of hydrosilyl groups possessed by the ladder type silsesquioxane [A2] can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the ladder-type silsesquioxane [A2] may have an aliphatic carbon-carbon unsaturated bond in the molecule.
  • the ladder-type silsesquioxane [A2] is a ladder type. In some cases, it can be used as silsesquioxane [A1].
  • the polyorganosilsesquioxane [A] is not particularly limited, but is a well-known and commonly used method such as JP-A-4-28722, JP-A-2010-518182, JP-A-5-39357, and JP-A-2004. -99872, International Publication No. 1997/007156, Japanese Unexamined Patent Publication No. 11-246661, Japanese Unexamined Patent Publication No. 9-20826, International Publication No. 2006/033147, Japanese Unexamined Patent Publication No. 2005-239829, and the like. It can be manufactured by a method or the like.
  • polyorganosilsesquioxane [A] can be manufactured by the manufacturing method which includes the following 1st process as an essential process, for example, and also includes the following 2nd process as needed.
  • First step a step of subjecting the compound represented by the formula (a-I) to a hydrolysis reaction and a condensation reaction.
  • Second step a step of further reacting a silylating agent after the first step.
  • R 1 in the above formula (a-I) represents a hydrogen atom or an organic group (monovalent organic group).
  • organic group include monovalent hydrocarbon groups and monovalent heterocyclic groups exemplified as R 1a to R 1f in formula (a-1).
  • R 1 is preferably an aromatic hydrocarbon group or an aliphatic hydrocarbon group, more preferably an alkyl group, an aryl group, or an alkenyl group, still more preferably a methyl group, a phenyl group, or a vinyl group.
  • R 5 in the above formula (a-I) represents a monovalent hydrocarbon group.
  • the monovalent hydrocarbon group include monovalent hydrocarbon groups and monovalent heterocyclic groups exemplified as R 1a to R 1f in the formula (a-1), and among them, an alkyl group Is preferred.
  • alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, s-butyl group, t-butyl group, pentyl group, hexyl group, heptyl group, octyl group, 2- An alkyl group having 1 to 20 carbon atoms such as ethylhexyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group, etc.
  • R 5 is preferably an alkyl group having 1 to 6 carbon atoms, more preferably a methyl group or an ethyl group, from the viewpoint of reactivity in the first step.
  • three R 5 in the compound represented by the above formula (a-I) may be the same or different.
  • Specific examples of the compound represented by the formula (a-I) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, propyltriethoxysilane, isopropyltrimethoxysilane, and butyltriethoxy.
  • Silane hexyltrimethoxysilane, hexyltriethoxysilane, octyltrimethoxysilane, decyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, naphthyltrimethoxysilane, anthryltrimethoxysilane, benzyltrimethoxysilane, phenethyltri Methoxysilane, pyridyltrimethoxysilane, furyltriethoxysilane, thienyltrimethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysila Allyltriethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidylpropyltrimethoxysilane, 3-glycidy
  • the compound represented by the formula (a-I) can be used alone or in combination of two or more. That is, the type and ratio (composition) of the compound represented by the formula (aI) to be used depend on the type and ratio (composition) of the organic group of the polyorganosilsesquioxane [A] to be produced. Can be appropriately selected.
  • the first step in the method for producing the polyorganosilsesquioxane [A] is a step of producing polyorganosilsesquioxane having at least a ladder-type silsesquioxane skeleton and having controlled number average molecular weight and molecular weight dispersity. It is. Specifically, it is a step of generating a ladder-type silsesquioxane skeleton by performing a hydrolysis reaction and a condensation reaction of the compound represented by the formula (a-I).
  • the reaction of the compound represented by formula (a-I) in the first step for example, reaction temperature, reaction time, use of water (addition) And a method of appropriately adjusting the process conditions such as the amount of water used, the amount of catalyst used (addition), the type of catalyst, the amount of catalyst used, the type of solvent and the amount of solvent used.
  • the method further includes two or more steps having different process conditions. For example, when three steps are included, the first step is performed at a low reaction temperature, the next step is performed at a moderate reaction temperature, and the last step is performed at a high reaction temperature.
  • a method for appropriately adjusting the reaction temperature may be used.
  • the two or more processes may be performed continuously or in stages.
  • a method of appropriately adjusting the reaction temperature and reaction time can be mentioned. For example, even when a phenyl group is included as the organic group, by adjusting the reaction temperature and reaction time as appropriate, a viscosity comparable to that when the organic group includes a vinyl group or a methyl group can be achieved. it can.
  • the reaction in the first step can be carried out in the presence or absence of a solvent.
  • a solvent include aromatic hydrocarbons such as benzene, toluene, xylene and ethylbenzene; ethers such as diethyl ether, dimethoxyethane, tetrahydrofuran and dioxane; ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone; methyl acetate and ethyl acetate.
  • Esters such as isopropyl acetate and butyl acetate; amides such as N, N-dimethylformamide and N, N-dimethylacetamide; nitriles such as acetonitrile, propionitrile and benzonitrile; alcohols such as methanol, ethanol, isopropyl alcohol and butanol Etc.
  • ketone ketone solvent
  • a solvent can be used individually by 1 type or in combination of 2 or more types.
  • the amount of the solvent used is not particularly limited, but is appropriately within a range of 0 to 50 parts by weight with respect to 100 parts by weight of the compound represented by formula (a-I) depending on the desired reaction time and the like. Can be adjusted.
  • the amount of water used is not particularly limited, but is 0.5 to 6.0 moles with respect to 1 mole of the compound represented by the formula (a-I). Within the range, it can be adjusted as appropriate.
  • the method for adding water is not particularly limited, and the total amount of water to be used (total amount used) may be added all at once or sequentially. When adding sequentially, you may add continuously and may add intermittently.
  • the first step can be performed in the presence of a catalyst, if necessary.
  • the catalyst may be an acid catalyst or an alkali catalyst.
  • the acid catalyst include mineral acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid and boric acid; phosphoric acid esters; carboxylic acids such as acetic acid, formic acid and trifluoroacetic acid; methanesulfonic acid, trifluoromethanesulfonic acid, p -Sulfonic acids such as toluenesulfonic acid; solid acids such as activated clay; Lewis acids such as iron chloride.
  • an acid catalyst can be used individually by 1 type or in combination of 2 or more types.
  • an acid catalyst can also be used in the state melt
  • the alkali catalyst include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, potassium hydroxide, and cesium hydroxide; alkaline earth metals such as magnesium hydroxide, calcium hydroxide, and barium hydroxide.
  • Hydroxides carbonates of alkali metals such as lithium carbonate, sodium carbonate, potassium carbonate, cesium carbonate; carbonates of alkaline earth metals such as magnesium carbonate; lithium hydrogen carbonate, sodium hydrogen carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate Alkali metal hydrogen carbonates such as cesium hydrogen carbonate; organic acid salts of alkali metals such as lithium acetate, sodium acetate, potassium acetate and cesium acetate (for example, acetate); organic acids of alkaline earth metals such as magnesium acetate Salt (eg acetate); lithium methoxide, sodium methoxy Alkali metal alkoxides such as sodium ethoxide, sodium isopropoxide, potassium ethoxide and potassium t-butoxide; alkali metal phenoxides such as sodium phenoxide; triethylamine, N-methylpiperidine, 1,8-diazabicyclo [5.4 0.0] undec-7-ene, 1,5-diazabicyclo [4.3
  • the amount of the catalyst used is not particularly limited, but can be appropriately adjusted within a range of 0.002 to 0.200 mol per 1 mol of the compound represented by the formula (a-I).
  • the reaction temperature in the first step is not particularly limited, but can be appropriately adjusted within a range of 0 to 80 ° C., for example.
  • the reaction temperature can be appropriately adjusted to 0 to 20 ° C. in the first step and 40 to 80 ° C. in the next step.
  • the reaction time in the first step is not particularly limited, but can be appropriately adjusted within a range of 10 to 720 minutes, for example.
  • the reaction time can be adjusted as appropriate, such as 30 to 180 minutes in the first step and 60 to 360 minutes in the next step.
  • the atmosphere at the time of carrying out the first step is not particularly limited, and may be, for example, a nitrogen atmosphere or an argon atmosphere.
  • a polyorganosilsesquioxane containing at least a ladder-type silsesquioxane skeleton is obtained by subjecting the compound represented by the formula (a-I) in the first step to a hydrolysis reaction and a condensation reaction.
  • the polyorganosilsesquioxane obtained in the first step can be obtained as polyorganosilsesquioxane [A] (that is, polyorganosilsesquioxane [A]
  • the polyorganosilsesquioxane obtained in the step may be obtained), and the product obtained by subjecting the polyorganosilsesquioxane to the second step is obtained as polyorganosilsesquioxane [A].
  • the polyorganosilsesquioxane obtained in the first step is usually a unit structure represented by the formula (ai) (referred to as “T2 form”) and a unit structure represented by the formula (a-ii). (Referred to as “T3 body”).
  • R 1 in the formula (ai) or the formula (a-ii) represents a hydrogen atom or an organic group (monovalent organic group).
  • the organic group is not particularly limited, and examples thereof include monovalent hydrocarbon groups and monovalent heterocyclic groups exemplified as R 1a to R 1f in Formula (a-1).
  • R 6 in the formula (ai) represents a hydrogen atom or a monovalent hydrocarbon group.
  • the monovalent hydrocarbon group include monovalent hydrocarbon groups and monovalent heterocyclic groups exemplified as R 1a to R 1f in the formula (a-1), and in particular, linear or branched A chain alkyl group is preferred.
  • the linear or branched alkyl group include linear or branched groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a hexyl group, an octyl group, an isooctyl group, a decyl group, and a dodecyl group. Examples thereof include a chain-like C 1-20 alkyl group (preferably a C 1-10 alkyl group, more preferably a C 1-4 alkyl group).
  • Ratio of unit structure (T2 body) represented by formula (ai) and unit structure (T3 body) represented by formula (ai) of the polyorganosilsesquioxane obtained in the first step [T3 / T2] is not particularly limited, but is preferably 0.4 to 1.5, more preferably 0.5 to 1.5, still more preferably 0.6 to 1.4, and particularly preferably 0. .7 to 1.3.
  • the two oxygen atoms located above and below the silicon atom of the T2 body are each bonded to another silicon atom (a silicon atom not shown in the formula (ai)).
  • each of the three oxygen atoms shown in the T3 body is bonded to another silicon atom (a silicon atom not shown in the formula (a-ii)).
  • T3 body / T2 body When the T3 body / T2 body is less than 0.4, for example, the physical properties (heat resistance, flexibility, transparency, gas barrier properties, etc.) of the cured product of polyorganosilsesquioxane tend to be lowered. On the other hand, when T3 body / T2 body exceeds 1.5, it tends to be solid at room temperature, and the handleability tends to be lowered. Moreover, compatibility with other components may deteriorate.
  • Ratio of unit structure (T2 body) represented by formula (ai) and unit structure (T3 body) represented by formula (ai) of the polyorganosilsesquioxane obtained in the first step [T3 body / T2 body] can be determined by, for example, 29 Si-NMR spectrum measurement.
  • the silicon atom in the unit structure (T2 form) represented by the formula (ai) and the silicon atom in the unit structure (T3 form) represented by the formula (a-ii) are:
  • the above ratio [T3 body / T2 body] is obtained by calculating the integration ratio of these respective peaks.
  • the polyorganosilsesquioxane obtained in the first step has one or two selected from the group consisting of a phenyl group and a vinyl group as an organic group
  • the signal of the silicon atom in the unit structure (T2 form) represented by the formula (ai) appears at ⁇ 65 to ⁇ 74 ppm
  • the silicon in the unit structure (T3 form) represented by the formula (a-ii) appears at -75 to -82 ppm.
  • the ratio [T3 body / T2 body] can be obtained by calculating the integral ratio of the signal (T3 body) of ⁇ 75 to ⁇ 82 ppm and the signal (T2 body) of ⁇ 65 to ⁇ 74 ppm. it can.
  • the polyorganosilsesquioxane obtained in the first step has a methyl group as an organic group
  • the signal of the silicon atom in the unit structure (T2 body) represented by the formula (ai) Appears at ⁇ 50 to ⁇ 60 ppm
  • the signal of the silicon atom in the unit structure (T3 form) represented by the formula (a-ii) appears at ⁇ 60 to ⁇ 70 ppm.
  • the ratio [T3 body / T2 body] can be obtained by calculating the integral ratio of the signal (T3 body) of -60 to -70 ppm and the signal (T2 body) of -50 to -60 ppm. it can.
  • the ratio [T3 body / T2 body] is around 0.5
  • the 29 Si-NMR spectrum of the polyorganosilsesquioxane obtained in the first step can be measured, for example, with the following apparatus and conditions.
  • Measuring apparatus Trade name “JNM-ECA500NMR” (manufactured by JEOL Ltd.)
  • Solvent Deuterated chloroform Accumulated times: 1800 times Measurement temperature: 25 ° C
  • the polyorganosilsesquioxane obtained in the first step is not particularly limited.
  • the polyorganosilsesquioxane is represented by the formula (a-1), and R a to R d are a hydrogen atom or a monovalent hydrocarbon group. It is preferable that a certain polyorganosilsesquioxane is included, and it is more preferable that the polyorganosilsesquioxane is included as a main component (for example, 50% by weight or more is included in the total amount of polyorganosilsesquioxane).
  • the ratio [T3 body / T2 body] of the unit structure (T2 body) represented by the formula (ai) and the unit structure (T3 body) represented by the formula (a-ii) is 0.4 to 1.
  • the polyorganosilsesquioxane obtained in the first step is represented by the formula (a-1), and R a to R d are a hydrogen atom or a monovalent hydrocarbon group. It can be said that polyorganosilsesquioxane, which is
  • silylating agent used in the second step of the method for producing polyorganosilsesquioxane [A] a well-known and commonly used silylating agent can be used, and is not particularly limited.
  • the silylating agent it is particularly preferable to use a compound represented by the following formula (a-II) or a compound represented by the following formula (a-III) as the silylating agent.
  • a-II a monovalent group represented by the above formula (a-2) is introduced into the resulting polyorganosilsesquioxane [A].
  • the compound represented by the formula (a-III) when the compound represented by the formula (a-III) is used, the resulting polyorganosilsesquioxane [A] has a monovalent group represented by the above formula (a-3). be introduced.
  • R 2a and R 2b are the same or different and represent a hydrogen atom or a monovalent hydrocarbon group as in the above formula (a-2).
  • R 2e to R 29 are the same or different and each represents a hydrogen atom or a monovalent hydrocarbon group.
  • R 2c and R 2d are the same or different and represent a monovalent hydrocarbon group as in the above formula (a-2).
  • p1 represents an integer of 0 or more, as in the case of the above formula (a-2).
  • Specific examples of the compound represented by the formula (a-II) include tetramethyldihydrosiloxane (for example, 1,1,3,3-tetramethyldisiloxane), 1,1,1,3, and the like. 3-pentamethyldisiloxane, 1,1,3,3,5,5-hexamethyltrisiloxane, 1,1,3,3,5,5,7,7-octamethyltetrasiloxane, 1,1,3 3,5,5,7,7,9,9-decamethylpentasiloxane and the like.
  • R 3a and R 3b are the same or different and represent a hydrogen atom or a monovalent hydrocarbon group as in the above formula (a-3).
  • R 3f to R 3h are the same or different and each represents a hydrogen atom or a monovalent hydrocarbon group.
  • R 3c and R 3d are the same or different and represent a monovalent hydrocarbon group as in the above formula (a-3).
  • R 3e represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond as in the above formula (a-3).
  • p2 represents an integer of 0 or more, as in the case of the above formula (a-3).
  • the compound represented by the formula (a-III) include tetramethyldivinyldisiloxane (for example, 1,1,3,3-tetramethyldivinyldisiloxane), 1,1,1, 3,3-pentamethyldivinyldisiloxane, 1,1,3,3,5,5-hexamethyldivinyltrisiloxane, 1,1,3,3,5,5,7,7-octamethyldivinyltetrasiloxane, Examples include 1,1,3,3,5,5,7,7,9,9-decamethyldivinylpentasiloxane.
  • tetramethyldivinyldisiloxane for example, 1,1,3,3-tetramethyldivinyldisiloxane
  • 1,1,1,3,3-pentamethyldivinyldisiloxane 1,1,1, 3,3-pentamethyldivinyldisiloxane
  • the silylating agent used in the second step includes a compound represented by the formula (a-II), a silylating agent other than the compound represented by the formula (a-III) (“other silylating agent” and May be used or used together.
  • other silylating agents well-known and conventional silylating agents can be used, for example, hexamethyldisiloxane, 1,1,1,3,3,3-hexamethyldisilazane, octamethyltrisiloxane, decamethyl. Examples include tetrasiloxane and chlorotrimethylsilane.
  • a monovalent group represented by the formula (a-4) is introduced into the polyorganosilsesquioxane [A]. it can.
  • R 4a and R 4b are the same or different and represent a hydrogen atom or a monovalent hydrocarbon group as in the above formula (a-4).
  • R 4f to R 4h are the same or different and each represents a hydrogen atom or a monovalent hydrocarbon group.
  • R 4c to R 4e are the same or different and represent a monovalent saturated aliphatic hydrocarbon group as in the above formula (a-4).
  • p3 represents an integer of 0 or more, as in the case of the above formula (a-4).
  • the amount of the silylating agent is the polyorganosilsesquioxane [A ] Can be suitably adjusted according to the structure of
  • a silylating agent can be used individually by 1 type or in combination of 2 or more types.
  • the reaction of the polyorganosilsesquioxane obtained in the first step and the silylating agent can be carried out in a solvent.
