WO2005096683A1 - 回路基板及びその製造方法及び回路基板を用いたジョイントボックス - Google Patents

回路基板及びその製造方法及び回路基板を用いたジョイントボックス Download PDF

Info

Publication number
WO2005096683A1
WO2005096683A1 PCT/JP2005/005811 JP2005005811W WO2005096683A1 WO 2005096683 A1 WO2005096683 A1 WO 2005096683A1 JP 2005005811 W JP2005005811 W JP 2005005811W WO 2005096683 A1 WO2005096683 A1 WO 2005096683A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
terminal
circuit
resin plate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/005811
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Tsugio Ambo
Satoru Fujiwara
Yoshikatsu Hasegawa
Chihiro Nakagawa
Takeshi Ono
Atsushi Urushidani
Tooru Kashioka
Katsuji Shimazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Ryosei Electro Circuit Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP05727833A priority Critical patent/EP1737282A4/en
Priority to CN200580009958A priority patent/CN100594757C/zh
Priority to JP2006511657A priority patent/JPWO2005096683A1/ja
Priority to US10/593,796 priority patent/US7943859B2/en
Priority to KR1020067019950A priority patent/KR101183336B1/ko
Priority to KR1020117026550A priority patent/KR101208823B1/ko
Application filed by Mitsubishi Cable Industries Ltd, Ryosei Electro Circuit Systems Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to KR1020117026551A priority patent/KR101208751B1/ko
Publication of WO2005096683A1 publication Critical patent/WO2005096683A1/ja
Anticipated expiration legal-status Critical
Priority to US13/006,222 priority patent/US8362366B2/en
Priority to US13/006,122 priority patent/US20110120756A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/2458—Electrical interconnections between terminal blocks
    • H01R9/2466—Electrical interconnections between terminal blocks using a planar conductive structure, e.g. printed circuit board
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Definitions

