CN1823409A - 电气部件的安装方法和安装装置 - Google Patents
电气部件的安装方法和安装装置 Download PDFInfo
- Publication number
- CN1823409A CN1823409A CNA2004800198375A CN200480019837A CN1823409A CN 1823409 A CN1823409 A CN 1823409A CN A2004800198375 A CNA2004800198375 A CN A2004800198375A CN 200480019837 A CN200480019837 A CN 200480019837A CN 1823409 A CN1823409 A CN 1823409A
- Authority
- CN
- China
- Prior art keywords
- electric component
- mentioned
- contact portion
- circuit board
- pressure contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 229920001971 elastomer Polymers 0.000 claims abstract description 40
- 239000002313 adhesive film Substances 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 239000000806 elastomer Substances 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000000155 melt Substances 0.000 abstract 1
- 235000019589 hardness Nutrition 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 12
- 239000003292 glue Substances 0.000 description 11
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000002788 crimping Methods 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
本发明提供一种能够使用粘合剂来进行高可靠性的电气部件安装的安装方法和安装装置。本发明是具有使用各向异性粘合膜(7)来将IC芯片(20)热压接到布线基板(10)上的安装方法,当进行该热压接时,以规定的压力将IC芯片(20)的顶部区域按压向布线基板(10),另一方面以比对IC芯片(20)的顶部区域的压力小的压力来对IC芯片(20)的侧部区域进行按压。作为热压接头(4)的压接部(6)使用橡胶硬度大于等于40且小于等于80的弹性体。作为各向异性导电粘合膜(7)使用含有溶融粘度大于等于1.0×102mPa·s且小于等于1.0×105mPa·s的粘接树脂(7b)的薄膜。
Description
技术领域
本发明涉及将例如半导体芯片等电气部件安装到布线基板上的技术,特别涉及使用粘合剂来安装电气部件的技术。
背景技术
以往,作为在印刷电路板等布线基板上直接安装裸芯片的方法,公知有使用在粘合剂中分散了导电粒子的各向异性导电粘合膜的方法。
在使用了各向异性导电粘合膜的安装方法中,在粘贴了各向异性导电粘合膜的基板上搭载了IC芯片之后,用陶瓷或金属制等平坦的压接头对IC芯片加压、加热,使各向异性导电粘合膜固化,进行热压接安装。
在使用这样的金属等的压接头来进行加压、加热的方法的情况下,也有下述问题:在进行热压接时,对IC芯片周围的粘合剂的胶瘤部分加热不足而成为连接可靠性低下的原因,此外多个IC芯片的安装也较困难。
于是,近年来为了解决这些问题,提出了使用由硅橡胶等的弹性体构成的热压接头来进行IC芯片的热压接的技术。
专利文献1:特开2000-79611号公报
专利文献2:特开2002-359264号公报
但是,在这样的现有技术中,存在下述问题:由于作为IC芯片和基板的连接部分的凸块部分与图形之间的压力不足,因此不能进行充分的连接,不能充分确保初始导通电阻和老化后的连接可靠性。
发明内容
本发明是为了解决这样的现有技术的课题而作成的,其目的在于提供一种能够使用粘合剂来进行高可靠性的电气部件安装的安装方法和安装装置。
为了达成上述目的而作成的本发明是具有使用粘合剂将电气部件热压接到布线基板上的工序的电气部件安装方法,当进行该热压接时,以规定的压力将上述电气部件的顶部区域按压向上述布线基板,另一方面以比对上述顶部区域的压力小的压力来对上述电气部件的侧部区域进行按压。
再有,在本发明中,所谓“电气部件”的“侧部区域”是指IC芯片等电气部件自身的侧部和电气部件的周围的例如粘合剂部分。
在本发明中,当进行该热压接时,以规定温度对上述电气部件一侧进行加热,同时以比上述规定温度高的温度对上述布线基板一侧进行加热,这也是有效的。
此外,在本发明中,将由规定的弹性体构成的压接部按压到上述电气部件的顶部和侧部上,这也是有效的。
进而,在本发明中,作为上述热压接头的压接部使用橡胶硬度大于等于40且小于等于80的弹性体,这也是有效的。
另外,在本发明中,当进行该热压接时,将上述粘合剂加热成其溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s,这也是有效的。
另外,在本发明中,作为上述粘合剂使用在粘结树脂中分散有导电粒子的各向异性导电粘合膜,这也是有效的。
另外,在本发明中,对上述电气部件的顶部区域和侧部区域同时进行按压,这也是有效的。
另一方面,本发明具备热压接头,该热压接头具有由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部,该装置构成为:使上述压接部以规定的压力对配置在布线基板上的电气部件进行按压。
在本发明中,上述热压接头的压接部的厚度大于等于该电气部件的厚度,这也是有效的。
此外,在本发明中,上述热压接头的压接部的大小大于该电气部件的面积,这也是有效的。
进而,在本发明中,上述热压接头的压接部的大小大于配置有多个电气部件的区域的面积,这也是有效的。
另外,在本发明中,具有支撑该布线基板的基座,在上述基座设有加热器,这也是有效的。
在本发明方法中,当进行热压接时,以规定的压力将电气部件的顶部区域按压向布线基板,另一方面以比对顶部区域的压力小的压力来对电气部件的侧部区域进行按压,因此,能够对电气部件与布线基板的连接部分施加上足够的压力,另一方面,能够对电气部件周围的胶瘤部分也加压以便不产生空隙,由此能够使用例如各向异性导电粘合膜来进行高可靠性的IC芯片等的连接。
特别地,在本发明中,只要当进行该热压接时,以规定温度对电气部件一侧进行加热,同时利用例如设置在支撑基座上的加热器来以比上述规定温度高的温度对布线基板一侧进行加热,就能够对电气部件的周围的胶瘤部分进行充分的加热,因此能够进一步防止空隙的产生。