  • the solvent include, but are not limited to, alicyclic hydrocarbons such as cyclohexane; aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene; ethers such as diethyl ether, dimethoxyethane, tetrahydrofuran, and dioxane; acetone, methyl ethyl ketone , Ketones such as methyl isobutyl ketone; esters such as methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate; amides such as N, N-dimethylformamide, N, N-dimethylacetamide; acetonitrile, propionitrile, benzonitrile, etc.
  • the solvent is preferably a solvent capable of dissolving both the polyorganosilsesquioxane obtained in the first step and the silylating agent, and more preferably a ketone (ketone solvent).
  • a solvent can be used individually by 1 type or in combination of 2 or more types.
  • reaction temperature It is preferably 40 to 80 ° C, more preferably 45 to 80 ° C, still more preferably 50 to 80 ° C.
  • the reaction time is not particularly limited, but is preferably 10 to 720 minutes, more preferably 60 to 480 minutes, and further preferably 120 to 300 minutes.
  • the atmosphere which implements the said reaction should just be a thing which does not inhibit reaction, and is not specifically limited, For example, nitrogen atmosphere, argon atmosphere, etc. are mentioned.
  • the reaction of the polyorganosilsesquioxane obtained in the first step and the silylating agent can be carried out in one step, or can be carried out in two or more steps.
  • the structure of the polyorganosilsesquioxane obtained in the first step For example, the terminal structure; for example, R a to R d in formula (a-1) has two or more types of structures (for example, monovalent monomers represented by the above formulas (a-2) to (a-4)). It is possible to introduce two or more of the groups).
  • the second step by reacting the polyorganosilsesquioxane obtained in the first step with the silylating agent, silanol groups or alkoxys possessed by the polyorganosilsesquioxane obtained in the first step.
  • a polyorganosilsesquioxane in which a silyl group is silylated is produced and can be obtained as polyorganosilsesquioxane [A]. That is, the polyorganosilsesquioxane [A] is a Si-OR 6 group (R 6 is a hydrogen atom or a monovalent carbonization as described above) of the polyorganosilsesquioxane obtained in the first step.
  • R 6 of a hydrogen group is a group derived from a silylating agent (for example, a monovalent group represented by the above formula (a-2) or the above formula (a-3)).
  • polyorganosilsesquioxane [A] is a monovalent group represented by the above formula (a-2) or a monovalent group represented by the above formula (a-3). It is preferable to have it as an essential group.
  • the method for producing polyorganosilsesquioxane [A] may include steps other than the first step and the second step described above.
  • the method for producing polyorganosilsesquioxane [A] includes, for example, a step of purifying a raw material, a step of purifying a product such as removing a solvent from a solution after completion of the reaction, and the like.
  • a step of recovering the raw material may be included.
  • the content (total amount) of the polyorganosilsesquioxane [A] in the curable resin composition (100 wt%) of the present invention is not particularly limited, but is 0.01 wt% or more (for example, 0.1 wt%). % Or more and less than 100% by weight), more preferably 1 to 99% by weight, and still more preferably 5 to 95% by weight. If the content of the polyorganosilsesquioxane [A] is less than 0.01% by weight, the effect of sufficiently improving the barrier property against the corrosive gas of the cured product may not be obtained.
  • the above-mentioned “content of polyorganosilsesquioxane [A]” includes two or more polyorganosilsesquioxane [A] (for example, ladder-type silsesquioxane [A1] and ladder).
  • Type silsesquioxane [A2]) means the sum of these contents.
  • the content of ladder-type silsesquioxane [A1] with respect to the total amount (100% by weight) of the compound having an aliphatic carbon-carbon unsaturated bond (compound ⁇ U>) in the curable resin composition is not particularly limited. Is preferably 0.1% by weight or more (for example, 0.1% by weight or more and less than 100% by weight), more preferably 0.5% by weight or more, further preferably 1% by weight or more, and particularly preferably 5% by weight. That's it.
  • the content of the ladder-type silsesquioxane [A1] is less than 0.1% by weight, the effect of sufficiently improving the barrier property against the corrosive gas of the cured product may not be obtained.
  • the curable resin composition of this invention contains ladder type silsesquioxane [A2]
  • the curable resin composition of this invention does not necessarily contain ladder type silsesquioxane [A1]. You don't have to.
  • the content of ladder-type silsesquioxane [A2] with respect to the total amount (100% by weight) of the compound having a hydrosilyl group (compound ⁇ H>) in the curable resin composition is not particularly limited, but is 0.1% % Or more (for example, 0.1% by weight or more and less than 100% by weight), more preferably 0.5% by weight or more, further preferably 1% by weight or more, and particularly preferably 5% by weight or more.
  • the content of the ladder-type silsesquioxane [A2] is less than 0.1% by weight, the effect of sufficiently improving the barrier property against the corrosive gas of the cured product may not be obtained.
  • the curable resin composition of this invention contains ladder type silsesquioxane [A1]
  • the curable resin composition of this invention does not necessarily contain ladder type silsesquioxane [A2]. You don't have to.
  • the ladder-type silsesquioxane [B] in the curable resin composition of the present invention is a silsesquioxane other than the polyorganosilsesquioxane [A], and is a hydrosilyl group or an aliphatic carbon-carbon unsaturated bond.
  • ladder-type silsesquioxanes ladder-type silsesquioxane [B1], ladder-type silsesquioxane [B2]).
  • the ladder-type silsesquioxane [B1] is a ladder-type silsesquioxane [B] having an aliphatic carbon-carbon unsaturated bond in the molecule
  • the ladder-type silsesquioxane [B1] B2] is a ladder-type silsesquioxane [B] having a hydrosilyl group in the molecule.
  • ladder-type silsesquioxane [B1] for example, a part or all of the molecular chain terminals of a polyorganosilsesquioxane having a ladder structure (ladder-type silsesquioxane) may be represented by the above formula (b-1). And a polyorganosilsesquioxane residue containing the unit structure represented by the above formula (b-2) (sometimes referred to as “polyorganosilsesquioxane residue (a)”) And ladder-type silsesquioxane (which may be referred to as “ladder-type silsesquioxane [B1-1]”).
  • the polyorganosilsesquioxane in the ladder type silsesquioxane [B1-1] is a polysiloxane represented by an empirical formula (basic structural formula) RSiO 1.5 .
  • R represents a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent sulfur atom-containing group.
  • At least a portion of R) in the sesquioxane is a monovalent organic group.
  • R in the polyorganosilsesquioxane may be the same or different.
  • Examples of the halogen atom in R include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • Examples of the monovalent organic group in R include, for example, a substituted or unsubstituted hydrocarbon group (monovalent hydrocarbon group), an alkoxy group, an alkenyloxy group, an aryloxy group, an aralkyloxy group, an acyloxy group, and an alkylthio group.
  • hydrocarbon group in R examples include an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and a group in which two or more of these are bonded.
  • Examples of the aliphatic hydrocarbon group for R include an alkyl group, an alkenyl group, and an alkynyl group.
  • Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a hexyl group, an octyl group, isooctyl group, decyl group, the C 1-20 alkyl group (preferably a dodecyl group C 1- 10 alkyl group, more preferably C 1-4 alkyl group).
  • alkenyl group examples include a vinyl group, allyl group, methallyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 1-pentenyl group, 2-pentenyl group, C 2-20 alkenyl groups (preferably C 2-10 alkenyl groups, more preferably C 2-4 alkenyl groups) such as 3-pentenyl group, 4-pentenyl group, 5-hexenyl group and the like can be mentioned.
  • alkynyl group examples include C 2-20 alkynyl groups such as ethynyl group and propynyl group (preferably C 2-10 alkynyl group, more preferably C 2-4 alkynyl group).
  • Examples of the alicyclic hydrocarbon group in R include a C 3-12 cycloalkyl group such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclododecyl group; and a C 3-12 such as a cyclohexenyl group.
  • a C 4-15 bridged cyclic hydrocarbon group such as a bicycloheptanyl group and a bicycloheptenyl group.
  • Examples of the aromatic hydrocarbon group in R include a C 6-14 aryl group (particularly, a C 6-10 aryl group) such as a phenyl group and a naphthyl group.
  • Examples of the group in which the aliphatic hydrocarbon group and the alicyclic hydrocarbon group in R are bonded include a cyclohexylmethyl group and a methylcyclohexyl group.
  • Examples of the group in which an aliphatic hydrocarbon group and an aromatic hydrocarbon group are bonded include, for example, C 7-18 aralkyl groups such as benzyl group and phenethyl group (particularly C 7-10 aralkyl groups), and C such as cinnamyl group.
  • C 1-4 alkyl-substituted aryl groups such as 6-10 aryl-C 2-6 alkenyl groups and tolyl groups, and C 2-4 alkenyl-substituted aryl groups such as styryl groups.
  • the hydrocarbon group for R may have a substituent.
  • the number of carbon atoms of the substituent in the hydrocarbon group is preferably 0-20, more preferably 0-10.
  • the substituent include halogen atoms such as fluorine atom, chlorine atom, bromine atom and iodine atom; hydroxyl group; alkoxy group such as methoxy group, ethoxy group, propoxy group, isopropyloxy group, butoxy group and isobutyloxy group (Preferably C 1-6 alkoxy group, more preferably C 1-4 alkoxy group); alkenyloxy group such as allyloxy group (preferably C 2-6 alkenyloxy group, more preferably C 2-4 alkenyloxy group)
  • An aromatic ring such as a phenoxy group, a tolyloxy group, or a naphthyloxy group may have a substituent such as a C 1-4 alkyl group, a C 2-4 alkenyl group, a halogen
  • Aralkyloxy group (preferably a C 7-18 aralkyloxy group); acetyloxy group, propionyloxy group, (meth) acryloyloxy group, an acyloxy group (preferably a C 1-12 acyloxy group) such as a benzoyloxy group; a mercapto group
  • An alkylthio group such as a methylthio group and an ethylthio group (preferably a C 1-6 alkylthio group, more preferably a C 1-4 alkylthio group); an alkenylthio group such as an allylthio group (preferably a C 2-6 alkenylthio group; Preferably a C 2-4 alkenylthio group); a phenylthio group, a tolylthio group, a naphthylthio group, etc., and an aromatic ring such as a C 1-4 alkyl group, a C 2-4 alkenyl group, a
  • arylthio group also an optionally substituted arylthio group (preferably a C 6-14 aryl Thio); benzylthio group, aralkylthio group (preferably a C 7-18 aralkylthio group such as a phenethylthio group); a carboxyl group; a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an alkoxycarbonyl group such as a butoxycarbonyl group (Preferably C 1-6 alkoxy-carbonyl group); aryloxycarbonyl groups such as phenoxycarbonyl group, tolyloxycarbonyl group, naphthyloxycarbonyl group (preferably C 6-14 aryloxy-carbonyl group); benzyloxycarbonyl group aralkyloxycarbonyl group (preferably a C 7-18 aralkyloxy - group) and the like; amino group; methylamino group, ethylamin
  • Examples of the monovalent oxygen atom-containing group in R include a hydroxyl group, a hydroperoxy group, an alkenyloxy group, an aryloxy group, an aralkyloxy group, an acyloxy group, an isocyanate group, a sulfo group, and a carbamoyl group. It is done.
  • Examples of the monovalent nitrogen atom-containing group include an amino group or a substituted amino group (mono or dialkylamino group, acylamino group, etc.), a cyano group, an isocyanate group, an isothiocyanate group, a carbamoyl group, and the like.
  • Examples of the monovalent sulfur atom-containing group include a mercapto group (thiol group), a sulfo group, an alkylthio group, an alkenylthio group, an arylthio group, an aralkylthio group, and an isothiocyanate group.
  • the monovalent organic group, the monovalent oxygen atom-containing group, the monovalent nitrogen atom-containing group, and the monovalent sulfur atom-containing group described above can overlap each other.
  • R group represented by a following formula (bs) is mentioned.
  • a plurality of R ′ in the above formula (bs) may be the same or different.
  • R ′ in the formula (bs) represents a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent sulfur atom-containing group. Examples of these groups include the same groups as those exemplified as R above.
  • each R ′ includes a hydrogen atom, a C 1-10 alkyl group (particularly a C 1-4 alkyl group), a C 2-10 alkenyl group (particularly, C 2-4 alkyl group), C 3-12 cycloalkyl group, C 3-12 cycloalkenyl group, C 1-4 alkyl group, C 2-4 alkenyl group, halogen atom, C 1-4 alkoxy on the aromatic ring C 6-14 aryl group, C 7-18 aralkyl group, C 6-10 aryl-C 2-6 alkenyl group, hydroxyl group, C 1-6 alkoxy group, halogen which may have a substituent such as a group Atoms are preferred.
  • R is preferably a hydrogen atom or a substituted or unsubstituted hydrocarbon group, more preferably a substituted or unsubstituted hydrocarbon group, and still more preferably an aliphatic hydrocarbon group (particularly an alkyl group). And an aromatic hydrocarbon group (particularly a phenyl group).
  • polyorganosilsesquioxane has a ladder-like Si—O—Si structure (ladder structure), a cage-like Si—O—Si structure (cage structure), and a random-like Si—O—Si structure. (Random structure) etc. are mentioned, but the polyorganosilsesquioxane in ladder type silsesquioxane [B1-1] is polyorganosilsesquioxane containing at least the ladder structure (polyorganosyl having ladder structure). Sesquioxane).
  • the polyorganosilsesquioxane in ladder-type silsesquioxane [B1-1] is represented by the following formula (b-L), for example.
  • p represents an integer of 1 or more (for example, 1 to 5000), preferably an integer of 1 to 2000, and more preferably an integer of 1 to 1000.
  • R in the formula (b-L) represents the same as R.
  • T represents a terminal group.
  • the group directly bonded to the silicon atom in the polyorganosilsesquioxane in ladder type silsesquioxane [B1-1] (R in the above empirical formula, for example, R in formula (bL)) is not particularly limited.
  • the ratio of the substituted or unsubstituted hydrocarbon group to the total amount (100 mol%) of the above group is preferably 50 mol% or more, more preferably 80 mol% or more, still more preferably 90 mol% or more. is there.
  • a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms (particularly an alkyl group having 1 to 4 carbon atoms such as a methyl group or an ethyl group), substituted or unsubstituted, based on the total amount (100 mol%) of the above group.
  • the total amount of the aryl group having 6 to 10 carbon atoms (particularly phenyl group) and the substituted or unsubstituted aralkyl group having 7 to 10 carbon atoms (particularly benzyl group) is preferably 50 mol% or more, More preferably, it is 80 mol% or more, More preferably, it is 90 mol% or more.
  • Ladder-type silsesquioxane [B1-1] has a polyorganosilsesquioxane residue (a) at a part or all of the molecular chain terminals of the polyorganosilsesquioxane having the ladder structure.
  • the ladder-type silsesquioxane [B1-1] is a part or all of T in the formula (bL). It has a structure substituted with a polyorganosilsesquioxane residue (a).
  • the polyorganosilsesquioxane residue (a) is a residue containing at least the unit structure represented by the formula (b-1) and the unit structure represented by the formula (b-2) as described above. is there.
  • R 11 in the above formula (b-1) represents a group having an aliphatic carbon-carbon double bond (a monovalent group containing an aliphatic carbon-carbon double bond).
  • the group having an aliphatic carbon-carbon double bond include a vinyl group, allyl group, methallyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, C 2-20 alkenyl groups (preferably C 2-10 alkenyl groups, more preferably C 2-4 alkenyl groups) such as 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group and 5-hexenyl group Group); C 3-12 cycloalkenyl group such as cyclohexenyl group; C 4-15 bridged cyclic unsaturated hydrocarbon group such as bicycloheptenyl group; C 2-4 alkenyl-substituted aryl group such as styryl
  • R ′ is the above C 2-20 alkenyl group
  • C also included are groups such as 3-12 cycloalkenyl groups, C 4-15 bridged cyclic unsaturated hydrocarbon groups, C 2-4 alkenyl substituted aryl groups, cinnamyl groups, and the like.
  • the alkenyl group and is more preferably C 2-20 alkenyl group, more preferably a vinyl group.
  • R 12 (3 one R 12) of (b-2) in each independently represent a hydrocarbon group (monovalent hydrocarbon group).
  • hydrocarbon group the hydrocarbon group similar to what was illustrated as said R is illustrated.
  • R 12 is preferably a C 1-20 alkyl group, more preferably a C 1-10 alkyl group, still more preferably a C 1-4 alkyl group, and particularly preferably a methyl group.
  • R 12 in formula (b-2) are methyl groups.
  • the three R 12 may be the same or different.
  • the polyorganosilsesquioxane residue (a) includes, for example, the following formula ( b-1 ′) It may have a unit structure represented by
  • R 11 ′ in the above formula (b-1 ′) represents a monovalent group excluding a group having an aliphatic carbon-carbon double bond.
  • a monovalent organic group excluding a hydrogen atom, a halogen atom, a group having an aliphatic carbon-carbon double bond, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or one And valent sulfur atom-containing groups.
  • the amount of silicon atoms to which the three oxygen atoms represented by the formula (b-1) in the polyorganosilsesquioxane residue (a) are bonded is not particularly limited, but the polyorganosilsesquioxane residue ( The amount is preferably 20 to 80 mol%, more preferably 25 to 60 mol%, based on the total amount (100 mol%) of silicon atoms constituting a).
  • the amount is less than 20 mol%, the amount of the aliphatic carbon-carbon double bond of the ladder-type silsesquioxane [B1-1] becomes insufficient, and the hardness of the cured product cannot be obtained sufficiently. There is a case.
  • the amount of the silicon atom bonded to one oxygen atom represented by the formula (b-2) in the polyorganosilsesquioxane residue (a) is not particularly limited, but the polyorganosilsesquioxane residue ( The amount is preferably 20 to 85 mol%, more preferably 30 to 75 mol%, based on the total amount (100 mol%) of silicon atoms constituting a).