  • the present invention relates to a circuit board, a method of manufacturing the same, and a joint box using the circuit board.
  • the present invention relates to a circuit board that can be used in various electric devices and a joint box used in an electric circuit to branch and couple various wirings, a method of manufacturing the same, and a joint box using the circuit board. It is.
  • a common notch hole 4 is formed in the laminated flat cable layer 3, and the conductor foil 1 of the flat cable layer 3 is exposed in each notch hole 4 as necessary, and the exposed conductor foil 1 is placed on the top. It is welded to the lower end of the attached connection terminal 5.
  • Patent Document 1 JP-A-10-243526
  • An object of the present invention is to solve the above-described problems and to use the circuit board having a circuit pattern made of metal foil, a method for manufacturing the same, and a circuit board that can be used in various electric appliances.
  • a circuit board according to the present invention for achieving the above object is characterized in that a circuit pattern having a metal foil force is mounted on a three-dimensionally molded synthetic resin material resin plate. Sign.
  • the circuit board according to the present invention is characterized in that terminals are formed at necessary locations on a resin plate made of a synthetic resin material formed three-dimensionally, and formed into a predetermined shape on the resin plate.
  • a circuit pattern made of stamped metal foil is placed, a substantially cylindrical receiving terminal made of metal is attached to the terminal hole, and the circuit pattern is connected to the receiving terminal.
  • the circuit board according to the present invention has a terminal through-hole formed at a required position on a resin plate made of a synthetic resin material molded three-dimensionally, and has a predetermined shape on the resin plate.
  • a circuit pattern made of stamped metal foil is placed, and a notch portion for inserting an insertion end of a connection terminal is provided in the metal foil portion corresponding to the terminal hole, and a corresponding notch is provided.
  • a metal tubular receiving terminal is fitted into the through hole.
  • the method for manufacturing a circuit board according to the present invention is a method for manufacturing a circuit board, comprising: mounting a circuit pattern made of a metal foil punched into a predetermined shape on a resin plate made of a synthetic resin material formed three-dimensionally; The circuit pattern is punched out of the metal foil with a big blade, and the circuit pattern is held between the big blades, transported onto the resin plate, and fixed on the resin plate.
  • a joint box using a circuit board according to the present invention comprises a plurality of circuit boards in which a circuit pattern having a metal foil force is mounted on a three-dimensionally molded resin plate made of a synthetic resin material.
  • a common terminal and a through hole are formed in the laminated circuit boards at predetermined positions of these circuit boards, and a substantially cylindrical metal receiving terminal is formed in the terminal and the through hole of the circuit board of the arbitrary layer. Then, a tab attached to the receiving terminal is connected to the circuit pattern of the circuit board, an insertion terminal having a pin-shaped insertion end is inserted into the common terminal hole, and the corresponding terminal is inserted through the receiving terminal.
  • the circuit pattern of each layer of the circuit board is electrically connected.
  • the joint box using the circuit board according to the present invention is characterized in that terminals are formed in necessary places on a resin plate made of a synthetic resin material formed in a three-dimensional manner, and a terminal hole is formed.
  • a circuit pattern made of a metal foil punched into a predetermined shape is placed on the plate, and a notch for inserting a pin-shaped insertion end into the circuit pattern corresponding to the terminal insertion hole is provided.
  • a metal-made substantially cylindrical receiving terminal is fitted in the corresponding terminal hole. Laminating several circuit boards, passing the insertion end through the terminal through hole, and electrically connecting the insertion end and the circuit pattern of each layer of the circuit board via the receiving terminal. It is characterized by.
  • circuit board and the method of manufacturing the same since a circuit pattern consisting of a metal foil punched by a beak blade or the like is placed on a molded resin plate, the configuration is simple, and the production is simple. Easy.
  • the circuit board on which the circuit pattern of the foil circuit is formed is laminated and manufactured, a complicated circuit can be manufactured with a reduced thickness.
  • FIG. 1 is an exploded perspective view of an upper case, a circuit unit, and a lower case constituting a joint box.
  • FIG. 2 is a plan view of a circuit board.
  • FIG. 3 is a bottom view of the circuit board.
  • FIG. 4 is a partial cross-sectional view of a circuit board.
  • FIG. 5 is a partial cross-sectional view of a circuit board in a foil circuit in which two metal foils are stacked.
  • FIG. 6 is a perspective view of a receiving terminal.
  • FIG. 7 is a cross-sectional view of a main part in which circuit boards to which receiving terminals are fixed are stacked.
  • FIG. 8 is a perspective view of an insertion terminal.
  • FIG. 9 is a sectional view of a circuit board and a block body.
  • FIG. 10 is a cross-sectional view of main parts of another example in which circuit boards to which receiving terminals are fixed are stacked.
  • FIG. 11 is a perspective view of another example of the insertion terminal.
  • FIG. 12 is an explanatory diagram of a circuit board manufacturing process.
  • FIG. 13 is an explanatory diagram of another manufacturing process of the circuit board.
  • FIG. 14 is a cross-sectional view of a step of holding a foil circuit by a big blade.
  • FIG. 15 is an explanatory diagram of a step of holding a receiving terminal by a robot hand.
  • FIG. 16 is an explanatory diagram of a step of fixing a receiving terminal to a circuit board.
  • FIG. 17 is an explanatory diagram of a step of welding a receiving terminal to a foil circuit.
  • FIG. 18 is an explanatory view of a manufacturing process of the rectangular electric wire.
  • FIG. 19 is an explanatory view of a step of bending a rectangular electric wire.
  • FIG. 20 is an explanatory diagram of a step of welding a rectangular electric wire to a foil circuit.
  • FIG. 21 is an explanatory view for assembling a circuit board.
  • FIG. 22 is an enlarged perspective view of a receiving ring.
  • FIG. 23 is a perspective view of a receiving ring of a modified example.
  • FIG. 24 is a cross-sectional view in which an insertion end is inserted into a receiving ring via a foil circuit.
  • FIG. 25 is a plan view of a modified example of a cut portion.
  • FIG. 26 is a cross-sectional view of relevant parts where circuit boards are stacked.
  • FIG. 27 is a cross-sectional view showing a state where an insertion end is inserted into a stacked circuit board.
  • FIG. 28 is a partial cross-sectional view of a conventional example.
  • FIG. 1 is an exploded perspective view of an embodiment of a joint box using a circuit board according to the present invention.
  • a circuit unit 12 By assembling an upper case 11, a circuit unit 12, and a lower case 13 with each other, a bottom-shaped joint is formed. You get a box.
  • the lock provided on the upper case 11 and the lower case 13 with the circuit unit 12 housed is Locked by parts 14a, 14b
  • a circuit pattern (not shown) is formed, and a synthetic resin block 16 to which a plurality of insertion terminals 15 are attached is arranged.
  • the block 16 is fitted into a frame 17 defined by the upper case 11, and the connecting portions of the insertion terminal 15 protruding above the block 16, such as the flat blade end 15 a, the receiving end 15 b, and the pin end 15 c, are connected to the frame 17. Is located within.
