WO2010035613A1 - 屈曲構造及び/又は分岐構造を持つシリカ二次粒子を含有するコロイダルシリカ及びその製造方法 - Google Patents
屈曲構造及び/又は分岐構造を持つシリカ二次粒子を含有するコロイダルシリカ及びその製造方法 Download PDFInfo
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- WO2010035613A1 WO2010035613A1 PCT/JP2009/065232 JP2009065232W WO2010035613A1 WO 2010035613 A1 WO2010035613 A1 WO 2010035613A1 JP 2009065232 W JP2009065232 W JP 2009065232W WO 2010035613 A1 WO2010035613 A1 WO 2010035613A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/02—Single-walled nanotubes
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B2202/00—Structure or properties of carbon nanotubes
- C01B2202/20—Nanotubes characterized by their properties
- C01B2202/36—Diameter
Definitions
- the present invention relates to a colloidal silica suitable as an abrasive, a coating vehicle, a binder, a nanopowder raw material, and a method for producing the same, and in particular, a colloidal silica containing silica secondary particles having a bent structure and / or a branched structure, and a method for producing the colloidal silica.
- a colloidal silica suitable as an abrasive, a coating vehicle, a binder, a nanopowder raw material and a method for producing the same, and in particular, a colloidal silica containing silica secondary particles having a bent structure and / or a branched structure, and a method for producing the colloidal silica.
- the bent structure refers to a particle formed by combining three or more particles in a row and not linear.
- the branched structure is a particle in which four or more particles are bonded and is not in a line (has branches). A specific example of bending and branching is shown in FIG.
- Colloidal silica is a dispersion of silica particles in a medium such as water, and is used as a physical property improver, paint vehicle, inorganic binder in the fields of paper, fiber, steel, etc. It is also used as an abrasive for materials. In particular, when used as an abrasive, high purity and denseness of silica particles are required.
- colloidal silica As a method for producing colloidal silica that can meet the above requirements, for example, a particle growth method in which an alkyl silicate hydrolyzate is continuously added to alkaline hot water is known. In this particle growth method, since the active silicic acid aqueous solution is added under alkaline conditions, spherical, monodispersed and dense silica particles tend to be generated.
- the spherical monodispersed silica shape has been modified (that is, secondary particles having a complicated shape) to adjust the contact resistance of the surface to be polished when used as an abrasive, thereby further improving the polishing rate. It is being considered.
- Patent Document 1 discloses that in a method for producing colloidal silica using an aqueous alkali silicate solution as a raw material, the pH is lowered to 5 to 6 at any point of particle formation, thereby forming a two-particle aggregate, a three-particle aggregate, and It is described that larger particle aggregates can be formed.
- the alkali silicate is used as a raw material, purity reduction due to residual alkali metal is inevitable.
- colloidal silica containing many silica particles having a branched structure or a bent structure can be obtained.
- Patent Document 2 As described in Patent Document 2, as a method for deforming silica particles, it is known to adjust pH by adjusting the amount of alkali added, salt addition, temperature adjustment, anion concentration, particle concentration and the like. It has been.
- Patent Document 3 describes a method of obtaining colloidal silica having an elongated shape by adding a calcium salt or a magnesium salt.
- shape control by addition of salt is unsuitable for use in a semiconductor manufacturing process in which high purity is required due to mixing of metal impurities.
- Patent Document 5 tetraethoxysilane is added to a hydrochloric acid aqueous solution for hydrolysis, and the resulting silicic acid monomer solution is added to an ethylenediamine aqueous solution having a pH of 11.1 over 2.5 hours to produce colloidal silica for particle growth.
- a method is disclosed. This method only produces sub-spherical particles as in the above Stoeber method. Moreover, chlorine ions are mixed in and anion contamination becomes a problem.
- Patent Document 6 describes a method for producing colloidal silica having an elongated shape from an active silicic acid aqueous solution obtained by hydrolyzing ethyl silicate with an acid. Even in this case, there is anion contamination due to addition of acid.
- colloidal silica having a structure in which spherical particles such as a saddle shape or a hump shape are distorted, or in an elongated shape, and containing many silica particles having a branched structure or a bent structure has not been obtained.
- Patent Document 7 discloses a silicate solution obtained by treating an alkali silicate aqueous solution with a cation exchange resin, an alkali such as KOH, NaOH or a water-soluble amine, an inorganic acid such as hydrochloric acid, sulfuric acid or formic acid, or an organic acid.
- the pH of the seed is adjusted to 1.0 to 7.0 using aging, and is aged by heating to highly polymerize silicic acid, and then to a pH of 9 to 12.5 by adding a water-soluble amine to a deformed seed
- a technique is disclosed in which a liquid is prepared and then built up (particle growth).
- the conventionally disclosed deformed colloidal silica production technology is highly dense, has a low content of both metal cations and acid-derived anions, is highly pure, and has a highly branched and bent structure. No deformed colloidal silica has been obtained.
- colloidal silica containing secondary particles of silica having a dense and high purity and further having a branched structure or a bent structure is desired.
- a main object of the present invention is to provide a colloidal silica containing silica secondary particles having a dense and high purity and further having a bent structure or a branched structure, and a method for producing the colloidal silica.
- colloidal silica containing silica secondary particles having a branched structure or a bent structure with a large aspect ratio has an excellent film property and is also useful as a vehicle for water-based paints.
- Another object of the present invention is to provide colloidal silica useful as a vehicle.
- the aspect ratio refers to the ratio of the major axis to the minor axis of the particles.
- colloidal silica obtained by a specific production method can achieve the above object, and has completed the present invention.
- the first embedding liquid (a liquid containing an alkali catalyst and water) that is the starting point of particle formation is referred to as a mother liquor.
- a mother liquor a liquid containing an alkali catalyst and water
- Colloidal silica obtained from alkyl silicate as a raw material, comprising silica secondary particles having a bent structure and / or a branched structure.