  • silanol groups and hydrolyzable silyl groups tend to remain in the ladder-type silsesquioxane [B1-1], and the ladder-type silsesquioxane [B1-1] is liquid. May not be available.
  • the condensation reaction proceeds in the product and the molecular weight changes, the storage stability may deteriorate.
  • the content exceeds 85 mol%, the amount of the aliphatic carbon-carbon double bond of the ladder-type silsesquioxane [B1-1] becomes insufficient, and the hardness of the cured product is sufficiently obtained. There may not be.
  • the Si—O—Si structure (skeleton) of the polyorganosilsesquioxane residue (a) is not particularly limited, and examples thereof include a ladder structure, a cage structure, and a random structure.
  • Polyorganosilsesquioxane [B1-1] can be represented by the following formula (b-L a ), for example.
  • a in the formula (b-L a ) represents a polyorganosilsesquioxane residue (a), or a hydroxyl group, a halogen atom, an alkoxy group, or an acyloxy group, and a part or all of A is a polyorgano It is a silsesquioxane residue (a).
  • the four A's may be the same or different.
  • each A is one or more Si—O—Si bonds with each other. It may be connected via.
  • the polyorganosilsesquioxane residue (a) in the ladder-type silsesquioxane [B1-1] is further represented by the formula (b-3) in the ladder-type silsesquioxane [B2-1] described later. It may have a unit structure represented. In this case, the ladder-type silsesquioxane [B1-1] may be usable as the ladder-type silsesquioxane [B2-1].
  • the method for producing the ladder-type silsesquioxane [B1-1] is not particularly limited.
  • the ladder-type silsesquioxane [B1-1] has a ladder structure and has a silanol group and / or a hydrolyzable silyl group (silanol group and hydrolyzable at the molecular chain terminal).
  • the silsesquioxane residue (a) is formed with respect to the molecular chain terminal of a polyorganosilsesquioxane (sometimes referred to as "raw material ladder polymer") having a silyl group (one or both of silyl groups).
  • a method is mentioned.
  • Examples of the hydrolyzable silyl group in the raw material ladder polymer include a halogenated silyl group, an alkoxysilyl group, and an acyloxysilyl group.
  • Examples of the halogen atom in the halogenated silyl group include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
  • Examples of the alkoxy group in the alkoxysilyl group include C 1-10 alkoxy groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group, a butoxy group, and an isobutyloxy group.
  • Examples of the acyloxy group in the acyloxysilyl group include C 1-10 acyloxy groups such as an acetyloxy group, a propionyloxy group, and a benzoyloxy group.
  • raw material ladder polymer examples include polyorganosilsesquioxane in which a part or all of the terminal groups T in the formula (bL) are a hydroxyl group, a halogen atom, an alkoxy group, or an acyloxy group. .
  • the number (total number) of silanol groups and hydrolyzable silyl groups contained in the raw ladder polymer is not particularly limited, but is preferably 1 or more (for example, 1 to 10), more preferably 2 to 6 in one molecule. It is a piece.
  • the number (total number) of the silanol group and hydrolyzable silyl group which the said raw material ladder polymer has can be calculated
  • the molecular weight of the raw material ladder polymer is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 30,000, particularly preferably 1000 to 20000, and most preferably 1500 to 10,000. is there. If the molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, when the molecular weight exceeds 800,000, the compatibility of the ladder-type silsesquioxane [B1-1] (or [B2-1]) with other components may be lowered.
  • the raw ladder polymer may be a mixture of those having various molecular weights within the above range.
  • the molecular weight can be calculated, for example, as a molecular weight in terms of polystyrene by gel permeation chromatography.
  • the weight average molecular weight (Mw) of the raw material ladder polymer is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 30,000, particularly preferably 1000 to 20000, and most preferably. Is 1500 to 10,000. If the molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, when the molecular weight exceeds 800,000, the compatibility of the ladder-type silsesquioxane [B1-1] (or [B2-1]) with other components may be lowered. In addition, the said weight average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the raw material ladder polymer can be produced by a production method of a polyorganosilsesquioxane having a known or conventional ladder structure, and the production method is not particularly limited.
  • the raw material ladder polymer can be produced by, for example, hydrolysis / condensation reaction (sol-gel reaction) of a trifunctional silane compound.
  • the hydrolysis / condensation reaction is, for example, one or two trifunctional silane compounds represented by the above formula (bi) in water or a mixed solvent of water and an organic solvent in the presence of a silanol condensation catalyst.
  • the above can be carried out by silanol condensation and distilling off the solvent and / or by-products (alcohol, etc.) during or after the reaction.
  • the reaction temperature is not particularly limited, but is preferably ⁇ 78 to 150 ° C., more preferably ⁇ 20 to 100 ° C.
  • the amount of water used is not particularly limited, but is preferably 1 mol or more (for example, 1 to 20 mol), more preferably 1 mol with respect to 1 mol of the total amount of the trifunctional silane compound represented by the formula (bi). Is 1 to 10 mol.
  • organic solvent examples include aliphatic hydrocarbons such as hexane, heptane, and octane; alicyclic hydrocarbons such as cyclohexane; aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene; chloroform, dichloromethane, 1,2, and the like.
  • a halogenated hydrocarbon such as dichloroethane; an ether such as diethyl ether, dimethoxyethane, tetrahydrofuran, and dioxane; a ketone such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; an ester such as methyl acetate, ethyl acetate, isopropyl acetate, and butyl acetate; Amides such as N-dimethylformamide and N, N-dimethylacetamide; Nitriles such as acetonitrile, propionitrile and benzonitrile; Alcohols such as methanol, ethanol, isopropyl alcohol and butanol ; And a mixture thereof can be mentioned.
  • the amount of the organic solvent used is not particularly limited, but is, for example, 0.5 to 30 parts by volume with respect to a total of 1 part by volume of the starting trifunctional silane compound.
  • an acid catalyst or a base catalyst can be used as the silanol condensation catalyst.
  • the acid catalyst include mineral acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and boric acid; phosphoric acid esters; carboxylic acids such as acetic acid and trifluoroacetic acid; methanesulfonic acid, trifluoromethanesulfonic acid, and p-toluene.
  • sulfonic acids such as sulfonic acid
  • solid acids such as activated clay
  • Lewis acids such as iron chloride.
  • the base catalyst examples include alkali metal hydroxides such as sodium hydroxide and potassium hydroxide; alkaline earth metal hydroxides such as barium hydroxide and magnesium hydroxide; alkali metal carbonates such as sodium carbonate; Alkaline earth metal carbonates such as barium carbonate and magnesium carbonate; Alkali metal hydrogen carbonates such as sodium hydrogen carbonate; Alkali metal alkoxides such as sodium methoxide and sodium ethoxide; Alkaline earth metal alkoxides such as barium methoxide; Sodium Alkali metal phenoxides such as phenoxide; quaternary ammonium hydroxides such as tetraalkylammonium hydroxide such as tetramethylammonium hydroxide and tetrabutylammonium hydroxide; tetramethylphosphonium hydroxide and tet Quaternary phosphonium hydroxide such as tetraalkylphosphonium hydroxide such as butylphosphonium hydro
  • the obtained raw material ladder polymer is separated by, for example, separation means such as water washing, acid washing, alkali washing, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, or a combination means combining these. It can be purified.
  • separation means such as water washing, acid washing, alkali washing, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, or a combination means combining these. It can be purified.
  • the method of forming the polysilsesquioxane residue (a) with respect to the molecular chain terminal of the raw material ladder polymer to generate ladder-type silsesquioxane [B1-1] is not particularly limited.
  • the following formula (b-I) [In formula (b-I), R 11 is the same as defined above.
  • Y independently represents a hydroxyl group, a halogen atom, an alkoxy group, or an acyloxy group. ] Is reacted (condensed or hydrolyzed and condensed), and then the following formula (b-II) [In formula (b-II), R 12 is the same as defined above.
  • Y represents a hydroxyl group, a halogen atom, an alkoxy group, or an acyloxy group.
  • this trifunctional silane compound at the time of making the trifunctional silane compound represented by Formula (bI) react with the said raw material ladder polymer is not specifically limited, The silanol group and hydrolyzability which a raw material ladder polymer has.
  • the amount is preferably 0.2 to 50 mol, more preferably 0.25 to 10 mol, and still more preferably 1 to 5 mol with respect to 1 mol of the total amount of silyl groups. If the amount used is less than 0.2 mol, a sufficient amount of aliphatic carbon-carbon double bonds may not be introduced to the raw ladder polymer. On the other hand, when the amount used exceeds 50 mol, a condensate of the above trifunctional silane compounds is likely to be formed, and the low molecular weight condensate may increase.
  • a trifunctional silane compound other than the trifunctional silane compound represented by the above formula (b-I) may be used in combination. That is, the above-described raw material ladder polymer may be reacted (co-condensation reaction) with the trifunctional silane compound represented by the formula (b-I) and other trifunctional silane compounds.
  • the other trifunctional silane compounds include, for example, R 11 in the formula (b-I) is a monovalent organic group other than a group having an aliphatic carbon-carbon double bond (for example, a saturated aliphatic hydrocarbon group). And trifunctional silane compounds that are aromatic hydrocarbon groups).
  • the amount used is not particularly limited. For example, it is 0.2 to 50 with respect to 100 parts by weight of the trifunctional silane compound represented by the formula (b-I). Part by weight is preferred, more preferably 0.25 to 10 parts by weight.
  • Raw material ladder polymer and trifunctional silane compound (trifunctional silane compound represented by formula (b-I) alone or trifunctional silane compound represented by formula (b-I) and other trifunctional silane compounds)
  • This reaction is preferably allowed to proceed in an organic solvent.
  • the organic solvent include aliphatic hydrocarbons such as hexane, heptane, and octane; alicyclic hydrocarbons such as cyclohexane; aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene; chloroform, dichloromethane, 1,2, and the like.
  • a halogenated hydrocarbon such as dichloroethane; an ether such as diethyl ether, dimethoxyethane, tetrahydrofuran, and dioxane; a ketone such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; an ester such as methyl acetate, ethyl acetate, isopropyl acetate, and butyl acetate; Amides such as N-dimethylformamide and N, N-dimethylacetamide; Nitriles such as acetonitrile, propionitrile and benzonitrile; Alcohols such as methanol, ethanol, isopropyl alcohol and butanol And the like.
  • an organic solvent can be used individually by 1 type or in combination of 2 or more types. Of these, methyl isobutyl ketone is preferred.
  • the reaction of the raw material ladder polymer and the trifunctional silane compound can proceed in the presence of water.
  • the amount of water used is not particularly limited, but is preferably 1 to 10 mol, more preferably 1.5 to 6 mol, still more preferably 2 with respect to 1 mol of the total amount of hydrolyzable silyl groups present in the system. ⁇ 4 moles. If the amount used is less than 1 mole, hydrolysis does not proceed easily, and the condensation reaction may not proceed sufficiently. On the other hand, when the amount used exceeds 10 mol, the concentration of the silane compound decreases, so the reaction rate becomes slow and the reaction may not proceed sufficiently.
  • the reaction between the raw material ladder polymer and the trifunctional silane compound further proceeds in the presence of a silanol condensation catalyst (particularly, an acid catalyst).
  • a silanol condensation catalyst include those similar to the silanol condensation catalyst used in the production of the raw ladder polymer.
  • the amount of the silanol condensation catalyst used is not particularly limited, but is preferably 0.001 to 0.5 mol, more preferably 0.001 mol, based on 1 mol of the total amount of silanol groups and hydrolyzable silyl groups present in the system. 005 to 0.3 mol, more preferably 0.01 to 0.1 mol. If the amount used is less than 0.001 mol, the progress of the condensation reaction may be insufficient. On the other hand, when the amount used exceeds 0.5 mol, side reactions and decomposition reactions may occur simultaneously, and the yield may decrease.
  • the temperature (reaction temperature) for carrying out the reaction between the raw material ladder polymer and the trifunctional silane compound is not particularly limited, but is preferably 50 to 100 ° C, more preferably 60 to 90 ° C, still more preferably 70 to 80 ° C. is there.
  • reaction temperature is less than 50 ° C., the progress of the condensation reaction may be insufficient.
  • reaction temperature exceeds 100 ° C., side reactions and decomposition reactions may occur simultaneously, and the yield may decrease.
  • the time (reaction time) for carrying out the reaction between the raw material ladder polymer and the trifunctional silane compound is not particularly limited, but is preferably 15 to 720 minutes, more preferably 30 to 360 minutes, still more preferably 60 to 240 minutes. is there. When the reaction time is less than 15 minutes, the progress of the condensation reaction may be insufficient. On the other hand, if the reaction time exceeds 720 minutes, side reactions and decomposition reactions may occur simultaneously, and the yield may be reduced.
  • the reaction between the raw material ladder polymer and the trifunctional silane compound yields a condensate (sometimes referred to simply as “condensate”) of the raw material ladder polymer and the trifunctional silane compound.
  • the condensate thus obtained may be directly subjected to the next reaction (reaction with a monofunctional silane compound represented by the formula (b-II)) without being purified, or after purification, You may attach to reaction of these.
  • known means such as water washing, acid washing, alkali washing, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography and the like, or a separation means combining these, etc. Conventional methods can be used.
  • the monofunctional silane compound (monofunctional silane compound) represented by the above formula (b-II) is reacted with the condensate of the raw material ladder polymer and the trifunctional silane compound. More specifically, a silanol group and a hydrolyzable silyl group contained in a condensate of a raw material ladder polymer and the above trifunctional silane compound are sealed with a monofunctional silane compound represented by the formula (b-II) to form a ladder type Silsesquioxane [B1-1] is produced.
  • the ladder type silsesquioxane [B1-1] has a structure in which the silanol group and the hydrolyzable silyl group in the condensate are sealed with a monofunctional silane compound represented by the formula (b-II). .
  • the amount of the monofunctional silane compound represented by the formula (b-II) is not particularly limited, but is 1 to 10 mol with respect to 1 mol of the total amount of silanol groups and hydrolyzable silyl groups contained in the condensate. Is more preferably 1 to 5 mol, and still more preferably 1 to 3 mol.
  • the amount used is less than 1 mol, a lot of silanol groups and / or hydrolyzable silyl groups are likely to remain in the ladder-type silsesquioxane [B1-1] and the cured product, resulting in poor storage stability. is there.
  • the amount used exceeds 10 moles, it may be disadvantageous in terms of cost.
  • the reaction between the condensate and the monofunctional silane compound represented by the formula (b-II) is preferably allowed to proceed in an organic solvent.
  • organic solvent the organic solvent similar to the thing in the condensation reaction of the said raw material ladder polymer and the said trifunctional silane compound is illustrated.
  • the reaction between the condensate and the monofunctional silane compound represented by the above formula (b-II) can proceed in the presence of water.
  • the amount of water used is not particularly limited, but is preferably 1 to 10 mol, more preferably 1 to 5 mol, and still more preferably 1 to 3 with respect to 1 mol of the total amount of hydrolyzable silyl groups present in the system. Is a mole. If the amount used is less than 1 mol, the hydrolysis does not proceed sufficiently, and the progress of the condensation reaction may be insufficient. On the other hand, if the amount used exceeds 10 moles, the substrate concentration may decrease and the reaction rate may decrease.
  • the reaction of the condensate with the monofunctional silane compound represented by the above formula (b-II) is preferably allowed to proceed in the presence of a silanol condensation catalyst (particularly an acid catalyst).
  • a silanol condensation catalyst particularly an acid catalyst.
  • the amount of the silanol condensation catalyst used is not particularly limited, but is preferably 0.0001 to 1.0 mol, more preferably 0 with respect to 1 mol of the total amount of silanol groups and hydrolyzable silyl groups present in the system. 0.001 to 0.1 mol, and more preferably 0.005 to 0.03 mol. If the amount used is less than 0.0001 mol, the reaction rate may be slow and the progress of the condensation reaction may be insufficient. On the other hand, when the amount used exceeds 1.0 mol, side reactions may easily proceed.
  • the temperature (reaction temperature) for carrying out the reaction between the condensate and the monofunctional silane compound represented by the formula (b-II) is not particularly limited, but is preferably 50 to 100 ° C, more preferably 60 to 80 ° C. More preferably, it is 65 to 75 ° C.
  • reaction temperature is less than 50 ° C., the progress of the condensation reaction may be insufficient.
  • reaction temperature exceeds 100 ° C., side reactions and decomposition reactions may occur simultaneously, and the yield may decrease.
  • the time (reaction time) for carrying out the reaction between the condensate and the monofunctional silane compound represented by the formula (b-II) is not particularly limited, but is preferably 60 to 600 minutes, more preferably 90 to 360 minutes. More preferably, it is 120 to 240 minutes. When the reaction time is less than 60 minutes, the progress of the condensation reaction may be insufficient. On the other hand, if the reaction time exceeds 600 minutes, side reactions and decomposition reactions may occur simultaneously, and the molecular weight may decrease.
  • the obtained ladder-type silsesquioxane [B1-1] is, for example, separation means such as water washing, acid washing, alkali washing, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, and the like. Purification can be carried out by using a known or conventional method such as a separation means combining the above.
  • the number of aliphatic carbon-carbon double bonds in the molecule is not particularly limited, but two or more (for example, 2 to 50) The number is preferably 2 to 30.
  • the number of aliphatic carbon-carbon double bonds can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the content of the aliphatic carbon-carbon double bond in the ladder-type silsesquioxane [B1-1] is not particularly limited, but is preferably 0.7 to 5.5 mmol / g, more preferably 1.1 to 4.4 mmol / g.
