WO2005006430A1 - 電気部品の実装方法及び実装装置 - Google Patents

電気部品の実装方法及び実装装置 Download PDF

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Publication number
WO2005006430A1
WO2005006430A1 PCT/JP2004/009726 JP2004009726W WO2005006430A1 WO 2005006430 A1 WO2005006430 A1 WO 2005006430A1 JP 2004009726 W JP2004009726 W JP 2004009726W WO 2005006430 A1 WO2005006430 A1 WO 2005006430A1
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WO
WIPO (PCT)
Prior art keywords
electric component
mounting
wiring board
thermocompression bonding
chip
Prior art date
Application number
PCT/JP2004/009726
Other languages
English (en)
French (fr)
Inventor
Takashi Matsumura
Hisashi Ando
Shiyuki Kanisawa
Yasuhiro Suga
Noriaki Kudo
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Priority to EP04747194.1A priority Critical patent/EP1646081B1/en
Priority to KR1020067000575A priority patent/KR101105948B1/ko
Publication of WO2005006430A1 publication Critical patent/WO2005006430A1/ja
Priority to US11/327,784 priority patent/US7556190B2/en
Priority to US12/466,977 priority patent/US7703657B2/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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Definitions

  • the present invention relates to a technology for mounting an electric component such as a semiconductor chip on a wiring board, and particularly to a technology for mounting an electric component using an adhesive.
  • the IC chip is mounted on a substrate to which the anisotropic conductive adhesive film is attached, and then the IC chip is pressed with a flat crimping head made of ceramic or metal. Press and heat to cure the anisotropic conductive adhesive film and perform thermocompression mounting.
  • thermocompression bonding of an IC chip using a thermocompression bonding head made of an elastic body such as silicone rubber.
  • Patent Document 1 JP-A-2000-79611
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2002-359264
  • the present invention has been made in order to solve the problems of the related art, and has been developed by using an adhesive. It is an object of the present invention to provide a mounting method and a mounting apparatus capable of mounting a highly reliable electric component using the same.
  • the present invention made in order to achieve the above object is a method for mounting an electric component having a step of thermocompression bonding an electric component on a wiring board using an adhesive, The top region is pressed against the wiring board with a predetermined pressure, while the side region of the electric component is pressed with a pressure smaller than the pressure against the top region.
  • the “side region” of the “electric component” refers to a side portion of the electric component itself such as an IC chip and a portion of an adhesive around the electric component, for example.
  • thermocompression bonding at the time of the thermocompression bonding, it is effective to heat the electric component side at a predetermined temperature and to heat the wiring board side at a temperature higher than the predetermined temperature. Further, in the present invention, it is also effective to press a crimp portion made of a predetermined elastomer against the top and side portions of the electric component.
  • thermocompression bonding head it is also effective to use an elastomer having a rubber hardness of 40 or more and 80 or less as the pressure bonding portion of the thermocompression bonding head.
  • the adhesive may be heated so that the melt viscosity is not less than 1.0 X 10 2 mPa's and not more than 1.0 X 10 5 mPa's. It is effective. Furthermore, in the present invention, it is also effective to use, as the adhesive, an anisotropic conductive adhesive film in which conductive particles are dispersed in a binder resin.
  • the present invention includes a thermocompression bonding head having a crimping portion made of an elastomer having a rubber hardness of 40 or more and 80 or less, and presses the crimping portion at a predetermined pressure with respect to an electric component arranged on a wiring board.
  • This is a mounting device that is configured to be pressed by a.
  • the thickness of the crimping portion of the thermocompression bonding head is equal to or greater than the thickness of the electric component.
  • the size of the crimping portion of the thermocompression bonding head is determined by the size of the electric component. Larger than the area is also effective.
  • the size of the crimping portion of the thermocompression bonding head is larger than the area of a region where a plurality of electric components are arranged.
  • the top region of the electric component is pressed against the wiring board with a predetermined pressure, while the side region of the electric component is pressed with a pressure smaller than the pressure against the top region.
  • sufficient pressure can be applied to the connection between the electric component and the wiring board, but also no void is generated in the fillet around the electric component.
  • Pressure can be applied, and thereby, a highly reliable connection of an IC chip or the like can be performed using, for example, an anisotropic conductive adhesive film.
  • the electric component side is heated at a predetermined temperature, and the wiring board side is heated at a temperature higher than the predetermined temperature by, for example, a heater provided on a support base.
  • the fillet around the electric component can be sufficiently heated, so that the generation of voids can be further prevented.
  • the predetermined pressure can be easily applied to the top region and the side region of the electric component. Pressure can be applied with a difference.
  • the crimping portion by using an elastomer having a rubber hardness of 40 or more and 80 or less as the crimping portion, it is possible to press the top region and the side region of the electric component with an optimum pressure, At the time of press bonding, the adhesive is heated so that the melt viscosity is not less than 1.0 X 10 2 mPa's and not more than 1.OX IO mPa's. It is possible to more reliably eliminate the occurrence of voids and prevent the occurrence of voids, and it is possible to make connections with even higher reliability.
