WO2010016170A1 - 圧着装置、圧着方法、実装体および押圧板 - Google Patents

圧着装置、圧着方法、実装体および押圧板 Download PDF

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Publication number
WO2010016170A1
WO2010016170A1 PCT/JP2009/001901 JP2009001901W WO2010016170A1 WO 2010016170 A1 WO2010016170 A1 WO 2010016170A1 JP 2009001901 W JP2009001901 W JP 2009001901W WO 2010016170 A1 WO2010016170 A1 WO 2010016170A1
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Prior art keywords
electronic component
pressing
substrate
bonded
pressing portion
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PCT/JP2009/001901
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English (en)
French (fr)
Inventor
古田和隆
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ソニーケミカル＆インフォメーションデバイス株式会社
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Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to CN2009800004033A priority Critical patent/CN101810067B/zh
Priority to EP09804657.6A priority patent/EP2309834B1/en
Priority to US12/635,651 priority patent/US8296939B2/en
Publication of WO2010016170A1 publication Critical patent/WO2010016170A1/ja
Priority to HK10109179.2A priority patent/HK1143023A1/xx

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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Definitions

  • the present invention relates to a pressure bonding apparatus, a pressure bonding method, a mounting body, and a pressing plate.
  • the present invention applies a uniform pressure to the crimping part even when electronic components having different heights are crimp-mounted on a substrate or when other electronic components are crimp-mounted on a substrate having an electronic component mounted on the back surface.
  • the present invention relates to a crimping apparatus, a crimping method, a mounting body, and a pressing plate that can be applied.
  • This application is related to the following Japanese application. For designated countries where incorporation by reference of documents is permitted, the contents described in the following application are incorporated into this application by reference and made a part of this application.
  • Patent Document 1 and Patent Document 2 Conventionally, a crimping device having an elastomer such as silicon rubber on the head or cradle of the crimping device has been reported (for example, Patent Document 1 and Patent Document 2).
  • a crimping device equipped with an elastomer can be used to batch-bond multiple electronic components with different heights to the board, so it can also be used when conventional metal heads cannot be used due to the unevenness of the electronic components. Can do.
  • By performing pressure bonding using a pressure bonding device equipped with an elastomer the connection reliability between the electronic component and the substrate is also improved.
  • JP 2007-227622 A Japanese Patent No. 3921459
  • a first pressure-bonded body is provided with a first pressing portion and a second pressing portion, and is sandwiched between the first pressing portion and the second pressing portion.
  • a pressure bonding apparatus that presses an object and a second object to be bonded and pressure-bonds the first object to be bonded and the second object to be bonded, wherein the first pressing part or the second pressing part is a dilatancy fluid. Is provided.
  • the said 1st press part or the said 2nd press part is A crimping device having a dilatancy fluid may be provided.
  • the first pressing part or the second pressing part may have a heating part.
  • the heating unit may heat the first object to be bonded or the second object to be bonded.
  • the first pressing portion and the second pressing portion are arranged substantially horizontally, the first pressing portion has the dilatancy fluid, and the second pressing portion is the first pressing portion. It may be arranged further upward.
  • the cover sheet covering the upper surface of the dilatancy fluid, the transport section that transports the cover sheet, and the end of the first pressing section are disposed, and the dilatancy fluid is transported together with the cover sheet.
  • the first pressing portion and the second pressing portion may further perform the pressure bonding via the covering sheet.
  • the first pressing part and the second pressing part may press the first and second objects to be pressed sandwiched between the first pressing part and the second pressing part.
  • the step of preparing the first object to be bonded and the second object to be bonded and the relative positional relationship between the first object to be bonded and the second object to be bonded are adjusted.
  • the step of adjusting the relative positional relationship between the first object to be bonded and the second object to be bonded, the first object to be bonded and the second object to be bonded to the first pressing part and the second pressing part A pressing method including a step of pressing between the first pressing portion and the second pressing portion, wherein the first pressing portion or the second pressing portion includes a dilatancy fluid.
  • compression-bonding method may further comprise the step which arrange
  • the mounting body includes a first electronic component and a second electronic component, and the relative positional relationship between the first electronic component and the second electronic component is adjusted.
  • a mounting body obtained by sandwiching and pressing the first electronic component and the second electronic component between a first pressing portion and a second pressing portion, at least one of which has a dilatancy fluid.
  • a mounting body including a first electronic component, an anisotropic conductive film, and a second electronic component, wherein the first electronic component and the second electronic component are relative to each other.
  • the first electronic component, the anisotropic conductive film, and the second electronic component are arranged in this order, and the first electronic component and the second electronic component are Provided is a mounting body obtained by sandwiching and pressing between a first pressing portion and a second pressing portion, at least one of which has a dilatancy fluid.
  • a mounting body including a substrate and a plurality of electronic components mounted on the substrate, wherein the plurality of electronic components include a first electronic component, a second electronic component, and a first electronic component.
  • the plurality of electronic components include a first electronic component, a second electronic component, and a first electronic component.
  • the maximum value of the distance to the component is 1 mm or more, and the minimum value of the distance between the first electronic component and the third electronic component in the direction substantially parallel to the main surface of the substrate is 0.8 mm or less.
  • a pressing plate that is used in a crimping device that comprises a dilatancy fluid and a base that holds the dilatancy fluid and that crimps and electrically couples a plurality of electronic components.
  • FIG. 1 shows an example of the crimping apparatus 100 of this embodiment.
  • the crimping apparatus 100 crimps a plurality of electronic components to a substrate and electrically couples the substrate and the electronic component.
  • the term “electronic component” includes “wiring board”. Examples of the wiring board include those having wiring of a conductive film such as copper foil on an insulating plate such as glass epoxy and bake board or a flexible insulating sheet such as polyimide.
  • the gravity direction is described as the downward direction.
  • the crimping device 100 includes a lower pressing portion 102, an upper pressing portion 104, a movable portion 106, a covering sheet 108, a conveying portion 110, a power source 111, a control portion 112, and a pressing member 114.
  • the lower pressing unit 102 includes a dilatancy fluid 116, a base 118, and a heating unit 120.
  • the lower pressing portion 102 may be an example of a first pressing portion and functions as a pressing plate used in the crimping apparatus 100.
  • the dilatancy fluid 116 included in the lower pressing portion 102 may be a substance that changes from a liquid state to a solid state when shearing stress (shear stress) is applied. If the shear stress is small, it has fluidity, but if the shear stress is large, it becomes solid, so that it can be deformed according to the shape of the object to be bonded, and can also be a cradle for the object to be bonded.
  • the dilatancy fluid 116 is a powder having a uniform particle diameter, and is preferably a powder having a sphericity of 1.5 ⁇ m or less and an average particle diameter of 0.05 ⁇ m to 30 ⁇ m.
  • the sphericity can be measured by the measuring method of the ball for ball bearing specified in JIS B 1501.
  • the dilatancy fluid 116 When the dilatancy fluid 116 is gently pressurized, the shape of the contact surface changes in accordance with the shape of the object to be bonded, while if the pressure is appropriately selected, the dilatancy fluid 116 is appropriately solidified and generates a resistance against the pressure. Therefore, the dilatancy fluid 116 can apply a uniform pressure to the object to be bonded without causing the entire object to be pressed to sink into the dilatancy fluid 116.