  • a connector accommodating a fuse element, a switch element, or another connection terminal can be attached to these connection portions.
  • a frame portion 18 is also formed in the lower case 13, and the connection end of the insertion terminal 15 protrudes downward from a block body 16 attached to the lower surface of the power circuit unit 12 (not shown), Similar elements, connectors, and the like can be mounted on the lower surface of the lower case 13.
  • an electronic circuit unit can be provided in the joint box.
  • the joint box power terminals can be protruded so that the boxes accommodating the electronic circuit units are adjacent to each other and connected by the terminals. it can.
  • the circuit unit 12 has, for example, five circuit boards 19 laminated thereon. As shown in FIGS. 2 and 3, each circuit board 19 has a maximum thickness of about 1.5 mm made of synthetic resin molded by injection molding, for example. On a resin plate 20, a foil circuit 21 having a pattern is placed. The foil circuit 21 also has a copper foil force of, for example, a thickness of 120 m, and is divided into different patterns for each of the laminated circuit boards 19.
  • a plurality of anchor pins 20a project upward from the resin plate 20. It is passed through a pin hole 21a provided in the foil circuit 21.
  • the foil circuit 21 is positioned and fixed to the resin plate 20 by crushing the upper portion of the anchor pin 20a by heat.
  • some of the foil circuits 21 are made of two or more layers of metal foil as shown in FIG. 5, and are fixed by high anchor pins 20a ′. By inserting the welding electrode from the welding hole 20b formed in the resin plate 20, the stacked metal foils 21 are welded to each other.
  • a plurality of circular resin terminal holes 20 c common to the laminated resin plates 20 are formed at a plurality of positions of the resin plate 20.
  • Each circuit 21 is provided with a hole having the same diameter as the terminal hole 20c, and a receiving terminal 22 is attached to the terminal hole 20c.
  • the receiving terminal 22 has several sizes depending on the required current capacity, and accordingly, several types of the diameter of the terminal through hole 20c are provided.
  • the receiving terminal 22 also has a brass plate force of, for example, a thickness of 0.2 mm, and is formed by a forming press. As shown in FIG. 6, the receiving terminal 22 has a flange portion 22b formed on an upper portion of a cylindrical connecting portion 22a formed in a short cylindrical shape, and a tab 22c is provided on a part of the flange portion 22b.
  • the boundary between the cylindrical connection portion 22a and the flange portion 22b is a tapered guide portion 22d for receiving an insertion terminal described later.
  • FIG. 7 is a cross-sectional view of main parts of the circuit unit 12 in a state where five circuit boards 19 are stacked and the receiving terminal 22 is fixed.
  • the outer diameter of the cylindrical connecting portion 22a of the receiving terminal 22 is substantially the same.
  • the periphery of the upper part of the terminal ⁇ through hole 20c is an annular portion 20d which is lifted upward, and a step portion 20e for mounting the flange portion 22b of the receiving terminal 22 is formed in the annular portion 20d. .
  • the inner diameter of the lower part of the terminal hole 20c is increased in order to expand the lower part of the cylindrical connecting part 22a.
  • the inner diameter of the terminal ⁇ through hole 20c to which the receiving terminal 22 is not attached is substantially the same size as the inner diameter of the receiving terminal 22. There is no problem.
  • the cylindrical connecting portion 22a of the receiving terminal 22 is arranged in the terminal through-hole 20c, and the lower portion of the cylindrical connecting portion 22a is tapered and stopped at the lower portion of the terminal through-hole 20c.
  • This cylindrical connection The expansion of the lower portion of 22a also serves as a tapered guide portion 22e for inserting the insertion terminal 15 from the lower surface direction mainly intended to fix the receiving terminal 22 to the circuit board 19.
  • the tab 22c is connected to the foil circuit 21 of the circuit board 19 by welding. For this welding, the resin plate 20 below the tab 22c is provided with a welding hole 2 for electrode passage. Of is formed.
  • an annular portion 20g is formed around the upper part thereof, and the foil circuit 21 exists around the terminal hole 20c. Also, the insertion terminal 15 to be inserted is prevented from contacting the foil circuit 21.
  • the annular portion 20g provided on the uppermost circuit board 19 of the circuit cut 12 is provided in a terminal ⁇ ⁇ ⁇ ⁇ ⁇ through hole 20c for mounting the receiving terminal 22 in order to stably mount the block body 16. It is the same height as the ring part 20d.
  • an electric wire groove 20h is formed on the lower surface side of the resin plate 20 as necessary, and an insulating paint is applied in the electric wire groove 20h.
  • Square wire 23 is installed. Both ends of the rectangular electric wire 23 are raised through the electric wire holes 20i provided at both ends of the electric wire groove 20h and are welded to the lower surface of the foil circuit 21. Are designed to short-circuit the patterns of the foil circuit 21 that cannot be connected as jumper wires.
  • the rectangular electric wires 23 have various cross-sectional areas according to the current capacity.
  • the above-mentioned heat-fused upper end portion of the anchor pin 20 a of the circuit board 19, the annular portion 20 d, and the receiving terminal 22 are fitted into the concave portion formed on the lower surface of the upper resin plate 20, and are stacked on the circuit board.
  • the plates 19 are in close contact with each other and are not shifted in the horizontal direction.
  • the concave portion 20j shown in FIG. 3 is a portion into which the receiving terminal 22 attached to the lower circuit board 19 fits.
  • through-holes 201 provided at four corners of the resin plate 20 are positioning holes when the circuit boards 19 are stacked.
  • the square hole 20m shown in Figs. 2 and 3 provided on the circuit board 19 has a large current connection shown in Fig. 1 when the insertion terminal 15 and the receiving terminal 22 have insufficient current capacity. This is for attaching the terminal 26, and is provided only on the uppermost circuit board 19 of the circuit unit 12!
  • the circuit board 19 does not always laminate all the foil circuits 21 upward, and in Fig. 7, the upper three-layer circuit board 19 laminates the foil circuit 21 upward, and the lower two The circuit board 19 of layers is laminated with the foil circuit 21 facing down. Also in this case, the circuit board 19 in which the lower surfaces of the third layer and the fourth layer are overlapped with each other can be partially fitted so as not to cause a force shift (not shown).
  • FIG. 8 is a perspective view of the insertion terminal 15 for insertion into the receiving terminal 22, and a lower portion of the insertion terminal 15 is a pin having a substantially square cross section for insertion into the cylindrical connecting portion 22 a of the receiving terminal 22.
  • the insertion end is 15d.
  • the upper portion via the intermediate portion 15e protrudes above the upper case 11, and serves as a flat blade end 15a for connecting to another connection terminal.
  • the flat blade end 15a may be the receiving end 15b or the pin end 15c shown in FIG.
  • a thin metal plate is bent and formed into a rod shape having a substantially vertical cross section with no cavity and a width in the vertical direction. Therefore, even when the thickness of the metal plate is small, the insertion end 15d whose one side is sufficiently thicker than the thickness of the metal plate can be obtained, and the insertion end 15d hardly bends or breaks.
  • the upper flat blade end 15a is also made thick by double folding the metal plate.
  • a plurality of steps may be formed at the insertion end 15d in order to obtain a click feeling when inserted into the insertion end receiving terminal 22 and to improve the connection.
  • several types of these insertion ends 15d are prepared according to the size of the receiving terminal 22.