- the colloidal silica according to Item 1 wherein the alkyl silicate is tetramethylorthosilicate.
- a method for producing colloidal silica comprising: a step of preparing a mother liquor having a pH of 9 to 12 containing an alkali catalyst and water; and 2) a step of adding a hydrolyzate obtained by hydrolyzing an alkyl silicate to the mother liquor.
- Adding the hydrolyzate to the mother liquor A) Step 1 of adding the hydrolyzate until the pH of the mixture becomes less than 7
- Item 5 Item 5.
- Step 1 and Step 2 are carried out so that the time during which the pH of the mixed solution is less than 7 is 0.5 to 5 hours.
- Item 10 The production method according to any one of Items 4 to 9, wherein Steps 1 to 3 are carried out without previously adding seed particles to the mother liquor.
- the colloidal silica of the present invention contains secondary silica particles having a bent structure and / or a branched structure. Since it has an unprecedented complex secondary particle structure, when colloidal silica is used as an abrasive, the contact resistance with the surface to be polished can be adjusted to improve the polishing rate.
- the secondary silica particles having a bent structure and / or a branched structure having a large aspect ratio have a good film property due to the overlapping and entanglement of the particles, and can improve the film property as a vehicle for water-based paints.
- the method for producing colloidal silica of the present invention can produce colloidal silica having the above structure with high purity and ease without using seed particles.
- FIG. 1 is a figure which shows transition of pH in Example 1.
- FIG. 2 is a scanning electron microscope (SEM) observation image of colloidal silica of Example 1.
- FIG. 3 is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 1.
- FIG. 4 is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 2.
- 3 is a scanning electron microscope (SEM) observation image of colloidal silica of Example 2.
- FIG. 4 is a scanning electron microscope (SEM) observation image of colloidal silica of Example 3.
- FIG. 4 is a scanning electron microscope (SEM) observation image of colloidal silica of Example 4.
- FIG. It is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 3-1.
- It is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 3-2.
- 6 is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 4.
- Example 7 is a scanning electron microscope (SEM) observation image of colloidal silica of Comparative Example 5.
- 2 is a solid-state 29 Si-CP / MAS-NMR spectrum of Example 1.
- 2 is a solid 29 Si-CP / MAS-NMR spectrum of Comparative Example 1.
- 3 is a solid 29 Si-CP / MAS-NMR spectrum of Comparative Example 2.
- 3 is a solid-state 29 Si-CP / MAS-NMR spectrum of Example 2.
- 3 is a solid-state 29 Si-CP / MAS-NMR spectrum of Example 3.
- 4 is a solid-state 29 Si-CP / MAS-NMR spectrum of Example 4.
- 3 is a solid 29 Si-CP / MAS-NMR spectrum of seed particles PL-2H used in Comparative Example 2.
- colloidal silica The colloidal silica of the present invention is obtained using alkyl silicate as a raw material, and contains silica secondary particles having a bent structure and / or a branched structure.
- alkyl silicate tetramethyl orthosilicate (TMOS) is preferable.
- the content of the secondary silica particles having a bent structure and / or a branched structure is preferably 30% or more of the number of particles in an arbitrary field of view at 200,000 times observed with a scanning electron microscope (SEM).
- the average aspect ratio (average aspect ratio) of the particles in the same field is preferably 1.5 or more and less than 5. When the average aspect ratio exceeds 5, it becomes difficult to handle due to an increase in viscosity or the like, which may cause gelation.
- the average particle diameter of the primary particles constituting the secondary particles is not limited, but is usually about 5 to 200 nm, and particularly preferably 10 to 100 nm.
- an average particle diameter represents the primary particle diameter converted by 2727 / specific surface area value.
- the average particle diameter measured by the dynamic light scattering method (“ELS8000” manufactured by Otsuka Electronics Co., Ltd.) is shown as the secondary particle diameter.
- the secondary particles have a bent structure or a branched structure as shown in FIG.
- a colloidal silica 200 ⁇ L is added to a 0.05 wt% sodium decyl sulfate (SDS) aqueous solution 10 mL to make it uniform.
- SDS sodium decyl sulfate
- 4 mL of colloidal silica is added to 50 mL of 0.3 wt% aqueous citric acid solution to make it uniform.
- colloidal silica when colloidal silica is used as an abrasive, it is necessary to prepare silica particles having a dense structure. More specifically, it is required to prepare particles in which siloxane bonds are more completely formed. In other words, it is preferable to prepare particles with few remaining silanol groups.
- the present inventors can detect 29 Si having an OH group in the vicinity of a solid 29 Si—CP / MAS-NMR spectrum, and the total area of three peaks normalized by the internal standard peak area, that is, the peak area value. was found to be effective as an index for evaluating the density of silica particles.
- Si (OH) 2 represents Si (OH) 2 (OSi) 2 .
- Si (OH) 1 represents Si (OH) (OSi) 3 .
- Si (OH) 0 represents Si (OSi) 4 .
- the peak area value indicates the total area of three peaks normalized by the internal standard peak area.
- the true specific gravity indicates a value measured by a liquid phase replacement method after drying on a hot plate at 150 ° C. and holding in a 300 ° C. furnace for 1 hour.
- the colloidal silica of the present invention has a peak area value of 20 or less, particularly preferably 15 or less.
- the lower limit is not limited, but is about 5.
- the peak area value indicates the number of residual silanol groups in the colloidal silica (see, for example, “Abstracts of the 43rd Thermosetting Resin Lecture Meeting”, p45 (1993)). That is, Si (OH) 2 and Si (OH) 1 count Si atoms in which an OH group is directly bonded to Si, and Si (OH) 0 has no OH directly bonded, but OH is present in the vicinity. The existing Si atoms are counted. The smaller the area value, the smaller the absolute number of residual silanol groups, which is desirable as the colloidal silica of the present invention.