  • the base 118 holds the dilatancy fluid 116.
  • the base 118 may be a material that does not deteriorate the dilatancy fluid 116 without deteriorating the dilatancy fluid 116, for example, a metal, as long as the base 118 can be maintained in a state of functioning as a pedestal.
  • the base 118 may include a scraping portion 122 at the end. The scraping portion 122 suppresses that the dilatancy fluid 116 is transported together with the cover sheet 108 by the transport when the cover sheet 108 is pressed by the pressing member 114 and the cover sheet 108 is replaced.
  • the heating unit 120 heats the object to be bonded.
  • the heating unit 120 may be, for example, a heater by resistance heating or a halogen lamp by lamp heating.
  • the heating unit 120 is supplied with power by the power source 111, and the power source 111 is controlled by the control unit 112.
  • the heating unit 120 is disposed inside the base 118 and heats the object to be bonded via the dilatancy fluid 116.
  • the heating unit 120 may be disposed inside the dilatancy fluid 116 and heat the object to be bonded via the dilatancy fluid 116. In this case, the dilatancy fluid 116 needs to have heat resistance.
  • the heating part 120 is provided in the lower pressing part 102, it is not necessary to provide the heating part in the upper pressing part 104, and the mechanism of the upper pressing part 104 can be simplified. When the upper pressing portion 104 moves up and down, the merit of simplifying the mechanism is great.
  • the upper pressing portion 104 may be an example of a second pressure bonding portion, and is moved up and down by the movable portion 106.
  • the upper pressing portion 104 may be an inelastic body such as a metal or an elastic body such as an elastomer.
  • the upper pressing portion 104 is disposed above the lower pressing portion 102, and the lower pressing portion 102 and the upper pressing portion 104 are disposed substantially horizontally.
  • the lower pressing part 102 and the upper pressing part 104 press the object to be bonded sandwiched between the lower pressing part 102 and the upper pressing part 104 to crimp the object to be bonded.
  • the upper pressing portion 104 may have unevenness according to the shape of the electronic component mounted on the back surface of the substrate.
  • the lower pressing unit 102 includes the heating unit 120, but either the lower pressing unit 102 or the upper pressing unit 104 may include the heating unit 120.
  • an elastomer material having poor heat resistance can be employed for the pressing surface of the upper pressing part 104. By using an elastomer material, the object to be bonded can be pressed evenly even when the object to be bonded has irregularities.
  • the lower pressing part 102 or the upper pressing part 104 may have a cooling part.
  • the movable part 106 moves the upper pressing part 104 in the vertical direction.
  • the movable portion 106 moves the upper pressing portion 104 downward, the lower pressing portion 102 and the upper pressing portion 104 press the object to be bonded with the object to be bonded interposed therebetween.
  • the covering sheet 108 covers the upper surface of the dilatancy fluid 116. By inserting the covering sheet 108 between the dilatancy fluid 116 and the electronic component, it is possible to prevent the dilatancy powder from adhering to the electronic component that is the object to be bonded.
  • the lower pressing portion 102 sandwiches the object to be bonded together with the upper pressing portion 104 via the covering sheet 108, and the covering sheet 108 extends according to the shape of the object to be bonded.
  • the covering sheet 108 can extend according to the shape of the object to be bonded, and can be selected from a material and thickness that does not break.
  • a polytetrafluoroethylene (PTFE) sheet can be exemplified, and the thickness can be exemplified as 0.05 mm.
  • the covering sheet 108 may be replaced for each crimping operation. In this case, for example, the covering sheet 108 may have a long sheet shape in the direction of an arrow A1 on the drawing.
  • the transport unit 110 transports the covering sheet 108 by winding it, for example, in the direction of arrow A2.
  • the transport unit 110 may replace the covering sheet 108 that covers the upper surface of the dilatancy fluid 116 for each press-bonding.
  • the wear-off part 122 suppresses that the dilatancy fluid 116 is conveyed with the coating sheet 108.
  • the control unit 112 controls operations of the movable unit 106, the transport unit 110, and the power source 111.
  • the control unit 112 is connected to one of the movable unit 106 and the transport unit 110, but also controls the other operation of the movable unit 106 and the transport unit 110 that are not connected to the control unit 112.
  • FIG. 2 shows a cross-sectional example of the mounting body in the crimping process.
  • the substrate 202 may be an example of a first object to be bonded.
  • the first electronic component 206, the second electronic component 210, and the third electronic component 214 are arranged in a direction substantially parallel to the main surface.
  • the substrate 202 may be, for example, a plastic, a polymer film, a silicon substrate, glass, or a laminate of these.
  • the substrate 202 may include a conductive portion 204 that electrically connects the substrate 202 and other electronic components.
  • the first electronic component 206 may be an example of a second object to be bonded.
  • the first electronic component 206 functions by being bonded to the substrate 202 or the like.
  • the first electronic component 206 may include a conductive portion 208 that electrically connects the first electronic component 206 and the substrate 202 or the like.
  • the second electronic component 210 may be an example of a second object to be bonded.
  • the second electronic component 210 functions by being bonded to the substrate 202 or the like.
  • the second electronic component 210 may include a conductive portion 212 that electrically connects the second electronic component 210 and the substrate 202 or the like.
  • the third electronic component 214 may be an example of a second object to be bonded.
  • the third electronic component 214 functions by being bonded to the substrate 202 or the like.
  • the third electronic component 214 may include a conductive portion 216 that electrically connects the third electronic component 214 and the substrate 202 or the like.
  • the first electronic component 206, the second electronic component 210, and the third electronic component 214 are flat electrode pads in place of ball grid array (BGA) or BGA ball electrodes in which ball electrodes made of solder are arranged in a grid with a dispenser. May be a Land grid array (LBA) arranged in a grid pattern.
  • LBA Land grid array
  • the maximum distance between the first electronic component 206 and the third electronic component 214 and the second electronic component 210 in a direction substantially perpendicular to the main surface of the substrate 202 is 1 mm or more, for example, 1 mm to 1.5 mm. Good.
  • the minimum value of the distance between the first electronic component 206 and the second electronic component 210 and the minimum value of the distance between the second electronic component 210 and the third electronic component 214 in the direction parallel to the main surface of the substrate 202 are 0. It may be about 05 mm.
  • the width of the second electronic component 210 in the direction substantially parallel to the main surface of the substrate 202 is 0.2 mm
  • the distance between the first electronic component 206 and the third electronic component 214 should be about 0.3 mm.
  • it can be 0.3 mm to 0.8 mm.
  • the minimum value of the distance between the first electronic component 206 and the third electronic component 214 in the direction substantially parallel to the main surface of the substrate 202 can be less than 0.3 mm.
  • the anisotropic conductive film 220 is, for example, electrically and physically joined to the substrate 202, the first electronic component 206, the second electronic component 210, and the third electronic component 214 by being pressurized and heated. Can do.
  • the anisotropic conductive film 220 only needs to have a thickness sufficient to fill the space between the members to be bonded with the binder resin 222 when the members to be bonded are bonded.