此外,在本发明中,只要将由规定的弹性体构成的压接部按压到电气部件的顶部和侧部上,就能够容易地对电气部件的顶部区域和侧部区域以规定的压力差来进行加压。
进而,作为压接部使用橡胶硬度大于等于40且小于等于80的弹性体,从而能够对电气部件的顶部区域和侧部区域以最佳的压力进行加压,此外,当进行该热压接时,将上述粘合剂加热成溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s,从而能够更可靠地排除热压接时连接部分中的粘接树脂并防止空隙的产生,能够进行可靠性更高的连接。
另外,根据本发明的装置,具备热压接头,该热压接头具有由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部,该装置构成为:使上述压接部以规定的压力对配置在布线基板上的电气部件进行按压,从而能够获得可进行高可靠性的连接的结构简单的安装装置。
特别地,在本发明中,在热压接头的压接部的厚度大于等于该电气部件的厚度的情况下,此外,在热压接头的压接部的大小大于该电气部件的面积的情况下,能够更可靠地对电气部件的顶部区域和侧部区域以最佳的压力进行加压。
进而,在本发明中,在热压接头的压接部的大小大于配置有多个电气部件的区域的面积的情况下,能够同时以高可靠性对多个电气部件进行连接,由此,能够大幅提高安装效率。
根据本发明,就能使用粘合剂来进行高可靠性的电气部件的安装。
附图说明
图1是表示本发明的安装装置的实施方式的主要部分和热压接工序的概略结构图。
图2是表示本发明的安装装置的实施方式的主要部分和热压接工序的概略结构图。
图3是表示本发明的其他实施方式的概略结构图。
符号的说明
1安装装置
2基座
3加热器
4热压接头
6压接部
6a压接面
7各向异性导电粘合膜(粘合剂)
7c胶瘤部分
10布线基板
20IC芯片(电气部件)
20b顶部
具体实施方式
下面,参照附图来详细说明本发明的电气部件的安装方法和安装装置的优选的实施方式。
图1和图2是表示本实施方式的安装装置的主要部分和热压接工序的概略结构图。
如图1所示,本实施方式的安装装置1具备:载放形成有布线图形10a的布线基板10的基座2、以及对设有凸块20a的IC芯片(电气部件)20进行加压及加热的热压接头4。
这里,基座2由规定的金属构成,在其内部设有加热用的加热器3。
另一方面,热压接头4具有规定的金属构成的头主体5,在其内部设有未图示的加热用的加热器。
此外,在头主体5的与基座2对置的部分形成有凹部5a,在该凹部5a,以与凹部5a密接的方式装配有由板状的弹性体构成的压接部6。
本实施方式的压接部6配置成其压接面6a水平。而且,压接部6的压接面6a构成为比IC芯片20的顶部20b的面积大。
另外,压接部6的厚度设定成大于等于IC芯片20的厚度。
另一方面,本发明并不特别限定压接部6的弹性体的种类,但从提高连接可靠性的观点出发,优选使用橡胶硬度大于等于40且小于等于80的弹性体。
橡胶硬度不到40的弹性体会有对IC芯片20的压力不充分而且初始电阻和连接可靠性差的不理想情况,橡胶硬度大于80的弹性体会有对胶瘤部分的压力不充分而且在粘合剂的粘接树脂中产生空隙从而连接可靠性差的不理想情况。
另外,在本说明书中,作为橡胶硬度使用根据JIS S 6050的规格。
作为这样的弹性体可以使用天然橡胶、合成橡胶的任一种,但从耐热性、耐压性的观点出发优选使用硅橡胶。
为了在具有这种结构的本实施方式中进行IC芯片20的安装,如图1所示,将布线基板10配置在基座2上,在该布线基板10上载放各向异性导电粘合膜7。
该各向异性导电粘合膜7是在粘接树脂7a中分散了导电粒子7b。
再有,只要粘接树脂7a中分散的导电粒子7b的量是少量的,那么作为本发明所使用的粘合剂的溶融粘度就不会因导电粒子7b的分散的有无而受到影响。
而且,在这种各向异性导电粘合膜7上载放IC芯片20,经由未图示的保护膜,将热压接头4的压接面6a推压到IC芯片20的顶部20b上,以规定的条件进行虚压接,进而按以下条件进行主压接。
本发明中,在主压接时,以规定温度对IC芯片20一侧进行加热,同时以比上述规定温度高的温度对布线基板10一侧进行加热。
具体是控制热压接头4的加热器使压接部6的温度成为100℃左右,控制基座2的加热器3使各向异性导电粘合膜7的粘接树脂7a的温度成为压接部6的温度200℃左右。
由此,当进行该热压接时,对粘合剂各向异性导电粘合膜7进行加热使其溶融粘度大于等于1.0×102mPa·s且小于等于1.0×105mPa·s。
这里,在热压接时的各向异性导电粘合膜的7溶融粘度不足1.0×102mPa·s的情况下,会有热压接时的粘接树脂7a的流动性大、产生空隙、初始电阻和连接可靠性差的不理想情形,在溶融粘度大于1.0×105mPa·s的情况下,会有热压接时在连接部分不能彻底排除粘接树脂7a、产生空隙、初始电阻和连接可靠性差的不理想情形。
再有,主压接时的压力以对每一个IC芯片100N的程度加压15秒左右。
如图2所示,在本实施方式中,通过利用由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部来进行加压,从而以规定的压力将IC芯片20的顶部20b按压向布线基板10,另一方面,能够以比对顶部20b的压力小的压力来对IC芯片20的侧部的胶瘤部分7c进行按压,由此,对IC芯片20和布线基板10的连接部分能够施加足够的压力,另一方面,对IC芯片20的周围的胶瘤部分7c也能够以不产生空隙的方式来进行加压。
其结果是,根据本实施方式,就能够使用各向异性导电粘合膜7来进行高可靠性的IC芯片20等的连接。
特别地,在本实施方式中,当进行该热压接时,以规定的温度对IC芯片20一侧进行加热,同时以比该规定温度高的温度对布线基板10一侧进行加热,从而能够对IC芯片20周围的胶瘤部分7c进行充分的加热,确实防止空隙的产生。
进而,当进行热压接时,由于将粘合剂各向异性导电粘合膜7加热成其溶融粘度大于等于1.0×102mPa·s且小于等于1.0×105mPa·s,所以就能够更确实地排除热压接时连接部分中的粘接树脂7a并防止空隙的产生,能够进行可靠性更高的连接。
另一方面,根据本实施方式的安装装置1,能够得到可进行高可靠性的连接的结构简单的安装装置。
特别地,根据本实施方式,因为压接部6的厚度大于等于IC芯片20的厚度,所以能够确实地对IC芯片20的顶部的20b和侧部的胶瘤部分7c以最佳的压力进行加压。
图3是表示本发明的其他实施方式的概略结构图,以下对与上述实施方式对应部分标注同一符号并省略其详细说明。
如图3所示,本实施方式的安装装置1A与上述实施方式在下述方面存在不同,即,其构成为:压接部6的大小大于配置了多个(例如2个)例如厚度不同的IC芯片20、21的区域的面积。
在这种情况下,压接部6本身的橡胶硬度为大于等于40且小于等于80,和上述实施方式一样。
根据具有这种结构的本实施方式,能够同时以高可靠性进行多个特别是厚度不同的IC芯片20、21的连接,由此能够大幅提高安装效率。关于其他的结构以及作用效果由于与上述实施方式相同,因此省略其详细说明。
再有,本发明不限于上述实施方式,能够进行各种各样的变更。
例如,在上述实施方式中,以使用各向异性导电粘合膜来安装IC芯片的情况作为例子进行了说明,但本发明不限于此,也可以使用不含有导电粒子的粘合剂。
