WO2005085877A1 - プローブ及びプローブの製造方法 - Google Patents
プローブ及びプローブの製造方法 Download PDFInfo
- Publication number
- WO2005085877A1 WO2005085877A1 PCT/JP2005/003609 JP2005003609W WO2005085877A1 WO 2005085877 A1 WO2005085877 A1 WO 2005085877A1 JP 2005003609 W JP2005003609 W JP 2005003609W WO 2005085877 A1 WO2005085877 A1 WO 2005085877A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- contact
- contact portion
- electrode pad
- tip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5193—Electrical connector or terminal
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05719913A EP1724594A1 (en) | 2004-03-05 | 2005-03-03 | Probe and probe manufacturing method |
US10/591,645 US7649369B2 (en) | 2004-03-05 | 2005-03-03 | Probe and method of manufacturing probe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-063228 | 2004-03-05 | ||
JP2004063228A JP4723195B2 (ja) | 2004-03-05 | 2004-03-05 | プローブの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005085877A1 true WO2005085877A1 (ja) | 2005-09-15 |
Family
ID=34918148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/003609 WO2005085877A1 (ja) | 2004-03-05 | 2005-03-03 | プローブ及びプローブの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7649369B2 (ja) |
EP (1) | EP1724594A1 (ja) |
JP (1) | JP4723195B2 (ja) |
KR (1) | KR100835245B1 (ja) |
CN (1) | CN100442058C (ja) |
TW (1) | TW200540425A (ja) |
WO (1) | WO2005085877A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7511524B1 (en) | 2007-12-28 | 2009-03-31 | Phicom Corporation | Contact tip structure of a connecting element |
US7586321B2 (en) * | 2006-09-26 | 2009-09-08 | Kabushiki Kaisha Nihon Micronics | Electrical test probe and electrical test probe assembly |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4676224B2 (ja) * | 2005-03-23 | 2011-04-27 | 東京特殊電線株式会社 | プローブ針及びその製造方法 |
JP4855757B2 (ja) * | 2005-10-19 | 2012-01-18 | 富士通株式会社 | カーボンナノチューブパッド及び電子デバイス |
JP2008039639A (ja) * | 2006-08-08 | 2008-02-21 | Hioki Ee Corp | 接触式計測用プローブ |
US7731503B2 (en) * | 2006-08-21 | 2010-06-08 | Formfactor, Inc. | Carbon nanotube contact structures |
KR100804738B1 (ko) * | 2007-01-16 | 2008-02-19 | 삼성전자주식회사 | 이온화 충돌 반도체 소자를 이용한 반도체 탐침 및 이를구비한 정보 저장 장치와 그의 제조 방법 |
JP2008235555A (ja) * | 2007-03-20 | 2008-10-02 | Shinko Electric Ind Co Ltd | 電子装置の製造方法及び基板及び半導体装置 |
KR100799166B1 (ko) * | 2007-07-02 | 2008-01-29 | 이재하 | 프로브 배열체의 제조방법 |
CN101526555B (zh) * | 2008-03-04 | 2011-12-07 | 跃沄科技有限公司 | 一种制探针的方法 |
CN102099692A (zh) * | 2008-07-18 | 2011-06-15 | 东京毅力科创株式会社 | 探针 |
JP5325085B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本碍子株式会社 | 接続装置 |
KR101047550B1 (ko) | 2010-07-02 | 2011-07-07 | 주식회사 아이에스시테크놀러지 | 탐침부를 가지는 도전성 접속부재 및 그 도전성 접속부재를 제조하는 방법 |
TWI421504B (zh) | 2010-07-02 | 2014-01-01 | Isc Co Ltd | 測試用的測試探針以及其製造方法 |
CN102610941A (zh) * | 2011-01-19 | 2012-07-25 | 富士康(昆山)电脑接插件有限公司 | 测试连接器 |
JP5688064B2 (ja) * | 2012-11-02 | 2015-03-25 | 本田技研工業株式会社 | 半導体素子検査装置及び検査方法 |
CN103091617B (zh) * | 2013-01-29 | 2017-08-15 | 无锡华润上华科技有限公司 | 一种半导体测试方法 |
JP5936579B2 (ja) * | 2013-05-08 | 2016-06-22 | 本田技研工業株式会社 | 電流印加装置 |
EP2894483B1 (en) | 2014-01-09 | 2018-06-27 | Multitest elektronische Systeme GmbH | Contact tip and contact element and method of producing the same |
US10732201B2 (en) * | 2014-04-13 | 2020-08-04 | Infineon Technologies Ag | Test probe and method of manufacturing a test probe |
TWI564569B (zh) * | 2015-09-21 | 2017-01-01 | 旺矽科技股份有限公司 | 探針結構及其製造方法 |
CN106443188B (zh) * | 2016-11-09 | 2020-08-25 | 武汉新芯集成电路制造有限公司 | 一种电阻量测探头 |
KR101962702B1 (ko) * | 2017-06-28 | 2019-03-27 | 주식회사 아이에스시 | 포고핀용 탐침부재, 이의 제조 방법 및 이를 포함하는 포고핀 |
KR101976702B1 (ko) * | 2017-08-31 | 2019-05-09 | 주식회사 아이에스시 | 탄소나노튜브가 포함된 검사용 소켓 |
CN108279368A (zh) * | 2018-01-23 | 2018-07-13 | 德淮半导体有限公司 | 测试机台及测试方法 |
JP2022013347A (ja) * | 2020-07-03 | 2022-01-18 | 富士電機株式会社 | 半導体チップの試験装置および試験方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10115637A (ja) * | 1996-10-14 | 1998-05-06 | Yamaichi Electron Co Ltd | 電子部品接触用フレキシブル配線板 |
JPH10221370A (ja) * | 1997-01-31 | 1998-08-21 | Mitsubishi Materials Corp | コンタクトプローブおよびその製造方法、並びにコンタクトプローブを備えたプローブ装置 |