  • the anisotropic conductive film 220 may include the binder resin 222 functioning as an adhesive and the conductive particles 224 dispersed in the binder resin 222.
  • the anisotropic conductive film 220 may be, for example, an anisotropic conductive film (ACF) and an anisotropic conductive paste (ACP).
  • the anisotropic conductive film 220 is crushed by being pressed between the substrate 202 and the first electronic component 206, the second electronic component 210, and the third electronic component 214, so that the conductive particles 224 are transferred to the substrate.
  • 202 is electrically connected to the first electronic component 206, the second electronic component 210, and the third electronic component 214.
  • the binder resin 222 cures, The first electronic component 206, the second electronic component 210, and the third electronic component 214 are physically joined.
  • An NCF connection such as an epoxy resin film in which conductive particles are not mixed, instead of the anisotropic conductive film 220, between the substrate 202 and the first electronic component 206, the second electronic component 210, and the third electronic component 214. You may arrange the member which can do.
  • FIG. 2 shows the steps of preparing the substrate 202 and the first electronic component 206, the second electronic component 210, and the third electronic component 214, and the substrate 202, the first electronic component 206, the second electronic component 210, and the third electronic component 214. Adjusting the relative positional relationship between the substrate, the anisotropic conductive film 220, the first electronic component 206, the second electronic component 210, and the third electronic component 214 in this order. The state which passed through is shown.
  • FIG. 3 shows a cross-sectional example of the mounting body in the crimping process.
  • FIG. 3 shows a stage in which the substrate 202, the first electronic component 206, the second electronic component 210, and the third electronic component 214 are sandwiched between the lower pressing portion 102 and the upper pressing portion 104 and pressed.
  • the mounting body 300 is obtained by being sandwiched between the lower pressing portion 102 and the upper pressing portion 104 having the dilatancy fluid 116, and pressurizing and heating.
  • FIG. 4 shows a cross-sectional example of the mounting body in another crimping process.
  • the conductive portion 402 included in the substrate 202 has conductivity, and electrically connects the substrate 202 and other electronic components.
  • the flexible printed circuit 404 may be an example of a first bonded object and a second bonded object.
  • the flexible printed circuit 404 may be made of a film-like insulator having a thickness of 12 ⁇ m to 50 ⁇ m, for example.
  • the flexible printed circuit 404 may include a conductive film 406 that electrically connects the flexible printed circuit 404 and the substrate 202 or the like.
  • the conductive film 406 may be copper, for example.
  • FIG. 4 shows the steps of preparing the substrate 202 and the flexible printed circuit 404, adjusting the relative positional relationship between the substrate 202 and the flexible printed circuit 404, and the substrate 202, the anisotropic conductive film 220, and the flexible printed circuit. 404 shows a state after passing through the steps in this order.
  • FIG. 5 shows a cross-sectional example of the mounting body in another crimping process.
  • FIG. 5 shows a stage in which the substrate 202 and the flexible printed circuit 404 are sandwiched between the lower pressing portion 102 and the upper pressing portion 104 and pressed.
  • the mounting body 500 is obtained by being sandwiched between the lower pressing portion 102 and the upper pressing portion 104 having the dilatancy fluid 116, and pressurizing and heating.
  • FIG. 6 shows an outline of a modified example of the crimping apparatus 600 of the present embodiment.
  • the upper pressing unit 602 included in the crimping device 600 may include a dilatancy fluid 604, a covering bag 606, and a base 608.
  • the dilatancy fluid 604 may be created in the same manner as the dilatancy fluid 116.
  • the covering bag 606 may be a bag-like member made of the same material as the covering sheet 108 of the first embodiment.
  • the covering bag 606 may be configured such that the dilatancy fluid 604 is sealed inside the bag and the dilatancy fluid 604 does not leak outside the bag.
  • the base 608 may be kept in a state in which the dilatancy fluid 604 functions as the upper pressing portion 602, similarly to the base 118 of the first embodiment.
  • FIG. 7 shows a cross-sectional example of the mounting body in the crimping process using the crimping apparatus 600.
  • the conductive portion 702 included in the substrate 202 has conductivity, and electrically connects the substrate 202 and other electronic components.
  • the electronic component 704 may be an example of a first bonded object and a second bonded object.
  • the electronic component 704 functions by being bonded to the substrate 202.
  • the electronic component 704 may include a conductive portion 706 that electrically connects the electronic component 704 and the substrate 202 or the like.
  • FIG. 7 shows a step of preparing the substrate 202 and the plurality of electronic components 704, a step of adjusting the relative positional relationship between the substrate 202 and the plurality of electronic components 704, and the substrate 202 in the crimping process using the crimping apparatus 600.
  • positioned the anisotropic conductive film 220 and the some electronic component 704 in this order is shown.
  • FIG. 8 shows a cross-sectional example of the mounting body in the crimping process using the crimping apparatus 600.
  • FIG. 8 shows a stage where the substrate 202 and the plurality of electronic components 704 are sandwiched and pressed between the lower pressing portion 102 and the upper pressing portion 602.
  • the mounting body 800 is obtained by being sandwiched between the lower pressing portion 102 having the dilatancy fluid 116 and the upper pressing portion 602 having the dilatancy fluid 604, and being pressurized and heated.
  • FIG. 9 illustrates a cross-sectional example of the mounting body 300 according to the first embodiment.
  • the mounting body 300 was formed by pressure-bonding the substrate 202, the first electronic component 206, the second electronic component 210, and the third electronic component 214.
  • a heat resistant glass base epoxy resin laminate was prepared as the substrate 202.
  • a dummy element having a surface area of 3 ⁇ 2 mm 2 and a height of 1.35 mm made of a heat-resistant glass-based epoxy resin laminate was prepared as the first electronic component 206 and the third electronic component 214.
  • a 1005 size 0 ⁇ jumper resistor having a height of 0.35 mm was prepared as the second electronic component 210.
  • the width of the second electronic component 210 is 0.5 mm.
  • ACF was prepared as the anisotropic conductive film 220.
  • a sand filling cradle was used as the base 118, and sand was used as the dilatancy fluid 116. Sand was filled in a sand filling cradle to form a lower pressing portion 102. The average particle size of the sand filled in the sand filling cradle was 0.25 mm. A metal head was used as the upper pressing portion 104.
  • the conduction contact resistance of the 0 ⁇ jumper resistor was evaluated when the height difference between the dummy element and the 0 ⁇ jumper resistor was adjusted to 1.0 mm and when adjusted to 1.5 mm.
  • the height difference H between the dummy element and the 0 ⁇ jumper resistor is indicated by an arrow H in FIG.
  • Table 1 shows the evaluation results of the conductive contact resistance of the mounting body 300 of Example 1 and the mounting body of Comparative Example 1. “O” indicates that the conduction contact resistance is 0.2 ⁇ or less and it is determined that conduction is possible, and “X” indicates that the conduction contact resistance exceeds 0.2 ⁇ and it is determined that conduction is not possible.
  • the distance D1 between the dummy elements is set to 1.
  • electrical conduction is not achieved unless the distance between the dummy element and the 0 ⁇ jumper resistor is 3 mm or less.