- FIGS. 20 to 26 show solid 29 Si-CP / MAS-NMR spectra in the dried product of the colloidal silica of the present invention.
- FIG. 21, FIG. 22, and FIG. 26 show solid 29 Si-CP / MAS-NMR spectra of the dried colloidal silica of the comparative example.
- the height difference of AA indicates the polydimethylsilane peak area
- the height difference of BB indicates the colloidal silica peak area.
- the normalized value where the polydimethylsilane peak area is “1” is the peak area value, which is displayed on the NMR chart near the upper right of the corresponding peak.
- FIG. 20 shows that the peak area value is 11.307, indicating that the colloidal silica of the present invention has very few residual silanol groups as an absolute number.
- the peak area value can be calculated from the ratio of heights of integral curves created by a data processing circuit provided in a known NMR spectrum analyzer.
- the colloidal silica of the present invention has a peak intensity of Si (OH) 0 when the total intensity (area value) of the colloidal silica-derived peaks is 100 when a solid 29 Si-CP / MAS-NMR spectrum is measured.
- the ratio is preferably 40 or more, more preferably 45 or more, and most preferably 50 or more. This means that when colloidal silica is used for polishing, the denseness in the vicinity of the surface that directly contacts the surface to be polished is high.
- Example 1 in Table 2 described later the intensity ratio of Si (OH) 0 is 55, whereas in Comparative Example 2 in Table 4 described later, it is 45. That is, Table 2 shows that the ratio of residual silanol groups is smaller, particularly in the surface layer portion of the silica particles.
- the said intensity ratio is each peak of Si (OH) 2 , Si (OH) 1 , Si (OH) 0 of the colloidal silica origin peak obtained as a result of the waveform separation process with which the well-known NMR spectrum analyzer is equipped. Is a value calculated as a percentage.
- the dried product in the present invention is obtained by putting 10 g of the colloidal silica of the present invention adjusted to 10% by weight into a 50 ml magnetic crucible and heat-treating it on a hot plate set at 150 ° C. for 10 hours. Say what you got.
- the polydimethylsilane used in the present invention has a weight average molecular weight of 2000. Further, EX-270 manufactured by JEOL Ltd. was used as an NMR spectrum analyzer.
- the colloidal silica of the present invention includes 1) sodium, 2) an alkaline earth metal selected from the group consisting of calcium and magnesium, and 3) iron, titanium, nickel, chromium, copper, zinc, lead, silver, manganese and cobalt. It is preferable that the content of heavy metals selected from the group consisting of 1 ppm by weight or less. In particular, when used as an abrasive for polishing an electronic material, it is preferable that the content of sodium that adversely affects the electronic material is small or not included. More preferably, the contents of sodium, alkaline earth metal and heavy metal are each 1 ppm by weight or less.
- heavy metals refer to metal elements having a density of 4 g / cm 3 or more. Content of alkaline-earth metal and heavy metal means content for every metal element.
- the present invention also includes an abrasive containing the colloidal silica of the present invention.
- an abrasive containing the colloidal silica of the present invention can be suitably used as an electronic material abrasive for polishing an electronic material. Examples thereof include silicon wafer polishing, chemical mechanical polishing (CMP) in LSI manufacturing process, photomask blank polishing, and hard disk polishing.
- CMP chemical mechanical polishing
- abrasives When using abrasives, they may be used in the same manner as known abrasives. For example, when polishing a silicon wafer, the concentration may be adjusted according to the application and the like, and then dropped onto a polishing pad set on a regular plate of a polishing machine.
- the colloidal silica of the present invention produces alkyl silicate that can be purified to high purity by distillation purification as a silica raw material.
- the silica raw material is tetramethyl orthosilicate (TMOS), which can be purified with high purity, has high reactivity, and can be easily hydrolyzed even at a normal temperature without a catalyst.
- TMOS tetramethyl orthosilicate
- Mother liquor preparation step a mother liquor containing an alkali catalyst and water is prepared.
- the mother liquor may be prepared by adding an alkali catalyst to water.
- an organic base catalyst containing no metal component is preferable from the viewpoint of avoiding mixing of metal impurities.
- organic base catalysts include nitrogen-containing compounds such as ethylenediamine, diethylenetriamine, triethylenetetraamine, ammonia, urea, monoethanolamine, diethanolamine, triethanolamine, tetramethylammonium hydroxide (TMAH), and tetramethylguanidine.
- An organic base catalyst is mentioned.
- an organic base catalyst having low volatility that does not volatilize in the temperature range (heating) of the addition step is preferable.
- a volatilizing base it may be continuously added to maintain the system pH. These can be used alone or in combination of two or more.
- KOH may be blended as a component, and KOH can be used as an alkali catalyst for abrasives having such a blend composition.
- the addition amount of the alkali catalyst may be appropriately set so that the pH of the mother liquor is usually within the range of 7 to 14.
- a more preferable pH is 9 to 12, and further preferably 9 to 11.
- the amount of alkali catalyst added is small, the particles generated during the acid transfer are small, and even if they are aggregated in an acidic state, sufficient deformation cannot be achieved. That is, if the particle size is too small, the deformed state is relaxed during the particle growth process. On the other hand, when the amount of the alkali catalyst is large, the particle size produced during the acid transfer becomes large, and aggregation becomes difficult to occur in the acidic state, and sufficient deformed particles cannot be obtained.
- the mother liquor when adding the alkyl silicate hydrolyzate described later.
- Reflux can be performed using a known apparatus. As the reaction temperature is higher, dense particles are obtained. Therefore, you may implement an addition process in a pressurized state so that it can be refluxed at higher temperature. In this case, a known apparatus such as an autoclave can be used.