  • intermediate portions 15e of some insertion terminals 15 are inserted and fixed. As shown in FIG. Inserted into the circuit board 19.
  • the middle part 15e of the insertion terminal 15 is provided with a not-shown claw for fixing it to the through hole.
  • one or a plurality of downwardly directed anchor pins 16 a are formed in the body, and pin holes 21 b provided in the foil circuit 21, It is inserted through a pin hole 20k commonly provided in the plate 20.
  • the block body 16 is fixed to the circuit unit 12, and the laminates of the circuit board 19 are fixed inseparably. ing.
  • FIG. 10 shows another example of the circuit board 19.
  • the lower circuit The diameter of the terminal through hole 20c is smaller in the circuit board 19, and accordingly, the diameter of the receiving terminal 22 is also smaller.
  • the pin-shaped insertion end 15d has a smaller diameter toward the tip in accordance with the diameter of the receiving terminal 22, as shown in FIG. With such a configuration, when the insertion terminal 15 fixed to the block body 16 is inserted into the laminated body of the circuit board 19, there is an advantage that the insertion becomes easy.
  • FIG. 12 is an explanatory diagram of the manufacturing process of the circuit board 19 described above.
  • the copper foil 41 which is the base material of the foil circuit 21, is wound around a roller 42 in a coil shape. If necessary, the copper foil 41 may be fed by a clamp or the like based on a pilot hole formed in advance in the copper foil 41. It is fed out intermittently by means 43.
  • the copper foil 41 is conveyed to a punching press step, where the pin holes 21 a and 21 b are punched at a plurality of predetermined positions by a punching press 44, and transferred to a laminating step with the resin plate 20. Since the pin holes 21 a provided in the copper foil 41 are for fixing the foil circuit 21 to the resin plate 20, the pin holes 21 a remain on the resin plate 20 and are provided in portions to become the foil circuits 21.
  • the resin plates 20 are laminated with a stop force 45, and are taken out one by one in synchronization with the transport of the copper foil 41.
  • the resin plate 20 is manufactured by injection-molding a synthetic resin film or hot-pressing a synthetic resin base, and includes an anchor pin 20a, holes 20b and 20f, terminal insertion holes 20c, annular portions 20d and 20g, and a step 20e.
  • the wire groove 20h, the hole 20i, the recess 20j, the pin hole 20k, the through hole 201, and the like have already been formed.
  • stacking base 46 When one resin plate 20 is placed on stacking base 46, stacking base 46 rises and is pushed up toward copper foil 41.
  • the position of the stacking base 46 is three-dimensionally controlled by image processing by the imaging camera 47 so that the anchor pins 20a of the resin plate 20 enter the pin holes 21a formed in the copper foil 41.
  • the copper foil 41 is double-laid as described above to reduce the electric resistance. Therefore, the above-described steps are repeated twice, and The welded copper foils 41 are welded to each other using the welding holes 20b provided in the resin plate 20, as shown in FIG.
  • the heat press 48 located above the stacking table 46 is lowered, and the top of the anchor pin 20a is pressed by heat. Crush the copper foil 41 so that it does not peel from the resin plate 20.
  • the pin holes 21b of the copper foil 41 passing through the anchor pins 16a of the block body 16 match the pin holes 20k of the resin plate 20!
  • the copper foil 41 integrated with the resin plate 20 is transported to the punching press 49, and the foil circuit 21 is punched from the copper foil 41 while performing image processing.
  • the upper punching press 49 has a big edge 49a, and punches the foil circuit 21 from the copper foil 41 without damaging the resin plate 20, and the big pattern 49 punches the circuit pattern of the foil circuit 21. .
  • the circuit pattern is punched, when the copper foil 41 located on the terminal hole 20c in the circuit pattern is connected to the receiving terminal 22 on the circuit board 19, the hole corresponding to the inner diameter of the receiving terminal 22 is formed. When not connected to the receiving terminal 22, a hole having a size outside the annular portion 20g is formed.
  • the copper foil 41 is transported together with the resin plate 20, and the residual copper foil 41 not used in the foil circuit 21 is cut off by the residual material processing blade 50 after being separated from the resin plate 20, It is dumped in the remaining material box 51.
  • the resin plate 20 with the foil circuit 21 integrally fixed on the surface is carried out in a predetermined direction as the circuit board 19 and is stacked in the stocker 52.
  • FIG. 13 is an explanatory diagram of a manufacturing process of the circuit board 19 by another method, and the same reference numerals as in FIG. 12 indicate the same members.
  • a copper foil 41 which is a base material of the foil circuit 21, is wound in a coil shape on a roller 42, and a plurality of pin holes 21a, 21b are punched in a plurality of predetermined positions by a punching press 44 on the copper foil 41, and a pattern circuit is punched. Transferring to the process is the same as in Figure 12.
  • the copper foil 41 is conveyed to a punching press 55, and the foil circuit 21 is punched from the copper foil 41 while performing image processing.
  • the upper punching press 55 has a big edge 55a, punches the foil circuit 21 from the copper foil 41, and the circuit pattern of the foil circuit 21 is punched by the big blade 55a.
  • a plurality of suction pads 55b are provided between the big blades 55a, hold the punched foil circuit 21 by vacuum suction, and transport it to a predetermined position by a big blade transport device.
  • the remaining copper foil 41 that is not punched out as the foil circuit 21 is further conveyed, shredded by the remaining material processing blade 56, and discarded in the remaining material box 57.
  • the resin plate 20 is laminated with a stop force 45, and the foil circuit 21 from the copper foil 41
  • the foil circuit 21 held by the blade 55a is carried onto the resin plate 20.
  • the three-dimensional position control by the image processing by the imaging camera 58 controls the big blade conveying device so that the anchor pins 20a of the resin plate 20 enter the pin holes 21a formed in the foil circuit 21.
  • the anchor pin 20a is inserted into the pin hole 21a of the foil circuit 21, and after the foil circuit 21 is overlaid on the resin plate 20, air is blown out from the suction pad 55b between the big blades 55a to form the foil circuit 21. Separate from the blade 55a and press it onto the resin plate 20.
  • the foil circuit 21 is pressed by providing a plurality of push pins between the blades 55a and pressing the foil circuit 21 onto the resin plate 20.
  • the big blade 55a is returned to the original position of the punching press 55 by the big blade conveying device, and the hot press 48 located above is lowered onto the resin plate 20 on which the foil circuit 21 is placed. Then, the top of the anchor pin 20a is crushed to fix the foil circuit 21 on the resin plate 20.
  • FIG. 15 to FIG. 17 are explanatory views of a process of fixing the receiving terminal 22 to the circuit board 19, and the receiving terminal 22 supplied in alignment by the parts feeder is shown in FIG.
  • the image is held by the imaging camera 62 while being processed by the imaging camera 62 as necessary, and transported to a required portion of the circuit board 19 by the imaging camera 62.
  • a lifting pin 64 is provided on the robot node 61 so as to be vertically movable with respect to the cylindrical portion 63. This lifting pin 64 is inserted into the cylindrical connecting portion 22a of the receiving terminal 22, the receiving terminal 22 is lifted by frictional resistance, and image processing is performed so that the tab 22c of the receiving terminal 22 is placed on the foil circuit 21. While adjusting the position, insert the receiving terminal 22 into the terminal hole 20c of the resin plate 20.