  • Example 1 even when the distance D1 between the dummy elements was 0.9 mm, that is, the distance between the dummy elements and the 0 ⁇ jumper resistor was narrowed to 0.2 mm, conduction was achieved.
  • the distance D1 between the dummy elements When the height difference H between the dummy element and the 0 ⁇ jumper resistor is adjusted to 1.5 mm, the distance D1 between the dummy elements must be 1.5 mm, that is, the distance between the dummy element and the 0 ⁇ jumper resistor must be increased to 0.5 mm. In Comparative Example 1, conduction was not achieved, whereas in Example 1, conduction was performed even when the distance D1 between the dummy elements was 0.9 mm, that is, the distance between the dummy elements and the 0 ⁇ jumper resistor was reduced to 0.2 mm.
  • the evaluation results in Table 1 indicate that application of the technique of the present embodiment can prevent defective crimping of components that are crimped to the mounting body.
  • a TEG (Test Element Group) substrate on which a heat-resistant glass base epoxy resin having conductive portions at a pitch of 200 ⁇ m was laminated was prepared as the substrate 202.
  • a 1005-size resistor was bonded to the lower surface of the substrate 202.
  • a flexible printed circuit having conductive portions at a pitch of 200 ⁇ m was prepared as a flexible printed circuit 404.
  • phenoxy resin manufactured by Union Carbide
  • 10 parts by mass of liquid epoxy resin EP828, manufactured by Japan Epoxy Resin
  • silane coupling agent A-187, manufactured by Momentive Performance Materials
  • rubber component SG80H, manufactured by Nagase ChemteX Corporation
  • conductive particles Ni—Au plating ⁇ 5 ⁇ m, manufactured by Sony Chemical & Information Device Co.
  • curing agent HX3941HP, manufactured by Asahi Kasei Chemicals
  • Toluene was added to 40 parts by mass, adjusted to a resin solution with a solid content of 50%, applied to a peeled PET film (manufactured by Sony Chemical & Information Device) using a bar coater, and then dried in a 80 ° C oven, An anisotropic conductive film 220 having a thickness of 20 ⁇ m was prepared.
  • a sand filling cradle was used as the base 118, and sand was used as the dilatancy fluid 116. Sand was filled in a sand filling cradle to form a lower pressing portion 102. The average particle size of the sand filled in the sand filling cradle was 0.25 mm. A metal head was used as the upper pressing portion 104.
  • the relative positional relationship between the TEG substrate and the flexible printed circuit was adjusted, and the TEG substrate, the anisotropic conductive film 220, and the flexible printed circuit were arranged in this order.
  • the TEG substrate and the flexible printed circuit were sandwiched between the sand-filled cradle and the metal head, and thermocompression bonded at a temperature of 190 ° C. and a pressure of 3 MPa for 10 seconds to prepare a mounting body 500.
  • a rubber cradle was used as the lower pressing portion 102 and a metal head was used as the upper pressing portion 104, and a mounting body was created by thermocompression bonding under the same conditions as in Example 2.
  • Comparative Example 3 as the lower pressing portion 102, a digging cradle having irregularities corresponding to the shape of a 1005R resistor joined to the lower surface of the substrate 202 is used, and a metal head is used as the upper pressing portion 104.
  • a mounting body was prepared by thermocompression bonding under the same conditions as in Example 2.
  • Comparative Example 4 a flexible printed circuit was thermocompression bonded to a TEG substrate with no electronic component bonded to the lower surface to prepare a mounting body.
  • Example 2 Aging was performed for a period of 1000 hr under the condition of high temperature and high humidity of 85 ° C. and 85% RH.
  • the conduction resistance between the substrate of the mounting body of Example 2, Comparative Example 2, Comparative Example 3, and Comparative Example 4 and the flexible printed circuit was evaluated.
  • the conduction resistance was evaluated using 4-terminal probing.
  • FIG. 10 shows the evaluation results of Example 2, Comparative Example 2, Comparative Example 3, and Comparative Example 4.
  • Comparative Example 2 and Comparative Example 3 the conduction resistance increased as the aging time passed. That is, the electrical connections of the mounting bodies of Comparative Example 2 and Comparative Example 3 were unstable.
  • Example 2 was able to suppress the increase in conduction resistance when the aging time had elapsed to the same extent as in Comparative Example 4.
  • the evaluation result of Example 2 shows that the electrical connection of the mounting body can be stabilized by applying the technique of the present embodiment.
  • the so-called face-down type crimping apparatus 100 and the crimping apparatus 600 have been described.
  • the crimping device 100 and the crimping device 600 are not limited to the face-down method, and for example, a face-up method in which a plurality of electronic devices are pressed in a state where they are arranged on the upper side of the substrate 202 may be adopted.
  • a method may be employed in which the lower pressing portion 102 and the upper pressing portion 104 are disposed so as to face each other in the horizontal direction and the substrate is pressed in a vertical state.
  • compression-bonding apparatus 100 of this embodiment is shown.
  • compression-bonding process of the mounting body 300 is shown.
  • compression-bonding process of the mounting body 300 is shown.
  • compression-bonding process of the mounting body 500 is shown.
  • compression-bonding process of the mounting body 500 is shown.
  • compression-bonding apparatus 600 of the modification of this embodiment is shown.
  • compression-bonding process of the mounting body 800 is shown.
  • compression-bonding process of the mounting body 800 is shown.
  • the cross-sectional example of the mounting body 300 of Example 1 is shown.