- an alkyl silicate preferably tetramethylorthosilicate hydrolyzate (hereinafter also simply referred to as “hydrolyzate”) is added to the mother liquor.
- Hydrolysis solution is prepared by hydrolyzing alkyl silicate with pure water. Specifically, when tetramethylorthosilicate is used as the alkyl silicate, an active alkyl silicate solution is prepared by adding water at least 1 equivalent to the methoxy group and performing the following reaction.
- An alkyl silicate hydrolyzate can be prepared by a known method. For example, an alkyl silicate may be added to water and stirred. In the reaction solution thus obtained, hydrolysis proceeds in about 1 to 2 hours, and a predetermined hydrolysis solution can be obtained.
- Alkyl silicate is non-volatile silicic acid oligomer when hydrolyzed, so that particle growth reaction at a higher temperature is possible, which is advantageous in terms of preparing denser particles.
- the amount of alkyl silicate added to water is such that the final hydrolyzate has a silica concentration of usually 1 to 20% by weight, preferably 1 to 10% by weight, more preferably 1 to 6% by weight. Set. This makes it possible to grow silica particles efficiently while preventing gelation of the alkyl silicate hydrolyzate.
- a water-soluble organic solvent can be contained in the reaction solution instead of a part of water as a compatibilizing solvent in order to make the alkyl silicate and water compatible as necessary.
- the water-soluble organic solvent include alcohols. Specifically, lower alcohols (particularly alcohols having 1 to 3 carbon atoms) such as methanol, ethanol and isopropanol can be exemplified.
- the content of the water-soluble organic solvent is not particularly limited, but is usually 0 to 90% by weight, preferably about 0 to 50% by weight in the reaction solution.
- the alkyl silicate hydrolyzate Since the alkyl silicate hydrolyzate has low storage stability, it may be prepared every 2 to 10 hours depending on the solid content concentration, or the supply of the hydrolyzate may be continued while continuously preparing. Since the storage stability is improved by the addition of the compatibilizing solvent, the addition amount of the compatibilizing solvent is determined in consideration of this aspect. In addition, since the stability of the hydrolyzed liquid increases as the storage temperature decreases, it is also effective to cool the hydrolyzed liquid within a range where it does not freeze after preparation of the hydrolyzed liquid.
- the hydrolysis may be carried out in the presence of a catalyst or in the absence of a catalyst.
- a catalyst an inorganic acid such as sulfuric acid, hydrochloric acid, nitric acid or acetic acid or an organic acid, or a solid acid such as a strong acidic cation exchange resin may be used as the acid catalyst.
- TMOS tetramethylorthosilicate
- TMOS tetramethylorthosilicate
- the step of adding the alkyl silicate hydrolyzate to the mother liquor is specifically, A) Step 1 of adding the hydrolyzate until the pH of the mixture becomes less than 7 B) Step 2 of adding an alkaline aqueous solution until the pH of the mixed solution becomes 7 or more, and C) Step 3 of adding the hydrolysis solution while maintaining the pH of the mixed solution at 7 or more.
- Step 1 of adding the hydrolyzate until the pH of the mixture becomes less than 7
- Step 2 of adding an alkaline aqueous solution until the pH of the mixed solution becomes 7 or more
- Step 3 of adding the hydrolysis solution while maintaining the pH of the mixed solution at 7 or more.
- Step 1 adds the hydrolysis solution until the pH of the mixed solution is less than 7.
- the lower limit of the pH is not limited, but the pH is preferably 6 or more in terms of suppressing excessive gelation of the mixed solution. That is, in step 1, it is preferable to adjust the pH of the mixed solution to 6 or more and less than 7. More preferably, it is 6.3 or more and less than 7. If the pH is lowered too much, the degree of irregularity increases, but it is disadvantageous because it reduces filterability, increases viscosity, and gels.
- seed particles are first formed in a mother liquor composed of water and an alkali catalyst, and thereafter particle growth starts. Since the number of seed particles formed is determined by the amount (concentration) of the alkyl silicate hydrolyzate added initially, the ratio of the mother liquor charge weight in step 1 to the addition rate of the alkyl silicate hydrolyzate Is a parameter.
- the rate of addition of the hydrolyzed liquid varies depending on the concentration of the hydrolyzed liquid, the desired particle size of the colloidal particles, and the like, but may be a speed sufficient to form dense silica particles. Preferably, 0.7 to 41 g silica / hour / kg mother liquor.
- g silica indicates the weight of silica
- “kg mother liquor” indicates the weight of the mother liquor.
- an alkaline aqueous solution is added until the pH of the mixed solution becomes 7 or more.
- the alkaline aqueous solution for example, an alkali metal hydroxide, an organic amine that does not easily volatilize at the boiling point of water, or the like can be used.
- the time during which the pH of the mixed solution is less than 7 is 0.5 to 5 hours.
- the hydrolysis solution may or may not be added.
- Step 1 the hydrolyzed solution is added and lowered to a predetermined pH, the addition is stopped, the pH in an acidic state is maintained for a predetermined time, and the seed particles are aggregated.
- an alkaline aqueous solution is added to make the alkali side again.
- the alkaline aqueous solution may be added gradually or may be added all at once.
- step 3 the hydrolyzed solution is added while maintaining the pH of the mixed solution at 7 or higher.
- the addition of the hydrolyzate is preferably resumed while adding an alkaline aqueous solution.
- the addition rate of the hydrolyzate is preferably 0.7 to 41 g silica / hour / kg mother liquor.
- the addition of the alkyl silicate hydrolyzate to the mother liquor is continued until it has grown to colloidal particles of the desired particle size. By the particle growth, colloidal silica containing silica secondary particles having a bent structure and / or a branched structure of the present invention is obtained.