另外,在上述实施方式中,以安装具有凸块电极的IC芯片的情况作为例子进行了说明,但也能适用于不具有凸块电极的IC芯片。
实施例
下面,将本发明的实施例与比较例一同做详细的说明。
<实施例1>
作为布线基板,在玻璃钢基板上形成宽75μm、间距150μm的铜(Cu)图形,在其上面使用实施了镀镍金的刚性基板,作为IC芯片,准备形成有间距150μm的凸块电极的、大小6×6mm、厚度0.4mm的芯片。
而且,使用安装了由大小60×60mm、厚度10mm、橡胶硬度40的硅橡胶构成的压接部的热压接头,作为各向异性导电粘合膜,使用在溶融粘度1.0×105mPa·s的粘接树脂中分散了导电粒子的薄膜,将IC芯片热压接到布线基板上。
在这种情况下,控制基座的温度使压接部的温度为100℃、各向异性导电粘合膜的温度为200℃,用压力100N/IC(278N/cm2)加压、加热15秒内。
<实施例2>
除了使用由橡胶硬度80的硅橡胶构成的压接部以外,其余以与实施例1相同的条件进行热压接。
<比较例1>
除了使用由橡胶硬度小于等于10的硅橡胶构成的压接部以外,其余以与实施例1相同的条件进行热压接。
<比较例2>
除了使用由橡胶硬度为120的硅橡胶构成的压接部以外,其余以与实施例1相同的条件进行热压接。
<实施例3>
除了使用在溶融粘度为1.0×105mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外,其余以与实施例1相同的条件进行热压接。
<比较例3>
除了使用在溶融粘度为5mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外,其余以与实施例1相同的条件进行热压接。
<比较例4>
除了使用在溶融粘度为1.0×109mPa·s的粘接树脂中分散有导电粒子的各向异性导电粘合膜以外,其余以与实施例1相同的条件进行热压接。
<比较例5>
除了使用厚度比IC芯片薄(0.2mm)的由硅橡胶构成的压接部以外,其余以与实施例1相同的条件进行热压接。
(评价)
对上述实施例和比较例的由压接部的橡胶硬度决定的可靠性以及由粘接树脂的溶融粘度决定的可靠性进行评价。将其结果表示在表1、2中。
[表1]
表1.由压接部的橡胶硬度决定的可靠性评价
连接可靠性 | × | ○ | ○ | × |
(注)树脂溶融粘度=1.0×105mPa·s
[表2]
表2.由粘接树脂的溶融粘度决定的可靠性评价
(注)橡胶硬度=40
在这种情况下,初始导通电阻通过4端子法来测定图形间的电阻值,其值不到1Ω用○表示,大于等于1Ω用×表示。
对于连接可靠性,在温度85℃、相对湿度85%的条件下,在24小时老化后进行规定曲线的回流处理(以1~4℃/S升温→150℃±10℃,30s±10s余热区→以1~4℃/S升温→峰值温度235℃±5℃,10s±1s软焊区→以1~4℃/S冷却)的电阻值不到1Ω用○表示,大于等于1Ω用×表示。
另外,关于空隙的有无,通过超声波显微镜来确认,未认定产生空隙的用○表示,认定产生空隙的用×表示。
从表1可明确看出,压接部的橡胶硬度为40的实施例1和80的实施例2初始导通电阻和连接可靠性均良好,此外也不产生空隙。
另一方面,压接部的橡胶硬度不足40的比较例1中,对IC芯片的压力不充分,初始电阻和连接可靠性差,橡胶硬度大于80的比较例2中,对胶瘤部分的压力不充分,在粘合剂的粘接树脂中产生空隙,连接可靠性差。
此外,各向异性导电粘合膜的粘接树脂的溶融粘度是1.0×102mPa·s的实施例3和溶融粘度是1.0×105mPa·s的实施例1的初始导通电阻和连接可靠性均良好,此外也不产生空隙。
一方面,使用溶融粘度不满1.0×102mPa·s的粘接树脂的比较例3中,热压接时粘接树脂的流动性大、产生空隙、初始电阻和连接可靠性差,使用溶融粘度大于1.0×105mPa·s的粘接树脂的比较例4中,进行热压接时,在连接部分不能彻底排除粘接树脂,产生空隙,初始电阻和连接可靠性差。
另一方面,关于使用厚度薄于IC芯片的压接部的比较例5,在胶瘤部分不能加压,产生空隙,初始电阻和连接可靠性差。
本发明可用于在制造例如小型电子设备时将半导体芯片等电气电子部件安装到印刷布线基板上来制作电路基板的用途中。
Claims (12)
1.一种电气部件的安装方法,将电气部件安装到布线基板上,其特征在于:
具有使用粘合剂将电气部件热压接到布线基板上的工序,
当进行该热压接时,以规定的压力将上述电气部件的顶部区域按压向上述布线基板,另一方面以比对上述顶部区域的压力小的压力来对上述电气部件的侧部区域进行按压。
2.如权利要求1所述的电气部件的安装方法,其特征在于:
当进行该热压接时,以规定温度对上述电气部件一侧进行加热,同时以比上述规定温度高的温度对上述布线基板一侧进行加热。
3.如权利要求1所述的电气部件的安装方法,其特征在于:
将由规定的弹性体构成的压接部按压到上述电气部件的顶部和侧部上。
4.如权利要求3所述的电气部件的安装方法,其特征在于:
作为上述热压接头的压接部使用橡胶硬度大于等于40且小于等于80的弹性体。
5.如权利要求1所述的电气部件的安装方法,其特征在于:
当进行该热压接时,将上述粘合剂加热成其溶融粘度为大于等于1.0×102mPa·s且小于等于1.0×105mPa·s。
6.如权利要求1所述的电气部件的安装方法,其特征在于:
作为上述粘合剂使用在粘结树脂中分散有导电粒子的各向异性导电粘合膜。
7.如权利要求1所述的电气部件的安装方法,其特征在于:
对上述电气部件的顶部区域和侧部区域同时进行按压。
8.一种安装装置,将电气部件安装到布线基板上,其特征在于:
具备热压接头,该热压接头具有由橡胶硬度大于等于40且小于等于80的弹性体构成的压接部,
该装置构成为:使上述压接部以规定的压力对配置在布线基板上的电气部件进行按压。
9.如权利要求8所述的安装装置,其特征在于:
上述热压接头的压接部的厚度大于等于上述电气部件的厚度。
10.如权利要求8所述的安装装置,其特征在于:
上述热压接头的压接部的大小大于该布线基板上配置的电气部件的面积。
11.如权利要求8所述的安装装置,其特征在于:
上述热压接头的压接部的大小大于配置有多个电气部件的区域的面积。
12.如权利要求8所述的安装装置,其特征在于:
还具有支撑该布线基板的基座,在上述基座设有加热器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003195684A JP3921459B2 (ja) | 2003-07-11 | 2003-07-11 | 電気部品の実装方法及び実装装置 |
JP195684/2003 | 2003-07-11 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102144331A Division CN101350324B (zh) | 2003-07-11 | 2004-07-08 | 电气部件的安装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1823409A true CN1823409A (zh) | 2006-08-23 |
