CN101810067B - 压接装置、压接方法、实装体及按压板 - Google Patents

压接装置、压接方法、实装体及按压板 Download PDF

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CN101810067B
CN101810067B CN2009800004033A CN200980000403A CN101810067B CN 101810067 B CN101810067 B CN 101810067B CN 2009800004033 A CN2009800004033 A CN 2009800004033A CN 200980000403 A CN200980000403 A CN 200980000403A CN 101810067 B CN101810067 B CN 101810067B
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pressing part
electronic component
compression bonding
crimped
thing
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CN101810067A (zh
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古田和隆
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Dexerials Corp
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Sony Chemical and Information Device Corp
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Abstract

本发明提供一种压接装置，该压接装置在基板上压接实装高度相异的电子元件时，或者对背面实装了电子元件的基板压接实装其他的电子元件的时候，也能对压接部施加均匀的压力。压接装置100具有作为第1按压部分的下部按压部分102和作为第2按压部分的上部按压部分104，按压被下部按压部分102及上部按压部分104夹着的譬如基板及多个电子元件，进行基板和多个电子元件的压接，下部按压部分102或上部按压部分104具有胀流型流体116。

Description

压接装置、压接方法、实装体及按压板
【技术领域】
本发明涉及压接装置、压接方法、实装体及按压板。本发明尤其涉及将高度相异的电子元件压接实装在基板上时，或者对在背面实装了电子元件的基板上压接实装其他的电子元件的时候，也能对压接部施加均匀的压力的压接装置、压接方法、实装体及按压板。另外，本申请与下列日本申请有关。对于认可通过参照文献编入内容的指定国，通过参照将以下日本专利申请记载的内容编入本申请，作为本申请的一部分。
专利申请2008-206217申请日2008年8月8日
专利申请2008-242946申请日2008年9月22日
【背景技术】
目前，公知的有在压接装置的头部或者托台上装备了硅橡胶等合成橡胶的压接装置(如，专利文献1及专利文献2)。包含合成橡胶的压接装置因为能对基板一揽子压接高度不相同的多个电子元件，所以即使在过去因为电子元件的凹凸不平而不能使用金属制的头的情况下也可以用。通过采用配备了合成橡胶的压接装置进行压接，电子元件和基板的连接可靠性也得到提高。
【专利文献1】特开2007-227622号公报
【专利文献2】专利3921459号
但是，最近，寻求一种在加速精密螺距连接的同时，在实装方法中也能对应精密螺距连接的连接方法。另外，IC的高密度实装进步，以在基板电极的内部备置有零部件的状态进行压接工序的情况也很多。在这样的情况下也希望能够实现高可靠性的连接的实装。
【发明内容】
为了解决上述课题，在本发明的第1形态中，提供一种压接装置，其具有第1按压部分和第2按压部分，是按压被夹在上述第1按压部分及上述第2按压部分间的第1被压接物及第2被压接物，并压接上述第1被压接物和上述第2被压接物的压接装置，上述第1按压部分或上述第2按压部分具有胀流型流体。或者，提供具备第1按压部分和第2按压部分，用上述第1按压部分及上述第2按压部分进行压接的压接装置，上述第1按压部分或上述第2按压部分具有胀流型流体。