  • the ratio (weight basis) of the aliphatic carbon-carbon double bond contained in the ladder-type silsesquioxane [B1-1] is not particularly limited, but is 2.0 to 15.0 weight in terms of vinyl group. %, More preferably 3.0 to 12.0% by weight.
  • the molecular weight of the ladder-type silsesquioxane [B1-1] is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 10,000, particularly preferably 500 to 8000, Most preferably, it is 1500 to 7000.
  • the ladder-type silsesquioxane [B1-1] may be a mixture having various molecular weights within the above range.
  • the said molecular weight can be measured as a molecular weight of standard polystyrene conversion by gel permeation chromatography, for example.
  • the weight average molecular weight (Mw) of the ladder type silsesquioxane [B1-1] is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 10,000, and particularly preferably. Is from 500 to 8000, most preferably from 1700 to 7000. If the weight average molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, if the weight average molecular weight exceeds 800,000, the compatibility with other components may decrease. In addition, the said weight average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the number average molecular weight (Mn) of the ladder-type silsesquioxane [B1-1] is not particularly limited, but is preferably from 800 to 800,000, more preferably from 150 to 100,000, still more preferably from 250 to 10,000, particularly preferably. Is 400 to 8000, most preferably 1500 to 7000. If the number average molecular weight is less than 80, the heat resistance of the cured product may decrease. On the other hand, if the number average molecular weight exceeds 800,000, the compatibility with other components may decrease. In addition, the said number average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the ladder-type silsesquioxane [B1-1] is not particularly limited, but is preferably liquid at room temperature (about 25 ° C.). More specifically, the viscosity of the ladder-type silsesquioxane [B1-1] at 23 ° C. is preferably 100 to 100,000 mPa ⁇ s, more preferably 500 to 10,000 mPa ⁇ s, and still more preferably 1000 to 8000 mPa ⁇ s. is there. If the viscosity is less than 100 mPa ⁇ s, the heat resistance of the cured product may decrease. On the other hand, when the viscosity exceeds 100,000 mPa ⁇ s, it may be difficult to prepare and handle the curable resin composition.
  • the number of rotations can be measured under the condition of 20 rpm.
  • ladder-type silsesquioxane [B2] for example, a part or all of the molecular chain terminal of the polyorganosilsesquioxane (ladder-type silsesquioxane) having a ladder structure may be substituted with the above formula (b-3). And a polyorganosilsesquioxane residue comprising the unit structure represented by the above formula (b-4) (sometimes referred to as “polyorganosilsesquioxane residue (b)”) And ladder-type silsesquioxane (which may be referred to as “ladder-type silsesquioxane [B2-1]”).
  • the polyorganosilsesquioxane in the ladder-type silsesquioxane [B2-1] is a polysiloxane represented by an empirical formula (basic structural formula) RSiO 1.5 .
  • polyorganosilsesquioxane in ladder type silsesquioxane [B2-1] for example, in the above formula (b-L)
  • Examples thereof are the same as the polyorganosilsesquioxane represented).
  • the ladder-type silsesquioxane [B2-1] is a part or all of T in the formula (bL). Is substituted with the polyorganosilsesquioxane residue (b).
  • the polyorganosilsesquioxane residue (b) includes at least a unit structure represented by the above formula (b-3) and a unit structure represented by the above formula (b-4). It is a group.
  • the organic group (—X—CHR 13 —CR 13 2 — [SiR 14 2 —O—] n1 SiHR 14 2 ) in the unit structure represented by the above formula (b-3) is referred to as “SiH-containing group”. May be called.
  • X represents a single bond or a linking group (a divalent group having one or more atoms).
  • the linking group include a divalent hydrocarbon group, a carbonyl group, an ether group (ether bond), a thioether group (thioether bond), an ester group (ester bond), a carbonate group (carbonate bond), and an amide group (amide). Bond), a group in which a plurality of these are linked, and the like.
  • Examples of the divalent hydrocarbon group include a linear or branched alkylene group having 1 to 18 carbon atoms and a divalent alicyclic hydrocarbon group.
  • Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group.
  • Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclohexene group.
  • divalent cycloalkylene groups including cycloalkylidene groups
  • a plurality of R 13 in the above formula (b-3) are each independently a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent group. Represents a sulfur atom-containing group. That is, the plurality of R 13 may be the same or different. Examples of R 13 include the same groups as R described above. Especially, as R ⁇ 13 >, a hydrogen atom or a substituted or unsubstituted hydrocarbon group is respectively preferable, More preferably, it is a hydrogen atom.
  • a plurality of R 14 in the formula (b-3) are each independently a hydrogen atom, a halogen atom, a monovalent organic group, a monovalent oxygen atom-containing group, a monovalent nitrogen atom-containing group, or a monovalent group.
  • Examples of the halogen atom, monovalent organic group, monovalent oxygen atom-containing group, monovalent nitrogen atom-containing group, and monovalent sulfur atom-containing group include the same groups as those described above for R.
  • n1 is an integer of 2 or more in the formula (b-3)
  • R 14 in each parentheses n1 is attached may each be the same or may be different.
  • each R 14 is preferably a hydrogen atom or a substituted or unsubstituted hydrocarbon group, more preferably a substituted or unsubstituted hydrocarbon group, still more preferably an aliphatic hydrocarbon group (particularly, Methyl group) and aromatic hydrocarbon group (particularly phenyl group).
  • N1 in the above formula (b-3) represents an integer of 1 to 100, preferably an integer of 1 to 30, more preferably an integer of 1 to 10, and further preferably an integer of 1 to 5.
  • n1 is too large, the barrier property against the gas (particularly corrosive gas) of the cured product tends to be lowered, and therefore, for example, it may not be suitable as a sealant for an optical semiconductor element.
  • R 15 ( 3 one R 15) in each independently, similarly to R 12 in the above formula (b-2), a hydrocarbon group (monovalent hydrocarbon group).
  • the hydrocarbon group include the same hydrocarbon groups as those exemplified for R above.
  • R 15 is preferably a C 1-20 alkyl group, more preferably a C 1-10 alkyl group, still more preferably a C 1-4 alkyl group, and particularly preferably a methyl group.
  • R 15 in formula (b-4) are methyl groups.
  • the polyorganosilsesquioxane residue (b) includes, for example, the above formula (b- It may have a unit structure represented by 1 ′).
  • the amount of the silicon atom (not including the silicon atom in the SiH-containing group) to which the three oxygen atoms in the formula (b-3) are bonded in the polyorganosilsesquioxane residue (b) is not particularly limited.
  • the amount is preferably 20 to 80 mol%, more preferably 25 to 60 mol%, based on the total amount (100 mol%) of silicon atoms constituting the polyorganosilsesquioxane residue (b). If the content is less than 20 mol%, the amount of hydrosilyl group contained in the ladder-type silsesquioxane [B2-1] becomes insufficient, and sufficient hardness of the cured product may not be obtained.
  • the amount of silicon atom bonded to one oxygen atom in the formula (b-4) in the polyorganosilsesquioxane residue (b) is not particularly limited, but the polyorganosilsesquioxane residue (b) The amount is preferably 20 to 85 mol%, more preferably 30 to 75 mol%, based on the total amount of silicon atoms (100 mol%). When the content is less than 20 mol%, a silanol group or a hydrolyzable silyl group tends to remain in the ladder-type silsesquioxane [B2-1], and the ladder-type silsesquioxane cannot be obtained in a liquid state. There is.
  • the condensation reaction proceeds in the product and the molecular weight changes, the storage stability may deteriorate.
  • the content exceeds 85 mol%, the amount of hydrosilyl group contained in the ladder-type silsesquioxane [B2-1] becomes insufficient, and the hardness of the cured product may not be sufficiently obtained.
  • the Si—O—Si structure (skeleton) of the polyorganosilsesquioxane residue (b) is not particularly limited, and examples thereof include a ladder structure, a cage structure, and a random structure.
  • Polyorganosilsesquioxane [B2-1] can be represented by the following formula (b-L b ), for example.
  • P in formula (b-L b), as the R those similar to the above formula (b-L) is exemplified.
  • B in the formula (b-L b ) represents a polyorganosilsesquioxane residue (b), or a hydroxyl group, a halogen atom, an alkoxy group, or an acyloxy group, and in the formula (b-L b ) Part or all of B is a polyorganosilsesquioxane residue (b).
  • the four Bs may be the same or different.
  • each B is one or more Si—O—Si bonds. It may be connected via.
  • the polyorganosilsesquioxane residue (b) in the ladder-type silsesquioxane [B2-1] is further represented by the formula (b-1) in the ladder-type silsesquioxane [B1-1] described above. It may have a unit structure represented. In this case, the ladder-type silsesquioxane [B2-1] may be used as the ladder-type silsesquioxane [B1-1] in some cases.
  • the method for producing the ladder-type silsesquioxane [B2-1] is not particularly limited.
  • a polyorganosilsesquioxy having a ladder structure and having a silanol group and / or a hydrolyzable silyl group at the molecular chain end is mentioned.
  • the same raw material ladder polymer as in the ladder type silsesquioxane [B1-1] can be used.
  • the method of forming the polysilsesquioxane residue (b) with respect to the molecular chain terminal of the raw ladder polymer to generate the ladder-type silsesquioxane [B2-1] is not particularly limited.
  • the ladder-type silsesquioxane [B1-1] is formed from the raw material ladder polymer, and the ladder-type silsesquioxane [B1-1] and the following formula (b-5) [In formula (b-5), R 14 and n1 are the same as defined above. ]
  • a method of reacting a compound represented by the above in the presence of a hydrosilylation catalyst is not limited to the said method.
  • Specific examples of the compound represented by the above formula (b-5) include 1,1,3,3-tetramethyldisiloxane, 1,1,3,3,5,5-hexamethyltrimethyl. Both siloxane, 1,1,3,3,5,5,7,7-octamethyltetrasiloxane, 1,1,3,3,5,5,7,7,9,9-decamethylpentasiloxane Linear polydimethylsiloxane having 1 to 10 (preferably 2 to 5) (Si-O) units having hydrosilyl groups at the ends, linear polydialkylsiloxane having SiH groups at both ends (preferably straight Chain polydiC 1-10 alkylsiloxane) and the like.
  • the amount of the compound represented by the formula (b-5) used when the ladder-type silsesquioxane [B1-1] is reacted with the compound represented by the above formula (b-5) is not particularly limited.
  • the amount of the hydrosilyl group is less than 3 mol, the curing reaction of the ladder-type silsesquioxane [B1-1] and the compound represented by the formula (b-5) proceeds and gelation occurs. There is a case. On the other hand, if the amount is such that the amount of hydrosilyl group exceeds 500 moles, it may be disadvantageous in terms of cost.
  • hydrosilylation catalyst examples include known hydrosilylation reaction catalysts such as platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts. Specifically, platinum fine powder, platinum black, platinum-supported silica fine powder, platinum Supported activated carbon, chloroplatinic acid, complexes of chloroplatinic acid with alcohols, aldehydes, ketones, platinum olefin complexes, platinum carbonyl complexes such as platinum-carbonylvinylmethyl complexes, platinum-divinyltetramethyldisiloxane complexes and platinum- Platinum-based catalysts such as platinum-vinylmethylsiloxane complexes such as cyclovinylmethylsiloxane complexes, platinum-phosphine complexes, platinum-phosphite complexes, etc., and palladium-based catalysts containing palladium atoms or rhodium atoms instead of platinum atoms in the platinum-based catalyst
  • the said hydrosilylation catalyst may be used individually by 1 type, and may use 2 or more types together.
  • a platinum vinylmethylsiloxane complex, a platinum-carbonylvinylmethyl complex, and a complex of chloroplatinic acid, an alcohol, and an aldehyde are preferable because the reaction rate is good.
  • the amount of the hydrosilylation catalyst used is not particularly limited, but is 1 ⁇ 10 ⁇ 8 to 1 with respect to 1 mol of the total amount of aliphatic carbon-carbon double bonds of ladder-type silsesquioxane [B1-1]. ⁇ 10 ⁇ 2 mol is preferable, and 1.0 ⁇ 10 ⁇ 6 to 1.0 ⁇ 10 ⁇ 3 mol is more preferable. If the amount used is less than 1 ⁇ 10 ⁇ 8 mol, the reaction may not proceed sufficiently. On the other hand, when the amount used exceeds 1 ⁇ 10 ⁇ 2 mol, the cured product may be easily colored.
  • the ladder-type silsesquioxane [B2-1] in the above hydrosilylation reaction (reaction between the ladder-type silsesquioxane [B1-1] and the compound represented by the formula (b-5))
  • other additives may be added to the reaction system.
  • the atmosphere for carrying out the hydrosilylation reaction is not particularly limited as long as it does not inhibit the reaction, and may be any of an air atmosphere, a nitrogen atmosphere, an argon atmosphere, and the like.
  • the hydrosilylation reaction can be carried out by any method such as batch, semi-batch and continuous methods.
  • the temperature (reaction temperature) of the hydrosilylation reaction is not particularly limited, but is preferably 0 to 200 ° C, more preferably 20 to 150 ° C, and further preferably 30 to 100 ° C.
  • reaction temperature is less than 0 ° C.
  • the reaction temperature exceeds 200 ° C.
  • decomposition of the reactants and side reactions may occur together, resulting in a decrease in yield.
  • the reaction temperature may be controlled to be constant during the reaction, or may be changed sequentially or continuously.
  • reaction time is not particularly limited, but is preferably 10 to 1400 minutes, more preferably 60 to 720 minutes. If the reaction time is less than 10 minutes, the reaction cannot sufficiently proceed, and the yield may be reduced. On the other hand, if the reaction time exceeds 1400 minutes, decomposition of the reactants and side reactions may occur simultaneously, resulting in a decrease in yield or a deep coloration.
  • reaction pressure in the hydrosilylation reaction is not particularly limited, and the reaction can be carried out under normal pressure, under pressure, under reduced pressure, or the like.
  • the ladder-type silsesquioxane [B2-1] obtained above is, for example, separation means such as water washing, acid washing, alkali washing, filtration, concentration, distillation, extraction, crystallization, recrystallization, column chromatography, Further, purification may be performed using a known or conventional method such as a separation means combining these.
  • the number of the SiH-containing groups in the molecule is not particularly limited, but is preferably 2 or more (for example, 2 to 50), more preferably. Is 2-30.
  • the number of SiH-containing groups can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the content of the hydrosilyl group (SiH group) contained in the ladder-type silsesquioxane [B2-1] is not particularly limited, but is preferably 0.01 to 0.5 mmol / g, more preferably 0.08 to 0. 0. 28 mmol / g. Further, the content of the hydrosilyl group (SiH group) based on the weight of the ladder-type silsesquioxane [B2-1] is not particularly limited, but in terms of weight (H conversion) of H (hydride) in the SiH group, The content is preferably 0.01 to 0.50% by weight, more preferably 0.08 to 0.28% by weight.
  • the content of the hydrosilyl group is too small (for example, less than 0.01 mmol / g and less than 0.01% by weight in terms of H), curing of the curable resin composition may not proceed.
  • the content of the hydrosilyl group is too large (for example, exceeding 0.50 mmol / g, exceeding 0.50% by weight in terms of H), the hardness of the cured product becomes too high and may be easily broken.
  • content of the hydrosilyl group in ladder type silsesquioxane [B2-1] can be measured by ⁇ 1 > H-NMR etc., for example.
  • the content of the SiH-containing group with respect to the total amount (100 mol%) of the hydrosilyl group contained in the ladder-type silsesquioxane [B2-1] is not particularly limited, but is 50 to 100 mol% from the viewpoint of the degree of curing. Preferably, it is 80 to 100 mol%.
  • the molecular weight of the ladder-type silsesquioxane [B2-1] is not particularly limited, but is preferably from 100 to 800,000, more preferably from 200 to 100,000, still more preferably from 300 to 10,000, particularly preferably from 500 to 9000, Most preferably, it is 2500 to 7000.
  • the ladder-type silsesquioxane [B2-1] may be a mixture having various molecular weights in the above range.
  • the said molecular weight can be measured as a molecular weight of standard polystyrene conversion by gel permeation chromatography, for example.
  • the weight average molecular weight (Mw) of the ladder type silsesquioxane [B2-1] is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 10,000, and particularly preferably. Is from 500 to 9000, most preferably from 2500 to 7000. If the weight average molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, if the molecular weight exceeds 800,000, the compatibility with other components may decrease. In addition, the said weight average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the number average molecular weight (Mn) of the ladder-type silsesquioxane [B2-1] is not particularly limited, but is preferably from 800 to 800,000, more preferably from 150 to 100,000, still more preferably from 250 to 10,000, particularly preferably. Is from 400 to 8000, most preferably from 2000 to 7000. If the number average molecular weight is less than 80, the heat resistance of the cured product may decrease. On the other hand, if the number average molecular weight exceeds 800,000, the compatibility with other components may decrease. In addition, the said number average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the ladder-type silsesquioxane [B2-1] is not particularly limited, but is preferably liquid at room temperature (about 25 ° C.). More specifically, the viscosity of the ladder-type silsesquioxane [B2-1] at 23 ° C. is preferably 100 to 100,000 mPa ⁇ s, more preferably 500 to 10,000 mPa ⁇ s, and still more preferably 1000 to 8000 mPa ⁇ s. is there. If the viscosity is less than 100 mPa ⁇ s, the heat resistance of the cured product may decrease. On the other hand, when the viscosity exceeds 100,000 mPa ⁇ s, it may be difficult to prepare and handle the curable resin composition. In addition, the viscosity in 23 degreeC can be measured by the method similar to the viscosity of ladder type silsesquioxane [B1-1], for example.
  • the ladder-type silsesquioxane [B] in addition to the ladder-type silsesquioxane [B1-1] and [B2-1], for example, the ladder-type silsesquioxane [B1-1] is solid at 25 ° C. and has an aliphatic carbon-carbon defect.