  • the evaluation result of Example 2 is shown.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　高さの相違する電子部品を基板に圧着実装する場合または裏面に電子部品が実装された基板に他の電子部品を圧着実装する場合においても、圧着部に均一な圧力を加える。圧着装置１００は、第１押圧部としての下部押圧部１０２と第２押圧部としての上部押圧部１０４とを備え、下部押圧部１０２および上部押圧部１０４に挟まれた、たとえば基板および複数の電子部品を押圧して、基板と複数の電子部品とを圧着する圧着装置であって、下部押圧部１０２または上部押圧部１０４は、ダイラタンシー流体１１６を有する。

Description

圧着装置、圧着方法、実装体および押圧板
　本発明は、圧着装置、圧着方法、実装体および押圧板に関する。本発明は、特に、高さの相違する電子部品を基板に圧着実装する場合または裏面に電子部品が実装された基板に他の電子部品を圧着実装する場合においても、圧着部に均一な圧力を加えることができる圧着装置、圧着方法、実装体および押圧板に関する。なお、本出願は、下記の日本出願に関連する。文献の参照による組み込みが認められる指定国については、下記の出願に記載された内容を参照により本出願に組み込み、本出願の一部とする。
　特願２００８－２０６２１７　　出願日２００８年８月８日
　特願２００８－２４２９４６　　出願日２００８年９月２２日
　従来、圧着装置のヘッドまたは受け台にシリコンゴムなどのエラストマーを備えた圧着装置が報告されている（たとえば、特許文献１および特許文献２）。エラストマーを備えた圧着装置は、高さの異なる複数の電子部品を基板に対して一括圧着させることができるので、電子部品の凹凸のために従来の金属製のヘッドを使用できない場合にも用いることができる。エラストマーを備えた圧着装置を用いて圧着することにより、電子部品と基板との接続信頼性も向上する。
特開２００７－２２７６２２号公報 特許３９２１４５９号
　しかし、最近、ファインピッチ接続が加速されるとともに、実装方法においてもファインピッチ接続に対応できる接続方法が期待されている。最近では、ＩＣの高密度実装が進み、基板電極の裏面に部品を備えた状態で、圧着工程に進む場合も多い。このような場合にも信頼性の高い接続の実現が期待される。
　上記課題を解決するために、本発明の第１形態においては、第１押圧部と第２押圧部とを備え、前記第１押圧部および前記第２押圧部に挟まれた、第１被圧着物および第２被圧着物を押圧して、前記第１被圧着物と前記第２被圧着物とを圧着する圧着装置であって、前記第１押圧部または前記第２押圧部は、ダイラタンシー流体を有する圧着装置が提供される。或いは、第１押圧部と第２押圧部とを備え、前記第１押圧部および前記第２押圧部を用いて圧着を行う圧着装置であって、前記第１押圧部または前記第２押圧部が、ダイラタンシー流体を有する圧着装置が提供されてもよい。
　上記圧着装置において、前記第１押圧部または前記第２押圧部が加熱部を有してよい。この場合、前記加熱部が第１被圧着物または第２被圧着物を加熱してよい。上記圧着装置において、前記第１押圧部および前記第２押圧部は、略水平に配され、前記第１押圧部は、前記ダイラタンシー流体を有し、前記第２押圧部は、前記第１押圧部より上方に配されてよい。上記圧着装置において、前記ダイラタンシー流体の上面を覆う被覆シートと、前記被覆シートを搬送する搬送部と、前記第１押圧部の端部に配され、前記ダイラタンシー流体が、前記被覆シートとともに搬送されることを抑制する摺り切り部とをさらに備え、前記第１押圧部および前記第２押圧部は、前記被覆シートを介して、前記圧着を行ってよい。前記第１押圧部および前記第２押圧部が、当該第１押圧部および当該第２押圧部に挟まれた第１被圧着物および第２被圧着物を押圧してよい。
　本発明の第２の形態においては、第１被圧着物および第２被圧着物を準備する段階と、前記第１被圧着物と前記第２被圧着物との相対的な位置関係を調整する段階と、前記第１被圧着物および前記第２被圧着物を、第１押圧部および第２押圧部の間に挟み、押圧する段階と、を備える圧着方法であって、前記第１押圧部または前記第２押圧部は、ダイラタンシー流体を有する圧着方法が提供される。或いは、第１被圧着物と第２被圧着物との相対的な位置関係を調整する段階と、前記第１被圧着物および前記第２被圧着物を、第１押圧部および第２押圧部の間に挟み、押圧する段階と、を備える圧着方法であって、前記第１押圧部または前記第２押圧部は、ダイラタンシー流体を有する圧着方法が提供されてもよい。上記圧着方法において、前記位置関係を調整する段階の後に、前記第１被圧着物と、異方性導電膜と、前記第２被圧着物とを、この順に配する段階をさらに備えてよい。
　本発明の第３形態においては、第１電子部品と、第２電子部品とを備える実装体であって、前記第１電子部品と前記第２電子部品との相対的な位置関係を調整して、前記第１電子部品および前記第２電子部品を、少なくとも一方がダイラタンシー流体を有する第１押圧部および第２押圧部の間に挟み、押圧して得られた実装体が提供される。
　本発明の第４の形態においては、第１電子部品と、異方性導電膜と、第２電子部品とを備える実装体であって、前記第１電子部品と前記第２電子部品との相対的な位置関係を調整して、前記第１電子部品と、前記異方性導電膜と、前記第２電子部品とをこの順に配して、前記第１電子部品および前記第２電子部品を、少なくとも一方がダイラタンシー流体を有する第１押圧部および第２押圧部の間に挟み、押圧して得られた実装体が提供される。
　本発明の第５の形態においては、基板と、前記基板に実装される複数の電子部品とを備える実装体であって、前記複数の電子部品は、第１電子部品、第２電子部品および第３電子部品を、前記基板の主面に略平行な方向に、この順に有し、前記基板の主面に略垂直な方向における、前記第１電子部品および第３電子部品と、前記第２電子部品との距離の最大値は、１ｍｍ以上であり、前記基板の主面に略平行な方向における、前記第１電子部品と前記第３電子部品との距離の最小値は、０．８ｍｍ以下である実装体が提供される。
　本発明の第６の形態においては、ダイラタンシー流体と、前記ダイラタンシー流体を保持する基台とを備える、複数の電子部品を圧着して電気的に結合する圧着装置に用いられる押圧板が提供される。
　なお、上記の発明の概要は、本発明の必要な特徴の全てを列挙したものではない。また、これらの特徴群のサブコンビネーションもまた、発明となりうる。
　以下、発明の実施の形態を通じて本発明を説明するが、以下の実施形態は特許請求の範囲にかかる発明を限定するものではない。また、実施形態の中で説明されている特徴の組み合わせの全てが発明の解決手段に必須であるとは限らない。
　図１は、本実施形態の圧着装置１００の一例を示す。圧着装置１００は、基板に複数の電子部品を圧着して基板と電子部品とを電気的に結合する。なお、本明細書において「電子部品」の文言には「配線基板」を含むものとする。配線基板は、ガラスエポキシ、ベーク板等の絶縁板またはポリイミド等フレキシブル絶縁シートに銅箔等導電膜の配線を有するものが例示できる。図１において重力方向を下方向として記載する。