在上述压接装置中，上述第1按压部分或上述第2按压部分可以具有加热部。在这种情况下，上述加热部可以对第1被压接物或第2被压接物进行加热。在上述压接装置中，上述第1按压部分及上述第2按压部分大体上被水平配置，上述第1按压部分具有上述胀流型流体(Dilatancy)，上述第2按压部分可以配置在上述第1按压部分的上方。在上述压接装置中，还具有覆盖上述胀流型流体表面的遮盖片、搬送上述遮盖片的搬送部、配置在上述第1按压部分端部，用于抑制所述胀流型流体和遮盖片一起被搬送的刮平部；上述第1按压部分及上述第2按压部分可以隔着遮盖片进行上述压接。上述第1按压部分及上述第2按压部分可以按压被该第1按压部分及该第2按压部分夹持的第1被压接物及第2被压接部物。
在本发明的第2形态中，提供一种压接方法，包括准备第1被压接物及第2被压接物的准备步骤、调整上述第1被压接物和上述第2被压接物的相对的位置关系的步骤、及将上述第1被压接物及上述第2被压接物夹在第1按压部分和第2按压部分之间并进行按压的步骤，其中上述第1按压部分或上述第2按压部分具有胀流型流体。或者，可以提供具有调整上述第1被压接物和上述第2被压接物的相对的位置关系的步骤、及将上述第1被压接物及上述第2被压接物夹在第1按压部分和第2按压部分之间并进行按压的步骤的压接方法，其中上述第1按压部分或上述第2按压部分具有胀流型流体。在上述压接方法中，还可以包括在调整上述位置关系的步骤之后，以上述第1被压接物、各向异性导电膜、上述第2被压接物的顺序进行配置的步骤。
在本发明的第3形态中，提供一种实装体，该实装体具有第1电子元件和第2电子元件，是调整上述第1电子元件和上述第2电子元件的相对位置关系，将上述第1电子元件及上述第2电子元件夹在至少一方有胀流型流体的第1按压部分及第2按压部分之间，按压后获得的实装体。
在本发明的第4形态中，提供一种实装体，该实装体具有第1电子元件、各向异性导电膜和第2电子元件，是调整上述第1电子元件和上述第2电子元件的相对位置关系，将第1电子元件、各向异性导电膜、第2电子元件按这个顺序配置，将上述第1电子元件及上述第2电子元件夹在至少一方有胀流型流体的第1按压部分及第2按压部分之间，按压后获得的实装体。
在本发明的第5形态中，提供一种实装体，该实装体具有基板和实装在上述基板上的多个电子元件，上述多个电子元件在大体上平行于主面的方向上，按第1电子元件，第2电子元件及第3电子元件的这个顺序设置，在大体上垂直于上述基板的主面的方向上，上述第1电子元件及第3电子元件与上述第2电子元件的距离的最大值是1mm以上，在大体上平行于上述基板的主面的方向，上述第1电子元件与上述第3电子元件的距离的最小值为0.8mm以下。
在本发明的第6形态中，提供一种按压板，该按压板具有胀流型流体及保持上述胀流型流体的基台，使用在压接多个电子元件并电耦合的压接装置上的按压板。
另外，上述发明的概要并未全部列举出本发明的必要特征，这些特征群的辅助结合也能够成本发明。
【具体实施方式】
以下，通过发明的实施方式说明本发明。但以下实施方式并不是对权利要求书所涉及的发明的限定，另外，在实施方式中说明的特征组合也并非全部都是发明的解决手段所必须的。
图1，表示本实施方式的压接装置100的一个例子。压接装置100在基板上压接多个电子元件，并电耦合基板和电子元件。另外，在本说明书中，所谓的「电子元件」为包含「线路基板」的物体。配线路基板，可以列举的有在玻璃环氧、电木板(ベ一ク板)等的绝缘板或聚酰亚胺等柔性绝缘片上设有铜箔等导电膜的线路。在图1中记载的重力方向为下方向。
压接装置100具有下部按压部分102、上部按压部分104、可动部件106、遮盖片108、搬送部110、电源111、控制部112及按住部件114。下部按压部分102包括胀流型流体116、基台118及加热部120。