  • Ladder-type silsesquioxane having a saturated bond sometimes referred to as “ladder-type silsesquioxane [B1-2]
  • a ladder-type silsesquioxane that is solid at 25 ° C. and has a hydrosilyl group For example, “ladder type silsesquioxane [B2-2]”).
  • the curable resin composition of the present invention contains ladder-type silsesquioxane [B1-2] and / or [B2-2], in particular, the barrier property against a corrosive gas of a cured product formed by curing. And toughness (particularly crack resistance) tends to be improved.
  • the number of aliphatic carbon-carbon unsaturated bonds in the molecule (in one molecule) in the ladder-type silsesquioxane [B1-2] is not particularly limited, but 2 or more (for example, 2 to 50) The number is preferably 2 to 30.
  • the position of the aliphatic carbon-carbon unsaturated bond in the ladder-type silsesquioxane [B1-2] is not particularly limited, and may be a side chain or a terminal.
  • the number of aliphatic carbon-carbon unsaturated bonds can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the number of hydrosilyl groups in the molecule (in one molecule) in the ladder-type silsesquioxane [B2-2] is not particularly limited, but is preferably 2 or more (for example, 2 to 50), more preferably 2 to 30 pieces.
  • the position of the hydrosilyl group in the ladder-type silsesquioxane [B2-2] is not particularly limited, and may be a side chain or a terminal.
  • the number of hydrosilyl groups can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the weight average molecular weight (Mw) of the ladder-type silsesquioxane [B1-2] and [B2-2] is not particularly limited, but is preferably 2000 to 800,000, and more preferably 6000 to 100,000.
  • Mw weight average molecular weight
  • the weight average molecular weight is less than 2000, the barrier property against the corrosive gas of the cured product may be lowered.
  • the molecular weight exceeds 800,000, the compatibility with other components may decrease.
  • the said weight average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • Ladder-type silsesquioxane [B1-2] and [B2-2] are produced by a known or conventional method for producing ladder-type silsesquioxane (for example, a sol-gel method using a trifunctional silane compound as a raw material). Can do.
  • ladder-type silsesquioxane [B] examples include the above-described ladder-type silsesquioxane [B1-1], [B1-2], [B2-1], and [B2-2], for example. It is also possible to use a raw material ladder polymer of the above, and the raw material ladder polymer having a hydrogen atom or an aliphatic carbon-carbon unsaturated bond as R, wherein a terminal group (T in the above formula (b-L)) is Those sealed with a silyl group such as a trimethylsilyl group can also be used.
  • the ladder type silsesquioxane [B] can be used alone or in combination of two or more.
  • the content (total amount) of the ladder-type silsesquioxane [B] in the curable resin composition (100% by weight) is not particularly limited, but is preferably 0% by weight or more and less than 100% by weight, more preferably 5%. It is ⁇ 95% by weight, more preferably 10 to 90% by weight, particularly preferably 15 to 85% by weight, and most preferably 20 to 80% by weight.
  • the “content of ladder-type silsesquioxane [B]” includes two or more types of ladder-type silsesquioxane [B] (for example, ladder-type silsesquioxane [B1] and ladder). Type silsesquioxane [B2]) means the sum of these contents.
  • the content of ladder-type silsesquioxane [B1] with respect to the total amount (100% by weight) of the compound (compound ⁇ H>) having an aliphatic carbon-carbon unsaturated bond in the curable resin composition is not particularly limited. Is preferably 0% by weight or more and less than 100% by weight, more preferably 5 to 95% by weight, still more preferably 10 to 90% by weight, particularly preferably 15 to 85% by weight, and most preferably 20 to 80% by weight. is there.
  • the content of ladder-type silsesquioxane [B2] relative to the total amount (100% by weight) of the compound having a hydrosilyl group (compound ⁇ U>) in the curable resin composition is not particularly limited, but is 0% by weight or more.
  • the content is preferably less than 100% by weight, more preferably 5 to 95% by weight, further preferably 10 to 90% by weight, particularly preferably 15 to 85% by weight, and most preferably 20 to 80% by weight.
  • Silicone [C] in the curable resin composition of the present invention is a polyorganosiloxane composed of siloxane bonds (Si—O—Si), and has a hydrosilyl group or an aliphatic carbon-carbon unsaturated bond. Or it is a branched chain silicone (silicone resin; silicone [C1], silicone [C2]). As described above, silicone [C1] is silicone [C] having an aliphatic carbon-carbon unsaturated bond in the molecule, and silicone [C2] is silicone [C] having a hydrosilyl group in the molecule. It is.
  • silicone [C] does not include polyorganosilsesquioxane such as polyorganosilsesquioxane [A] and ladder-type silsesquioxane [B] described above.
  • Examples of the silicone skeleton constituting the silicones [C1] and [C2] include, for example, phenyl silicone skeleton (polydiphenylsiloxane), phenylmethylsilicone skeleton (polymethylphenylsiloxane), and dimethylsilicone skeleton (polydimethylsiloxane).
  • a conventional silicone skeleton may be mentioned.
  • the position of the hydrosilyl group and the aliphatic carbon-carbon unsaturated bond in the silicone [C] is not particularly limited, and may be located at the side chain of the silicone skeleton or at the terminal.
  • the terminal structure of silicone [C] is not particularly limited, and examples thereof include a silanol group, an alkoxysilyl group, a trialkylsilyl group (for example, a trimethylsilyl group) and the like.
  • Various organic groups such as a group containing an aliphatic carbon-carbon unsaturated bond and a hydrosilyl group may be introduced into the terminal of the silicone [C].
  • the molecular weight of silicone [C] is not particularly limited, but is preferably 100 to 800,000, more preferably 200 to 100,000, still more preferably 300 to 50,000, particularly preferably 1000 to 30000, and most preferably 2500 to 20000. is there. If the molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, if the molecular weight exceeds 800,000, the compatibility with other components may decrease.
  • the molecular weight can be calculated, for example, as a molecular weight in terms of polystyrene by gel permeation chromatography.
  • the weight average molecular weight (Mw) of silicone [C] is not particularly limited, but is preferably from 100 to 800,000, more preferably from 200 to 100,000, still more preferably from 300 to 50,000, particularly preferably from 1000 to 30000, most preferably. Is 2500-20000. If the weight average molecular weight is less than 100, the heat resistance of the cured product may decrease. On the other hand, if the weight average molecular weight exceeds 800,000, the compatibility with other components may decrease. In addition, the said weight average molecular weight is computable from the molecular weight of standard polystyrene conversion by a gel permeation chromatography, for example.
  • the number of aliphatic carbon-carbon unsaturated bonds in the molecule (in one molecule) in the silicone [C1] is not particularly limited, but is preferably 2 or more (for example, 2 to 50), more preferably 2 to 30.
  • the number of aliphatic carbon-carbon unsaturated bonds can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the number of hydrosilyl groups in the molecule (in one molecule) in the silicone [C2] is not particularly limited, but is preferably 2 or more (for example, 2 to 50), more preferably 2 to 30.
  • the number of hydrosilyl groups can be calculated by, for example, 1 H-NMR spectrum measurement.
  • Silicone [C] can be produced by a known or conventional method such as a method of polycondensation of a bifunctional silane corresponding to the structure of the silicone [C] and modifying as necessary. Moreover, as silicone [C], it is also possible to use a commercial item.
  • silicone [C] examples include a silicone having no aryl group in the molecule (sometimes referred to as “aryl group-free silicone”), and a silicone having an aryl group in the molecule (referred to as “aryl group-containing silicone”). In some cases). These silicones can be selected as appropriate depending on, for example, the desired physical properties of the cured product, optical properties such as refractive index, and the like, and in what composition both are used.
  • the aryl group-free silicone has a group other than an aryl group (sometimes referred to as a “non-aryl group”) as a group directly bonded to a silicon atom.
  • non-aryl groups include: , A hydrogen atom, a group having a Si—H bond, a substituted or unsubstituted hydrocarbon group (however, an aryl group and a group containing an aryl group are not included), a hydroxyl group, an alkoxy group, an alkenyloxy group, an acyloxy group, Examples include mercapto group (thiol group), alkylthio group, alkenylthio group, carboxyl group, alkoxycarbonyl group, amino group or substituted amino group (mono or dialkylamino group, acylamino group etc.), epoxy group, halogen atom and the like.
  • hydrocarbon group an alkyl group, an alkenyl group, a cycloalkyl group,
  • a C1-10 alkyl group is preferable, More preferably, it is a C1-4 alkyl group.
  • a C2-10 alkenyl group is preferable, More preferably, it is a C2-4 alkenyl group.
  • the cycloalkyl group is preferably a C 3-12 cycloalkyl group.
  • a C 3-12 cycloalkenyl group is preferable.
  • the alkoxy group a C 1-6 alkoxy group is preferable.
  • the alkenyloxy group a C 1-6 alkenyloxy group is preferable.
  • acyloxy group a C 1-6 acyloxy group is preferable.
  • alkylthio group a C 1-6 alkylthio group is preferable.
  • alkenylthio group a C 1-6 alkenylthio group is preferable.
  • alkoxycarbonyl group a C 1-6 alkoxycarbonyl group is preferable.
  • examples of the non-aryl group described above include the same non-aryl groups exemplified as R 1a to R 1f in formula (a-1).
  • the above aryl group-free silicone contains substantially no aryl group in the molecule.
  • the aryl group content relative to the total amount (100 wt%) of the aryl group-free silicone is preferably 0.5 wt% or less (for example, 0 to 0.5 wt%), more preferably 0 .2% by weight or less, more preferably 0.1% by weight or less.
  • desired physical properties for example, high refractive index
  • the non-aryl group (non-aryl group bonded directly to the silicon atom) of the aryl group-free silicone a hydrogen atom, a group having a Si—H bond, and a substituted or unsubstituted hydrocarbon group (preferably Is preferably at least one group selected from the group consisting of an alkyl group or an alkenyl group.
  • the aryl group-free silicone has a group containing an aliphatic carbon-carbon unsaturated bond as a non-aryl group (for example, an alkenyl group)
  • the aryl group-free silicone can be used as silicone [C1]. .
  • the aryl group-free silicone has a group having a Si—H bond as a non-aryl group (for example, a hydrosilyl group or a group containing the same), the aryl group-free silicone is used as silicone [C2]. it can.
  • the number average molecular weight of the aryl group-free silicone is not particularly limited, but is preferably 500 to 20000, more preferably 600 to 10000, and still more preferably 700 to 5000.
  • the weight average molecular weight of the silicone having no aryl group is not particularly limited, but is preferably 500 to 50000, more preferably 1000 to 40000, and still more preferably 2000 to 30000.
  • the number average molecular weight and the weight average molecular weight can be calculated from the molecular weight in terms of standard polystyrene by gel permeation chromatography, for example.
  • the said aryl group-free silicone can also be used individually by 1 type, and can be used in combination of 2 or more type.
  • an aryl group-free silicone (silicone [C1]) having a group having an aliphatic carbon-carbon unsaturated bond (for example, an alkenyl group)
  • an aryl group-free silicone (silicone [C2]) having a group having a Si—H bond (for example, a hydrosilyl group or a group containing the same).
  • silicone which does not have the said aryl group brand name "GD-1012A”, “GD-1012B” (above, the Changxing Chemical Industry make); brand name “KER-2500A”, “KER-2500B” ( As described above, commercially available products such as Shin-Etsu Chemical Co., Ltd. can also be used.
  • the aryl group-free silicone having an aliphatic carbon-carbon unsaturated bond may be an aryl group-free silicone having a Si—H bond at the same time.
  • the aryl group-free silicone having a Si—H bond may be an aryl group-free silicone having an aliphatic carbon-carbon unsaturated bond at the same time.
  • Examples of the aryl group contained in the aryl group-containing silicone that is the silicone [C] include C 6-14 aryl groups (particularly C 6-10 aryl groups) such as a phenyl group and a naphthyl group.
  • the aryl group may be a group directly bonded to a silicon atom constituting the aryl group-containing silicone.
  • the above aryl group-containing silicone may contain the above-mentioned non-aryl group in addition to the aryl group.
  • the non-aryl group include a hydrogen atom, a group having a Si—H bond (such as a hydrosilyl group and a group including the same), and a substituted or unsubstituted hydrocarbon group (however, an aryl group and a group including the same are included).
  • the said aryl group containing silicone has group (for example, alkenyl group) containing an aliphatic carbon-carbon unsaturated bond as a non-aryl group
  • the said aryl group containing silicone can be used as silicone [C1].
  • the aryl group-containing silicone has a group having a Si—H bond as a non-aryl group (for example, a hydrosilyl group or a group containing the same)
  • the aryl group-containing silicone can be used as silicone [C2].
  • the non-aryl group may be a group directly bonded to a silicon atom constituting the aryl group-containing silicone.
  • the content of the aryl group (in terms of phenyl group) relative to the total amount (100% by weight) of the aryl group-containing silicone is not particularly limited, but is preferably 35% by weight or more, more preferably 40% by weight or more, and still more preferably 45% by weight or more.
  • the content of the aryl groups is less than 35% by weight, the barrier property against corrosive gas SO X or the like of the obtained cured product becomes low.
  • all of the substituents in the main chain composed of the siloxane bond (Si—O—Si) of the aryl group-containing silicone may be an aryl group, or only a part of the substituents is an aryl group. It may be.
  • the content of the aryl group can be calculated by, for example, 1 H-NMR spectrum measurement.
  • the number average molecular weight (Mn) of the aryl group-containing silicone is not particularly limited, but is preferably 500 to 4000, more preferably 550 to 2800, and further preferably 600 to 1500.
  • the weight average molecular weight (Mw) of the silicone having an aryl group is not particularly limited, but is preferably 500 to 20000, more preferably 600 to 10,000, and still more preferably 700 to 6500.
  • the number average molecular weight and / or the weight average molecular weight is less than 500, the heat resistance of the obtained cured product may be lowered.
  • the compatibility with the other components of the aryl group-containing silicone is reduced, or two types of silicone having an aryl group are used. When used in combination, the compatibility of these may be reduced.
  • the aryl group-containing silicone may be a mixture having various molecular weights controlled to an average molecular weight within the above range.
  • a number average molecular weight and a weight average molecular weight can be calculated from the molecular weight of standard polystyrene conversion by gel permeation chromatography, for example.
  • the molecular weight dispersity (Mw / Mn) calculated from the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the aryl group-containing silicone is not particularly limited, but is preferably 0.95 to 4.00, more preferably Is from 1.00 to 3.80, more preferably from 1.20 to 3.50. If the molecular weight dispersity exceeds 4.00, there is a case where a barrier against corrosive gases such as heat resistance and SO X gas of the cured product obtained is lowered.
  • aryl group-containing silicone examples include an aryl group-containing silicone having an aliphatic carbon-carbon unsaturated bond.
  • the aliphatic carbon-carbon unsaturated bond may be a group directly bonded to a silicon atom constituting the aryl group-containing silicone having the aliphatic carbon-carbon unsaturated bond.
  • the aliphatic carbon-carbon unsaturated bond is a main chain (straight chain and / or branched) composed of a siloxane bond (Si-O-Si) of an aryl group-containing silicone having an aliphatic carbon-carbon unsaturated bond. It may be present at the end of the chain.
  • Examples of the group containing an aliphatic carbon-carbon unsaturated bond include a vinyl group, an allyl group, a methallyl group, a 1-propenyl group, an isopropenyl group, a 1-butenyl group, a 2-butenyl group, a 3-butenyl group, C 2-20 alkenyl groups (preferably C 2-10 alkenyl groups, more preferably C 2-4 alkenyl groups) such as 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group and 5-hexenyl group Group); C 3-12 cycloalkenyl group such as cyclohexenyl group; C 4-15 bridged cyclic unsaturated hydrocarbon group such as bicycloheptenyl group; C 2-4 alkenyl-substituted aryl group such as styryl group; cinnamyl Groups and the like.
  • R ′ is the above C 2-20 alkenyl group, C 3.
  • Groups that are a -12 cycloalkenyl group, a C 4-15 bridged cyclic unsaturated hydrocarbon group, a C 2-4 alkenyl substituted aryl group, a cinnamyl group, and the like are also included.
  • an alkenyl group is preferable, a C 2-20 alkenyl group is more preferable, and a vinyl group is more preferable.
  • the content (in terms of vinyl group) of the aliphatic carbon-carbon unsaturated bond relative to the total amount (100% by weight) of the aryl group-containing silicone having the aliphatic carbon-carbon unsaturated bond is not particularly limited, but is 1.5. It is preferably ⁇ 15.0% by weight, more preferably 2.0 to 13.0% by weight, still more preferably 3.0 to 12.0% by weight.
  • a cured product excellent in various physical properties such as heat resistance, crack resistance, and barrier properties against corrosive gas tends to be obtained.
  • the content of the aliphatic carbon-carbon unsaturated bond can be calculated by, for example, 1 H-NMR spectrum measurement.
  • an aryl group-containing silicone having a Si—H bond for example, an aryl group-containing silicone having a Si—H bond can be mentioned.
  • the Si—H bond may have a substituent bonded to a silicon atom constituting the aryl group-containing silicone having the Si—H bond.
  • the Si-H bond is present at the end of the main chain (straight chain and / or branched chain) composed of the siloxane bond (Si-O-Si) of the aryl group-containing silicone having a Si-H bond. May be.
  • Examples of the group having an Si—H bond include a group represented by the above formula (bs) in which at least one of three R ′ is a hydrogen atom.
  • the content of the Si-H bond relative to the total amount (100% by weight) of the aryl group-containing silicone having the Si-H bond is not particularly limited.