  • thermocompression bonding head having a compression bonding portion made of an elastomer having a rubber hardness of 40 or more and 80 or less is provided, and the compression bonding portion is formed on the electric component arranged on the wiring board.
  • the thickness of the crimping portion of the thermocompression bonding head is equal to or greater than the thickness of the electric component, or when the size of the crimping portion of the thermocompression bonding head is larger than the electric component Therefore, it is possible to more reliably press the top region and the side region of the electric component with the optimum pressure.
  • the size of the crimping portion of the thermocompression bonding head is larger than the area of the region where the plurality of electric components are arranged, the plurality of electric components can be simultaneously connected with high reliability. This can greatly improve the mounting efficiency.
  • a highly reliable electric component can be mounted using an adhesive.
  • FIG. 1 is a schematic configuration diagram illustrating a main part and a thermocompression bonding step of an embodiment of a mounting apparatus according to the present invention.
  • FIG. 2 is a schematic configuration diagram showing a main part and a thermocompression bonding step of an embodiment of the mounting apparatus according to the present invention.
  • FIG. 3 is a schematic configuration diagram showing another embodiment of the present invention.
  • FIG. 1 and FIG. 2 are schematic configuration diagrams showing a main part of the mounting apparatus of the present embodiment and a thermocompression bonding step.
  • the mounting apparatus 1 of the present embodiment includes a base 2 on which a wiring board 10 on which a wiring pattern 10a is formed, and an IC chip (electric component) 20 provided with bumps 20a.
  • a thermocompression head 4 for pressurizing and heating is provided.
  • the base 2 is made of a predetermined metal, and a heater 3 for heating is provided inside the base.
  • thermocompression bonding head 4 has a head main body 5 made of a predetermined metal, and a heating heater (not shown) is provided inside the head main body 5.
  • a recess 5 a is formed in a portion of the head body 5 facing the base 2, and a crimp portion 6 made of a plate-like elastomer is attached to the recess 5 a so as to be in close contact with the recess 5 a. Have been.
  • the crimping portion 6 of the present embodiment is arranged such that the crimping surface 6a is horizontal.
  • the crimping surface 6a of the crimping portion 6 is configured to be larger than the area of the top 20b of the IC chip 20.
  • the thickness of the crimping portion 6 is set to be equal to or greater than the thickness of the IC chip 20.
  • the type of the elastomer of the crimping portion 6 is not particularly limited. From the viewpoint of improving the force connection reliability, it is preferable to use a rubber having a rubber hardness of 40 or more and 80 or less. preferable.
  • An elastomer having a rubber hardness of less than 40 has a disadvantage that the pressure on the IC chip 20 is insufficient and the initial resistance and the connection reliability are inferior. Is insufficient, and voids are generated in the binder resin of the adhesive, resulting in poor connection reliability.
  • any of natural rubber and synthetic rubber can be used. From the viewpoint of force, heat resistance and pressure resistance, it is preferable to use silicone rubber.
  • the wiring board 10 is disposed on the base 2 and the wiring board 10 is mounted on the wiring board 10.
  • the conductive adhesive film 7 is placed.
  • the anisotropic conductive adhesive film 7 is one in which conductive particles 7b are dispersed in a binder resin 7a.
  • the melt viscosity of the adhesive handled in the present invention is not affected by the presence or absence of the dispersion of the conductive particles 7b. Absent.
  • the IC chip 20 is placed on such an anisotropic conductive adhesive film 7, and the crimping surface 6a of the thermocompression bonding head 4 is pressed against the top 20b of the IC chip 20 via a protective film (not shown). Then, temporary compression is performed under predetermined conditions, and final compression is performed under the following conditions.
  • the IC chip 20 side is heated at a predetermined temperature, and the wiring board 10 side is heated at a temperature higher than the above-mentioned predetermined temperature.
  • the heater of the thermocompression head 4 is controlled so that the temperature of the crimping section 6 is about 100 ° C., and the temperature of the binder resin 7a of the anisotropic conductive adhesive film 7 is 200 ° C. Control the heater 3 of the base 2 so that it is about C.
  • the adhesive anisotropic conductive adhesive film 7 has a melt viscosity of 1.
  • the pressure at the time of the final pressure bonding is about 100N per IC chip and about 15 seconds.
  • an elastomer having a rubber hardness of 40 or more and 80 or less is used.
  • the top 20b of the IC chip 20 is pressed against the wiring board 10 at a predetermined pressure by applying pressure by the crimping section 6 also serving as a marker, while the side fillet 7c of the IC chip 20 is pressed against the top 20b. Pressing can be performed with a pressure smaller than the pressure, and thereby sufficient pressure can be applied to the connection portion between the IC chip 20 and the wiring board 10, while the fillet portion 7 c around the IC chip 20 can be pressed. On the other hand, pressure can be applied so as not to cause voids.
  • the IC chip 20 is heated at a predetermined temperature and the wiring board 10 is heated at a temperature higher than the predetermined temperature.