CN100459080C CN100459080C (zh) | 2009-02-04 |
Family
ID=34055756
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102144331A Expired - Lifetime CN101350324B (zh) | 2003-07-11 | 2004-07-08 | 电气部件的安装方法 |
CNB2004800198375A Expired - Lifetime CN100459080C (zh) | 2003-07-11 | 2004-07-08 | 电气部件的安装方法和安装装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008102144331A Expired - Lifetime CN101350324B (zh) | 2003-07-11 | 2004-07-08 | 电气部件的安装方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7556190B2 (zh) |
EP (1) | EP1646081B1 (zh) |
JP (1) | JP3921459B2 (zh) |
KR (1) | KR101105948B1 (zh) |
CN (2) | CN101350324B (zh) |
HK (1) | HK1125226A1 (zh) |
TW (1) | TWI296905B (zh) |
WO (1) | WO2005006430A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101524008B (zh) * | 2006-10-02 | 2010-12-22 | 松下电器产业株式会社 | 部件压接设备控制方法、部件压接设备和测量工具 |
CN102456590A (zh) * | 2010-10-18 | 2012-05-16 | 东京毅力科创株式会社 | 接合装置及接合方法 |
US8296939B2 (en) | 2008-08-08 | 2012-10-30 | Sony Chemical & Information Device Corporation | Mounting method using dilatancy fluid |
CN104025273A (zh) * | 2011-11-07 | 2014-09-03 | 迪睿合电子材料有限公司 | 连接装置、连接构造体的制造方法、芯片堆叠部件的制造方法及电子部件的安装方法 |
CN107004614A (zh) * | 2014-09-29 | 2017-08-01 | 丹佛斯硅动力有限责任公司 | 烧结装置 |
US10814396B2 (en) | 2014-09-29 | 2020-10-27 | Danfoss Silicon Power Gmbh | Sintering tool and method for sintering an electronic subassembly |
US10818633B2 (en) | 2014-09-29 | 2020-10-27 | Danfoss Silicon Power Gmbh | Sintering tool for the lower die of a sintering device |
US11776932B2 (en) | 2014-09-29 | 2023-10-03 | Danfoss Silicon Power Gmbh | Process and device for low-temperature pressure sintering |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4206320B2 (ja) * | 2003-09-19 | 2009-01-07 | 株式会社ルネサステクノロジ | 半導体集積回路装置の製造方法 |
JP2012124504A (ja) * | 2005-02-02 | 2012-06-28 | Sony Chemical & Information Device Corp | 電気部品の実装方法 |
EP1845556A4 (en) | 2005-02-02 | 2010-02-10 | Sony Chem & Inf Device Corp | ATTACHING DEVICE FOR ELECTRICAL COMPONENTS |
JP2006245554A (ja) * | 2005-02-02 | 2006-09-14 | Sony Chemical & Information Device Corp | 電気部品の実装方法 |
JP4925669B2 (ja) | 2006-01-13 | 2012-05-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置及び実装方法 |
WO2007088647A1 (ja) * | 2006-02-01 | 2007-08-09 | Sony Chemical & Information Device Corporation | 電気部品の実装方法 |
JP4996859B2 (ja) * | 2006-02-10 | 2012-08-08 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置 |
JP4832107B2 (ja) | 2006-02-23 | 2011-12-07 | ソニーケミカル&インフォメーションデバイス株式会社 | 実装方法 |
JP4902229B2 (ja) | 2006-03-07 | 2012-03-21 | ソニーケミカル&インフォメーションデバイス株式会社 | 実装方法 |
JP4795067B2 (ja) | 2006-03-28 | 2011-10-19 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品付基板の製造方法 |
JP2007294607A (ja) * | 2006-04-24 | 2007-11-08 | Sony Chemical & Information Device Corp | 押圧ヘッド及び押圧装置 |
JP2007324413A (ja) | 2006-06-01 | 2007-12-13 | Sony Chemical & Information Device Corp | 熱圧着ヘッド及びこれを用いた実装装置 |
JP4979288B2 (ja) * | 2006-07-19 | 2012-07-18 | ソニーケミカル&インフォメーションデバイス株式会社 | 熱圧着ヘッドを用いた実装方法 |
WO2008032510A1 (fr) * | 2006-09-15 | 2008-03-20 | Lintec Corporation | Procédé de production d'un dispositif à semi-conducteur |