  • the weight conversion of H (hydride) in the Si-H bond (H conversion) Is preferably 0.01 to 0.50% by weight, more preferably 0.05 to 0.30% by weight, still more preferably 0.08 to 0.20% by weight.
  • the said aryl group containing silicone can also be used individually by 1 type, and can be used in combination of 2 or more type.
  • a group having an aliphatic carbon-carbon unsaturated bond for example, An aryl group-containing silicone having an alkenyl group (silicone [C1]) and an aryl group-containing silicone having a group having a Si—H bond (for example, a hydrosilyl group or a group containing the same) (silicone [C2]). It is preferable.
  • aryl group-containing silicone examples include, for example, trade names “GD-1130A” and “GD-1130B” (manufactured by Changxing Chemical Industry); trade names “OE-6630A” and “OE-6630B” (above, Commercial products such as “ASP-1120A” and “ASP-1120B” (manufactured by Shin-Etsu Chemical Co., Ltd.) can also be used.
  • the aryl group-containing silicone having an aliphatic carbon-carbon unsaturated bond may be an aryl group-containing silicone having an Si—H bond at the same time, and the aryl group-containing silicone having an Si—H bond may be aliphatic at the same time.
  • An aryl group-containing silicone having a carbon-carbon unsaturated bond may be used.
  • the silicone [C] in the curable resin composition of the present invention includes, for example, silicone containing a structure represented by the following formula (c-1) (“silicone [C-1]”). May be referred to).
  • R 21 to R 26 each represent a hydrogen atom, a monovalent hydrocarbon group, or a monovalent heterocyclic group.
  • R 21 to R 26 are a monovalent group containing a hydrogen atom or an aliphatic carbon-carbon unsaturated bond.
  • Examples of the monovalent hydrocarbon group and monovalent heterocyclic group include the same groups as those exemplified as R 1a to R 1f in the above formula (a-1).
  • R 21 to R 26 may be the same or different from each other.
  • formula (c-1a) when one or more of R 21 to R 26 is a monovalent group containing an aliphatic carbon-carbon unsaturated bond may be referred to as formula (c-1a).
  • formula (c-1b) when one or more of R 21 to R 26 are hydrogen atoms may be referred to as formula (c-1b). That is, the silicone [C1] may be a silicone containing a structure represented by the formula (c-1a), and the silicone [C2] is a silicone containing a structure represented by the formula (c-1b). There may be.
  • R 27 represents a divalent hydrocarbon group.
  • the divalent hydrocarbon group include a linear or branched alkylene group (for example, a group represented by — [CH 2 ] t — and the like: t represents an integer of 1 or more), divalent And alicyclic hydrocarbon groups.
  • the linear or branched alkylene group include a linear or branched alkylene having 1 to 18 carbon atoms such as a methylene group, a methylmethylene group, a dimethylmethylene group, an ethylene group, a propylene group, and a trimethylene group. Groups and the like.
  • divalent alicyclic hydrocarbon group examples include 1,2-cyclopentylene group, 1,3-cyclopentylene group, cyclopentylidene group, 1,2-cyclohexylene group, 1,3-cyclohexene group.
  • divalent cycloalkylene groups such as a silylene group, 1,4-cyclohexylene group, and cyclohexylidene group.
  • s1 represents an integer of 1 or more.
  • subjected s1 may respectively be the same, and may differ.
  • the addition form of the structures is not particularly limited, and may be a random type or a block type.
  • s2 represents an integer of 1 or more.
  • the structure in the parenthesis to which s2 is attached may be the same or different.
  • the addition form of the structures is not particularly limited, and may be a random type or a block type.
  • the addition form of the structure in parentheses with s1 and the structure in parentheses with s2 is not particularly limited, and may be a random type or a block type. It may be.
  • silicone [C-1] is not specifically limited, For example, a silanol group, an alkoxysilyl group, a trialkylsilyl group (for example, trimethylsilyl group) etc. are mentioned.
  • Various organic groups such as a group containing an aliphatic carbon-carbon unsaturated bond and a hydrosilyl group may be introduced into the terminal of the silicone [C-1]. That is, more specifically, examples of silicone [C-1] include silicones represented by the following structures.
  • R 21 to R 27 , s1, and s2 are the same as described above.
  • R 28 represents a hydrogen atom, a monovalent hydrocarbon group, or a monovalent group represented by the following formula, respectively.
  • R 29 are each (a plurality of R 29 may each be the same or may be different), a hydrogen atom or a monovalent hydrocarbon group.
  • s3 represents an integer of 0 or more.
  • the content (total amount) of silicone [C] in the curable resin composition (100 wt%) is not particularly limited, but is preferably 0 wt% or more and less than 100 wt%, more preferably 0.01 to 95 wt%. %, More preferably 0.1 to 90% by weight, particularly preferably 1 to 80% by weight, and most preferably 3 to 70% by weight.
  • the “content of silicone [C]” means that when two or more types are included as silicone [C] (for example, when silicone [C1] and silicone [C2] are included), the total of these contents Means.
  • content of silicone [C1] is not specifically limited with respect to the whole quantity (100 weight%) of the compound (compound ⁇ U>) which has an aliphatic carbon-carbon unsaturated bond in curable resin composition, It is 0 weight%
  • the content is preferably less than 100% by weight, more preferably 0.01 to 95% by weight, still more preferably 0.1 to 90% by weight, particularly preferably 1 to 80% by weight, and most preferably 3 to 70% by weight. .
  • the content of silicone [C2] with respect to the total amount (100% by weight) of the compound having a hydrosilyl group (compound ⁇ H>) in the curable resin composition is not particularly limited, but is 0% by weight or more and less than 100% by weight. It is preferably 0.01 to 95% by weight, more preferably 0.1 to 90% by weight, particularly preferably 1 to 80% by weight, and most preferably 3 to 70% by weight.
  • the curable resin composition of the present invention may contain a compound represented by the above formula (d-1) (isocyanuric acid derivative; may be referred to as “isocyanuric acid compound [D]”).
  • R 31 represents a monovalent organic group having a carbon atom at the bonding site with the nitrogen atom shown in the formula.
  • R 31 may be the same or different.
  • the monovalent organic group include the monovalent organic groups exemplified as R in the ladder-type silsesquioxane [B1].
  • the isocyanuric acid compound [D] is a monovalent group (in particular, an alkenyl group) containing at least an aliphatic carbon-carbon unsaturated bond as the monovalent organic group (R 31 in the formula (d-1)). ).
  • isocyanuric acid compound [D] those having at least an aliphatic carbon-carbon unsaturated bond are particularly preferable in that they are incorporated into a cured product.
  • Specific examples include a compound represented by the above formula (d-2), a compound represented by the above formula (d-3), a compound represented by the above formula (d-4), and the like.
  • R 32 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • the monovalent group containing an aliphatic carbon-carbon unsaturated bond include a vinyl group, allyl group, methallyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3- Alkenyl groups such as butenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group and 5-hexenyl group; alkynyl groups such as ethynyl group and propynyl group; cycloalkenyl groups such as cyclohexenyl group A group having the above alkenyl group, alkynyl group or cycloalkenyl group; R 33 represents a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms, respectively.
  • linear or branched alkyl group having 1 to 8 carbon atoms examples include, for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, s-butyl group, pentyl group, hexyl group, heptyl Group, octyl group, ethylhexyl group and the like.
  • linear or branched alkyl groups having 1 to 3 carbon atoms such as a methyl group, an ethyl group, a propyl group, and an isopropyl group are preferable.
  • the plurality of R 33 may be the same or different. It is particularly preferable that the two R 33 in the above formula (d-2) are both hydrogen atoms.
  • the compound represented by the above formula (d-2) may be modified by reacting with a compound that reacts with an epoxy group such as alcohol or acid anhydride.
  • the compound represented by the above formula (d-2) can also be used after previously reacting (hydrosilylation) with a compound having a hydrosilyl group.
  • the composition of the curable resin composition of the present invention obtained by reacting the compound represented by the formula (d-2) with the ladder-type silsesquioxane [B2] in the presence of a hydrosilylation catalyst. It may be used as an ingredient.
  • a component obtained by reacting the compound represented by the above formula (d-2) with a cyclic siloxane [E2] described below in the presence of a hydrosilylation catalyst is a constituent of the curable resin composition of the present invention.
  • hydrosilylation catalyst May be used as As said hydrosilylation catalyst, the thing similar to what was illustrated in the manufacturing method of ladder type silsesquioxane [B2] is illustrated.
  • the conditions for the hydrosilylation reaction can be appropriately selected from known or conventional conditions for hydrosilylation reactions.
  • the compound represented by the above formula (d-2) may be blended with other components after previously mixing with a silane coupling agent as described later. Good.
  • the content of the compound represented by the formula (d-2) is not particularly limited, but is preferably 0.01 to 10% by weight, more preferably 0 with respect to the curable resin composition (100% by weight). .05 to 5% by weight, more preferably 0.1 to 3% by weight.
  • the content of the compound represented by the above formula (d-2) is less than 0.01% by weight, the barrier property against the corrosive gas and the adhesion to the adherend may be deteriorated.
  • the content of the compound represented by the formula (d-2) exceeds 10% by weight, a solid may precipitate in the curable resin composition or the cured product may become cloudy.
  • each R 34 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • Examples of the monovalent group containing an aliphatic carbon-carbon unsaturated bond include the same groups as those exemplified in the above formula (d-2).
  • the plurality of R 34 may be the same or different.
  • R 35 represents a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms, and examples thereof include the same groups as R 33 .
  • R 35 in the above formula (d-3) is particularly preferably a hydrogen atom.
  • the compound represented by the above formula (d-3) is modified by reacting with a compound that reacts with an epoxy group such as an alcohol or an acid anhydride in the same manner as the compound represented by the above formula (d-2). Can also be used.
  • the compound represented by the above formula (d-3) may be used after previously reacting (hydrosilylating) with a compound having a hydrosilyl group, similarly to the compound represented by the above formula (d-2). it can. Specifically, for example, those that have been reacted in advance with ladder-type silsesquioxane [B2] or cyclic siloxane [E2] can be used as a constituent of the curable resin composition of the present invention.
  • the compound represented by the above formula (d-3) may be blended with other components after previously mixing with a silane coupling agent described later.
  • the content of the compound represented by the formula (d-3) is not particularly limited, but is preferably 0.01 to 10% by weight, more preferably 0 with respect to the curable resin composition (100% by weight). .05 to 5% by weight, more preferably 0.1 to 3% by weight.
  • the content of the compound represented by the formula (d-3) is less than 0.01% by weight, the barrier property against the corrosive gas of the cured product and the adhesion to the adherend may be deteriorated.
  • the content of the compound represented by the above formula (d-3) exceeds 10% by weight, a solid may precipitate in the curable resin composition or the cured product may become cloudy.
  • each R 36 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • Examples of the monovalent group containing an aliphatic carbon-carbon unsaturated bond include the same groups as those exemplified in the above formula (d-2).
  • the plurality of R 36 may be the same or different.
  • the compound represented by the above formula (d-4) may be used after previously reacting (hydrosilylating) with a compound having a hydrosilyl group, similarly to the compound represented by the above formula (d-2). it can. Specifically, for example, those that have been reacted in advance with ladder-type silsesquioxane [B2] or cyclic siloxane [E2] can be used as a constituent of the curable resin composition of the present invention.
  • the compound represented by the above formula (d-4) may be blended with other components after previously mixed with a silane coupling agent described later from the viewpoint of improving compatibility with other components.
  • the content of the compound represented by the formula (d-4) is not particularly limited, but is preferably 0.01 to 10% by weight, more preferably 0 with respect to the curable resin composition (100% by weight). .05 to 5% by weight, more preferably 0.1 to 3% by weight.
  • the content of the compound represented by the above formula (d-4) is less than 0.01% by weight, the barrier property against the corrosive gas and the adhesion to the adherend may be deteriorated.
  • the content of the compound represented by the above formula (d-4) exceeds 10% by weight, a solid may precipitate in the curable resin composition or the cured product may become cloudy.
  • isocyanuric acid compound [D] in addition to the compounds represented by the above formulas (d-2) to (d-4), for example, a compound represented by the following formula (d-5) may be used. You can also.
  • R 37 represents a hydrogen atom or a linear or branched alkyl group having 1 to 8 carbon atoms, and examples thereof include the same groups as R 33 .
  • the plurality of R 37 may be the same or different.
  • R 37 in the above formula (d-5) is particularly preferably a hydrogen atom.
  • isocyanuric acid compound [D] for example, compounds represented by the following formulas (d-6) to (d-8) (compounds having an alicyclic epoxy group) can also be used. .
  • R 38 represents an alkyl group (a linear or branched alkyl group).
  • R 38 is particularly preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms.
  • R 38 in the above formula (d-7) may be the same or different.
  • R 39 represents a monovalent group represented by the following formula (d ′).
  • Z in the following formula (d ′) is a linking group having one or more atoms (a divalent group having one or more atoms) at the bonding site with the nitrogen atom shown in the formulas (d-6) to (d-8). ).
  • Examples of the linking group include a divalent hydrocarbon group (for example, an alkylene group having 1 to 30 carbon atoms such as a methylene group or an ethylene group, a cycloalkylene group, etc.), one or more divalent hydrocarbon groups and a hetero group. And a group in which one or more divalent groups containing atoms (for example, a carbonyl group, an ether group, a thioether group, an ester group, a carbonate group, an amide group, etc.) are linked.
  • the above formula (d-6), (d -8) a plurality of R 39 in may each be the same or may be different.
  • isocyanuric acid compound [D] for example, monoallyl diglycidyl isocyanuric acid, 1-allyl-3,5-bis (2-methylepoxypropyl) isocyanuric acid, 1- (2-methylpropenyl)- 3,5-diglycidyl isocyanuric acid, 1- (2-methylpropenyl) -3,5-bis (2-methylepoxypropyl) isocyanuric acid, diallyl monoglycidyl isocyanuric acid, 1,3-diallyl-5- (2- Methylepoxypropyl) isocyanuric acid, 1,3-bis (2-methylpropenyl) -5-glycidyl isocyanuric acid, 1,3-bis (2-methylpropenyl) -5- (2-methylepoxypropyl) isocyanuric acid, tri Allyl isocyanuric acid, tris (2-methylpropenyl) isocyanuric acid, triglycy Examples include ru
  • the content (total amount) of the isocyanuric acid compound [D] is not particularly limited, but is preferably 0.01 to 10% by weight, and more preferably 0.05 to 10% by weight with respect to the curable resin composition (100% by weight). It is 5% by weight, more preferably 0.1 to 3% by weight.
  • the content of the isocyanuric acid compound [D] is less than 0.01% by weight, the barrier property against the corrosive gas and the adhesion to the adherend may be deteriorated.
  • the content of the isocyanuric acid compound [D] exceeds 10% by weight, the curability may be deteriorated, and a solid may precipitate in the curable resin composition or the cured product may become cloudy.
  • the said "content of isocyanuric acid compound [D]" means the sum total of these content, when two or more types are included as an isocyanuric acid compound [D].
  • the cyclic siloxane [E] in the curable resin composition of the present invention is a compound having a cyclic structure composed of Si—O bonds (cyclic siloxane [E1], cyclic siloxane [E2]).
  • the cyclic siloxane [E1] is a cyclic siloxane [E] having an aliphatic carbon-carbon unsaturated bond in the molecule
  • the cyclic siloxane [E2] is a cyclic having a hydrosilyl group in the molecule.
  • the cyclic siloxane [E1] is a siloxane compound having an aliphatic carbon-carbon unsaturated bond (particularly, an aliphatic carbon-carbon double bond) in the molecule and a cyclic structure constituted by Si—O bonds. Although it does not specifically limit, For example, the compound etc. which have the group containing the aliphatic carbon-carbon unsaturated bond represented by a following formula (e-1) are mentioned. However, the cyclic siloxane [E1] does not include silsesquioxane having a ring structure (for example, polyorganosilsesquioxane [A], ladder-type silsesquioxane [B], etc.).
  • R 41 in the formula (e-1) represents a monovalent organic group, and examples thereof are the same as the monovalent organic group in R. At least one of R 41 is a group containing an aliphatic carbon-carbon unsaturated bond.
  • the plurality of R 41 may be the same or different.
  • 2 or more of R 41 of the compound represented by the formula (e-1) may be a group containing an aliphatic carbon-carbon unsaturated bond (particularly, an aliphatic carbon-carbon double bond). preferable.
  • Examples of the group containing an aliphatic carbon-carbon unsaturated bond include the same groups as R 3e in formula (a-3).
  • As the group having an aliphatic carbon-carbon unsaturated bond an alkenyl group (particularly, a vinyl group) is preferable.
  • Q in the formula (e-1) represents an integer of 3 or more (for example, an integer of 3 to 10), preferably an integer of 3 to 7, and more preferably 4.
  • cyclic siloxane [E1] examples include 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane and 1,3,5,7-tetramethyl.
  • -1,3,5,7-tetrahexenylcyclotetrasiloxane 1-propyl-3,5,7-trivinyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,5-divinyl-3,7 -Dihexyl-1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane, 1,3,5,7,9-pentavinyl-1, 3,5,7,9-pentamethylcyclopentasiloxane, 1,3,5,7,9,11-hexavinyl-1,3,5,7,9,11-hexamethylcyclohexasiloxane and the like.
  • cyclic siloxane [E1] can be used individually by 1 type or in combination of 2 or more types.
  • 1,3,5,7- is particularly preferable in that the effect of reducing the initial viscosity of the curable resin composition and improving the barrier property against the corrosive gas of the cured product can be easily obtained.
  • Tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane is preferred.
  • the cyclic siloxane [E1] may further have two or more hydrosilyl groups in the molecule.
  • the cyclic siloxane [E1] may be used as the cyclic siloxane [E2].