  • the fillet portion 7c around the IC chip 20 can be sufficiently heated, and the generation of voids can be reliably prevented.
  • the adhesive anisotropic conductive adhesive film 7 is heated so that the melt viscosity becomes 1.0 X 10 2 mPa's or more and 1.0 X 10 5 mPa's or less.
  • the melt viscosity becomes 1.0 X 10 2 mPa's or more and 1.0 X 10 5 mPa's or less.
  • the mounting apparatus 1 of the present embodiment it is possible to obtain a mounting apparatus having a simple configuration capable of highly reliable connection.
  • the thickness of the crimping portion 6 is equal to or greater than the thickness of the IC chip 20, it is ensured that the top portion 20b of the IC chip 20 and the side fillet portion 7c It can be pressurized with the optimal pressure.
  • FIG. 3 is a schematic configuration diagram showing another embodiment of the present invention.
  • portions corresponding to the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
  • the area of the plurality of (for example, two) IC chips 20 and 21 having different thicknesses, for example, is arranged.
  • This embodiment is different from the above embodiment in that it is configured to be larger than the area of.
  • the rubber hardness of the crimping portion 6 itself is 40 or more and 80 or less, which is the same as in the above embodiment.
  • a plurality of IC chips 20 and 21 having particularly different thicknesses can be simultaneously connected with high reliability, thereby greatly improving the mounting efficiency. Can be done.
  • the other configuration and operation and effect are the same as those of the above-described embodiment, and a detailed description thereof will be omitted.
  • the present invention can be applied to an IC chip having no bump electrodes as described by taking an example of mounting an IC chip having bump electrodes.
  • a copper (Cu) pattern with a width of 75 zm and a pitch of 150 zm is formed on a glass epoxy board, and a rigid board with nickel plating is used on it.
  • a chip having a size of 6 ⁇ 6 mm and a thickness of 0.4 mm on which bump electrodes of 150 ⁇ m pitch were formed was prepared.
  • thermocompression bonding head equipped with a press-fitted portion made of silicone rubber having a size of 60 X 60mm, a thickness of 10mm, and a rubber hardness of 40 was used, and as an anisotropic conductive adhesive film, the melt viscosity was 1.OX10.
  • a binder resin of 5 mPa's in which conductive particles were dispersed an IC chip was thermocompression-bonded on a wiring board.
  • the temperature of the base was controlled so that the temperature of the crimping portion was 100 ° C and the temperature of the anisotropic conductive adhesive film was 200 ° C, and the pressure was 100 N / lC (278 N / cm 2 ). For 15 seconds.
  • Example 2 Same conditions as in Example 1 except that a crimped part made of silicone rubber with a rubber hardness of 80 was used. Thermocompression bonding was performed.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that a compression bonding portion made of silicone rubber having a rubber hardness of 10 or less was used.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that a compression bonding portion made of silicone rubber having a rubber hardness of 120 was used.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that an anisotropic conductive adhesive film in which conductive particles were dispersed in a binder resin having a melt viscosity of 1.0 X 1 O mPa ⁇ s was used.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that an anisotropic conductive adhesive finolem in which conductive particles were dispersed in a binder resin having a melt viscosity of 5 mPa's was used.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that an anisotropic conductive adhesive film in which conductive particles were dispersed in a binder resin having a melt viscosity of 1.0 ⁇ 10 9 mPa ′s was used.
  • Thermocompression bonding was performed under the same conditions as in Example 1 except that a compression portion made of silicone rubber (0.2 mm) thinner than the IC chip was used.
  • the resistance value between the patterns was measured by a four-terminal method, and those having a value of less than 1 ⁇ were designated as ⁇ , and those having a value of 1 ⁇ or more were designated as X.
  • connection reliability is as follows: After aging for 24 hours under the conditions of a temperature of 85 ° C and a relative humidity of 85%, the reflow treatment of the specified profile (heated up to 114 ° C ZS ⁇ 150; C ⁇ 10 ° C, 30s ⁇ 10s extra heat area ⁇ 1-4. Temperature rise at C / S ⁇ Peak temperature 235. C ⁇ 5. C, 10s ⁇ Is soldering area ⁇ cooled at 1-4 ° C / S) Those with a resistance force of less than 1 ⁇ were marked with ⁇ and those with a resistance force of 1 ⁇ or more were marked with X.
  • Comparative Example 1 in which the rubber hardness of the crimped portion was less than 40, the pressure on the IC chip was insufficient and the initial resistance and connection reliability were poor, and in Comparative Example 2 in which the rubber hardness was greater than 80, Insufficient pressure caused voids in the binder resin of the adhesive, resulting in poor connection reliability.
  • Example 3 in which the melt viscosity of the binder resin of the anisotropic conductive adhesive film was 1.0 ⁇ 10 2 mPa ′s and Example 1 in which the melt viscosity was 1.OX 10 5 mPa * s, Both initial conduction resistance and connection reliability were good, and no voids were generated.