JP4171926B2 (ja) * | 2006-09-19 | 2008-10-29 | セイコーエプソン株式会社 | 板片付き配線基板の製造方法 |
JP4945304B2 (ja) * | 2007-05-07 | 2012-06-06 | ソニーケミカル&インフォメーションデバイス株式会社 | 物性評価用サンプル、並びにその作製方法及び作製装置 |
WO2009001564A1 (ja) * | 2007-06-28 | 2008-12-31 | Panasonic Corporation | 半導体素子の実装構造体及びその製造方法、半導体素子の実装方法、並びに加圧ツール |
JP5122192B2 (ja) * | 2007-07-04 | 2013-01-16 | パナソニック株式会社 | 半導体素子実装装置 |
JP2009032845A (ja) * | 2007-07-26 | 2009-02-12 | Sony Chemical & Information Device Corp | 熱圧着装置及び電気部品の実装方法 |
JP5164499B2 (ja) * | 2007-09-27 | 2013-03-21 | デクセリアルズ株式会社 | 電子部品の実装方法及び電子部品実装基板 |
JP2009141267A (ja) | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
JP2009141269A (ja) | 2007-12-10 | 2009-06-25 | Sony Chemical & Information Device Corp | 電気部品の実装方法及び実装装置 |
US8163599B2 (en) | 2008-04-18 | 2012-04-24 | Panasonic Corporation | Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus |
JP4548509B2 (ja) * | 2008-04-23 | 2010-09-22 | 株式会社デンソー | プリント基板製造装置 |
US20090289101A1 (en) * | 2008-05-23 | 2009-11-26 | Yong Du | Method for ball grid array (bga) solder attach for surface mount |
WO2010057016A2 (en) * | 2008-11-13 | 2010-05-20 | Orthodyne Electronics Corporation | Semiconductor device support for bonding |
JP2011009357A (ja) * | 2009-06-24 | 2011-01-13 | Fujitsu Ltd | 実装装置 |
JP5602439B2 (ja) | 2010-01-22 | 2014-10-08 | デクセリアルズ株式会社 | 加熱装置および実装体の製造方法 |
CN102859674A (zh) * | 2010-04-23 | 2013-01-02 | 住友电木株式会社 | 电子装置的制造方法和装置及其一对夹压构件 |
JP5684584B2 (ja) * | 2010-04-28 | 2015-03-11 | 株式会社アイエスシーIsc Co., Ltd. | 電子部品、電子部材の接続方法および回路接続部材 |
JP5621320B2 (ja) * | 2010-05-19 | 2014-11-12 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
JP5665494B2 (ja) * | 2010-06-24 | 2015-02-04 | キヤノン株式会社 | 放射線検出装置及び放射線撮像システム |
JP5521848B2 (ja) | 2010-07-21 | 2014-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体及びそれらの製造方法 |
US8381965B2 (en) | 2010-07-22 | 2013-02-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal compress bonding |
US8104666B1 (en) * | 2010-09-01 | 2012-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Thermal compressive bonding with separate die-attach and reflow processes |
JP5614217B2 (ja) * | 2010-10-07 | 2014-10-29 | デクセリアルズ株式会社 | マルチチップ実装用緩衝フィルム |
JP5592820B2 (ja) * | 2011-03-15 | 2014-09-17 | 積水化学工業株式会社 | 半導体チップ実装体の製造方法、積層シート及び半導体チップ実装体 |
DE102012213651B3 (de) * | 2012-08-02 | 2013-08-01 | Keiper Gmbh & Co. Kg | Haltevorrichtung und Verfahren zum Betrieb einer Haltevorrichtung |
JP5406974B2 (ja) * | 2012-12-03 | 2014-02-05 | デクセリアルズ株式会社 | 熱圧着装置及び電気部品の実装方法 |
JP2015053418A (ja) * | 2013-09-09 | 2015-03-19 | 株式会社東芝 | 半導体製造装置 |
DE102015120156B4 (de) * | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung |
CN106785802B (zh) * | 2016-12-29 | 2019-03-29 | 武汉数字工程研究所(中国船舶重工集团公司第七0九研究所) | 一种免焊型高密连接器的压接方法 |
CN112310262A (zh) * | 2020-11-18 | 2021-02-02 | 深德彩科技(深圳)股份有限公司 | 用于led灯板的压合装置及压合方法 |
US20230268312A1 (en) * | 2022-02-18 | 2023-08-24 | Bae Systems Information And Electronic Systems Integration Inc. | Soft touch eutectic solder pressure pad |
Family Cites Families (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US994094A (en) * | 1910-07-21 | 1911-05-30 | Richard Max Eaton | Portable-lamp apparatus. |