下部按压部分102可以是第1按压部分的一个例子，具有作为被压接装置100使用的按压板的作用。在下部按压部分102里具有的胀流型流体116，可以是一施加切断应力(滑动应力)就从液体状态变化为固体状态的物质。如果是小的剪切应力带有流动性，不过，剪切应力如果变得很大则变成固体状，因此，能够按照被压接物的形状进行变形的同时，也能成为被压接物的托台。胀流型流体116是粒直径统一的粉状体，优选真球度为1.5μm以下，平均粒直径0.05μm～30μm的粉状体。真球度可根据JIS B 1501规定的滚珠轴承用钢球的测量方法测得。
胀流型流体116一方面在缓慢地加压时，按照被压接物的形状变化接触面的形状，另一方面适当选择加压力的话，会产生对适度固定加压力的抗力。因而，胀流型流体116能对被压接物增加均匀的压力，而不是让被压接物的全体浸入胀流型流体116中。
基台118保持胀流型流体116。基台118可以用作托台发挥作用以保持胀流型流体116，可以使用不会使胀流型流体116劣化并不被胀流型流体116劣化的材料，比如可以是金属。基台118在端部可以包含刮平部122。刮平部122利用推压部件114压住遮盖片108，抑制由于更换遮盖片108时的搬送而使胀流型流体116与遮盖片108一起被搬送。
加热部120加热被压接物。加热部120譬如可以是由电阻加热的电热器，由油灯加热的卤油灯。加热部120由电源111供给电力，电源111由控制部112控制。本实施方式中，加热部120被配置在基台118内部，通过胀流型流体116加热被压接物。或者，加热部120也可以被配置在胀流型流体116内部，通过胀流型流体116加热被压接物。这种情况下，胀流型流体116需要具有耐热性。因为在下部按压部分102上具备加热部120，所以在上部按压部分104上不需要具备加热部，可以简略化上部按压部分104结构。如果上部按压部分104上下移动，则结构简略化的好处很大。
上部按压部分104可以是第2压接部的一个例子，由可动部件106上下方向移动。上部按压部分104譬如可以是金属等的非弹性体或合成橡胶等的弹性体。上部按压部分104被配置在下部按压部分102的上方，下部按压部分102及上部按压部分104大体上被水平配置。下部按压部分102及上部按压部分104按压被下部按压部分102及上部按压部分104夹持的被压接物，进行被压接物压接。
如果在作为被压接物的基板里面已经被实装了电子元件的情况下，上部按压部分104可以具有对应于基板里面被实装的电子元件的形状的凹凸。再者，本实施方式中在下部按压部分102上具有加热部120，不过，可以在下部按压部分102及上部按压部分104任何一个上具有加热部120。在上部按压部分104上不预备加热部的情况下，可以对上部按压部分104的按压表面采用耐热性缺乏的合成橡胶材。通过采用合成橡胶材料，即使被压接物具有凹凸也能对被压接物进行均匀地按压。下部按压部分102或上部按压部分104可以具有冷却部。
可动部件106可把上部按压部分104上下方向移动。通过可动部件106把上部按压部分104向下方向移动，下部按压部分102及上部按压部分104夹住被压接物，按压被压接物。
遮盖片108覆盖胀流型流体116表面。通过在胀流型流体116和电子元件之间插入遮盖片108，能防止胀流型粉状体附着在作为被压接物的电子元件上。下部按压部分102通过遮盖片108与上部按压部分104一起夹住被压接物，遮盖片108按照被压接物的形状延展。遮盖片108可以选择能按照被压接物的形状延展且不破损的材料及厚度。譬如，聚四氯乙烯(PTFE)片，厚0.05mm。遮盖片108可以在每次压接操作中更换，这种情况下，可以是譬如沿附图上的箭头符号A1方向的长的片状。
搬送部110譬如可以在箭头A2方向上卷起遮盖片108来搬送。搬送部110可以在每次压接时交换覆盖胀流型流体116表面的遮盖片108。在交换时，刮平部122抑制胀流型流体116与遮盖片108一起被搬送。
控制部112控制可动部件106、搬送部110及电源111的运作。在图1中控制部112与可动部件106及搬送部110的一方连接，但也可控制没与控制部112连接的可动部件106及搬送部110的其他方的运作。
图2表示在压接工序中的实装体的剖面的一个例子。基板202可以是第1被压接物的一个例子。基板202在大体上平行于主面的方向上配置第1电子元件206、第2电子元件210及第3电子元件214。基板202譬如可以是塑料、高分子薄膜、硅基板、玻璃这些的层积。基板202可以具有电连接基板202和其他电子元件等的导电部204。