  • the content (total amount) of the cyclic siloxane [E1] in the curable resin composition of the present invention is not particularly limited, but is preferably 0.01 to 20% by weight with respect to the curable resin composition (100% by weight). More preferably, it is 0.1 to 10% by weight, and further preferably 0.5 to 5% by weight.
  • the content is less than 0.01% by weight, the barrier property against the corrosive gas of the cured product may be lowered, or the viscosity of the curable resin composition may be too high.
  • the content exceeds 20% by weight the hardness becomes too high, and the cured product is likely to be cracked or peeled off from the adherend in some cases.
  • the cyclic siloxane [E2] is not particularly limited as long as it is a siloxane compound having a hydrosilyl group in the molecule and having a cyclic structure constituted by Si—O bonds. ) And the like. However, the cyclic siloxane [E2] does not include silsesquioxane having a ring structure (for example, polyorganosilsesquioxane [A], ladder-type silsesquioxane [B], etc.).
  • R 42 in the above formula (e-2) represents a hydrogen atom or a monovalent organic group, and examples of the monovalent organic group include the same monovalent organic groups as those described above for R. At least one of R 42 is a hydrogen atom. However, among the R 42 of the compound represented by formula (e-2), it is preferable more than two are hydrogen atoms. The plurality of R 42 may be the same or different. In the formula (e-2), r represents an integer of 3 or more (for example, an integer of 3 to 10), preferably an integer of 3 to 7, and more preferably 4.
  • cyclic siloxane [E2] include, for example, cyclotrisiloxane and hexamethylcyclohexasiloxane (for example, 1,3,5,7,9,11-hexamethylcyclohexasiloxane) in the molecule.
  • cyclic siloxane [E2] can be used individually by 1 type or in combination of 2 or more types.
  • 1,3,5,7-tetramethylcyclotetrasiloxane is particularly preferable in that the effect of improving the barrier property against the corrosive gas of the cured product can be easily obtained by reducing the initial viscosity of the curable resin composition.
  • the cyclic siloxane [E2] may further have two or more aliphatic carbon-carbon unsaturated bonds in the molecule.
  • the cyclic siloxane [E2] may be used as the cyclic siloxane [E1] in some cases.
  • the content (total amount) of the cyclic siloxane [E2] in the curable resin composition of the present invention is not particularly limited, but is preferably 0.01 to 30% by weight with respect to the curable resin composition (100% by weight). More preferably, it is 0.1 to 20% by weight, and further preferably 0.5 to 10% by weight.
  • the content is less than 0.01% by weight, the barrier property against the corrosive gas of the cured product may be lowered.
  • the content exceeds 30% by weight, the hardness of the cured product becomes too high, and cracks are likely to occur.
  • the curable resin composition of the present invention is a condensed compound of a compound represented by the above formula (f-1) (trifunctional silane compound) and a compound represented by the above formula (f-2) (bifunctional silane compound). (May be referred to as “condensation compound [F]”).
  • R 51 represents a monovalent hydrocarbon group.
  • Examples of the monovalent hydrocarbon group include the same groups as those exemplified as R 1a to R 1f in the formula (a-1).
  • R 52 represents a monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group include the same groups as those exemplified as R 1a to R 1f in the formula (a-1).
  • R 53 and R 54 each represent a monovalent hydrocarbon group.
  • Two R 53 s may be the same or different.
  • Examples of the monovalent hydrocarbon group include the same groups as those exemplified as R 1a to R 1f in the formula (a-1).
  • R 55 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond.
  • R ⁇ 3e> in the said Formula (a-3) is mentioned, for example.
  • the condensation compound [F] is obtained by condensing (hydrolysis and condensation reaction) the compound represented by the above formula (f-1) and the compound represented by the above formula (f-2).
  • the compound represented by the said formula (f-1) as a raw material can also be used individually by 1 type, and can also be used in combination of 2 or more type.
  • the compound represented by the said Formula (f-2) can also be used individually by 1 type, and can also be used in combination of 2 or more type.
  • the method for condensing the compound represented by the above formula (f-1) and the compound represented by the above formula (f-2) is not particularly limited, and a well-known and commonly used method for condensing an alkoxysilane compound. Can be adopted. Specifically, for example, the same conditions as when the trifunctional silane compound represented by the above formula (bi) is condensed (silanol condensation) can be employed.
  • Ratio of the compound represented by formula (f-1) and the compound represented by formula (f-2) constituting the condensed compound [F] [compound represented by formula (f-1) / formula ( The compound represented by f-2)] (weight ratio) is not particularly limited, but is preferably 1/99 to 99/1, and more preferably 10/90 to 90/10.
  • the condensation compound [F] is a condensation compound obtained by further condensing a tetrafunctional silane compound in addition to the compound represented by the formula (f-1) and the compound represented by the formula (f-2). Also good. That is, the condensed compound [F] is a compound represented by the formula (f-1) (trifunctional silane compound), a condensed compound of the compound represented by the formula (f-2) (bifunctional silane compound), and 4 It may be a condensation compound (condensate) of a functional silane compound.
  • the tetrafunctional silane compound is, for example, Si (OR 56 ) 4 [R 56 is the same or different and represents a monovalent hydrocarbon group, and is exemplified as R 1a to R 1f in the above formula (a-1), for example. The thing similar to what was done is mentioned. ].
  • the content (total amount) of the condensation compound [F] in the curable resin composition of the present invention is not particularly limited, but is preferably 0 to 80% by weight relative to the curable resin composition (100% by weight). Preferably, the content is 0.1 to 50% by weight. If the content exceeds 80% by weight, the crosslink density increases and the resin (cured product) may become brittle.
  • the curable resin composition of the present invention may further contain a hydrosilylation catalyst.
  • a hydrosilylation catalyst include known hydrosilylation reaction catalysts such as platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts.
  • platinum fine powder, platinum black, platinum-supported silica fine powder, platinum Supported activated carbon chloroplatinic acid, complexes of chloroplatinic acid with alcohols, aldehydes, ketones, platinum olefin complexes, platinum carbonyl complexes such as platinum-carbonylvinylmethyl complexes, platinum-divinyltetramethyldisiloxane complexes and platinum- Platinum-based catalysts such as platinum-vinylmethylsiloxane complexes such as cyclovinylmethylsiloxane complexes, platinum-phosphine complexes, platinum-phosphite complexes, etc., and palladium-based catalysts containing palladium atoms or rhodium atoms instead of platinum atoms in the platinum-based catalysts A catalyst or a rhodium-type catalyst is mentioned.
  • the said hydrosilylation catalyst may be used individually by 1 type, and may use 2 or more types together.
  • a platinum vinylmethylsiloxane complex, a platinum-carbonylvinylmethyl complex, and a complex of chloroplatinic acid, an alcohol, and an aldehyde are preferable because the reaction rate is good.
  • the content (blending amount) of the hydrosilylation catalyst is not particularly limited, but the total amount of aliphatic carbon-carbon unsaturated bonds of the compound having an aliphatic carbon-carbon unsaturated bond contained in the curable resin composition is 1 mol.
  • the amount is preferably 1 ⁇ 10 ⁇ 8 to 1 ⁇ 10 ⁇ 2 mol, more preferably 1.0 ⁇ 10 ⁇ 6 to 1.0 ⁇ 10 ⁇ 3 mol. If the amount used is less than 1 ⁇ 10 ⁇ 8 mol, the reaction may not proceed sufficiently. On the other hand, when the amount used exceeds 1 ⁇ 10 ⁇ 2 mol, the cured product may be easily colored.
  • the curable resin composition of the present invention may further contain a silane coupling agent.
  • a silane coupling agent When the silane coupling agent is included, the adhesion of the cured product to the adherend tends to be improved. Furthermore, since the silane coupling agent has good compatibility with the above isocyanuric acid compound [D] (particularly monoallyl diglycidyl isocyanuric acid compound), ladder-type silsesquioxane [B2] and the like, Compatibility with other components such as the isocyanuric acid compound [D] can be improved.
  • the composition of the isocyanuric acid compound [D] and the silane coupling agent is formed in advance and then blended with other components to obtain a uniform composition.
  • a resin composition is easily obtained.
  • silane coupling agent known or commonly used silane coupling agents can be used and are not particularly limited.
  • silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycid.
  • Epoxy group-containing silane coupling agents such as xylpropyltriethoxysilane; N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N 2- (Aminoethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propyl Amine, N-phenyl-3-aminopropyltrime Amino group-containing silane couplings such as xylsilane, hydrochloride of N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane, N-
  • an epoxy group-containing silane coupling agent (particularly 3-glycidoxypropyltrimethoxysilane) can be preferably used.
  • the said silane coupling agent can be used individually by 1 type or in combination of 2 or more types.
  • the content (blending amount) of the silane coupling agent is not particularly limited, but is preferably 0.01 to 15% by weight, more preferably 0.1 to 0.1% by weight with respect to the curable resin composition (100% by weight). It is 10% by weight, more preferably 0.5 to 5% by weight.
  • the content of the silane coupling agent is less than 0.01% by weight, the adhesion of the cured product to the adherend may be insufficient.
  • the isocyanuric acid compound [D] particularly, monoallyl diglycidyl isocyanurate compound
  • curing may be insufficient, and the toughness, heat resistance, and barrier properties of the cured product may be reduced.
  • the curable resin composition of the present invention may contain a hydrosilylation reaction inhibitor in order to adjust the speed of the curing reaction (hydrosilylation reaction).
  • hydrosilylation reaction inhibitor examples include alkyne alcohols such as 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and phenylbutynol; 3-methyl-3 -Enyne compounds such as pentene-1-yne and 3,5-dimethyl-3-hexen-1-yne; and thiazole, benzothiazole, benzotriazole and the like.
  • the said hydrosilylation reaction inhibitor can be used individually by 1 type or in combination of 2 or more types.
  • the content of the hydrosilylation reaction inhibitor varies depending on the crosslinking conditions of the curable resin composition and is not particularly limited, but practically, the content in the curable resin composition is in the range of 0.00001 to 5% by weight. The inside is preferable.
  • the curable resin composition of the present invention may contain a solvent.
  • the solvent include conventionally known solvents such as toluene, hexane, isopropanol, methyl isobutyl ketone, cyclopentanone, and propylene glycol monomethyl ether acetate.
  • a solvent can be used individually by 1 type or in combination of 2 or more types.
  • the curable resin composition of the present invention may contain other silane compounds (for example, compounds having a hydrosilyl group).
  • the other silane compounds include methyl (trisdimethylsiloxy) silane, tetrakis (dimethylsiloxy) silane, 1,1,3,3-tetramethyldisiloxane, 1,1,3,3,5,5- Hexamethyltrisiloxane, 1,1,1,3,5,5,5-heptamethyltrisiloxane, 1,1,3,3,5,5,7,7-octamethyltetrasiloxane, 1,1,1 , 3,5,5,7,7,7-nonamethyltetrasiloxane, 1,1,3,3,5,5,7,7,9,9-decamethylpentasiloxane, 1,1,1,3 , 5,5,7,7,9,9,9-undecamethylpentasiloxane and the like, and straight chain or branched siloxanes having SiH groups
  • the silane compound those having two or more SiH groups in the molecule are preferable.
  • the said silane compound can be used individually by 1 type or in combination of 2 or more types.
  • the content of the silane compound is not particularly limited, but is preferably 5% by weight or less (for example, 0 to 5% by weight), more preferably 1.5% by weight or less with respect to 100% by weight of the curable resin composition. It is.
  • the curable resin composition of the present invention includes, as other optional components, precipitated silica, wet silica, fumed silica, calcined silica, titanium oxide, alumina, glass, quartz, aluminosilicate, iron oxide, zinc oxide, calcium carbonate, Inorganic fillers such as carbon black, silicon carbide, silicon nitride and boron nitride; inorganic fillers obtained by treating these fillers with organosilicon compounds such as organohalosilanes, organoalkoxysilanes and organosilazanes; silicone resins other than those described above; Organic resin fine powders such as epoxy resins and fluororesins; fillers such as conductive metal powders such as silver and copper, solvents, stabilizers (antioxidants, ultraviolet absorbers, light stabilizers, heat stabilizers, etc.) Flame retardants (phosphorous flame retardants, halogen flame retardants, inorganic flame retardants, etc.), flame retardant aids, reinfor
  • the curable resin composition of the present invention is not particularly limited, but an aliphatic carbon-carbon unsaturated bond (particularly, an aliphatic carbon-carbon double bond) per 1 mol of hydrosilyl group present in the curable resin composition.
  • the composition (composition) is preferably 0.2 to 4 mol, more preferably 0.5 to 1.5 mol, and still more preferably 0.8 to 1.2 mol.
  • the curable resin composition of the present invention is not particularly limited, but can be prepared by stirring and mixing each of the above components at room temperature.
  • the curable resin composition of the present invention can be used as a one-component composition in which each component is mixed in advance, for example, two or more stored separately. It can also be used as a multi-component (for example, two-component) composition in which the components are mixed at a predetermined ratio before use.
  • the curable resin composition of the present invention is not particularly limited, but is preferably liquid at room temperature (about 25 ° C.). More specifically, the curable resin composition of the present invention has a viscosity at 23 ° C. of preferably 300 to 20000 mPa ⁇ s, more preferably 500 to 10000 mPa ⁇ s, and still more preferably 1000 to 8000 mPa ⁇ s. If the viscosity is less than 300 mPa ⁇ s, the heat resistance of the cured product may decrease. On the other hand, when the viscosity exceeds 20000 mPa ⁇ s, it is difficult to prepare and handle the curable resin composition, and bubbles may remain in the cured product. In addition, the viscosity of curable resin composition can be measured by the method similar to the viscosity of polyorgano silsesquioxane [A], for example.
  • the curable resin composition can be cured to obtain a cured product (sometimes referred to as “cured product of the present invention”).
  • cured product of the present invention can do.
  • Conditions for curing (hydrosilylation) are not particularly limited and can be appropriately selected from conventionally known conditions.
  • the temperature (curing temperature) is 25 to 180 ° C. (more preferably Is preferably 60 to 150 ° C., and the time (curing time) is preferably 5 to 720 minutes.
  • the cured product of the present invention heat resistance, transparency, good physical properties, such as flexibility, particularly excellent in barrier properties against corrosive gases such as SO X gas.
  • the curable resin composition of the present invention can be preferably used as an optical semiconductor sealing resin composition.
  • a sealant containing the curable resin composition of the present invention as an essential component (sometimes referred to as “the sealant of the present invention”) is used as a sealant for an optical semiconductor element (LED element).
  • LED element optical semiconductor element
  • the encapsulant (cured product) obtained by curing the encapsulant of the present invention is excellent in various physical properties such as heat resistance, transparency and flexibility, and particularly excellent in barrier properties against corrosive gas.
  • the sealing agent of this invention can be preferably used especially as a sealing agent etc. of a high-intensity, short wavelength optical semiconductor element.
  • An optical semiconductor device can be obtained by sealing an optical semiconductor device using the sealing agent of the present invention.
  • the optical semiconductor element is sealed by injecting the sealing agent of the present invention into a predetermined mold and heating and curing under predetermined conditions.
  • the curing temperature and the curing time can be set in the same range as at the time of preparing the cured product.
  • the curable resin composition of the present invention is not limited to the above-described encapsulant application (particularly, for encapsulating optical semiconductor elements).
  • a functional coating agent a heat-resistant plastic lens, a transparent device, and an adhesive (heat-resistant Transparent adhesive, etc.), optical semiconductor encapsulant (encapsulant), electrical insulation (insulation film, etc.), laminate, coating, ink, paint, sealant, resist, composite material, transparent substrate, transparent sheet, transparent
  • optical-related and semiconductor-related applications such as films, optical elements, optical lenses, optical members, optical modeling, electronic paper, touch panels, solar cell substrates, optical waveguides, light guide plates, and holographic memories.
  • the curable resin composition of the present invention is a sealing material that covers an optical semiconductor element in a high-brightness, short-wavelength optical semiconductor device, which has been difficult to handle with conventional resin materials, and has high heat resistance and high resistance.
  • a withstand voltage semiconductor device such as a power semiconductor
  • it can be preferably used for applications such as a sealing material covering a semiconductor element.
  • the reaction product was identified by 1 H-NMR spectrum measurement with JEOL ECA500 (500 MHz).
  • the weight average molecular weight of the reaction product was measured using Alliance HPLC system 2695 (manufactured by Waters), Refractive Index Detector 2414 (manufactured by Waters), column: Tskel GMH HR- MX2 (manufactured by Tosoh Corporation), guard column: Tskel guard column H HR L (manufactured by Tosoh Corporation), column oven: COLUMN HEATER U-620 (manufactured by Sugai), solvent: THF, measurement conditions: 40 ° C.
  • GD-1012A manufactured by Changxing Chemical Industry
  • vinyl group content 1.33% by weight, phenyl group content 0% by weight, SiH group content (hydride conversion) 0% by weight, number average molecular weight 5108, weight average molecular weight 23385
  • GD-1012B manufactured by Changxing Chemical Industry, vinyl group content 1.65% by weight, phenyl group content 0% by weight, SiH group content (hydride conversion) 0.19% by weight, number average molecular weight 4563, weight average molecular weight 21873 KER-2500A: manufactured by Shin-Etsu Chemical Co., Ltd., vinyl group content 1.53% by weight, phenyl group content 0% by weight, SiH group content (hydride conversion) 0.03% by weight, number average molecular weight 4453, weight Average molecular weight 19355 KER-2500B: manufactured by Shin-Etsu Chemical Co., Ltd., vinyl group content 1.08% by weight, phenyl group content 0%
  • Production Example 2 [Production of polyorganosilsesquioxane having a vinyl group]
  • a 100 ml flask (reaction vessel) equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen inlet tube was charged with 65 mmol (9.64 g) vinyltrimethoxysilane and 195 mmol phenyltrimethoxysilane (38 mmol) under a nitrogen stream. .67 g) and 8.31 g of methyl isobutyl ketone (MIBK) were charged and the mixture was cooled to 10 ° C.