  • Comparative Example 3 using a binder resin having a melt viscosity of less than 1.OX 10 2 mPa's, voids in which the fluidity of the binder resin was large during thermocompression bonding were generated, and the initial resistance and poor connection reliability
  • Comparative example 4 in which the melt viscosity with 1. 0 X 10 5 mPa 'S greater than the binder resin, the binder resin is not completely eliminated in the connecting portion at the time of thermocompression bonding, voids are generated The initial resistance and connection reliability were poor.
  • Comparative Example 5 in which a pressure-bonded portion having a thickness smaller than that of the IC chip was used, no pressure was applied to the fillet portion, voids were generated, and initial resistance and connection reliability were poor.
  • the present invention can be used, for example, when manufacturing a small electronic device, for manufacturing a circuit board by mounting electric and electronic components such as a semiconductor chip on a printed wiring board.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

　接着剤を用いて高信頼性の電気部品の実装が可能な実装方法及び実装装置を提供する。 　本発明は、異方導電性接着フィルム７を用いてＩＣチップ２０を配線基板１０上に熱圧着する工程を有する実装方法であって、当該熱圧着の際、ＩＣチップ２０の頂部領域を配線基板１０に対して所定の圧力で押圧する一方、ＩＣチップ２０の側部領域をＩＣチップ２０の頂部領域に対する圧力より小さい圧力で押圧する。熱圧着ヘッド４の圧着部６として、ゴム硬度が４０以上８０以下ののエラストマーを用いる。異方導電性接着フィルム７としては、溶融粘度が１．０×１０2ｍＰａ・ｓ以上１．０×１０5ｍＰａ・ｓ以下の結着樹脂７ｂを含有するものを用いる。

Description

明 細 書
電気部品の実装方法及び実装装置
技術分野
[0001] 本発明は、例えば半導体チップ等の電気部品を配線基板上に実装する技術に関 し、特に接着剤を用いて電気部品を実装する技術に関する。
背景技術
[0002] 従来、プリント配線板等の配線基板上にベアチップを直接実装する方法として、バ インダ中に導電粒子を分散させた異方導電性接着フィルムを用いる方法が知られて いる。
[0003] 異方導電性接着フィルムを用いた実装方法では、異方導電性接着フィルムを貼り 付けた基板上に ICチップを搭載した後に、セラミックや金属製等の平坦な圧着ヘッド で ICチップを加圧 ·加熱して異方導電性接着フィルムを硬化させて熱圧着実装を行
5。
[0004] このような金属等の圧着ヘッドを用いて加圧'加熱を行う方法の場合、熱圧着の際 に ICチップの周囲の接着剤のフィレット部に対して加熱が不足し、接続信頼性の低 下の原因になっており、また複数の ICチップの実装が困難であるという問題もある。
[0005] そこで、近年、これらの問題を解決するため、シリコーンゴム等の弾性体からなる熱 圧着ヘッドを用いて ICチップの熱圧着を行う技術が提案されている。
特許文献 1 :特開 2000 - 79611号公報
特許文献 2：特開 2002 - 359264号公報
発明の開示
発明が解決しょうとする課題
[0006] し力、しながら、このような従来技術にぉレ、ては、 ICチップと基板の接続部分であるバ ンプとパターン間の加圧力が不足するため十分な接続が行うことができず、初期導通 抵抗及びエージング後の接続信頼性を十分に確保することができないという問題が ある。
[0007] 本発明は、このような従来の技術の課題を解決するためになされたもので、接着剤 を用いて高信頼性の電気部品の実装が可能な実装方法及び実装装置を提供するこ とを目的とする。
課題を解決するための手段
上記目的を達成するためになされた本発明は、接着剤を用いて電気部品を配線基 板上に熱圧着する工程を有する電気部品の実装方法であって、当該熱圧着の際、 前記電気部品の頂部領域を前記配線基板に対して所定の圧力で押圧する一方、前 記電気部品の側部領域を前記頂部領域に対する圧力より小さい圧力で押圧するも のである。