  • the lifting pin 64 is lifted upward as shown in FIG. Then, the press pin 65 having a conical tip is lifted from below, and the lower portion of the cylindrical connecting portion 22a is pushed open to spread the receiving terminal 22 to the lower portion of the terminal hole 20c.
  • the tab 22c is welded to the foil circuit 21 using the electrodes 66 and 67.
  • the tips of the electrodes 66 and 67 are each a small diameter round shape with a diameter of about lmm.
  • the upper electrode 66 contacts the tab 22c, and the lower electrode 67 contacts the lower surface of the foil circuit 21 via the welding hole 20f. I do.
  • This welding can be performed sequentially by a robot hand.
  • the electrodes can be welded together using electrodes.
  • FIG. 18 to FIG. 20 are explanatory views of a process of fixing the rectangular electric wire 23 to the electric wire groove 20h of the resin plate 20.
  • the rectangular electric wire is insulated by a flat rectangular copper wire of 0.3 ⁇ 3 mm.
  • the rectangular electric wire 71 coated with the layer is wound around a roller 72 and is fed out intermittently and supplied.
  • the rectangular electric wire material 71 supplied from the roller 72 is straightened by a straightening roll 73, the length of feeding is measured by a measuring roller 74, and is fixed by a chuck 75 when the predetermined length is fed.
  • the insulating layer at the end of the rectangular electric wire material 71 is peeled off by the coating stripping machine 76, and then, when the peeled portion advances to the cutting machine 77, it is fixed by the chuck 78. Cut the center.
  • a rectangular electric wire 23 having a predetermined length with the insulating layers at both ends removed is obtained.
  • this rectangular electric wire 23 is bent at both ends by a kagami press machine 79, and the resin plate 20 is turned upside down by a robot hand, and the rectangular electric wire 23 is mounted in the wire groove 20h on the back side.
  • the imaging camera 80 while performing image processing by the imaging camera 80, the insulating stripped portions at both ends are pressed against the lower surface of the foil circuit 21 through the welding holes 20i of the resin plate 20, and the upper and lower electrodes 81, 82 Then, the rectangular electric wire 23 is welded to the foil circuit 21 and electrically connected.
  • a plurality of circuit boards 19 manufactured in this way and having different circuit patterns are laminated, and the block body 16 is placed on the laminate of the circuit boards 19 as shown in FIG.
  • the insertion end 15d of the insertion terminal 15 fixed to the block body 16 is inserted into the terminal hole 20c of the circuit board 19, the insertion end 15d becomes at least the receiving end 22 of the receiving terminal 22 attached to any one of the circuit boards 19. It is inserted into the cylindrical connection part 22a.
  • the insertion end 15 d has a substantially square cross section, when the insertion end 15 d is inserted into the cylindrical connection portion 22 a of the receiving terminal 22, the corner portion makes good contact, and Good electrical connection with the foil circuit 21 of the circuit board 19 of FIG. If necessary, the block body 16 is mounted also from the lower surface side of the circuit unit 12.
  • the circuit unit 12 is sandwiched between the upper case 11 and the lower case 13, and the lock portions 14a, 14b To lock cases 11 and 13 together.
  • the various elements and connectors are attached to the flat blade end 15a, the receiving end 15b, and the pin end 15c of the insertion terminal 15 from which the surface forces of the upper case 11 and the lower case 13 also protrude, thereby functioning as a joint box.
  • FIG. 21 and subsequent figures show an embodiment of another circuit board 91.
  • each circuit board 91 is made of a synthetic resin molded by injection molding, for example, on a resin plate 92 having a maximum thickness of about 1.5 mm.
  • a foil circuit 93 having a pattern in which different sections are made for each of the laminated circuit boards 91 is mounted.
  • a concave portion 94 having a depth equivalent to the thickness of the foil circuit 93 is formed in the resin plate 92 in the same shape as the foil circuit 93, as necessary, in order to place and position the foil circuit 93. ing.
  • a plurality of anchor pins 92a project upward from the resin plate 92, pass through pin holes 93a provided in the foil circuit 93, and crush the upper portions of the anchor pins 92a by heat.
  • the foil circuit 93 is positioned and fixed on the resin plate 92. If a current capacity is required, some of the foil circuits 93 may have two or more copper foil layers as in the first embodiment.
  • a circular terminal insertion hole 92b common to the laminated resin plates 92 is formed at a plurality of positions of the resin plate 92, and a predetermined terminal insertion hole 92b of the circuit board 91 of a predetermined layer is formed.
  • the receiving ring 95 has several sizes depending on the type of insertion terminal and the current capacity to be described later, and accordingly, several types of terminals ⁇ through holes 92b are provided. For example, a round pipe or a square pipe made of stainless steel is used. It is made by cutting. Note that, as shown in FIG. 23, the receiving ring 95 may be provided with a flange portion 95a.
  • the foil circuit 93 on the receiving ring 95 fitted in the terminal hole 92b is provided with a cross-shaped notch 93b, for example, as shown in FIG.
  • the cut portion 93b of the foil circuit 93 is broken and pushed and expanded, and the foil circuit 93 is sandwiched between the insertion end 96d and the receiving ring 95, and is inserted into the insertion end 96d.
  • the foil circuit 93 makes conductive contact.
  • the receiving ring 95 is not fitted to the insertion end that does not require conduction, and the circuit pattern around the insertion hole 92b is provided with holes or removed so that conduction does not occur. It is.
  • the insertion is facilitated by sharpening the tip of the insertion end 96d as shown in Fig. 21.
  • the cut portion 93b is easily broken, and the contact with the receiving ring 95 becomes more reliable.
  • FIG. 26 is a cross-sectional view of a main part of the circuit unit 97 in a state where five circuit boards 91 are stacked.
  • circuit board 91 In addition, at the four corners of the circuit board 91, uneven portions (not shown) for laminating the circuit boards 91 are formed, and the upper and lower circuit boards 91 are positioned by fitting these uneven portions.
  • a plurality of circuit boards 91 having different circuit patterns are stacked, and the block body 16 is placed on the uppermost circuit board 91 as shown in FIG.
  • the specified insertion end 96d of the connection terminal 96 is inserted into the terminal hole 92b of the circuit board 91, the insertion end 96d is inserted into at least the receiving ring 95 attached to any one of the circuit boards 91.
  • the insertion end 96d is electrically connected to the foil circuit 93 provided for each receiving ring 95, and a three-dimensional circuit unit 97 using the laminated circuit boards 91 is configured.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
PCT/JP2005/005811 2004-03-31 2005-03-29 回路基板及びその製造方法及び回路基板を用いたジョイントボックス Ceased WO2005096683A1 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
CN200580009958A CN100594757C (zh) 2004-03-31 2005-03-29 电路基板及其制造方法和采用该电路基板的接线箱
JP2006511657A JPWO2005096683A1 (ja) 2004-03-31 2005-03-29 回路基板及びその製造方法及び回路基板を用いたジョイントボックス
US10/593,796 US7943859B2 (en) 2004-03-31 2005-03-29 Circuit board, its manufacturing method, and joint box using circuit board
KR1020067019950A KR101183336B1 (ko) 2004-03-31 2005-03-29 회로기판을 이용한 조인트 박스
KR1020117026550A KR101208823B1 (ko) 2004-03-31 2005-03-29 회로기판 및 이 회로기판을 이용한 조인트 박스
EP05727833A EP1737282A4 (en) 2004-03-31 2005-03-29 PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND JUNCTION BOX USING THE CIRCUIT BOARD
KR1020117026551A KR101208751B1 (ko) 2004-03-31 2005-03-29 회로기판의 제조방법
US13/006,222 US8362366B2 (en) 2004-03-31 2011-01-13 Circuit board, its manufacturing method, and joint box using circuit board
US13/006,122 US20110120756A1 (en) 2004-03-31 2011-01-13 Circuit board, its manufacturing method, and joint box using circuit board