　圧着装置１００は、下部押圧部１０２、上部押圧部１０４、可動部１０６、被覆シート１０８、搬送部１１０、電源１１１、制御部１１２および押え部材１１４を備える。下部押圧部１０２は、ダイラタンシー流体１１６、基台１１８および加熱部１２０を有する。
　下部押圧部１０２は、第１押圧部の一例であってよく、圧着装置１００に用いられる押圧板として機能する。下部押圧部１０２に有するダイラタンシー流体１１６は、せん断応力（ずり応力）がかかると液体状態から固体状態に変化する物質であってよい。小さいせん断応力であれば流動性を帯びるが、せん断応力が大きくなれば固体状になるので、被圧着物の形状に合わせて変形することができるとともに、被圧着物の受け台にもなり得る。ダイラタンシー流体１１６は、粒径のそろった粉体であり、真球度が１．５μｍ以下、平均粒径が０．０５μｍ～３０μｍの粉体であることが好ましい。真球度は、ＪＩＳ　Ｂ　１５０１に規定される玉軸受用鋼球の測定方法により測定できる。
　ダイラタンシー流体１１６は、緩やかに加圧した場合には被圧着物の形状に応じて接触面の形状が変化する一方、加圧力を適切に選択すれば適度に固まり加圧力に対する抗力を生じる。よって、ダイラタンシー流体１１６は、被圧着物の全体をダイラタンシー流体１１６に沈み込ませることなく、被圧着物に均一な圧力を加えることができる。
　基台１１８は、ダイラタンシー流体１１６を保持する。基台１１８は、ダイラタンシー流体１１６を受け台として機能する状態に保てればよく、ダイラタンシー流体１１６を劣化させることなくダイラタンシー流体１１６により劣化しない材料、たとえば金属であればよい。基台１１８は、端部に擦り切り部１２２を含んでよい。擦り切り部１２２は、被覆シート１０８が押え部材１１４により押さえつけられ、被覆シート１０８を交換するときの搬送により、ダイラタンシー流体１１６が被覆シート１０８とともに搬送されることを抑制する。
　加熱部１２０は、被圧着物を加熱する。加熱部１２０は、たとえば抵抗加熱によるヒーター、ランプ加熱によるハロゲンランプであってよい。加熱部１２０は、電源１１１により電力が供給され、電源１１１は制御部１１２により制御される。本実施形態では、加熱部１２０は、基台１１８の内部に配置され、ダイラタンシー流体１１６を介して被圧着物を加熱する。あるいは、加熱部１２０は、ダイラタンシー流体１１６の内部に配置され、ダイラタンシー流体１１６を介して被圧着物を加熱してもよい。この場合、ダイラタンシー流体１１６は耐熱性を備える必要がある。加熱部１２０を下部押圧部１０２に備えるので、上部押圧部１０４に加熱部を備える必要がなく、上部押圧部１０４の機構を簡略化できる。上部押圧部１０４が上下移動する場合、機構の簡略化のメリットは大きい。
　上部押圧部１０４は、第２圧着部の一例であってよく、可動部１０６によって上下方向に移動する。上部押圧部１０４は、たとえば金属等の非弾性体、または、エラストマー等の弾性体であってよい。上部押圧部１０４は、下部押圧部１０２よりも上方に配され、下部押圧部１０２および上部押圧部１０４は、略水平に配される。下部押圧部１０２および上部押圧部１０４は、下部押圧部１０２および上部押圧部１０４に挟まれた被圧着物を押圧して、被圧着物を圧着する。
　被圧着物である基板の裏面に既に電子部品が実装されている場合、上部押圧部１０４は、基板の裏面に実装されている電子部品の形状に応じた凹凸を有してもよい。なお、本実施の形態では、下部押圧部１０２に加熱部１２０を有するが、下部押圧部１０２または上部押圧部１０４のいずれに加熱部１２０を有してもよい。上部押圧部１０４に加熱部を備えない場合は、上部押圧部１０４の押圧面に耐熱性の乏しいエラストマー材を採用できる。エラストマー材を用いることにより被圧着物に凹凸があった場合にも被圧着物を均一に押圧することができる。下部押圧部１０２または上部押圧部１０４は、冷却部を有してもよい。
　可動部１０６は、上部押圧部１０４を上下方向に可動する。可動部１０６が上部押圧部１０４を下方向に可動することにより、下部押圧部１０２および上部押圧部１０４が被圧着物を挟んで、被圧着物を押圧する。
　被覆シート１０８は、ダイラタンシー流体１１６の上面を覆う。ダイラタンシー流体１１６と電子部品との間に被覆シート１０８を挿入することにより、被圧着物である電子部品へのダイラタンシー粉体の付着を防止できる。下部押圧部１０２は、被覆シート１０８を介して上部押圧部１０４とともに被圧着物を挟み、被覆シート１０８は、被圧着物の形状に応じて延びる。被覆シート１０８は、被圧着物の形状に応じて延びることができ、かつ破れないような材料および厚さを選択できる。たとえば、ポリテトラフルオロエチレン（ＰＴＦＥ）シートが例示でき、厚さは０．０５ｍｍが例示できる。被覆シート１０８は、圧着操作毎に交換してもよく、この場合、たとえば図面上の矢印Ａ１の方向に長いシート状であってよい。
　搬送部１１０は、被覆シート１０８をたとえば矢印Ａ２方向に巻き取ることにより搬送する。搬送部１１０は、圧着毎にダイラタンシー流体１１６の上面を覆う被覆シート１０８を交換してよい。交換する場合に、擦り切り部１２２は、ダイラタンシー流体１１６が、被覆シート１０８とともに搬送されることを抑制する。
　制御部１１２は、可動部１０６、搬送部１１０および電源１１１の動作を制御する。図１において制御部１１２は、可動部１０６および搬送部１１０の一方と接続しているが、制御部１１２と接続されていない可動部１０６および搬送部１１０の他方の動作も制御している。
　図２は、圧着工程における実装体の断面例を示す。基板２０２は、第１被圧着物の一例であってよい。基板２０２は、主面に略平行な方向に、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４が配される。基板２０２は、たとえばプラスチック、高分子フィルム、シリコン基板、ガラス、これらが積層されたものであってよい。基板２０２は、基板２０２と他の電子部品などとを電気的に接続する導電部２０４を有してよい。
　第１電子部品２０６は、第２被圧着物の一例であってよい。第１電子部品２０６は、基板２０２などに接合されて機能する。第１電子部品２０６は、第１電子部品２０６と基板２０２などとを電気的に接続する導電部２０８を有してよい。
　第２電子部品２１０は、第２被圧着物の一例であってよい。第２電子部品２１０は、基板２０２などに接合されて機能する。第２電子部品２１０は、第２電子部品２１０と基板２０２などとを電気的に接続する導電部２１２を有してよい。
　第３電子部品２１４は、第２被圧着物の一例であってよい。第３電子部品２１４は、基板２０２などに接合されて機能する。第３電子部品２１４は、第３電子部品２１４と基板２０２などとを電気的に接続する導電部２１６を有してよい。
　第１電子部品２０６、第２電子部品２１０および第３電子部品２１４は、半田によるボール状電極をディスペンサで格子状に並べたＢａｌｌ　ｇｒｉｄ　ａｒｒａｙ（ＢＧＡ）またはＢＧＡのボール状電極の代わりに平面電極パッドを格子状に並べたＬａｎｄ　ｇｒｉｄ　ａｒｒａｙ（ＬＢＡ）であってよい。基板２０２の主面に略垂直な方向における、第１電子部品２０６および第３電子部品２１４と、第２電子部品２１０との距離の最大値は、１ｍｍ以上、たとえば１ｍｍ～１．５ｍｍであってよい。