- the addition of the hydrolysis liquid is stopped. If necessary, alcohol remaining in the reaction solution may be removed by distillation or the like. In this case, it is possible to avoid a decrease in the reaction temperature by continuously removing the water-soluble organic solvent (alcohol or the like). In addition, the presence of a large amount of water-soluble organic solvent (alcohol, etc.) in the addition step is observed to prevent the precipitation of silica, such as dissolving alkyl silicate. It is preferable to quickly distill out of the system. By distilling out of the system, the concentration described later can also proceed simultaneously. At the end of the reaction, the solid concentration can be concentrated to 25% or more.
- reaction solution is concentrated as necessary.
- a trace amount of a water-soluble organic solvent (alcohol or the like) remaining in the system can be removed in advance.
- the concentration method for example, a known concentration method such as a distillation concentration method or a membrane concentration method can be employed.
- the concentrate can be used in various applications as it is after being filtered through a predetermined filter to remove coarse particles and foreign matters.
- Example 1 To an Erlenmeyer flask (volume: 3 L), 228 g of tetramethylorthosilicate (TMOS) was weighed, and 2772 g of pure water was added with stirring at room temperature. The reaction solution, which was initially opaque, became a transparent homogeneous solution after 5 minutes due to the progress of hydrolysis. The reaction was continued for 1 hour to prepare a TMOS hydrolyzate having a silica content of 3% by weight. The pH of the hydrolyzed solution was about 4.4 because of the acidity of the silanol groups produced by the hydrolysis.
- TMOS tetramethylorthosilicate
- a 4-column flask (5 liters) equipped with a packed column (5 mm glass Raschig ring packing, packed height 30 cm) equipped with a thermometer and a ring head, a feed tube, and a stirrer was added with 2000 g of pure water, 1N-TMAH (tetramethylammonium Hydroxide) 2 g was added to make a mother liquor.
- the pH of the mother liquor was 10.70.
- feeding of the TMOS hydrolyzate was started.
- the addition rate was 16 mL / min (14.2 g silica / hour / kg mother liquor).
- the association ratio is a value obtained by secondary particle size / primary particle size.
- the average aspect ratio is the average of the long / short diameter ratios of measurable particles in SEM photographs. The measured number was also displayed.
- Comparative Example 1 A 5 L four-necked flask was set in a mantle heater, and a stirrer, a 30 cm Raschig ring column with a distillation head, a feed pump, and a thermometer were attached. This was charged with 1 L of pure water and 2 g of 1N-TMAH aqueous solution and heated to a reflux state.
- Comparative Example 2 PL-2H2666.8 g (silica content: 533 g), 30 wt% of 1N-TMAH in the same amount of pure water was charged into a 10 L flask equipped with a stirrer, a 30 cm Raschig ring column with a distillation head, a thermometer, and a feed tube. It heated to the reflux state with the mantle heater.
- a hydrolyzed liquid prepared by adding 2772 g of pure water to 228 g of TMOS and stirring for 1 hour at room temperature is used at a rate of 16 ml / min (using 2 Tygon tubes with an inner diameter of 2 mm ⁇ and a scale of 8) using a tube pump. It was dripped.
- the hydrolyzed solution was prepared every 3 hours, and a total of 12 times (silica content: 1067 g) was prepared and added dropwise.
- the ratio between the seed particles and the added activated silica was 1: 2.
- the time required for dropping was about 40 hours.
- the methanol-water mixture is continuously distilled off to maintain the reaction temperature and replace with concentrated water.
- the silica concentration at the end of dropping was around 18 wt%.
- the peak area value of the colloidal silica of the comparative example 2 is as large as 15.7, this is the Stoeber method colloidal silica (peak area value: 28.5) containing a large amount of OH as seed particles. This is because PL-2H was used. The calculated value is 16.8.
- Example 2 Into an Erlenmeyer flask (volume: 3 L), 228 g of tetramethylorthosilicate (TMOS) was weighed and 2772 g of pure water was added at room temperature with stirring. The reaction solution, which was initially opaque, became a transparent homogeneous solution after 5 minutes due to the progress of hydrolysis. The reaction was continued as it was for 1 hour to prepare a TMOS hydrolyzate having a silica content of 3% by weight. The pH of the hydrolyzed solution was about 4.4 because of the acidity of silanol groups generated by hydrolysis.
- TMOS tetramethylorthosilicate
- Filterability was good with about 1300 g / 90 ⁇ 3 ⁇ m membrane filter. As shown in FIG. 13, it can be confirmed that many particles having a larger aspect ratio than Comparative Example 2 are contained. Thereby, the effect excellent in film property and binder property can be expected.
- Example 3 To an Erlenmeyer flask (volume: 3 L), 228 g of tetramethylorthosilicate (TMOS) was weighed, and 2772 g of pure water was added with stirring at room temperature. The reaction solution, which was initially opaque, became a transparent homogeneous solution after 5 minutes due to the progress of hydrolysis. The reaction was continued for 1 hour to prepare a TMOS hydrolyzate having a silica content of 3% by weight. The pH of the hydrolyzed solution was about 4.4 because of the acidity of the silanol groups produced by the hydrolysis.
- TMOS tetramethylorthosilicate
- Example 2 As shown in FIG. 14, it can be confirmed that a larger number of particles having a larger aspect ratio than in Example 2 are contained. Thereby, the effect excellent in film property and binder property can be expected.
- Example 4 In Example 2, 1N-TMAH was replaced with 1N-TEA (triethanolamine). The pH of the mother liquor was 9.28.
- Comparative Examples 3-1 and 3-2 The same procedure as in Example 2 was performed except that 1N-TMAH was not added to the mother liquor and the number of hydrolyzate preparations was as shown in Table 8.
- Comparative Example 4 The test was performed under the same conditions as in Example 2 except that 8 g of 1N-TMAH added to the mother liquor was changed. The pH of the initial mother liquor was 11.58.