第1电子元件206可以是第2被压接物的一个例子。第1电子元件206有连接于基板202等的功能。第1电子元件206可以具有电连接第1电子元件206和基板202等的导电部208。
第2电子元件210可以是第2被压接物的一个例子。第2电子元件210有连接于基板202等的功能。第2电子元件210可以具有电连接第2电子元件210和基板202等的导电部212。
第3电子元件214可以是第2被压接物的一个例子。第3电子元件214有连接于基板202等的功能。第3电子元件214可以具有电连接第3电子元件214和基板202等的导电部216。
第1电子元件206、第2电子元件210及第3电子元件214，可以用分配器将焊接的球状电极排列成格子状的BGA(球格子阵列Ball grid array)或代替BGA的球状电极将平面电极垫排列成格子状的LBA(Land grid array)。在与基板202主面大体上垂直的方向，第1电子元件206及第3电子元件214和第2电子元件210的距离的最大值可以是1mm以上，譬如可以是1mm～1.5mm。
在与基板202的主面平行的方向上第1电子元件206和第2电子元件210的距离的最小值及第2电子元件210和第3电子元件214的距离的最小值可以是0.05mm左右。在与基板202主面大体平行的方向上当第2电子元件210的幅度是0.2mm的情况下，第1电子元件206和第3电子元件214的距离可以设定成0.3mm左右，譬如，可以设定成0.3mm～0.8mm。但是，当电子元件的幅度的最小值达到不满0.2mm的情况下，与基板202主面大体平行的方向上，第1电子元件206和第3电子元件214的距离的最小值能够达到比0.3mm还小的值。
各向异性导电膜220通过被加压及加热，能够电气或物理性地连接譬如基板202和第1电子元件206、第2电子元件210及第3电子元件214。当各向异性导电膜220压接了被压接部件的时候，可以用粘接树脂222填满被压接部件间，使其具有充分的厚度。各向异性导电膜220可以具有发挥作为粘着剂作用的粘接树脂222和被粘接树脂222分散了的导电性粒子224。各向异性导电膜220譬如可以是各向异性导电性薄膜(ACF)以及各向异性导电性粘贴剂(ACP)。
各向异性导电膜220，通过基板202和第1电子元件206、第2电子元件210及第3电子元件214之间被加压而被压，导电性粒子224电连接基板202与第1电子元件206、第2电子元件210及第3电子元件214。各向异性导电膜220如果在基板202和第1电子元件206、第2电子元件210及第3电子元件214之间被加热的话，由于粘接树脂222硬化，基板202和第1电子元件206、第2电子元件210及第3电子元件214被物理性地连接。在基板202和第1电子元件206、第2电子元件210及第3电子元件214之间，也可以配置不混有导电性粒子的环氧树脂胶片等的能够NCF连接的部件，以替代各向异性导电膜220。
图2表示经过了以下步骤后的状态，即，准备基板202以及第1电子元件206、第2电子元件210及第3电子元件214的步骤；调整基板202和第1电子元件206、第2电子元件210及第3电子元件214的相对的位置关系的步骤；按顺序配置基板202、各向异性导电膜220、第1电子元件206和第2电子元件210及第3电子元件214的步骤。
图3表示在压接工序中的实装体的剖面的一个例子。图3表示将基板202及第1电子元件206、第2电子元件210及第3电子元件214，夹在下部按压部分102及上部按压部分104间，进行按压的步骤。实装体300通过夹在具有胀流型流体116的下部按压部分102及上部按压部分104间，加压及加热而获得。
图4表示在其他的压接工序中的实装体的剖面的一个例子。基板202具有的导电部402，具有导电性，电连接基板202和其他的电子元件等。柔性印刷电路404，可以是第1被压接物及第2被压接物的一个例子。柔性印刷电路404譬如可以用厚度12μm～50μm的薄膜状的绝缘体作为基材。柔性印刷电路404可以具有电连接柔性印刷电路404和基板202等的导电膜406。导电膜406譬如可以是铜。
图4表示经过了以下步骤后的状态，即准备基板202及柔性印刷电路404的步骤；调整基板202和柔性印刷电路404的相对的位置关系的步骤；及按顺序配置基板202、各向异性导电膜220、柔性印刷电路404的步骤。