  • MIBK methyl isobutyl ketone
  • reaction solution 360 mmol (6.48 g) of water and 0.24 g of 5N hydrochloric acid (1.2 mmol as hydrogen chloride) were simultaneously added dropwise over 1 hour. After the dropwise addition, the mixture (reaction solution) was kept at 10 ° C. for 1 hour to allow hydrolysis condensation reaction to proceed. Thereafter, 40 g of MIBK was added to dilute the reaction solution. Next, the temperature in the reaction vessel was raised to 70 ° C. When the temperature reached 70 ° C., 520 mmol (9.36 g) of water was added, and the polycondensation reaction was performed under a nitrogen stream for 6 hours.
  • the product (the product after the silylation reaction) had a number average molecular weight of 1280 and a molecular weight dispersity of 1.13.
  • FIG. 3 shows a chart of 1 H-NMR spectrum of the product.
  • the said product corresponds to the above-mentioned "ladder type silsesquioxane [A1]".
  • reaction solution After the dropwise addition, the mixture (reaction solution) was kept at 10 ° C. for 1 hour to allow hydrolysis condensation reaction to proceed. Thereafter, 80.02 g of MIBK was added to dilute the reaction solution. Next, the temperature in the reaction vessel was raised to 70 ° C. When the temperature reached 70 ° C., 4.81 g of 5N hydrochloric acid (25 mmol as hydrogen chloride) was added, and the polycondensation reaction was carried out for 5 hours under a nitrogen stream. Subsequently, 60 mmol (98.06 g) of tetramethyldisiloxane was added to the reaction solution after the polycondensation reaction, and the silylation reaction was performed at 70 ° C. for 3 hours.
  • 5N hydrochloric acid 25 mmol as hydrogen chloride
  • FIG. 4 shows a chart of 1 H-NMR spectrum of the product.
  • the said product corresponds to the above-mentioned "ladder type silsesquioxane [A2]".
  • the ladder-type silsesquioxane having a vinyl group and a TMS group at the terminal has a weight average molecular weight (Mw) of 3400, and the vinyl group content (average content) per molecule is 3.96% by weight.
  • Mw weight average molecular weight
  • the phenyl group / methyl group / vinyl group (molar ratio) was 17/68/15.
  • Production Example 5 [Production of polyorganosilsesquioxane having a vinyl group at the terminal]
  • a 100 ml flask (reaction vessel) equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen inlet tube was charged with 80 mmol (15.86 g) of phenyltrimethoxysilane and methyl isobutyl ketone (MIBK) 6 under a nitrogen stream. .16 g was charged and the mixture was cooled to 10 ° C.
  • 240 mmol (4.32 g) of water and 0.16 g of 5N hydrochloric acid (2.4 mmol as hydrogen chloride) were simultaneously added dropwise over 1 hour.
  • reaction solution was kept at 10 ° C. for 1 hour to allow hydrolysis condensation reaction to proceed. Thereafter, 26.67 g of MIBK was added to dilute the reaction solution. Next, the temperature in the reaction vessel was raised to 70 ° C. When the temperature reached 70 ° C., 0.16 g of 5N hydrochloric acid (25 mmol as hydrogen chloride) was added, and the polycondensation reaction was performed under a nitrogen stream for 4 hours.
  • the product (the product after the silylation reaction) had a number average molecular weight of 840 and a molecular weight dispersity of 1.06.
  • the polyorganosilsesquioxane which has a vinyl group at the terminal obtained above corresponds to the above-mentioned “ladder type silsesquioxane [A1]”.
  • Production Example 6 [Production of polyorganosilsesquioxane having a vinyl group at the terminal]
  • a 100 ml flask (reaction vessel) equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen introducing tube was charged with 100 mmol (13.72 g) of methyltrimethoxysilane and 5.3 mmol of phenyltrimethoxysilane under a nitrogen stream. (1.05 g) and 41.06 g of methyl isobutyl ketone (MIBK) were charged, and the mixture was cooled to 10 ° C.
  • MIBK methyl isobutyl ketone
  • reaction solution 106 mmol (1.91 g) of water and 0.10 g of 5N hydrochloric acid (0.5 mmol as hydrogen chloride) were simultaneously added dropwise over 1 hour. After the dropwise addition, the mixture (reaction solution) was kept at 10 ° C. for 1 hour to allow hydrolysis condensation reaction to proceed. Next, the temperature in the reaction vessel was raised to 50 ° C. When the temperature reached 50 ° C., 0.95 g (53 mmol) of water was added, and the polycondensation reaction was performed for 6 hours under a nitrogen stream.
  • the product (the product after the silylation reaction) had a number average molecular weight of 874 and a molecular weight dispersity of 1.31.
  • the polyorganosilsesquioxane which has a vinyl group at the terminal obtained above corresponds to the above-mentioned “ladder type silsesquioxane [A1]”.
  • Example 3 [Production of curable resin composition 3 and cured product 3] 2.5 g of polyorganosilsesquioxane having a hydrosilyl group obtained in Production Example 3, 3.6 g of polyorganosilsesquioxane having a vinyl group obtained in Production Example 2, 2,4,6,8- Tetravinyl-2,4,6,8-tetramethylcyclotetrasiloxane 0.184 g and allyldiglycidyl isocyanuric acid 0.061 g previously dissolved in 3-glycidyloxypropyltrimethoxysilane 0.245 g When weighed into a 30 ml screw tube and stirred at room temperature for 2 hours, the compatibility of each component was good, and a transparent and uniform solution was obtained.
  • Comparative Example 1 Weigh 0.100 g of the product name “OE-6665A” (manufactured by Toray Dow Corning Co., Ltd.) and 2.00 g of the product name “OE-6665B” (manufactured by Toray Dow Corning Co., Ltd.) into a 30 ml screw tube. The mixture was stirred for 30 minutes to prepare a curable resin composition.
  • Example 4 [Production of curable resin composition 4 and cured product 4] 1.327 g of ladder type silsesquioxane obtained in Production Example 1, 0.600 g of polyorganosilsesquioxane obtained in Production Example 5, and 2.0% platinum-cyclovinylsiloxane complex vinylcyclosiloxane solution 0.2 ⁇ l (manufactured by Wako Pure Chemical Industries, Ltd.) was weighed into a 30 ml screw tube and stirred for 30 minutes to obtain a curable resin composition 4. When the said curable resin composition 4 was apply
  • Example 5 [Production of curable resin composition 5 and cured product 5] 0.856 g of the polyorganosilsesquioxane obtained in Production Example 5, 1.000 g of the polyorganosilsesquioxane obtained in Production Example 3, and a 2.0% platinum-cyclovinylsiloxane complex vinylcyclosiloxane solution 0.2 ⁇ l (manufactured by Wako Pure Chemical Industries, Ltd.) was weighed into a 30 ml screw tube and stirred for 30 minutes to obtain a curable resin composition 5. When the said curable resin composition 5 was apply
  • Example 6 [Production of curable resin composition 6 and cured product 6] 1.327 g of ladder-type silsesquioxane obtained in Production Example 1, 0.600 g of polyorganosilsesquioxane obtained in Production Example 5, 2.0% platinum-cyclovinylsiloxane complex vinylcyclosiloxane solution (sum Mitsuru Kogyo Kogyo Co., Ltd.) 0.4 ⁇ l and monoallyl diglycidyl isocyanuric acid 0.004 g previously dissolved in 3-glycidyloxypropyltrimethoxysilane 0.015 g were weighed into a 30 ml screw tube. The mixture was stirred for 30 minutes to obtain a curable resin composition 6. When the said curable resin composition 6 was apply
  • Example 7 [Production of curable resin composition 7 and cured product 7] 0.525 g of polyorganosilsesquioxane obtained in Production Example 3, 1.200 g of ladder-type silsesquioxane obtained in Production Example 4, 2.0% platinum-cyclovinylsiloxane complex vinylcyclosiloxane solution (sum Mitsuru Kogyo Kogyo Co., Ltd.) 0.4 ⁇ l and monoallyl diglycidyl isocyanuric acid 0.003 g previously dissolved in 3-glycidyloxypropyltrimethoxysilane 0.013 g were weighed into a 30 ml screw tube. The mixture was stirred for 30 minutes to obtain a curable resin composition 7. When the curable resin composition 7 was applied on a glass plate and heated at 150 ° C. for 5 hours, a colorless and transparent cured product 7 was obtained.
  • Example 8 [Production of curable resin composition 8 and cured product 8] 0.856 g of polyorganosilsesquioxane obtained in Production Example 5, 1.000 g of polyorganosilsesquioxane obtained in Production Example 3, 2.0% platinum-cyclovinylsiloxane complex vinylcyclosiloxane solution (sum Mitsui Chemicals Co., Ltd.) 0.2 ⁇ l and monoallyl diglycidyl isocyanuric acid 0.004 g dissolved in advance in 3-glycidyloxypropyltrimethoxysilane 0.014 g were weighed into a 30 ml screw tube. The mixture was stirred for 30 minutes to obtain a curable resin composition 8. When the said curable resin composition 8 was apply
  • Example 9 [Production of curable resin composition 9 and cured product 9]
  • Product name “GD1012A” (manufactured by Changxing Chemical Industry) 0.90 g
  • product name “GD1012B” (manufactured by Changxing Chemical Industry) 1.00 g
  • the curable resin composition 9 was obtained by weighing into a 30 ml screw tube and stirring for 30 minutes. When the said curable resin composition 9 was apply
  • Example 10 [Production of curable resin composition 10 and cured product 10]
  • Product name “GD1012A” (manufactured by Changxing Chemical Industry) 0.90 g
  • Example 11 [Production of curable resin composition 11 and cured product 11]
  • Product name “KER2500A” (manufactured by Shin-Etsu Chemical Co., Ltd.) 0.90 g
  • product name “KER2500B” (manufactured by Shin-Etsu Chemical Co., Ltd.) 1.00 g
  • polyorganosilsesquioki obtained in Production Example 6 0.10 g of sun was weighed into a 30 ml screw tube and stirred for 30 minutes to obtain a curable resin composition 11.
  • the said curable resin composition 11 was apply
  • Example 12 [Production of curable resin composition 12 and cured product 12]
  • Product name “KER2500A” (manufactured by Shin-Etsu Chemical Co., Ltd.) 0.90 g
  • product name “KER2500B” (manufactured by Shin-Etsu Chemical Co., Ltd.) 1.00 g
  • Example 13 [Production of curable resin composition 13 and cured product 13]
  • Product name “GD1130A” (manufactured by Changxing Chemical Industry) 0.35 g
  • product name “GD1130B” (manufactured by Changxing Chemical Industry) 2.00 g
  • a curable resin composition 13 was obtained by weighing into a 30 ml screw tube and stirring for 30 minutes. The curable resin composition 13 was applied on a glass plate, heated at 80 ° C. for 1 hour, and then heated at 150 ° C. for 4 hours. As a result, a colorless and transparent cured product 13 was obtained.
  • Example 14 [Production of curable resin composition 14 and cured product 14]
  • Product name “GD1130A” (manufactured by Changxing Chemical Industry) 0.35 g
  • product name “GD1130B” (manufactured by Changxing Chemical Industry) 2.00 g
  • a curable resin composition 14 was obtained.
  • the curable resin composition 14 was applied onto a glass plate, heated at 80 ° C. for 1 hour, and then heated at 150 ° C. for 4 hours. As a result, a colorless and transparent cured product 14 was obtained.
  • Example 15 [Production of curable resin composition 15 and cured product 15]
  • Example 16 [Production of curable resin composition 16 and cured product 16]
  • Product name “OE-6630A” (manufactured by Dow Corning Toray) 0.500 g
  • product name “OE-6630B” (manufactured by Dow Corning Toray) 2.000 g
  • a curable resin composition 16 was obtained by weighing into a 30 ml screw tube and stirring for 30 minutes. When the said curable resin composition 16 was apply
  • Example 17 [Production of curable resin composition 17 and cured product 17]
  • Example 18 [Production of curable resin composition 18 and cured product 18]
  • Product name “ASP-1120A” (manufactured by Shin-Etsu Chemical Co., Ltd.) 0.900 g
  • product name “ASP-1120B” (manufactured by Shin-Etsu Chemical Co., Ltd.) 1.000 g
  • the curable resin composition 18 was obtained by weighing into a screw tube and stirring for 30 minutes. When the said curable resin composition 18 was apply
  • Comparative Example 2 1.00 g of trade name “GD1012A” (manufactured by Changxing Chemical Industry) and 1.00 g of trade name “GD1012B” (manufactured by Changxing Chemical Industry) are weighed into a 30 ml screw tube and stirred for 30 minutes to obtain a curable resin composition. A product was prepared.
  • Comparative Example 3 1.00 g of the trade name “KER2500A” (manufactured by Shin-Etsu Chemical Co., Ltd.) and 1.00 g of the trade name “KER2500B” (manufactured by Shin-Etsu Chemical Co., Ltd.) are weighed in a 30 ml screw tube, stirred for 30 minutes, and cured. A composition was obtained.
  • Comparative Example 4 0.500 g of the product name “GD1130A” (manufactured by Changxing Chemical Industry Co., Ltd.) and 2.00 g of the product name “GD1130B” (manufacturing by Changxing Chemical Industry Co., Ltd.) are weighed into a 30 ml screw tube and stirred for 30 minutes. Thus, a curable resin composition was obtained.
  • Comparative Example 5 Add 0.500 g of the product name “OE-6630A” (manufactured by Toray Dow Corning Co., Ltd.) and 2.000 g of the product name “OE-6630B” (manufactured by Toray Dow Corning Co., Ltd.) to a 30 ml screw tube. Weighing and stirring for 30 minutes gave a curable resin composition.
  • Comparative Example 6 1.000 g of trade name “ASP-1120A” (manufactured by Shin-Etsu Chemical Co., Ltd.) and 1.000 g of trade name “ASP-1120B” (manufactured by Shin-Etsu Chemical Co., Ltd.) are weighed into a 30 ml screw tube. The mixture was stirred for 30 minutes to obtain a curable resin composition.
  • This aluminum box is put into an oven (model number DN-64, manufactured by Yamato Kagaku Co., Ltd.) with an internal temperature of 80 ° C., and the corrosion situation of the silver electrode in the LED package over time from the start of heating (after 0 hours) confirmed.
  • cured material is four steps of A, B, C, D [A (barrier property is very high): An electrode does not discolor, B (barrier property is High): electrode slightly discolored, C (good barrier property): electrode slightly discolored, D (barrier property poor): electrode discolored].
  • Example 5 shows a sample of an electrode state (example) corresponding to each of cases where the barrier property against corrosive gas is A to D.
  • Tables 1-3 The results are shown in Tables 1-3.
  • Tables 1 to 3 the curable resin composition satisfying the provisions of the present invention (the curing of the present invention) as compared with the case of using the curable resin composition not satisfying the provisions of the present invention (Comparative Example)
  • the cured product (Example) of the conductive resin composition) was superior in the barrier property of sulfur gas (corrosive gas), and it was confirmed that corrosion of the silver electrode was suppressed.
  • thermo shock tester Espec Co., Ltd. was subjected to a thermal shock with one cycle of exposing the sample to an atmosphere of ⁇ 40 ° C. for 30 minutes and subsequently exposing to an atmosphere of 100 ° C. for 30 minutes. 1000 cycles were given using a small thermal shock apparatus (TSE-11A).
  • cured material in each sample was evaluated on the following references
  • the evaluation results are shown in Tables 2 and 3.
  • the cured product (Example) of the curable resin composition that satisfies the provisions of the present invention is compared with the case where the polyorganosilsesquioxane [A] is not included (Comparative Example). Excellent barrier properties against corrosive gas. More specifically, according to the comparison between Examples 1 to 8 and Comparative Example 1 shown in Table 1, in the system containing polyorganosilsesquioxane [A], the cured product has a remarkably excellent gas barrier property (for corrosive gas). (Barrier property) was observed.
  • Example 9 to 12 and Comparative Examples 3, 7, and 8 shown in Table 2 are systems containing silicone [C] having a side chain methyl group. All of these systems are excellent in thermal shock resistance, but are inferior in gas barrier properties when polyorganosilsesquioxane [A] is not included. On the other hand, in the system containing polyorganosilsesquioxane [A] and silicone [C] having a side chain methyl group (Examples 9 to 12), the gas barrier property of the cured product is greatly improved. Is recognized.
  • Examples 13 to 18 and Comparative Examples 4 to 6 shown in Table 3 are systems containing silicone [C] having a side chain phenyl group.
  • a system containing polyorganosilsesquioxane [A] in addition to silicone [C] having a side chain phenyl group, and a system containing isocyanuric acid compound [D] the gas barrier property of the cured product is greatly improved.
  • the systems of Examples 13 and 14 are excellent in both the thermal shock resistance and gas barrier properties of the cured product.
  • the curable resin composition of the present invention can be preferably used as a resin composition for optical semiconductor encapsulation.
  • the curable resin composition of the present invention includes a functional coating agent, a heat-resistant plastic lens, a transparent device, an adhesive (such as a heat-resistant transparent adhesive), an optical semiconductor sealing material (sealing agent), and an electrical insulating material (insulating). Film, etc.), laminated board, coating, ink, paint, sealant, resist, composite material, transparent substrate, transparent sheet, transparent film, optical element, optical lens, optical member, stereolithography, electronic paper, touch panel, solar cell substrate
  • it can be preferably used for optical and semiconductor applications such as optical waveguides, light guide plates, and holographic memories.

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