- the filterability was extremely reduced to about 38 g / 90 ⁇ 3 ⁇ m membrane filter.
- FIG. 18 it is in a state of a mixture of secondary particles and spherical particles having a bent structure and / or a branched structure, and it can be seen that they are not uniformly deformed. If the initial pH is high, the particle size at the time of acidification becomes large, and it becomes difficult for the particles to associate with each other. Deformation is a process in which silicate oligomers liquefied in an acidic state between particles of an appropriate size formed in the initial alkali state are cross-linked by surface tension and solidified when alkalized again to form one irregular particle. It seems to suggest the mechanism of formation. That is, in the reaction system of this patent, the time of acidification for deforming is not always good, and it can be confirmed that an appropriate time and state exist.
- Comparative Example 5 The reaction was carried out under the same conditions as in Example 2, except that the amount of 1N-TMAH contained in the mother liquor was 1 g, TMOS itself was used instead of the hydrolyzate, the reaction temperature was 80 ° C., and the hydrolyzate was prepared 5 times. Went. The initial pH of the mother liquor was 10.76. The feed rate was 1.23 ml / min (14.2 g silica / hour / kg mother liquor) and the silica feed rate was consistent with Example 2.
- the reaction temperature was set to 80 ° C. This is because TOS volatilized in a boiling state at 100 ° C., silica was adhered to the gas layer portion, and a phenomenon that the filterability was remarkably lowered was observed. .
- a non-volatile hydrolysis solution in advance, such inconvenience due to volatilization can be avoided, and more dense particles can be formed at a higher temperature.
Abstract
Description
1.ケイ酸アルキルを原料として得られるコロイダルシリカであって、屈曲構造及び/又は分岐構造を持つシリカ二次粒子を含有することを特徴とするコロイダルシリカ。
2.前記ケイ酸アルキルは、テトラメチルオルトシリケートである、上記項1に記載のコロイダルシリカ。
3.上記項1又は2に記載のコロイダルシリカを含む研磨剤。
4.1)アルカリ触媒及び水を含むpH9~12の母液を調製する工程及び
2)ケイ酸アルキルを加水分解して得られる加水分解液を前記母液に添加する工程
を含むコロイダルシリカの製造方法であって、
前記加水分解液を前記母液に添加する工程は、
A)混合液のpHが7未満となるまで前記加水分解液を添加する工程1
B)混合液のpHが7以上となるまでアルカリ水溶液を添加する工程2及び
C)混合液のpHを7以上に維持しながら前記加水分解液を添加する工程3
を順に有することを特徴とする製造方法。
5.前記ケイ酸アルキルは、テトラメチルオルトシリケートである、上記項4に記載の製造方法。
6.前記加水分解を無触媒下で行う、上記項4又は5に記載の製造方法。
7.工程1において、混合液のpHが6以上7未満となるまで前記加水分解液を添加する、上記項4~6のいずれかに記載の製造方法。
8.工程1及び工程3において、前記加水分解液を前記母液に添加する添加速度が41gシリカ/時/kg母液以下である、上記項4~7のいずれかに記載の製造方法。
9.混合液のpHが7未満である時間が0.5~5時間となるように工程1及び工程2を実施する、上記項8に記載の製造方法。
10.前記母液に予め種粒子を添加することなく工程1~3を実施する、上記項4~9のいずれかに記載の製造方法。
本発明のコロイダルシリカは、ケイ酸アルキルを原料として得られ、屈曲構造及び/又は分岐構造を持つシリカ二次粒子を含有することを特徴とする。原料のケイ酸アルキルとしては、テトラメチルオルトシリケート(TMOS)が好ましい。
本発明のコロイダルシリカは、蒸留精製により高純度に精製可能なケイ酸アルキルをシリカ原料として製造する。好ましくは、シリカ原料として、高純度に精製可能で、かつ反応性が高く、常温で無触媒でも容易に加水分解されるテトラメチルオルトシリケート(TMOS)が望ましい。
2)ケイ酸アルキルを加水分解して得られる加水分解液を前記母液に添加する工程
を含むコロイダルシリカの製造方法であって、
前記加水分解液を前記母液に添加する工程は、
A)混合液のpHが7未満となるまで前記加水分解液を添加する工程1
B)混合液のpHが7以上となるまでアルカリ水溶液を添加する工程2及び
C)混合液のpHを7以上に維持しながら前記加水分解液を添加する工程3
を順に有することを特徴とする製造方法。
母液調製工程では、アルカリ触媒及び水を含む母液を調製する。例えば、水にアルカリ触媒を添加することにより母液を調製すれば良い。
添加工程では、ケイ酸アルキル(好ましくはテトラメチルオルトシリケート)の加水分解液(以下単に「加水分解液」ともいう。)を前記母液に添加する。
(但し、Meは、メチル基を示す。)
A)混合液のpHが7未満となるまで前記加水分解液を添加する工程1
B)混合液のpHが7以上となるまでアルカリ水溶液を添加する工程2及び
C)混合液のpHを7以上に維持しながら前記加水分解液を添加する工程3
を順に有することを特徴とする。つまり、アルカリ性の母液に加水分解液を添加して一旦混合液のpHを7未満(酸性領域)とした後、アルカリ水溶液を添加して混合液のpHを7以上に戻し、その後はpHを7以上に維持しながら(即ちアルカリ水溶液を添加しながら)加水分解液の添加を継続することを特徴とする。なお、アルカリ水溶液を添加して混合液のpHを7以上に戻す工程(工程2)では加水分解液の添加を中止するか又は添加を少量とすることが好ましい。以下、工程毎に説明する。