US3350552A (en) * | 1965-03-05 | 1967-10-31 | Paul A Lawrence | Illuminating device for a person's head |
US3634676A (en) * | 1970-03-23 | 1972-01-11 | Angelo Castellano | Combined spectacle frame and light |
US3699640A (en) * | 1970-12-01 | 1972-10-24 | Western Electric Co | Compliant bonding |
US4234910A (en) * | 1978-03-20 | 1980-11-18 | Price Linda D | Head-supported illumination device |
US4195328A (en) * | 1978-06-19 | 1980-03-25 | Harris William R Jr | Open vehicle lighting system utilizing detachable vehicle operator helmet mounted light |
US4521831A (en) * | 1984-01-18 | 1985-06-04 | Thayer John R | Protective helmet with dual adjustment illumination means |
US4616297A (en) * | 1985-10-18 | 1986-10-07 | Liu Ju Fu | Spectacles-like illuminating device |
US4793007A (en) * | 1987-06-15 | 1988-12-27 | Barnett Elben R | Safety helmet and adjustable light |
US4891736A (en) * | 1988-02-04 | 1990-01-02 | Adam Gouda | Signal helmet |
GB2216246B (en) * | 1988-03-30 | 1991-11-20 | Jean Jacques Evendon | Lamp for use with a protective helmet having a visor. |
US4999747A (en) * | 1989-06-21 | 1991-03-12 | Jiann Shyong Chen | Flash hair pin |
US5207500A (en) * | 1991-08-26 | 1993-05-04 | Obdulio Rios | Motorcycle helmet with headlights |
EP0539041B1 (en) * | 1991-10-03 | 1997-06-18 | Andrew L. Gold | High voltage power supply |
ATE157845T1 (de) * | 1991-12-11 | 1997-09-15 | Gear L A Inc | Druckbetätigtes lichtausstrahlendes modul und damit ausgerüsteter sportschuh |
JP2001501547A (ja) * | 1992-06-12 | 2001-02-06 | アルミナム カンパニー オブ アメリカ | 非平面を有する多層構造の製造方法 |
US5224772A (en) * | 1992-11-02 | 1993-07-06 | Fustos Vincent E | Illuminated dive mask |
US5658065A (en) * | 1993-03-10 | 1997-08-19 | Jamieson; Jim | Flashlight holder for protective helmets, hardhats or the like |
CA2116634C (en) * | 1993-03-16 | 1998-06-30 | Richard N. Case | Helmet flashlight retainer |
US5408393A (en) * | 1993-11-26 | 1995-04-18 | Becker; Kenneth | U-shaped helmet light |
US5427301A (en) * | 1994-05-06 | 1995-06-27 | Ford Motor Company | Ultrasonic flip chip process and apparatus |
US5564128A (en) * | 1994-10-03 | 1996-10-15 | Richardson; Patrick J. | Safety helmet with electroluminescent lamp |
US5553325A (en) * | 1994-12-12 | 1996-09-10 | Gutierrez; Shelley S. | Hat with adjustable dual visor |
US5689830A (en) * | 1995-04-12 | 1997-11-25 | Pflum; Trish Winsche | Retractable visor |
US5510961A (en) * | 1995-05-31 | 1996-04-23 | Peng; Yu-Lin | Cap structure with sound recording and generating functions and warning lights |
TW340898B (en) * | 1995-07-10 | 1998-09-21 | Leica Inc | Zero clearance bearing |
US5743621A (en) * | 1995-11-01 | 1998-04-28 | Mantha; Robert L. | Illuminated safety helmet |
JP3842362B2 (ja) | 1996-02-28 | 2006-11-08 | 株式会社東芝 | 熱圧着方法および熱圧着装置 |
US5911494A (en) * | 1996-03-13 | 1999-06-15 | Lary; Banning G. | Cap with removable halide light |
US5741060A (en) * | 1996-08-28 | 1998-04-21 | Johnson; Thomas R. | Baseball cap light |
US5688039A (en) * | 1996-09-10 | 1997-11-18 | Johnson; Lyndon F. | Pivoting projection beam safety helmet |