なお、本発明において「電気部品」の「側部領域」とは、 ICチップ等の電気部品自 体の側部及び電気部品の周囲の例えば接着剤の部分をいうものとする。
本発明においては、当該熱圧着の際、前記電気部品側を所定温度で加熱するとと もに、前記配線基板側を前記所定温度より高レ、温度で加熱することも効果的である。 また、本発明においては、所定のエラストマ一からなる圧着部を前記電気部品の頂 部及び側部に押圧することも効果的である。
さらに、本発明においては、前記熱圧着ヘッドの圧着部として、ゴム硬度が 40以上 80以下のエラストマ一を用いることも効果的である。
さらにまた、本発明においては、当該熱圧着の際、前記接着剤を、溶融粘度が 1. 0 X 102mPa ' s以上 1. 0 X 105mPa ' s以下となるように加熱することも効果的である。 さらにまた、本発明においては、前記接着剤として、結着樹脂中に導電粒子が分散 された異方導電性接着フィルムを用レ、ることも効果的である。
さらにまた、本発明においては、前記電気部品の頂部領域と側部領域とを同時に 押圧することも効果的である。
一方、本発明は、ゴム硬度が 40以上 80以下のエラストマ一からなる圧着部を有す る熱圧着ヘッドを備え、配線基板上に配置された電気部品に対して前記圧着部を所 定の圧力で押圧するように構成されている実装装置である。
本発明においては、前記熱圧着ヘッドの圧着部の厚さが、当該電気部品の厚さと 同等以上であることも効果的である。
また、本発明においては、前記熱圧着ヘッドの圧着部の大きさが、当該電気部品の 面積より大きレ、ことも効果的である。
さらに、本発明においては、前記熱圧着ヘッドの圧着部の大きさが、複数の電気部 品を配置した領域の面積より大きいことも効果的である。
さらにまた、本発明においては、当該配線基板を支持する基台を有し、前記基台に ヒーターが設けられてレ、ることも効果的である。
[0009] 本発明方法においては、熱圧着の際、電気部品の頂部領域を配線基板に対して 所定の圧力で押圧する一方、電気部品の側部領域を頂部領域に対する圧力より小 さい圧力で押圧するようにしたことから、電気部品と配線基板の接続部分に対して十 分な圧力をカ卩えることができる一方で、電気部品の周囲のフィレット部に対してもボイ ドの生じないように加圧することができ、これにより例えば異方導電性接着フィルムを 用いて高信頼性の ICチップ等の接続を行うことができる。
[0010] 特に、本発明において、当該熱圧着の際、電気部品側を所定温度で加熱するとと もに、例えば支持基台に設けたヒーターによって配線基板側を上記所定温度より高 い温度で加熱するようにすれば、電気部品の周囲のフィレット部に対して十分に加熱 することができるので、ボイドの発生を一層防止することができる。
[0011] また、本発明において、所定のエラストマ一からなる圧着部を電気部品の頂部及び 側部に押圧するようにすれば、電気部品の頂部領域と側部領域とに対し容易に所定 の圧力差をもって加圧することができる。
[0012] さらに、圧着部として、ゴム硬度が 40以上 80以下のエラストマ一を用いることにより 、電気部品の頂部領域と側部領域とに対して最適の圧力で加圧することができ、また 当該熱圧着の際、前記接着剤を、溶融粘度が 1. 0 X 102mPa' s以上 1. O X lO mP a' s以下となるように加熱することにより、熱圧着時の接続部分における結着樹脂の 排除とボイドの発生防止をより確実なものとすることができ、一層信頼性の高い接続 を行うこと力 Sできる。
[0013] 他方、本発明装置によれば、ゴム硬度が 40以上 80以下のエラストマ一からなる圧 着部を有する熱圧着ヘッドを備え、配線基板上に配置された電気部品に対して圧着 部を所定の圧力で押圧するように構成することにより、高信頼性の接続が可能な簡 素な構成の実装装置を得ることができる。 [0014] 特に、本発明において、熱圧着ヘッドの圧着部の厚さが当該電気部品の厚さと同 等以上である場合、また、熱圧着ヘッドの圧着部の大きさが当該電気部品より大きい 場合には、より確実に電気部品の頂部領域と側部領域とに対して最適の圧力で加圧 すること力 Sできる。
[0015] さらに、本発明において、熱圧着ヘッドの圧着部の大きさが、複数の電気部品を配 置した領域の面積より大きい場合には、複数の電気部品を同時に高い信頼性で接 続を行うことができ、これにより実装効率を大幅に向上させることができる。
発明の効果
[0016] 本発明によれば、接着剤を用いて高信頼性の電気部品の実装を行うことができる。
図面の簡単な説明
[0017] [図 1]本発明に係る実装装置の実施の形態の要部及び熱圧着工程を示す概略構成 図である。
[図 2]本発明に係る実装装置の実施の形態の要部及び熱圧着工程を示す概略構成 図である。
[図 3]本発明の他の実施の形態を示す概略構成図である。
符号の説明
[0018] 1……実装装置
2……基台
3……ヒーター
4……熱圧着ヘッド
6……圧着部
6a…圧看面
7……異方導電性接着フィルム (接着剤）
7c…フィレット部
10……配線基板
20…… ICチップ（電気部品）
20b…頂部 発明を実施するための最良の形態