　基板２０２の主面に平行な方向における、第１電子部品２０６と第２電子部品２１０との距離の最小値および第２電子部品２１０と第３電子部品２１４との距離の最小値は、０．０５ｍｍ程度であってよい。基板２０２の主面に略平行な方向における、第２電子部品２１０の幅が０．２ｍｍである場合、第１電子部品２０６と第３電子部品２１４との距離は、０．３ｍｍ程度にすることができ、たとえば、０．３ｍｍ～０．８ｍｍにすることができる。ただし、幅の最小値が０．２ｍｍ未満の電子部品が実現できた場合は、基板２０２の主面に略平行な方向における、第１電子部品２０６と第３電子部品２１４との距離の最小値は０．３ｍｍよりも小さい値にすることができる。
　異方性導電膜２２０は、加圧および加熱されることにより、たとえば基板２０２と、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４とを電気的および物理的に接合することができる。異方性導電膜２２０は、被圧着部材を圧着したときに、被圧着部材間を結着樹脂２２２で満たすのに十分な厚みを有すればよい。異方性導電膜２２０は、接着剤として機能する結着樹脂２２２と、結着樹脂２２２に分散された導電性粒子２２４とを有すればよい。異方性導電膜２２０は、たとえば異方性導電性フィルム（ＡＣＦ）および異方性導電性ペースト（ＡＣＰ）であってよい。
　異方性導電膜２２０は、基板２０２と、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４との間で加圧されることにより押し潰されて、導電性粒子２２４が基板２０２と第１電子部品２０６、第２電子部品２１０および第３電子部品２１４とを電気的に接続する。異方性導電膜２２０は、基板２０２と第１電子部品２０６、第２電子部品２１０および第３電子部品２１４との間で加熱されると、結着樹脂２２２が硬化することにより、基板２０２と第１電子部品２０６、第２電子部品２１０および第３電子部品２１４とを物理的に接合する。基板２０２と、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４との間には、異方性導電膜２２０に代えて、導電性粒子の混在しないエポキシ樹脂フィルム等のＮＣＦ接続ができる部材を配してもよい。
　図２は、基板２０２ならびに第１電子部品２０６、第２電子部品２１０および第３電子部品２１４を準備する段階と、基板２０２と第１電子部品２０６、第２電子部品２１０および第３電子部品２１４との相対的な位置関係を調整する段階と、基板２０２と、異方性導電膜２２０と、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４とを、この順に配する段階とを経た状態を示している。
　図３は、圧着工程における実装体の断面例を示す。図３は、基板２０２ならびに第１電子部品２０６、第２電子部品２１０および第３電子部品２１４を、下部押圧部１０２および上部押圧部１０４の間に挟み、押圧する段階を示す。実装体３００は、ダイラタンシー流体１１６を有する下部押圧部１０２および上部押圧部１０４の間に挟み、加圧および加熱することにより得られる。
　図４は、他の圧着工程における実装体の断面例を示す。基板２０２が有する導電部４０２は、導電性を有しており、基板２０２と他の電子部品などとを電気的に接続する。フレキシブルプリント回路４０４は、第１被圧着物および第２被圧着物の一例であってよい。フレキシブルプリント回路４０４は、たとえば１２μｍ～５０μｍの厚みを有するフィルム状の絶縁体を基材としてもよい。フレキシブルプリント回路４０４は、フレキシブルプリント回路４０４と基板２０２などとを電気的に接続する導電膜４０６有してもよい。導電膜４０６は、たとえば銅であってよい。
　図４は、基板２０２およびフレキシブルプリント回路４０４を準備する段階、基板２０２とフレキシブルプリント回路４０４との相対的な位置関係を調整する段階および基板２０２と、異方性導電膜２２０と、フレキシブルプリント回路４０４とを、この順に配する段階を経た状態を示す。
　図５は、他の圧着工程における実装体の断面例を示す。図５は、基板２０２およびフレキシブルプリント回路４０４を、下部押圧部１０２および上部押圧部１０４の間に挟み、押圧する段階を示す。実装体５００は、ダイラタンシー流体１１６を有する下部押圧部１０２および上部押圧部１０４の間に挟み、加圧および加熱することにより得られる。
　図６は、本実施形態の圧着装置６００の変更例の概要を示す。圧着装置６００に備わる上部押圧部６０２は、ダイラタンシー流体６０４、被覆バッグ６０６および基台６０８を有してよい。
　ダイラタンシー流体６０４は、ダイラタンシー流体１１６と同様に作成されてよい。被覆バッグ６０６は、第１実施形態の被覆シート１０８と同様の材料で作成される袋状の部材であってよい。被覆バッグ６０６は、ダイラタンシー流体６０４が袋内部に封入され、ダイラタンシー流体６０４を袋外部に漏らさなければよい。基台６０８は、第１実施形態の基台１１８と同様に、ダイラタンシー流体６０４が上部押圧部６０２として機能する状態に保てばよい。
　図７は、圧着装置６００を用いた圧着工程における実装体の断面例を示す。基板２０２が有する導電部７０２は、導電性を有しており、基板２０２と他の電子部品などとを電気的に接続する。電子部品７０４は、第１被圧着物および第２被圧着物の一例であってよい。電子部品７０４は、基板２０２に接合されて機能する。電子部品７０４は、電子部品７０４と基板２０２などとを電気的に接続する導電部７０６を有してよい。
　図７は、圧着装置６００を用いた圧着工程において、基板２０２および複数の電子部品７０４を準備する段階、基板２０２と複数の電子部品７０４との相対的な位置関係を調整する段階および基板２０２と、異方性導電膜２２０と、複数の電子部品７０４とを、この順に配する段階を経た状態を示す。
　図８は、圧着装置６００を用いた圧着工程の実装体の断面例を示す。図８は、基板２０２および複数の電子部品７０４を、下部押圧部１０２および上部押圧部６０２の間に挟み、押圧する段階を示す。実装体８００は、ダイラタンシー流体１１６を有する下部押圧部１０２およびダイラタンシー流体６０４を有する上部押圧部６０２の間に挟み、加圧および加熱することにより得られる。
　図９は、実施例１の実装体３００の断面例を示す。実装体３００は、基板２０２と、第１電子部品２０６、第２電子部品２１０および第３電子部品２１４とを圧着して作成した。耐熱性ガラス基材エポキシ樹脂積層板を、基板２０２として準備した。耐熱性ガラス基材エポキシ樹脂積層を材料にした、３×２ｍｍ２の表面積および１．３５ｍｍの高さを有するダミー素子を、第１電子部品２０６および第３電子部品２１４として準備した。０．３５ｍｍの高さを有する１００５サイズ０Ωジャンパ抵抗体を第２電子部品２１０として準備した。第２電子部品２１０の幅は０．５ｍｍである。異方性導電膜２２０としてＡＣＦを準備した。
　基台１１８として砂充填受け台を用い、ダイラタンシー流体１１６として砂を用いた。砂を砂充填受け台に充填して、下部押圧部１０２とした。砂充填受け台に充填した砂の平均粒径は０．２５ｍｍであった。上部押圧部１０４として金属ヘッドを用いた。