图5表示在其他的压接工序中的实装体的剖面的一个例子。图5表示将基板202及柔性印刷电路404夹在下部按压部分102及上部按压部分104间进行按压的步骤。实装体500通过夹在具有胀流型流体116的下部按压部分102及上部按压部分104间，加压及加热而获得。
图6表示本实施方式的压接装置600的变更例的概要。压接装置600具有的上部按压部分602可以包括胀流型流体604、遮盖包606及基台608。
胀流型流体604可以和胀流型流体116同样制成。遮盖包606可以是用与第1实施形态的遮盖片108同样的材料做成的袋状的部件。遮盖包606将胀流型流体604封入袋内部，只要胀流型流体604不向袋外部泄出就可以。基台608只要能和第1实施方式的基台118同样，保持胀流型流体604作为上部按压部分602发挥作用的状态即可。
图7表示在使用了压接装置600的压接工序中的实装体的剖面的一个例子。基板202包含的导电部702，具有着导电性，电连接基板202和其他的电子元件等。电子元件704可以是第1被压接物及第2被压接物的一个例子。电子元件704有连接于基板202的功能。电子元件704可以具有电连接电子元件704和基板202等的导电部706。
图7表示在使用压接装置600的压接工序中，经过了以下步骤后的状态，即准备基板202及多个电子元件704的步骤；调整基板202和多个电子元件704的相对的位置关系的步骤；及按基板202、各向异性导电膜220、多个电子元件704的这个顺序配置的步骤。
图8表示使用了压接装置600的压接工序的实装体的剖面的一个例子。图8表示将基板202及多个电子元件704夹在下部按压部分102及上部按压部分602间，进行按压的步骤。实装体800通过夹在具有胀流型流体116的下部按压部分102及具有胀流型流体604的上部按压部分602间，加压及加热而获得
【实施例1】
图9，表示实施例1的实装体300的剖面的一个例子。实装体300是通过压接基板202和第1电子元件206、第2电子元件210及第3电子元件214而制成。准备了耐热性玻璃基材环氧树脂层积板作为基板202。准备了由耐热性玻璃基材环氧树脂层积做为材料的具有3×2mm2表面积及1.35mm高度的虚拟元件作为第1电子元件206及第3电子元件214。准备了具有0.35mm高度的1005尺寸0Ω跃迁电阻作为第2电子元件210。第2电子元件210幅度是0.5mm。准备了ACF作为各向异性导电膜220。
采用沙填充架台作为基台118，使用沙作为胀流型流体116。沙填充架台填充沙子后，作为下部按压部分102。填充沙填充架台的沙子的平均颗粒直径是0.25mm。使用了金属头作为上部按压部分104。
调整耐热性玻璃基材环氧树脂层积板与虚拟元件及0Ω跃迁电阻的相对位置关系，将耐热性玻璃基材环氧树脂层积板、ACF、虚拟元件及0Ω跃迁电阻按这个顺序配置。把耐热性玻璃基材环氧树脂层积板、虚拟元件及0Ω跃迁电阳.夹在沙填充架台及金属头之间，以180℃的温度且2MPa的压力热压接20秒钟，制成实装体300。作为比较例1，采用陶瓷制架台作为下部按压部分102，采用弹性体作为上部按压部分104，以与实施例1同样的条件热压接制成实装体。
围绕将虚拟元件和0Ω跃迁电阻的高度差调整到1.0mm的时候和调整到1.5mm的时候，来对0Ω跃迁电阻的导通接触电阻进行评价。虚拟元件和0Ω跃迁电阳的高度差H用图9箭头符号H来表示。
【表1】
Figure G2009800004033D00111
表1，表示出了对实施例1的实装体300及比较例1的实装体的导通接触电阻的评价结果。「○」表示导通接触电阻在0.2Ω以下，判断为可导通的状态，「×」表示导通接触电阻超过0.2Ω，判断为不能导通的状态。
在比较例1中，如果把虚拟元件(第1电子元件206及第3电子元件214)与0Ω跃迁电阻(第2电子元件210)的高度差H调整到1.0mm时，虚拟元件的间隔D1不打开到13mm，即虚拟元件和0Ω跃迁电阻的间隔不打开到0.4mm的话，则不导通。与此相对，实施例1中，即使虚拟元件的间隔D1窄到0.9mm，即虚拟元件和0Ω跃迁电阻的间隔窄到0.2mm也为导通。在比较例1中，如果调整虚拟元件和0Ω跃迁电阻的高度差H到1.5mm，虚拟元件的间隔D1不打开到15mm，即虚拟元件和0Ω跃迁电阻的间隔不开到0.5mm的话，则不导通，与此相对，在实施例1中，虚拟元件的间隔D1即使窄到0.9mm，即虚拟元件和0Ω跃迁电阻的间隔窄到0.2mm也为导通。表1评价结果说明使用本实施方式的技术能够防止对实装体进行压接时的零部件的压接不良。