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2004105997 2004-03-31
JP2004-105997 2004-03-31
JP2004-239707 2004-08-19
JP2004239707 2004-08-19
JP2004-381266 2004-12-28
JP2004381266 2004-12-28

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10/593,796 A-371-Of-International US7943859B2 (en) 2004-03-31 2005-03-29 Circuit board, its manufacturing method, and joint box using circuit board
US13/006,122 Division US20110120756A1 (en) 2004-03-31 2011-01-13 Circuit board, its manufacturing method, and joint box using circuit board
US13/006,222 Continuation US8362366B2 (en) 2004-03-31 2011-01-13 Circuit board, its manufacturing method, and joint box using circuit board

Publications (1)

Publication Number Publication Date
WO2005096683A1 true WO2005096683A1 (ja) 2005-10-13

Family

ID=35064168

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/005811 Ceased WO2005096683A1 (ja) 2004-03-31 2005-03-29 回路基板及びその製造方法及び回路基板を用いたジョイントボックス

Country Status (6)

Country Link
US (3) US7943859B2 (https=)
EP (1) EP1737282A4 (https=)
JP (4) JPWO2005096683A1 (https=)
KR (3) KR101208823B1 (https=)
CN (2) CN101568227B (https=)
WO (1) WO2005096683A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010666A1 (ja) * 2008-07-23 2010-01-28 三菱電線工業株式会社 回路構造体、ジョイントボックス、及び、回路構造体の製造方法
JP2019133975A (ja) * 2018-01-29 2019-08-08 矢崎総業株式会社 配索構造および配索方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101208823B1 (ko) * 2004-03-31 2012-12-06 미츠비시 덴센 고교 가부시키가이샤 회로기판 및 이 회로기판을 이용한 조인트 박스
DE102007028511A1 (de) * 2007-06-21 2008-12-24 Robert Bosch Gmbh Elektronisches Gerät mit mindestens einem elektrischen Anschlusselement und Verfahren zur Herstellung eines Anschlusselements
DE102008008278A1 (de) * 2008-02-07 2009-08-13 Dr. Johannes Heidenhain Gmbh Winkelmesseinrichtung
JP5255365B2 (ja) * 2008-08-09 2013-08-07 古河電気工業株式会社 中継端子部材及びそれを備えた回路構造体、並びに電子ユニット
JP5497389B2 (ja) * 2009-09-17 2014-05-21 三菱マテリアル株式会社 電気接続箱
JP5758584B2 (ja) 2010-03-18 2015-08-05 本田技研工業株式会社 ジャンクションボックス
CN101958521A (zh) * 2010-09-19 2011-01-26 淮南润成科技有限公司 矿用本安电路用分线盒
JP5610285B2 (ja) * 2010-09-29 2014-10-22 本田技研工業株式会社 配線構造体及びそれを備えたジョイントボックス
DE102011102484B4 (de) 2011-05-24 2020-03-05 Jumatech Gmbh Leiterplatte mit Formteil und Verfahren zu dessen Herstellung
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
US9536798B2 (en) * 2012-02-22 2017-01-03 Cyntec Co., Ltd. Package structure and the method to fabricate thereof
JP5952039B2 (ja) * 2012-03-15 2016-07-13 住友精密工業株式会社 放電セル及びオゾンガス発生装置
DE102012009651A1 (de) * 2012-05-14 2013-11-14 Robert Bosch Gmbh Anschlusseinrichtung für Antriebseinrichtung
DE202012010075U1 (de) * 2012-10-22 2012-11-13 Truma Gerätetechnik GmbH & Co. KG Zentraleinheit für Rangierantrieb
JP2015049053A (ja) * 2013-08-29 2015-03-16 アルプス・グリーンデバイス株式会社 電流検出装置
CN104953011B (zh) * 2015-06-26 2016-05-11 深圳市峻泽科技有限公司 一种具有金属层的基板及其制造方法
US9994407B2 (en) 2015-11-06 2018-06-12 Nxp B.V. System and method for processing a flexible substrate
US10104784B2 (en) * 2015-11-06 2018-10-16 Nxp B.V. Method for making an electronic product with flexible substrate
US20170223816A1 (en) * 2016-02-01 2017-08-03 Ibiden Co., Ltd. Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board
WO2018114690A1 (en) * 2016-12-19 2018-06-28 Abb Schweiz Ag Reinforced multi-phase busbar for conducting electric energy and method of manufacturing the same
JP2019029535A (ja) * 2017-07-31 2019-02-21 イビデン株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板を備える電子デバイス、及び、フレキシブルプリント配線板を備える電子デバイスの製造方法
GB2566943B (en) * 2017-09-25 2020-09-02 Ge Aviat Systems Ltd Surface mount connector and method of forming a printed circuit board
JP6666320B2 (ja) 2017-11-21 2020-03-13 ファナック株式会社 樹脂成型基板及びコンデンサの実装構造
CN108901134B (zh) * 2018-07-12 2023-07-25 深圳智慧者机器人科技有限公司 铜板组装装置
JP7289706B2 (ja) * 2019-04-08 2023-06-12 矢崎エナジーシステム株式会社 ジョイントボックス
US11374366B2 (en) 2020-06-19 2022-06-28 Lear Corporation System and method for providing an electrical ground connection for a circuit assembly
JP2022026387A (ja) * 2020-07-31 2022-02-10 日本電産エレシス株式会社 モータ制御装置、および電動パワーステアリング装置
US11646514B2 (en) 2020-08-10 2023-05-09 Lear Corporation Surface mount technology terminal header and method for providing an electrical connection to a printed circuit board
US11706867B2 (en) 2021-01-27 2023-07-18 Lear Corporation System and method for providing an electrical ground connection for a circuit assembly
CN113161948B (zh) * 2021-02-09 2022-12-09 国网福建省电力有限公司明溪县供电公司 一种挤压式自密封型接线盒

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045670U (https=) * 1990-04-30 1992-01-20
JPH04345082A (ja) * 1991-05-22 1992-12-01 Mitsubishi Electric Corp 大電流配線基板
JPH05167207A (ja) * 1991-12-13 1993-07-02 Okuma Mach Works Ltd パワー回路配線用プリント基板及びその製造方法
JPH08153425A (ja) * 1994-11-28 1996-06-11 Furukawa Electric Co Ltd:The フラット回路体の製造方法
JPH08223742A (ja) * 1995-02-14 1996-08-30 Sumitomo Wiring Syst Ltd 分岐接続箱
JPH09163516A (ja) * 1995-12-06 1997-06-20 Yazaki Corp 配線板およびその製造方法
JPH10242592A (ja) * 1997-02-26 1998-09-11 Siemens Ag 電気回路のためのプリント基板及びその製法
US6552274B1 (en) 1999-11-15 2003-04-22 Sumitomo Wiring Systems, Ltd. Wire laying plate assembly and a molding process for an insulation plate