[0019] 以下、本発明に係る電気部品の実装方法及び実装装置の最良の実施の形態を図 面を参照して詳細に説明する。
[0020] 図 1及び図 2は、本実施の形態の実装装置の要部及び熱圧着工程を示す概略構 成図である。
図 1に示すように、本実施の形態の実装装置 1は、配線パターン 10aが形成された 配線基板 10を載置する基台 2と、バンプ 20aが設けられた ICチップ (電気部品） 20を 加圧及び加熱する熱圧着ヘッド 4を備えてレ、る。
ここで、基台 2は所定の金属からなり、その内部には、加熱用のヒーター 3が設けら れている。
[0021] 一方、熱圧着ヘッド 4は、所定の金属からなるヘッド本体 5を有し、その内部には、 図示しない加熱用のヒーターが設けられている。
[0022] また、ヘッド本体 5の基台 2と対向する部分には凹部 5aが形成され、この凹部 5aに は、プレート状のエラストマ一からなる圧着部 6が凹部 5aに密着するように取り付けら れている。
[0023] 本実施の形態の圧着部 6は、その圧着面 6aが水平となるように配置される。そして 、圧着部 6の圧着面 6aは、 ICチップ 20の頂部 20bの面積より大きくなるように構成さ れている。
また、圧着部 6の厚さは、 ICチップ 20の厚さと同等以上となるように設定されている
[0024] 一方、本発明の場合、圧着部 6のエラストマ一の種類は特に限定されることなない 力 接続信頼性を向上させる観点からは、ゴム硬度が 40以上 80以下のものを用いる ことが好ましい。
[0025] ゴム硬度が 40未満のエラストマ一は、 ICチップ 20に対する圧力が不十分で初期抵 抗及び接続信頼性が劣るという不都合があり、ゴム硬度が 80より大きいエラストマ一 は、フィレット部分に対する圧力が不十分で接着剤の結着樹脂にボイドが発生して接 続信頼性が劣るという不都合がある。
[0026] なお、本明細書では、ゴム硬度として、 JIS S 6050に準拠する規格を適用するもの とする。
[0027] このようなエラストマ一としては、天然ゴム、合成ゴムのいずれも用いることができる 力 耐熱性、耐圧性の観点からは、シリコーンゴムを用いることが好ましい。
[0028] このような構成を有する本実施の形態において ICチップ 20の実装を行うには、図 1 に示すように、配線基板 10を基台 2上に配置し、この配線基板 10上に異方導電性 接着フィルム 7を載置する。
[0029] この異方導電性接着フィルム 7は、結着樹脂 7a中に導電粒子 7bが分散されたもの である。
[0030] なお、結着樹脂 7a中に分散させる導電粒子 7bの量は少量であれば、本発明で扱 う接着剤としての溶融粘度は、導電粒子 7bの分散の有無によって影響を及ぼすこと はない。
[0031] そして、このような異方導電性接着フィルム 7上に ICチップ 20を載置し、図示しない 保護フィルムを介して ICチップ 20の頂部 20bに熱圧着ヘッド 4の圧着面 6aを押し付 けて所定の条件で仮圧着を行い、さらに以下の条件で本圧着を行う。
[0032] 本発明の場合、本圧着の際に、 ICチップ 20側を所定温度で加熱するとともに、配 線基板 10側を上述の所定温度より高い温度で加熱する。
具体的には、圧着部 6の温度が 100°C程度となるように熱圧着ヘッド 4のヒーターを 制御し、異方導電性接着フィルム 7の結着樹脂 7a温度が圧着部 6の温度 200°C程度 になるように基台 2のヒーター 3を制御する。
[0033] これにより、当該熱圧着の際、接着剤異方導電性接着フィルム 7を、溶融粘度が 1.
0 X lO mPa · s以上 1 · 0 X lO mPa · s以下となるように加熱する。
[0034] ここで、熱圧着の際の異方導電性接着フィルムの 7溶融粘度が 1. O X IO mPa - s 未満の場合は、熱圧着時の結着樹脂 7aの流動性が大きぐボイドが発生して初期抵 抗及び接続信頼性が劣るという不都合があり、溶融粘度が 1. O X 105mPa' sより大き い場合は、熱圧着時に接続部分において結着樹脂 7aが排除しきれず、ボイドが発 生して初期抵抗及び接続信頼性が劣るという不都合がある。
[0035] なお、本圧着時の圧力は、 ICチップ 1個当たり 100N程度で 15秒程度とする。
[0036] 図 2に示すように、本実施の形態においては、ゴム硬度が 40以上 80以下のエラスト マーカもなる圧着部 6によって加圧を行うことによって、 ICチップ 20の頂部 20bを配 線基板 10に対して所定の圧力で押圧する一方、 ICチップ 20の側部のフィレット部 7c を頂部 20bに対する圧力より小さい圧力で押圧することができ、これにより、 ICチップ 20と配線基板 10の接続部分に対して十分な圧力を加えることができる一方で、 ICチ ップ 20の周囲のフィレット部 7cに対してもボイドの生じないように加圧することができ る。
その結果、本実施の形態によれば、異方導電性接着フィルム 7を用いて高信頼性 の ICチップ 20等の接続を行うことができる。
[0037] 特に、本実施の形態においては、当該熱圧着の際、 ICチップ 20側を所定温度で 加熱するとともに、配線基板 10側をこの所定温度より高い温度で加熱することにより
、 ICチップ 20の周囲のフィレット部 7cに対して十分に加熱することができ、ボイドの発 生を確実に防止することができる。