【实施例2】
准备了以200μm的间距具有导电部的层积了耐热性玻璃基材环氧树脂的TEG(Test Element Group)基板作为基板202。基板202底部连接了1005尺寸的电阳。准备了以200μm间距具有导电部的柔性印刷电路作为柔性印刷电路404。
在酚醛树脂(PKHH，Union Carbide公司制)30质量部、液状环氧树脂(EP828，日本环氧树脂公司制)10质量部、硅烷偶联剂(A-187，Momentive Performance Materials公司制)1质量部、橡胶成分(SG80H，Nagase Chemtech公司制)10质量部、导电性粒子(Ni-Au镀金φ5μm，索尼化学&信息部件株式会社制)9质量部、硬化剂(HX3941HP，旭化成化学公司制)40质量部里加上甲苯，调整成固体成分50％的树脂溶液，用涂敷棒(a bar coàter)涂在剥离PET薄膜(索尼化学&信息部件株式会社制)上之后，在80℃烤炉上使溶媒干燥，准备作为厚20μm的各向异性导电膜220。
采用沙填充架台作为基台118，使用沙作为胀流型流体116。往沙填充架台填充沙，作为下部按压部分102。填充沙填充架台的沙的平均粒直径是0.25mm。使用了金属头作为上部按压部分104。
调整TEG基板和柔性印刷电路的相对位置关系，按TEG基板、各向异性导电膜220、柔性印刷电路的顺序配置。将TEG基板及柔性印刷电路夹在沙填充台及金属头之间，用190℃的温度且以3MPa的压力热压接10秒钟，制成实装体500。作为比较例2，采用橡胶架台作为下部按压部分102，使用金属头作为上部按压部分104，在与实施例2同样的条件下，热压接制成实装体。作为比较例3，采用具有对应于基板202底部连接的1005R尺寸的电阻的形状的凹凸的不平坦架台作为下部按压部分102，使用金属头作为上部按压部分104，，在与实施例2同样的条件下进行热压接，制成实装体。作为比较例4，在底部没有连接电子元件的TEG基板上热压接柔性印刷电路，制成实装体。
在85℃的温度及RH的湿度的高温高湿85％状况下，做1000hr的期间老化。评价了实施例2、比较例2、比较例3及比较例4的实装体的基板和柔性印刷电路的导通电阻。对导通电阻的评价采用4终端专业管脚。
图10表示实施例2、比较例2、比较例3及比较例4的评价结果。比较例2及比较例3，随着老化时间增长，导通阻抗增大。即，比较例2及比较例3的实装体电连接不稳定。另一方面，实施例2实现了和比较例4同程度地抑制随着老化时间增长导通阻抗的增大。实施例2评价结果证明，通过使用本实施方式的技术，能使实装体的电连接稳定。
在上述的实施方式中，说明了所谓面下降方式的压接装置100及压接装置600。但，压接装置100及压接装置600不仅可以采用面下降方式，也可以采用譬如以在基板202上面配置多个电子装置的状态进行按压的面上升方式。另外，，还可以采用将下部按压部分102及上部按压部分104水平方向对着配置，以基板垂直竖立的状态进行按压的方式。
以上，用实施方式说明了本发明，但本发明的技术范围不受上述实施方式所记载的范围的限定。本领域技术人员明白，可对上述实施方式实施多种多样的变更或改良。根据本申请的权利要求书的记载可明确，实施上述变更和改良后的方式也包含在本发明的技术范围内。
另外，权利要求书、说明书以及附图中表示的装置、系统、程序、以及在方法中的动作、次序、步骤，和步骤等的各处理的实施顺序，只要没有特别注明「比…先」、「在…之前」等，或者只要不是后边的处理必须使用前面处理的结果，就可以以任意的顺序实施。有关权利要求书、说明书和附图中的动作流程，为了说明上的方便，使用了「首先、」、「其次」等字样加以说明，但这也不是意味着必须以这个顺序实施。
【附图说明】
【图1】表示本实施方式的压接装置100概要。
【图2】表示在压接工序中的实装体300的剖面的一个例子。
【图3】表示在压接工序中的实装体300的剖面的一个例子。
【图4】表示在压接工序中的实装体500的剖面的一个例子。
【图5】表示在压接工序中的实装体500的剖面的一个例子。