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3688248A (en) * 1968-08-13 1972-08-29 Henry John Modrey Roller metal pin for use as electric connector or fastener
FR2217906B3 (https=) * 1973-02-15 1976-02-13 Radiall Fr
JPS5575294A (en) * 1978-12-02 1980-06-06 Sumitomo Electric Industries Method of connecting back and front surfaces of bothhside printed circuit board
US4333233A (en) * 1979-02-19 1982-06-08 Guardall Limited Machines and method applicable to the manufacture of electrical and like devices
US4435741A (en) * 1980-09-03 1984-03-06 Canon Kabushiki Kaisha Electrical circuit elements combination
JPS58106971U (ja) * 1982-01-14 1983-07-21 棚沢　日佐司 プリント配線基板
US4487463A (en) * 1983-02-22 1984-12-11 Gulf & Western Manufacturing Company Multiple contact header assembly
JPS59230741A (ja) * 1983-06-15 1984-12-25 株式会社日立製作所 形状記憶複合材料
JPS618960U (ja) * 1984-06-22 1986-01-20 日本航空電子工業株式会社 圧入用弾性ピン
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
ATE61162T1 (de) * 1985-12-11 1991-03-15 Burndy Electra Nv Kontaktstift.
JPS63127222U (https=) * 1987-02-09 1988-08-19
JPS63229897A (ja) * 1987-03-19 1988-09-26 古河電気工業株式会社 リジツド型多層プリント回路板の製造方法
US4937932A (en) * 1987-04-10 1990-07-03 Ishii Hyoki Co., Ltd. Membrane panel switch
US4769907A (en) * 1987-07-27 1988-09-13 Northern Telecom Limited Method of making a circuit board pin
US4948375A (en) * 1987-08-25 1990-08-14 Howard Lawrence Adaptor assembly for circuit boards
US4867691A (en) * 1987-10-29 1989-09-19 E. I. Du Pont De Nemours And Company Connector having expansible barrel with a layer of reflowable solder material thereon
JP2582142B2 (ja) * 1988-04-27 1997-02-19 日本電信電話株式会社 マトリクススイッチボ−ド及びマトリクススイッチボ−ド用接続ピン及びマトリクスボ−ドの製造方法
US4950170A (en) * 1988-06-23 1990-08-21 Ltv Aerospace & Defense Company Minimal space printed circuit board and electrical connector system
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
JPH02239684A (ja) * 1989-03-14 1990-09-21 Yazaki Corp 樹脂成形体上への回路パターンの形成法
JP2827621B2 (ja) * 1991-10-23 1998-11-25 三菱電機株式会社 大電流基板及びその製造方法
US5373626A (en) * 1993-01-06 1994-12-20 Elco Corporation Removable pin carrier
JP2849888B2 (ja) * 1993-02-02 1999-01-27 矢崎総業株式会社 配線接続箱
JP3163592B2 (ja) * 1993-04-01 2001-05-08 矢崎総業株式会社 複合回路基板
US5456608A (en) * 1993-08-25 1995-10-10 Conx Corporation Cross-connect system
US6031349A (en) * 1993-08-25 2000-02-29 Con-X Corporation Cross-connect method and apparatus
JPH07122825A (ja) * 1993-10-22 1995-05-12 Sharp Corp 立体成形回路基板及びその製造方法
JP3170124B2 (ja) * 1993-12-07 2001-05-28 矢崎総業株式会社 回路体の多層接続構造、及び回路体の多層接続方法
EP0804381A1 (en) * 1993-12-08 1997-11-05 Massachusetts Institute Of Technology Casting tooling
US5836582A (en) * 1994-04-04 1998-11-17 Canon Kabushiki Kaisha Sheet feeding device with air injectors for separating sheets
EP0708046A1 (de) * 1994-10-21 1996-04-24 Maschinenfabrik Gietz Ag Registereinzugsvorrichtung
US5788513A (en) * 1995-01-11 1998-08-04 Enplas Corporation IC socket
JPH08222825A (ja) * 1995-02-13 1996-08-30 Nec Corp プリント基板の接続構造
JPH08322127A (ja) * 1995-05-23 1996-12-03 Sumitomo Wiring Syst Ltd 電気接続箱に収容するバスバーと絶縁板の積層構造
JPH09153516A (ja) 1995-11-30 1997-06-10 Sumitomo Bakelite Co Ltd 半導体装置及びｉｃチップの検査方法
US5914534A (en) * 1996-05-03 1999-06-22 Ford Motor Company Three-dimensional multi-layer molded electronic device and method for manufacturing same
JPH10243526A (ja) 1997-02-21 1998-09-11 Ryosei Denso Kk ジョイントボックス
DE19709551A1 (de) * 1997-03-07 1998-09-10 Wuerth Elektronik Gmbh & Co Kg Leiterplatte und Verfahren zum Verbinden einer Leiterplatte
JP3201516B2 (ja) * 1997-07-18 2001-08-20 ユーエイチティー株式会社 穿孔装置
JP2001127242A (ja) * 1999-10-22 2001-05-11 Seiko Epson Corp 半導体チップ、マルチチップパッケージ、半導体装置、並びに電子機器、およびそれらの製造方法
US6483041B1 (en) * 1999-11-12 2002-11-19 Emc Corporation Micro soldered connection
FR2806249B1 (fr) * 2000-03-13 2002-05-10 Axo Scintex Cie Equip Automobi Montage des circuits decoupes sur des supports de lampes
JP2001264276A (ja) * 2000-03-21 2001-09-26 Polyplastics Co 金属箔転写により形成された回路を有するセンサー
JP2001307795A (ja) * 2000-04-18 2001-11-02 Yazaki Corp 配線ユニット及び電気接続箱
JP2001343906A (ja) * 2000-05-31 2001-12-14 Internatl Business Mach Corp <Ibm> 表示装置、液晶表示装置、液晶表示装置の製造方法および接続方法
JP2001359222A (ja) * 2000-06-13 2001-12-26 Yazaki Corp 電気接続箱
JP2002034126A (ja) 2000-07-19 2002-01-31 Yazaki Corp 配線ユニット
JP2002374049A (ja) * 2001-06-13 2002-12-26 Densei Lambda Kk 電源装置の実装構造
JP2003017163A (ja) * 2001-06-27 2003-01-17 Gunma Denki Kk サブ基板搭載用多ピンコネクタ及びプリント基板の部品実装方法
JP3884931B2 (ja) * 2001-08-31 2007-02-21 アルプス電気株式会社 電子機器のｆｐｃ接続構造
JP2003142178A (ja) * 2001-11-07 2003-05-16 Matsushita Electric Ind Co Ltd プリント配線板
JP2003249755A (ja) * 2002-02-22 2003-09-05 Kyocera Corp セラミック多層配線基板の製造方法、並びにセラミック多層配線基板
JP2004030936A (ja) * 2002-06-21 2004-01-29 Mitsubishi Cable Ind Ltd フラット配線体の製法及び導体箔打ち抜き装置
JP3976627B2 (ja) * 2002-06-25 2007-09-19 矢崎総業株式会社 電気接続箱の製造方法
JP4141213B2 (ja) * 2002-09-17 2008-08-27 アルプス電気株式会社 電気部品およびその実装構造
DE102004007180B4 (de) * 2003-02-14 2015-10-22 Autonetworks Technologies, Ltd. Verteilereinheit und elektrisches Verbindungsgehäuse hiermit
KR101208823B1 (ko) * 2004-03-31 2012-12-06 미츠비시 덴센 고교 가부시키가이샤 회로기판 및 이 회로기판을 이용한 조인트 박스