US6044495A (en) * | 1997-01-21 | 2000-04-04 | Louis Ellman | Detachable visor cover for baseball caps |
US6009555A (en) * | 1997-06-25 | 2000-01-04 | Siprut; Leonard Albert | Multiple component headgear system |
JP3298810B2 (ja) * | 1997-07-09 | 2002-07-08 | 株式会社新川 | ダイボンディング装置 |
US6244721B1 (en) * | 1997-12-24 | 2001-06-12 | Mark F. Rodriguez | Illuminated helmet device |
US6056413A (en) * | 1997-12-29 | 2000-05-02 | Urso; Charles L. | Cap lamp |
US6113243A (en) * | 1998-06-19 | 2000-09-05 | Saul; James D. | Driver information lights |
JP4077982B2 (ja) * | 1998-06-26 | 2008-04-23 | 日機装株式会社 | 加圧成形用型 |
SG102032A1 (en) * | 1998-07-01 | 2004-02-27 | Seiko Epson Corp | Semiconductor device and method of its manufacture |
US6032291A (en) * | 1998-12-29 | 2000-03-07 | Asenguah; Augustus | Solar powered head cooling device |
JP3325000B2 (ja) * | 1999-05-28 | 2002-09-17 | ソニーケミカル株式会社 | 半導体素子の実装方法 |
US6283620B1 (en) * | 1999-07-16 | 2001-09-04 | James F. Taylor | Light for an individual engaged in a sport activity |
JP3594120B2 (ja) * | 1999-10-28 | 2004-11-24 | シャープ株式会社 | 半導体装置の製造方法及びボンディング用加圧治具 |
JP2001230528A (ja) * | 2000-02-15 | 2001-08-24 | Sony Corp | 実装装置及び実装方法 |
US6439733B1 (en) * | 2000-04-13 | 2002-08-27 | Ernst W Fischer | Removable helmet light system |
JP4513235B2 (ja) * | 2001-05-31 | 2010-07-28 | ソニー株式会社 | フリップチップ実装装置 |
KR100889283B1 (ko) * | 2001-09-12 | 2009-03-17 | 니기소 가부시키가이샤 | 회로소자의 실장방법 및 가압장치 |
JP4718734B2 (ja) * | 2001-09-12 | 2011-07-06 | 日機装株式会社 | 回路素子の実装方法 |
TW504812B (en) | 2001-10-26 | 2002-10-01 | Ind Tech Res Inst | Method of using non-conductive adhesive to bond integrated circuit with board and its assembling structure |
JP2003152021A (ja) * | 2001-11-09 | 2003-05-23 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
JP4086222B2 (ja) * | 2002-03-12 | 2008-05-14 | 信越化学工業株式会社 | 耐熱熱伝導性熱圧着用シリコーンゴムシート |
US6605491B1 (en) | 2002-05-21 | 2003-08-12 | Industrial Technology Research Institute | Method for bonding IC chips to substrates with non-conductive adhesive |
USD489165S1 (en) * | 2002-11-06 | 2004-05-04 | Michael Waters | Lighted hat |
US6721962B1 (en) * | 2003-02-19 | 2004-04-20 | Michael Polaire | Hat with brim light |
US6935761B2 (en) * | 2003-06-25 | 2005-08-30 | Carl R. Vanderschuit | Lighted hat |
-
2003
- 2003-07-11 JP JP2003195684A patent/JP3921459B2/ja not_active Expired - Lifetime
-
2004
- 2004-07-08 WO PCT/JP2004/009726 patent/WO2005006430A1/ja active Application Filing
- 2004-07-08 KR KR1020067000575A patent/KR101105948B1/ko active IP Right Grant
- 2004-07-08 TW TW093120441A patent/TWI296905B/zh active
- 2004-07-08 CN CN2008102144331A patent/CN101350324B/zh not_active Expired - Lifetime
- 2004-07-08 EP EP04747194.1A patent/EP1646081B1/en not_active Expired - Lifetime
- 2004-07-08 CN CNB2004800198375A patent/CN100459080C/zh not_active Expired - Lifetime
-
2006
- 2006-01-06 US US11/327,784 patent/US7556190B2/en not_active Expired - Lifetime
-
2009
- 2009-03-30 HK HK09103002.1A patent/HK1125226A1/xx not_active IP Right Cessation
- 2009-05-15 US US12/466,977 patent/US7703657B2/en not_active Expired - Lifetime