【图6】表示本实施方式的变形例的压接装置600的概要。
【图7】表示在压接工序中的实装体800的剖面的一个例子。
【图8】表示在压接工序中的实装体800的剖面的一个例子。
【图9】表示在实施例1中实装体300的剖面的一个例子。
【图10】表示实施例2的评价结果。
【符号说明】
100压接装置
102下部按压部分
104上部按压部分
106可动部件
108遮盖片
110搬送部
111电源
112控制部
114按住部件
116胀流型流体
118基台
120加热部
122刮平部
202基板
204导电部
206第1电子元件
208导电部
210第2电子元件
212导电部
214电子元件
216导电部
220各向异性导电膜
222粘接树脂
224导电性粒子
300实装体
402导电部
404柔性印刷电路
406导电膜
500实装体
600压接装置
602上部按压部分
604胀流型流体
606遮盖包
608基台
702导电部
704电子元件
706导电部
800实装体

Claims (6)

1.一种压接装置，其包括，
第1按压部分和第2按压部分，
所述第1按压部分或所述第2按压部分具有胀流型流体，所述胀流型流体为粒直径统一的粉状体，
覆盖所述胀流型流体表面的遮盖片，
搬送所述遮盖片的搬送部，
被配置在所述第1按压部分的端部，用于抑制所述胀流型流体与所述遮盖片一起被搬送的刮平部，
所述第1按压部分及所述第2按压部分隔着所述遮盖片进行压接。
2.根据权利要求1所述的压接装置，所述第1按压部分或所述第2按压部分具有加热部。
3.根据权利要求1或2所述的压接装置，
所述第1按压部分及所述第2按压部分大体上水平配置，
所述第1按压部分具有所述胀流型流体，
所述第2按压部分被配置在所述第1按压部分的上方。
4.根据权利要求1至3任一项所述的压接装置，
所述第1按压部分及所述第2按压部分按压被夹在该第1按压部分及该第2按压部分间的第1被压接物及第2被压接物。
5.一种压接方法，包括以下步骤：
调整第1被压接物和第2被压接物的相对位置关系的步骤，其中，所述第1按压部分或所述第2按压部分具有胀流型流体；
搬送覆盖所述胀流型流体表面的遮盖片的步骤；以及，
将所述第1被压接物及所述第2被压接物夹在第1按压部分及第2按压部分之间并隔着所述遮盖片按压的步骤；
被配置在所述第1按压部分的端部的刮平部抑制所述胀流型流体与所述遮盖片一起被搬送。
6.根据权利要求5所述的压接方法，在调整所述位置关系的步骤之后，还包括，将所述第1被压接物、各向异性导电膜、所述第2被压接物，按照这个顺序配置的步骤。
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011109046A (ja) * 2009-11-20 2011-06-02 Sony Chemical & Information Device Corp 実装装置および電子モジュールの製造方法
JP6041463B2 (ja) * 2009-12-25 2016-12-07 デクセリアルズ株式会社 エポキシ樹脂組成物及びそれを用いた接合体の製造方法、並びに接合体
DE102010039749A1 (de) * 2010-08-25 2012-03-01 Robert Bosch Gmbh Verfahren zur Bestückung einer Leiterplatte mit mehreren Bauteilen und elektrische Schaltung mit einer Leiterplatte und darauf montierten mehreren Bauteilen
CN112863732B (zh) * 2014-10-29 2023-01-17 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
TWI581942B (zh) 2015-04-08 2017-05-11 韋僑科技股份有限公司 跨橋裝置與系統及其軟性電路元件跨橋方法
TWI681701B (zh) * 2018-09-03 2020-01-01 活躍科技股份有限公司 節能式壓板機