[0038] さらに、熱圧着の際、接着剤異方導電性接着フィルム 7を、溶融粘度が 1. 0 X 102 mPa' s以上 1. 0 X 105mPa' s以下となるように加熱することから、熱圧着時の接続部 分における結着樹脂 7aの排除とボイドの発生防止をより確実なものとすることができ
、一層信頼性の高い接続を行うことができる。
[0039] 他方、本実施の形態の実装装置 1によれば、高信頼性の接続が可能な簡素な構成 の実装装置を得ることができる。
[0040] 特に、本実施の形態によれば、圧着部 6の厚さが ICチップ 20の厚さと同等以上で あるので、確実に ICチップ 20の頂部 20bと側部のフィレット部 7cに対して最適の圧 力で加圧することができる。
[0041] 図 3は、本発明の他の実施の形態を示す概略構成図であり、以下、上記実施の形 態と対応する部分については同一の符号を付しその詳細な説明を省略する。
[0042] 図 3に示すように、本実施の形態の実装装置 1Aは、圧着部 6の大きさが、複数 (例 えば 2個）の例えば厚さの異なる ICチップ 20、 21を配置した領域の面積より大きくな るように構成されている点が上記実施の形態と異なるものである。
[0043] この場合、圧着部 6自体のゴム硬度は、 40以上 80以下で上記実施の形態と同一 である。 [0044] このような構成を有する本実施の形態によれば、複数の特に厚さの異なる ICチップ 20、 21を同時に高い信頼性で接続を行うことができ、これにより実装効率を大幅に 向上させることができる。その他の構成及び作用効果については上述の実施の形態 と同一であるのでその詳細な説明を省略する。
[0045] なお、本発明は上述の実施の形態に限られることなぐ種々の変更を行うことができ る。
例えば、上述の実施の形態においては、異方導電性接着フィルムを用いて ICチッ プを実装する場合を例にとって説明したが、本発明はこれに限られず、導電粒子を 含有しない接着剤を用いることも可能である。
[0046] また、上述の実施の形態においては、バンプ電極を有する ICチップを実装する場 合を例にとって説明した力 バンプ電極を有しない ICチップにも適用することができ る。
実施例
[0047] 以下、本発明の実施例を比較例とともに詳細に説明する。
<実施例 1 >
配線基板として、ガラスエポキシ基板上に、幅 75 z m、ピッチ 150 z mの銅（Cu)パ ターンを形成し、その上にニッケル一金めつきを施したリジッド基板を用レ、、 ICチップ として、 150 x mピッチのバンプ電極が形成された大きさ 6 X 6mm、厚さ 0. 4mmの チップを準備した。
[0048] そして、大きさ 60 X 60mm、厚さ 10mm、ゴム硬度 40のシリコーンゴムからなる圧 着部を装着した熱圧着ヘッドを用い、異方導電性接着フィルムとして、溶融粘度が 1 . O X 105mPa' sの結着樹脂に導電粒子を分散させたもの用いて配線基板上に ICチ ップを熱圧着した。
[0049] この場合、圧着部の温度は 100°C、異方導電性接着フィルムの温度が 200°Cにな るように基台の温度を制御し、圧力 100N/lC (278N/cm2)で 15秒間加圧及び加 熱した。
[0050] <実施例 2 >
ゴム硬度 80のシリコーンゴムからなる圧着部を用いた以外は実施例 1と同一の条件 で熱圧着を行った。
[0051] <比較例 1 >
ゴム硬度 10以下のシリコーンゴムからなる圧着部を用いた以外は実施例 1と同一の 条件で熱圧着を行った。
[0052] ぐ比較例 2 >
ゴム硬度 120のシリコーンゴムからなる圧着部を用いた以外は実施例 1と同一の条 件で熱圧着を行った。
[0053] ぐ実施例 3 >
溶融粘度が 1. 0 X 1 O mPa · sの結着樹脂に導電粒子を分散させた異方導電性接 着フィルムを用いた以外は実施例 1と同一の条件で熱圧着を行った。
[0054] ぐ比較例 3 >
溶融粘度が 5mPa ' sの結着樹脂に導電粒子を分散させた異方導電性接着フィノレ ムを用いた以外は実施例 1と同一の条件で熱圧着を行った。
[0055] <比較例 4 >
溶融粘度が 1. 0 X 109mPa ' sの結着樹脂に導電粒子を分散させた異方導電性接 着フィルムを用いた以外は実施例 1と同一の条件で熱圧着を行った。
[0056] <比較例 5 >
厚さが ICチップより薄い（0. 2mm)シリコーンゴムからなる圧着部を用いた以外は 実施例 1と同一の条件で熱圧着を行った。
[0057] (評価）
上記実施例及び比較例の圧着部のゴム硬度による信頼性及び結着樹脂の溶融粘 度による信頼性を評価した。その結果を表 1、 2に示す。
[0058] [表 1] 圧着部のゴム硬度による信頼性評価
Figure imgf000012_0001
(注) 樹脂溶融粘度 = 1.0 105mPa -S
[0059] [表 2]
結着樹脂の溶融粘度による信頼性評価
Figure imgf000012_0002
(注） ゴム硬度 =40
[0060] この場合、初期導通抵抗は、パターン間の抵抗値を 4端子法によって測定し、その 値が 1Ω未満のものを〇、 1Ω以上のものを Xとした。