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045670U (https=) * 1990-04-30 1992-01-20
JPH04345082A (ja) * 1991-05-22 1992-12-01 Mitsubishi Electric Corp 大電流配線基板
JPH05167207A (ja) * 1991-12-13 1993-07-02 Okuma Mach Works Ltd パワー回路配線用プリント基板及びその製造方法
JPH08153425A (ja) * 1994-11-28 1996-06-11 Furukawa Electric Co Ltd:The フラット回路体の製造方法
JPH08223742A (ja) * 1995-02-14 1996-08-30 Sumitomo Wiring Syst Ltd 分岐接続箱
JPH09163516A (ja) * 1995-12-06 1997-06-20 Yazaki Corp 配線板およびその製造方法
JPH10242592A (ja) * 1997-02-26 1998-09-11 Siemens Ag 電気回路のためのプリント基板及びその製法
US6049043A (en) 1997-02-26 2000-04-11 Siemens Aktiengesellschaft Printed circuit board
US6552274B1 (en) 1999-11-15 2003-04-22 Sumitomo Wiring Systems, Ltd. Wire laying plate assembly and a molding process for an insulation plate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1737282A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010666A1 (ja) * 2008-07-23 2010-01-28 三菱電線工業株式会社 回路構造体、ジョイントボックス、及び、回路構造体の製造方法
JP2010027957A (ja) * 2008-07-23 2010-02-04 Mitsubishi Cable Ind Ltd 回路構造体、ジョイントボックス、及び、回路構造体の製造方法
JP2019133975A (ja) * 2018-01-29 2019-08-08 矢崎総業株式会社 配索構造および配索方法
JP7094619B2 (ja) 2018-01-29 2022-07-04 矢崎総業株式会社 配索構造および配索方法

Also Published As

Publication number Publication date
CN1939101A (zh) 2007-03-28
JPWO2005096683A1 (ja) 2008-02-21
JP2009164632A (ja) 2009-07-23
EP1737282A4 (en) 2010-05-05
JP2008160156A (ja) 2008-07-10
JP4823262B2 (ja) 2011-11-24
KR101208823B1 (ko) 2012-12-06
JP4719759B2 (ja) 2011-07-06
JP4938046B2 (ja) 2012-05-23
CN101568227B (zh) 2011-09-28
JP2008220165A (ja) 2008-09-18
CN100594757C (zh) 2010-03-17
US20070218257A1 (en) 2007-09-20
EP1737282A1 (en) 2006-12-27
US20110120756A1 (en) 2011-05-26
KR101183336B1 (ko) 2012-09-14
KR101208751B1 (ko) 2012-12-05
US8362366B2 (en) 2013-01-29
KR20120003481A (ko) 2012-01-10
KR20110129490A (ko) 2011-12-01
KR20070034460A (ko) 2007-03-28
US20110116248A1 (en) 2011-05-19
US7943859B2 (en) 2011-05-17
CN101568227A (zh) 2009-10-28

Similar Documents

Publication Publication Date Title
WO2005096683A1 (ja) 回路基板及びその製造方法及び回路基板を用いたジョイントボックス
US5434749A (en) Hybrid printed circuit board
US6137054A (en) Wire-circuit sheet and electric junction box thereof
CN107371340B (zh) 一种刚挠结合板
US12336091B2 (en) Method for manufacturing flexible printed circuit board
JPH0634446B2 (ja) 回路基板のはんだ付方法
JP4939634B2 (ja) 回路基板用接続端子
JP4578843B2 (ja) 回路基板用接続端子
US6725537B2 (en) Method of connecting circuit element
JP3124813U (ja) フレキシブルフラットケーブル
JP5581882B2 (ja) フラットケーブルとその製造方法
JP2008517449A (ja) 電気又は電子機械装置のマイクロパッケージ法及びマイクロパッケージ
JP3303801B2 (ja) 回路板、該回路板を備えた電気接続箱および回路板の製造方法
JPH07235756A (ja) 回路基板及びその製造方法
JP2004032877A (ja) フラット回路体相互の接続方法と電気接続箱の製造方法及び電気接続箱
JP2810877B2 (ja) 回路基板
JP2019003775A (ja) フレキシブルフラットケーブルおよびその製造方法
JPH09199811A (ja) フレキシブルプリント基板およびその製造方法
JPH05327140A (ja) プリント板構造

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1020067019950

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2005727833

Country of ref document: EP

Ref document number: 2006511657

Country of ref document: JP

Ref document number: 200580009958.6

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

WWP Wipo information: published in national office

Ref document number: 2005727833

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007218257

Country of ref document: US

Ref document number: 10593796

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1020067019950

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 10593796

Country of ref document: US