JP2004056078A (ja) * | 2002-05-27 | 2004-02-19 | Yamaichi Electronics Co Ltd | 電極の回復処理方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0355273B1 (en) * | 1988-05-18 | 1994-08-03 | Canon Kabushiki Kaisha | Probe card, method for measuring part to be measured by use thereof and electrical circuit member |
US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
US5419807A (en) * | 1993-09-03 | 1995-05-30 | Micron Technology, Inc. | Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability |
JP3460094B2 (ja) * | 1994-02-21 | 2003-10-27 | 株式会社呉英製作所 | Icパッケージ検査用ソケットの電極部形成方法 |
JPH0968546A (ja) * | 1995-08-31 | 1997-03-11 | Nitto Denko Corp | テストヘッド構造およびその製造方法 |
JPH09196969A (ja) * | 1996-01-23 | 1997-07-31 | Nitto Denko Corp | プローブ構造 |
JP2796070B2 (ja) | 1995-04-28 | 1998-09-10 | 松下電器産業株式会社 | プローブカードの製造方法 |
US5763879A (en) * | 1996-09-16 | 1998-06-09 | Pacific Western Systems | Diamond probe tip |
JPH10132854A (ja) | 1996-10-29 | 1998-05-22 | Matsushita Electron Corp | コンタクタ及びコンタクタの形成方法 |
US5894161A (en) * | 1997-02-24 | 1999-04-13 | Micron Technology, Inc. | Interconnect with pressure sensing mechanism for testing semiconductor wafers |
JPH1123615A (ja) * | 1997-05-09 | 1999-01-29 | Hitachi Ltd | 接続装置および検査システム |
DE69832010T2 (de) * | 1997-07-24 | 2006-07-13 | Mitsubishi Denki K.K. | Prüfspitze für Halbleiterschaltungen und Verfahren zu ihrer Herstellung |
JPH1151970A (ja) | 1997-07-31 | 1999-02-26 | Nec Corp | プローブカード |
JPH1197494A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
WO1999015908A1 (en) * | 1997-09-19 | 1999-04-01 | Hitachi, Ltd. | Method for manufacturing semiconductor integrated circuit device |
US6285201B1 (en) * | 1997-10-06 | 2001-09-04 | Micron Technology, Inc. | Method and apparatus for capacitively testing a semiconductor die |
US6246245B1 (en) * | 1998-02-23 | 2001-06-12 | Micron Technology, Inc. | Probe card, test method and test system for semiconductor wafers |
JP4084498B2 (ja) * | 1998-10-27 | 2008-04-30 | 松下電器産業株式会社 | 検査用基板 |
JP4361161B2 (ja) * | 1999-04-06 | 2009-11-11 | 日東電工株式会社 | 異方導電性コネクター |
US6352454B1 (en) * | 1999-10-20 | 2002-03-05 | Xerox Corporation | Wear-resistant spring contacts |
JP2002131334A (ja) * | 2000-10-24 | 2002-05-09 | Nec Yamaguchi Ltd | プローブ針、プローブカード、及びプローブカードの作製方法 |
US7015707B2 (en) * | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
US7112974B1 (en) * | 2002-05-23 | 2006-09-26 | Cypress Semiconductor Corporation | Proble for testing integrated circuits |
KR100373762B1 (en) * | 2002-09-25 | 2003-02-26 | Uk Ki Lee | Method for manufacturing cavity-type micro-probe using mems technology and micro-probe according to the same |
-
2004
- 2004-03-05 JP JP2004063228A patent/JP4723195B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-03 KR KR1020067017410A patent/KR100835245B1/ko not_active IP Right Cessation
- 2005-03-03 US US10/591,645 patent/US7649369B2/en not_active Expired - Fee Related
- 2005-03-03 EP EP05719913A patent/EP1724594A1/en not_active Withdrawn
- 2005-03-03 CN CNB2005800071701A patent/CN100442058C/zh not_active Expired - Fee Related
- 2005-03-03 WO PCT/JP2005/003609 patent/WO2005085877A1/ja not_active Application Discontinuation
- 2005-03-04 TW TW094106626A patent/TW200540425A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10115637A (ja) * | 1996-10-14 | 1998-05-06 | Yamaichi Electron Co Ltd | 電子部品接触用フレキシブル配線板 |
JPH10221370A (ja) * | 1997-01-31 | 1998-08-21 | Mitsubishi Materials Corp | コンタクトプローブおよびその製造方法、並びにコンタクトプローブを備えたプローブ装置 |
JP2004056078A (ja) * | 2002-05-27 | 2004-02-19 | Yamaichi Electronics Co Ltd | 電極の回復処理方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7586321B2 (en) * | 2006-09-26 | 2009-09-08 | Kabushiki Kaisha Nihon Micronics | Electrical test probe and electrical test probe assembly |
US7511524B1 (en) | 2007-12-28 | 2009-03-31 | Phicom Corporation | Contact tip structure of a connecting element |
Also Published As
Publication number | Publication date |
---|---|
CN100442058C (zh) | 2008-12-10 |
US7649369B2 (en) | 2010-01-19 |
KR20070005605A (ko) | 2007-01-10 |
TWI379080B (ja) | 2012-12-11 |
TW200540425A (en) | 2005-12-16 |
CN1930482A (zh) | 2007-03-14 |
KR100835245B1 (ko) | 2008-06-05 |
JP2005249693A (ja) | 2005-09-15 |
EP1724594A1 (en) | 2006-11-22 |
JP4723195B2 (ja) | 2011-07-13 |
US20080036479A1 (en) | 2008-02-14 |
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