[0061] 接続信頼性は、温度 85°C、相対湿度 85%の条件下で 24時間エージング後に所 定のプロファイルのリフロー処理（1一 4°CZSで昇温→150。C±10°C， 30s±10s余 熱エリア→1一 4。C/Sで昇温→ピーク温度 235。C±5。C, 10s± Isはんだ付けエリ ァ→1一 4°C/Sで冷却）を行ったものの抵抗値力 1Ω未満のものを〇、 1Ω以上の ものを Xとした。
[0062] また、ボイドの有無については、超音波顕微鏡によって確認し、ボイドの発生が認 められな力 たものを〇、ボイドの発生が認められたものを Xとした。 [0063] 表 1から明らかなように、圧着部のゴム硬度が 40の実施例 1及び 80の実施例 2は、 初期導通抵抗及び接続信頼性ともに良好で、またボイドも発生しなかった。
[0064] 一方、圧着部のゴム硬度が 40未満の比較例 1は、 ICチップに対する圧力が不十分 で初期抵抗及び接続信頼性が劣り、ゴム硬度が 80より大きい比較例 2は、フィレット 部に対する圧力が不十分で接着剤の結着樹脂にボイドが発生して接続信頼性が劣 つていた。
[0065] また、異方導電性接着フィルムの結着樹脂の溶融粘度が 1. 0 X 102mPa' sの実施 例 3及び溶融粘度が 1. O X 105mPa* sの実施例 1は、初期導通抵抗及び接続信頼 性ともに良好で、またボイドも発生しなかった。
[0066] 一方、溶融粘度が 1. O X 102mPa' s未満の結着樹脂を用いた比較例 3は、熱圧着 時の結着樹脂の流動性が大きぐボイドが発生して初期抵抗及び接続信頼性が劣り 、溶融粘度が 1. 0 X 105mPa' Sより大きい結着樹脂を用いた比較例 4は、熱圧着時 に接続部分において結着樹脂が排除しきれず、ボイドが発生して初期抵抗及び接続 信頼性が劣っていた。
[0067] 他方、厚さが ICチップより薄い圧着部を用いた比較例 5については、フィレット部に 圧力が加わらず、ボイドが発生して初期抵抗及び接続信頼性が劣っていた。
産業上の利用可能性
[0068] 本発明は、例えば小型の電子機器を製造する際、半導体チップ等の電気電子部 品をプリント配線基板上に実装して回路基板を作製する用途に利用可能である。

Claims

請求の範囲
[1] 電気部品を配線基板上に実装する実装方法であって、
接着剤を用いて電気部品を配線基板上に熱圧着する工程を有し、
当該熱圧着の際、前記電気部品の頂部領域を前記配線基板に対して所定の圧力 で押圧する一方、前記電気部品の側部領域を前記頂部領域に対する圧力より小さ レ、圧力で押圧する電気部品の実装方法。
[2] 請求項 1において、当該熱圧着の際、前記電気部品側を所定温度で加熱するとと もに、前記配線基板側を前記所定温度より高レ、温度で加熱する電気部品の実装方 法。
[3] 請求項 1において、所定のエラストマ一からなる圧着部を前記電気部品の頂部及び 側部に押圧する電気部品の実装方法。
[4] 請求項 3において、前記熱圧着ヘッドの圧着部として、ゴム硬度が 40以上 80以下 のエラストマ一を用いる電気部品の実装方法。
[5] 請求項 1において、当該熱圧着の際、前記接着剤を、溶融粘度が 1. O X lO mPa- s以上 1. O X 105mPa' s以下となるように加熱する電気部品の実装方法。
[6] 請求項 1において、前記接着剤として、結着樹脂中に導電粒子が分散された異方 導電性接着フィルムを用レ、る電気部品の実装方法。
[7] 請求項 1において、前記電気部品の頂部領域と側部領域とを同時に押圧する電気 部品の実装方法。
[8] 電気部品を配線基板上に実装する実装装置であって、
ゴム硬度が 40以上 80以下のエラストマ一からなる圧着部を有する熱圧着ヘッドを 備え、
配線基板上に配置された電気部品に対して前記圧着部を所定の圧力で押圧する ように構成されてレ、る実装装置。
[9] 請求項 8において、前記熱圧着ヘッドの圧着部の厚さが、前記電気部品の厚さと同 等以上である実装装置。
[10] 請求項 8において、前記熱圧着ヘッドの圧着部の大きさが、当該配線基板上に配 置された電気部品の面積より大きい実装装置。 請求項 8において、前記熱圧着ヘッドの圧着部の大きさが、複数の電気部品を配 置した領域の面積より大きい実装装置。
請求項 8において、当該配線基板を支持する基台を更に有し、前記基台にヒータ 一が設けられてレ、る実装装置。
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US20090230171A1 (en) 2009-09-17
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CN100459080C (zh) 2009-02-04
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US7556190B2 (en) 2009-07-07
CN101350324B (zh) 2010-09-01
KR20060035736A (ko) 2006-04-26
CN101350324A (zh) 2009-01-21
TWI296905B (en) 2008-05-11
EP1646081A1 (en) 2006-04-12

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