(但し、SDは標準偏差、Dは平均粒子径を示す。)
三角フラスコ(容量3L)にテトラメチルオルトシリケート(TMOS)228gを計り取り、純水2772gを常温で攪拌しながら加えた。当初は不透明であった反応液が5分後には加水分解の進行により透明な均一溶液となった。そのまま反応を1時間継続し、シリカ分3重量%のTMOS加水分解液を調製した。加水分解液は、加水分解によって生成したシラノール基の示す酸性のため、そのpHは約4.4であった。
*2平均アスペクト比は、SEM写真の計測可能な粒子の長径/短径比を測定し、平均したもの。測定個数を合わせて表示した。
5L四つ口フラスコをマントルヒーターにセットし、攪拌機、還留ヘッド付30cmラシヒリングカラム、フィードポンプ、温度計を取り付けた。これに、純水1L、1N-TMAH水溶液2gを仕込み、加熱してリフラックス状態にした。
PL-2H2666.8g(シリカ分:533g)、同量の純水に1N-TMAH30.44gを攪拌機、還留ヘッド付30cmラシヒリングカラム、温度計、フィード管を付けた10Lフラスコに仕込み、攪拌下にマントルヒーターでリフラックス状態まで加熱した。
三角フラスコ(容量3L)にテトラメチルオルトシリケート(TMOS)228gを計り取り、純水2772gを常温で攪拌しながら加えた。当初は不透明であった反応液が5分後には加水分解の進行により透明な均一溶液となった。そのまま反応を1時間継続し、シリカ分3重量%のTMOS加水分解液を調製した。加水分解液は、加水分解によって生成したシラノール基の示す酸性のため、そのpHは約4.4であった。
三角フラスコ(容量3L)にテトラメチルオルトシリケート(TMOS)228gを計り取り、純水2772gを常温で攪拌しながら加えた。当初は不透明であった反応液が5分後には加水分解の進行により透明な均一溶液となった。そのまま反応を1時間継続し、シリカ分3重量%のTMOS加水分解液を調製した。加水分解液は、加水分解によって生成したシラノール基の示す酸性のため、そのpHは約4.4であった。
実施例2において、1N-TMAHを1N-TEA(トリエタノールアミン)に変えて実施した。母液のpHは、9.28であった。
母液に1N-TMAHを添加せず、加水分解液調製回数を表8の通りとした以外、実施例2と同様の条件で実施した。
母液に添加する1N-TMAHを8gとした以外、実施例2と同じ条件で実施した。初期母液のpHは、11.58であった。
母液に含まれる1N-TMAH量を1gとし、加水分解液の代わりにTMOS自体を使用し、反応温度を80℃、加水分解液調製回数を5回とした以外、実施例2と同じ条件で反応を行った。母液初期pHは、10.76であった。フィード速度は1.23ml/分(14.2gシリカ/時/kg母液)とし、シリカのフィード速度を実施例2と一致させた。
Claims (10)
- ケイ酸アルキルを原料として得られるコロイダルシリカであって、屈曲構造及び/又は分岐構造を持つシリカ二次粒子を含有することを特徴とするコロイダルシリカ。
- 前記ケイ酸アルキルは、テトラメチルオルトシリケートである、請求項1に記載のコロイダルシリカ。
- 請求項1又は2に記載のコロイダルシリカを含む研磨剤。
- 1)アルカリ触媒及び水を含むpH9~12の母液を調製する工程及び
2)ケイ酸アルキルを加水分解して得られる加水分解液を前記母液に添加する工程
を含むコロイダルシリカの製造方法であって、
前記加水分解液を前記母液に添加する工程は、
A)混合液のpHが7未満となるまで前記加水分解液を添加する工程1
B)混合液のpHが7以上となるまでアルカリ水溶液を添加する工程2及び
C)混合液のpHを7以上に維持しながら前記加水分解液を添加する工程3
を順に有することを特徴とする製造方法。 - 前記ケイ酸アルキルは、テトラメチルオルトシリケートである、請求項4に記載の製造方法。
- 前記加水分解を無触媒下で行う、請求項4又は5に記載の製造方法。
- 工程1において、混合液のpHが6以上7未満となるまで前記加水分解液を添加する、請求項4~6のいずれかに記載の製造方法。
- 工程1及び工程3において、前記加水分解液を前記母液に添加する添加速度が41gシリカ/時/kg母液以下である、請求項4~7のいずれかに記載の製造方法。
- 混合液のpHが7未満である時間が0.5~5時間となるように工程1及び工程2を実施する、請求項8に記載の製造方法。
- 前記母液に予め種粒子を添加することなく工程1~3を実施する、請求項4~9のいずれかに記載の製造方法。
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US11274043B2 (en) * | 2018-06-12 | 2022-03-15 | Evonik Operations Gmbh | Increased particle loading by surface modification with polyethersilane |
WO2020179557A1 (ja) * | 2019-03-06 | 2020-09-10 | 扶桑化学工業株式会社 | コロイダルシリカ及びその製造方法 |
KR20210133285A (ko) * | 2019-03-06 | 2021-11-05 | 후소카가쿠코교 가부시키가이샤 | 콜로이달 실리카 및 그의 제조 방법 |
WO2022226471A1 (en) * | 2021-04-21 | 2022-10-27 | Versum Materials Us, Llc | Non-spherical primary silica nanoparticles and the use therefor |
CN115449258A (zh) * | 2022-09-16 | 2022-12-09 | 昆山大世界油墨涂料有限公司 | 一种高展色效果之装饰纸水墨及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61117113A (ja) * | 1984-07-11 | 1986-06-04 | ロ−ヌ−プ−ラン シミ− ドウ バ−ズ | 高い吸油性能と制御された一次構造とを有するシリカ及びその製造方法 |
JPH02196015A (ja) * | 1989-01-25 | 1990-08-02 | Chisso Corp | シリカの製造方法 |
JP2000001309A (ja) * | 1998-06-12 | 2000-01-07 | Otsuka Chem Co Ltd | 繊維状シリカ及びその製造方法 |
JP2000226453A (ja) * | 1999-02-05 | 2000-08-15 | Jsr Corp | 中空粒子およびその製造方法 |
JP2001002411A (ja) * | 1999-06-15 | 2001-01-09 | Asahi Denka Kogyo Kk | 水性シリカゾルの製造方法 |
WO2006011252A1 (ja) * | 2004-07-26 | 2006-02-02 | Fuso Chemical Co. Ltd. | シリカゾル及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2680721A (en) * | 1952-03-20 | 1954-06-08 | Du Pont | Process of increasing the size of unaggregated silica particles in an aqueous silicasuspension |