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101524008B (zh) * | 2006-10-02 | 2010-12-22 | 松下电器产业株式会社 | 部件压接设备控制方法、部件压接设备和测量工具 |
US8296939B2 (en) | 2008-08-08 | 2012-10-30 | Sony Chemical & Information Device Corporation | Mounting method using dilatancy fluid |
CN101810067B (zh) * | 2008-08-08 | 2013-07-10 | 索尼化学&信息部件株式会社 | 压接装置、压接方法、实装体及按压板 |
CN102456590A (zh) * | 2010-10-18 | 2012-05-16 | 东京毅力科创株式会社 | 接合装置及接合方法 |
CN102456590B (zh) * | 2010-10-18 | 2014-07-16 | 东京毅力科创株式会社 | 接合装置及接合方法 |
CN104025273B (zh) * | 2011-11-07 | 2016-12-21 | 迪睿合电子材料有限公司 | 连接装置、连接构造体的制造方法、芯片堆叠部件的制造方法及电子部件的安装方法 |
CN104025273A (zh) * | 2011-11-07 | 2014-09-03 | 迪睿合电子材料有限公司 | 连接装置、连接构造体的制造方法、芯片堆叠部件的制造方法及电子部件的安装方法 |
CN107004614A (zh) * | 2014-09-29 | 2017-08-01 | 丹佛斯硅动力有限责任公司 | 烧结装置 |
CN107004614B (zh) * | 2014-09-29 | 2019-08-30 | 丹佛斯硅动力有限责任公司 | 烧结装置 |
US10483229B2 (en) | 2014-09-29 | 2019-11-19 | Danfoss Silicon Power Gmbh | Sintering device |
US10814396B2 (en) | 2014-09-29 | 2020-10-27 | Danfoss Silicon Power Gmbh | Sintering tool and method for sintering an electronic subassembly |
US10818633B2 (en) | 2014-09-29 | 2020-10-27 | Danfoss Silicon Power Gmbh | Sintering tool for the lower die of a sintering device |
US11776932B2 (en) | 2014-09-29 | 2023-10-03 | Danfoss Silicon Power Gmbh | Process and device for low-temperature pressure sintering |
Also Published As
Publication number | Publication date |
---|---|
EP1646081A1 (en) | 2006-04-12 |
US7703657B2 (en) | 2010-04-27 |
CN101350324B (zh) | 2010-09-01 |
KR20060035736A (ko) | 2006-04-26 |
US20090230171A1 (en) | 2009-09-17 |
HK1125226A1 (en) | 2009-07-31 |
KR101105948B1 (ko) | 2012-01-18 |
EP1646081A4 (en) | 2010-06-16 |
TW200505299A (en) | 2005-02-01 |
EP1646081B1 (en) | 2018-09-05 |
US7556190B2 (en) | 2009-07-07 |
JP3921459B2 (ja) | 2007-05-30 |
TWI296905B (en) | 2008-05-11 |
WO2005006430A1 (ja) | 2005-01-20 |
US20060113356A1 (en) | 2006-06-01 |
CN100459080C (zh) | 2009-02-04 |
CN101350324A (zh) | 2009-01-21 |
JP2005032952A (ja) | 2005-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1823409A (zh) | 电气部件的安装方法和安装装置 | |
CN1303646C (zh) | 增强板粘着装置 | |
CN1076872C (zh) | 载片及其制造方法和安装方法 | |
CN1262784A (zh) | 半导体装置及其制造方法、电路基板和电子装置 | |
CN1324701C (zh) | 具有窄间距化的内引线的半导体装置 | |
CN1110078C (zh) | 半导体元件的安装方法 | |
CN1275246A (zh) | 半导体装置及其制造方法、电路基板和电子装置 | |
CN1242373C (zh) | 矩阵型显示装置 | |
CN1477704A (zh) | 弹性导电树脂及电子装置 | |
CN1434980A (zh) | 微粒子配置薄膜、导电连接薄膜、导电连接构造体以及微粒子的配置方法 | |
CN1605903A (zh) | 各向异性导电材料体、显示设备、用于制造该显示设备的方法以及导电构件 | |
CN1690813A (zh) | 电子零件的连接构造 | |
CN1767177A (zh) | 半导体器件以及电子设备 | |
CN1340851A (zh) | 电子器件及其制造方法 | |
CN1882224A (zh) | 配线基板及其制造方法 | |
CN1815733A (zh) | 半导体装置及其制造方法 | |
JP2001053110A (ja) | 半導体素子の実装方法及び実装装置 | |
CN1808712A (zh) | 半导体装置、显示模块以及半导体装置的制造方法 | |
CN1220260C (zh) | 半导体装置及其制造方法和印刷掩膜 | |
CN1155997C (zh) | 各向异性导电膜、半导体芯片的安装方法和半导体装置 | |
CN1678175A (zh) | 电路部件模块及其制造方法 | |
CN1734757A (zh) | 电子回路装置 | |
CN1976557A (zh) | 电路基板装置及基板间的连接方法 | |
CN1644006A (zh) | 固定/传送夹具以及固定/传送方法 | |
CN1665375A (zh) | 各向异性导电薄板及其制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20090204 |