CN109335675A (zh) * 2018-11-09 2019-02-15 东莞市若渝电子科技有限公司 自动贴球顶机及其工作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1665003A (zh) * 2005-03-14 2005-09-07 西安交通大学 基于压接互连技术的电力电子集成模块的制备方法
CN1823409A (zh) * 2003-07-11 2006-08-23 索尼化学株式会社 电气部件的安装方法和安装装置
CN101111932A (zh) * 2005-02-02 2008-01-23 索尼化学&信息部件株式会社 电气部件的安装装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529117A (en) * 1969-09-11 1970-09-15 Argus Eng Co Soldering apparatus
JPH0690099A (ja) * 1992-06-09 1994-03-29 Ibiden Co Ltd 基板支持用治具
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact
JPH08146451A (ja) * 1994-11-16 1996-06-07 Sony Corp 回路装置の製造装置
JPH10150297A (ja) * 1996-11-18 1998-06-02 Toyo Commun Equip Co Ltd 電子部品装着用サポート治具
JP2002017519A (ja) * 2000-07-06 2002-01-22 Toyo Tire & Rubber Co Ltd 均圧マット
JP2004322490A (ja) * 2003-04-25 2004-11-18 Konica Minolta Photo Imaging Inc 積層体の製造方法及び積層体の製造装置
JP4274126B2 (ja) * 2005-01-18 2009-06-03 パナソニック株式会社 圧着装置および圧着方法
JP4925669B2 (ja) 2006-01-13 2012-05-09 ソニーケミカル＆インフォメーションデバイス株式会社 圧着装置及び実装方法
JP4832107B2 (ja) 2006-02-23 2011-12-07 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
JP2007294607A (ja) * 2006-04-24 2007-11-08 Sony Chemical & Information Device Corp 押圧ヘッド及び押圧装置
JP2008206217A (ja) 2007-02-16 2008-09-04 Yaskawa Electric Corp 半導体スイッチング素子の寿命監視回路を有する半導体電力変換装置
JP2008242946A (ja) 2007-03-28 2008-10-09 Toshiba Corp 電子機器およびキー押下判定方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1823409A (zh) * 2003-07-11 2006-08-23 索尼化学株式会社 电气部件的安装方法和安装装置
CN101111932A (zh) * 2005-02-02 2008-01-23 索尼化学&信息部件株式会社 电气部件的安装装置
CN1665003A (zh) * 2005-03-14 2005-09-07 西安交通大学 基于压接互连技术的电力电子集成模块的制备方法

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US8296939B2 (en) 2012-10-30
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TWI436700B (zh) 2014-05-01
KR20110039510A (ko) 2011-04-19

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