JP2803134B2 (ja) | 1988-03-16 | 1998-09-24 | 日産化学工業株式会社 | 細長い形状のシリカゾル及びその製造法 |
US5221497A (en) * | 1988-03-16 | 1993-06-22 | Nissan Chemical Industries, Ltd. | Elongated-shaped silica sol and method for preparing the same |
JP3195569B2 (ja) | 1997-08-11 | 2001-08-06 | 守 磯 | 繭型コロイダルシリカの製造方法 |
JP2923943B1 (ja) * | 1998-03-30 | 1999-07-26 | 日本電気株式会社 | 研磨方法 |
JP4158274B2 (ja) | 1999-04-01 | 2008-10-01 | 王子製紙株式会社 | シリカ微粒子分散液の製造方法 |
JP2001048520A (ja) | 1999-08-04 | 2001-02-20 | Nippon Chem Ind Co Ltd | 細長い形状のシリカゾル及びその製造方法 |
US6334880B1 (en) * | 1999-12-07 | 2002-01-01 | Silbond Corporation | Abrasive media and aqueous slurries for chemical mechanical polishing and planarization |
JP2003226515A (ja) * | 2001-11-27 | 2003-08-12 | Mitsubishi Chemicals Corp | シリカ及びその製造方法 |
US7514363B2 (en) * | 2003-10-23 | 2009-04-07 | Dupont Air Products Nanomaterials Llc | Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use |
JP5127452B2 (ja) * | 2005-08-10 | 2013-01-23 | 日揮触媒化成株式会社 | 異形シリカゾルの製造方法 |
-
2009
- 2009-09-01 KR KR1020117009339A patent/KR101626179B1/ko active IP Right Grant
- 2009-09-01 JP JP2010530800A patent/JP5808106B2/ja active Active
- 2009-09-01 WO PCT/JP2009/065232 patent/WO2010035613A1/ja active Application Filing
- 2009-09-01 US US12/998,096 patent/US8529787B2/en active Active
- 2009-09-01 CN CN200980137876.8A patent/CN102164853B/zh active Active
- 2009-09-25 TW TW98132400A patent/TWI471268B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61117113A (ja) * | 1984-07-11 | 1986-06-04 | ロ−ヌ−プ−ラン シミ− ドウ バ−ズ | 高い吸油性能と制御された一次構造とを有するシリカ及びその製造方法 |
JPH02196015A (ja) * | 1989-01-25 | 1990-08-02 | Chisso Corp | シリカの製造方法 |
JP2000001309A (ja) * | 1998-06-12 | 2000-01-07 | Otsuka Chem Co Ltd | 繊維状シリカ及びその製造方法 |
JP2000226453A (ja) * | 1999-02-05 | 2000-08-15 | Jsr Corp | 中空粒子およびその製造方法 |
JP2001002411A (ja) * | 1999-06-15 | 2001-01-09 | Asahi Denka Kogyo Kk | 水性シリカゾルの製造方法 |
WO2006011252A1 (ja) * | 2004-07-26 | 2006-02-02 | Fuso Chemical Co. Ltd. | シリカゾル及びその製造方法 |
Cited By (37)
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CN102947919A (zh) * | 2010-06-23 | 2013-02-27 | 日产化学工业株式会社 | 碳化硅基板研磨用组合物和碳化硅基板的研磨方法 |
US20130092871A1 (en) * | 2010-06-23 | 2013-04-18 | Nissan Chemical Industries, Ltd. | Composition for polishing silicon carbide substrate and method for polishing silicon carbide substrate |
KR101842300B1 (ko) * | 2010-06-23 | 2018-03-26 | 닛산 가가쿠 고교 가부시키 가이샤 | 탄화규소 기판 연마용 조성물 및 탄화규소 기판의 연마 방법 |
JP2012025596A (ja) * | 2010-07-20 | 2012-02-09 | Shin-Etsu Chemical Co Ltd | 会合シリカ微粒子の製造方法 |
JP2012101953A (ja) * | 2010-11-08 | 2012-05-31 | Shin-Etsu Chemical Co Ltd | 異形シリカ微粒子の製造方法及び静電荷像現像用トナー外添剤 |
JP2012111869A (ja) * | 2010-11-25 | 2012-06-14 | Jgc Catalysts & Chemicals Ltd | 研磨用シリカゾル、研磨用組成物及び研磨用シリカゾルの製造方法 |
JP2013082584A (ja) * | 2011-10-11 | 2013-05-09 | Fuso Chemical Co Ltd | 高純度単分散シリカ粒子及びその製造方法 |
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WO2018159530A1 (ja) * | 2017-02-28 | 2018-09-07 | 富士フイルム株式会社 | 研磨液、研磨液の製造方法、研磨液原液、研磨液原液収容体、化学的機械的研磨方法 |
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TWI471268B (zh) | 2015-02-01 |
CN102164853A (zh) | 2011-08-24 |
US20110163262A1 (en) | 2011-07-07 |
TW201022144A (en) | 2010-06-16 |
KR20110081212A (ko) | 2011-07-13 |
US8529787B2 (en) | 2013-09-10 |
CN102164853B (zh) | 2014-12-31 |
KR101626179B1 (ko) | 2016-05-31 |
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