　耐熱性ガラス基材エポキシ樹脂積層板と、ダミー素子および０Ωジャンパ抵抗体との相対的な位置関係を調整して、耐熱性ガラス基材エポキシ樹脂積層板と、ＡＣＦと、ダミー素子および０Ωジャンパ抵抗体とを、この順に配した。耐熱性ガラス基材エポキシ樹脂積層板ならびにダミー素子および０Ωジャンパ抵抗体を、砂充填受け台および金属ヘッドの間に挟み、１８０℃の温度かつ２ＭＰａの圧力で２０秒間熱圧着して、実装体３００を作成した。比較例１として、下部押圧部１０２としてセラミック製受け台を用い、上部押圧部１０４として弾性体を用いて、実施例１と同様の条件で熱圧着して実装体を作成した。
　ダミー素子と０Ωジャンパ抵抗体との高さ差を、１．０ｍｍに調整した場合と、１．５ｍｍに調整した場合とについて、０Ωジャンパ抵抗体の導通接触抵抗を評価した。ダミー素子と０Ωジャンパ抵抗体との高さ差Ｈは、図９の矢印Ｈで示される。
Figure JPOXMLDOC01-appb-T000001
　表１は、実施例１の実装体３００および比較例１の実装体の導通接触抵抗の評価結果を示す。「○」は、導通接触抵抗が０．２Ω以下であり導通できると判断した場合、「×」は、導通接触抵抗が０．２Ωを超えており、導通できないと判断した場合を示している。
　ダミー素子（第１電子部品２０６および第３電子部品２１４）と０Ωジャンパ抵抗体（第２電子部品２１０）との高さ差Ｈを１．０ｍｍに調整した場合、ダミー素子の間隔Ｄ１を１．３ｍｍすなわちダミー素子と０Ωジャンパ抵抗体との間隔を０．４ｍｍまで開けないと比較例１においては導通しない。これに対し、実施例１では、ダミー素子の間隔Ｄ１を０．９ｍｍすなわちダミー素子と０Ωジャンパ抵抗体との間隔を０．２ｍｍまで狭くしても導通した。ダミー素子と０Ωジャンパ抵抗体との高さ差Ｈを１．５ｍｍに調整した場合、ダミー素子の間隔Ｄ１を１．５ｍｍすなわちダミー素子と０Ωジャンパ抵抗体との間隔を０．５ｍｍまで開けないと比較例１においては導通しないのに対し、実施例１では、ダミー素子の間隔Ｄ１を０．９ｍｍすなわちダミー素子と０Ωジャンパ抵抗体との間隔を０．２ｍｍまで狭くしても導通した。表１の評価結果は、本実施形態の技術を適用すると、実装体に圧着する部品の圧着不良を防ぐことができることを示している。
　２００μｍピッチで導電部を有する、耐熱性ガラス基材エポキシ樹脂を積層したＴＥＧ（Ｔｅｓｔ　Ｅｌｅｍｅｎｔ　Ｇｒｏｕｐ）基板を、基板２０２として準備した。基板２０２の下面には、１００５サイズの抵抗体を接合した。２００μｍピッチで導電部を有するフレキシブルプリント回路をフレキシブルプリント回路４０４として準備した。
　フェノキシ樹脂（ＰＫＨＨ、ユニオンカーバイト社製）３０質量部、液状エポキシ樹脂（ＥＰ８２８、ジャパンエポキシレジン社製）１０質量部、シランカップリング剤（Ａ－１８７、モメンティブ・パフォーマンス・マテリアルズ社製）１質量部、ゴム成分（ＳＧ８０Ｈ、ナガセケムテックス社製）１０質量部、導電性粒子（Ｎｉ－Ａｕメッキφ５μｍ、ソニーケミカル＆インフォメーションデバイス社製）９質量部、硬化剤（ＨＸ３９４１ＨＰ、旭化成ケミカルズ社製）４０質量部にトルエンを加え、固形分５０％の樹脂液に調整し、バーコーターを用いて剥離ＰＥＴフィルム（ソニーケミカル＆インフォメーションデバイス社製）に塗布した後８０℃のオーブンで溶媒を乾燥させ、厚さ２０μｍの異方性導電膜２２０として準備した。
　基台１１８として砂充填受け台を用い、ダイラタンシー流体１１６として砂を用いた。砂を砂充填受け台に充填して、下部押圧部１０２とした。砂充填受け台に充填した砂の平均粒径は０．２５ｍｍであった。上部押圧部１０４として金属ヘッドを用いた。
　ＴＥＧ基板と、フレキシブルプリント回路との相対的な位置関係を調整して、ＴＥＧ基板と、異方性導電膜２２０と、フレキシブルプリント回路とを、この順に配した。ＴＥＧ基板およびフレキシブルプリント回路を、砂充填受け台および金属ヘッドの間に挟み、１９０℃の温度かつ３ＭＰａの圧力で１０秒間熱圧着して、実装体５００を作成した。比較例２として、下部押圧部１０２としてラバー受台を用い、上部押圧部１０４として金属ヘッドを用いて、実施例２と同様の条件で熱圧着して実装体を作成した。比較例３として、下部押圧部１０２として、基板２０２の下面に接合された１００５Ｒサイズの抵抗体の形状に応じた凹凸を有した掘り込み受台を用い、上部押圧部１０４として金属ヘッドを用いて、実施例２と同様の条件で熱圧着して実装体を作成した。比較例４として、下面に電子部品が接合されていないＴＥＧ基板にフレキシブルプリント回路を熱圧着して実装体を作成した。
　８５℃の温度および８５％ＲＨの湿度の高温高湿の状況下で、１０００ｈｒの期間エージングをした。実施例２、比較例２、比較例３および比較例４の実装体の基板とフレキシブルプリント回路との導通抵抗を評価した。導通抵抗の評価は、４端子プロービングを用いて行った。
　図１０は、実施例２、比較例２、比較例３および比較例４の評価結果を示す。比較例２および比較例３は、エージング時間が経過するに従い、導通抵抗が増大した。すなわち、比較例２および比較例３の実装体は、電気的な接続が不安定であった。一方、実施例２は、エージング時間が経過したときの導通抵抗の増大を、比較例４と同程度に抑制できた。実施例２の評価結果は、本実施形態の技術の適用により、実装体の電気的な接続を安定させることができることを示している。
　上記の実施形態では、いわゆるフェイスダウン方式の圧着装置１００および圧着装置６００を説明した。しかし圧着装置１００および圧着装置６００は、フェイスダウン方式に限られず、たとえば複数の電子装置が基板２０２の上側に配置された状態で押圧するフェイスアップ方式を採用してもよい。また、下部押圧部１０２および上部押圧部１０４を水平方向に対向させて配置して、基板を垂直に立てた状態で押圧する方式を採用してもよい。
　以上、本発明を、実施形態を用いて説明したが、本発明の技術的範囲は上記実施形態に記載の範囲には限定されない。上記実施形態に、多様な変更または改良を加えることが可能であることが当業者に明らかである。その様な変更または改良を加えた形態も本発明の技術的範囲に含まれ得ることが、特許請求の範囲の記載から明らかである。
　請求の範囲、明細書、および図面中において示した装置、システム、プログラム、および方法における動作、手順、ステップ、および段階等の各処理の実行順序は、特段「より前に」、「先立って」等と明示しておらず、また、前の処理の出力を後の処理で用いるのでない限り、任意の順序で実現しうることに留意すべきである。請求の範囲、明細書、および図面中の動作フローに関して、便宜上「まず、」、「次に、」等を用いて説明したとしても、この順で実施することが必須であることを意味するものではない。
本実施形態の圧着装置１００の概要を示す。 実装体３００の圧着工程における断面例を示す。 実装体３００の圧着工程における断面例を示す。 実装体５００の圧着工程における断面例を示す。 実装体５００の圧着工程における断面例を示す。 本実施形態の変形例の圧着装置６００の概要を示す。 実装体８００の圧着工程における断面例を示す。 実装体８００の圧着工程における断面例を示す。 実施例１の実装体３００の断面例を示す。 実施例２の評価結果を示す。
１００　圧着装置
１０２　下部押圧部
１０４　上部押圧部
１０６　可動部
１０８　被覆シート
１１０　搬送部
１１１　電源
１１２　制御部
１１４　押え部材
１１６　ダイラタンシー流体
１１８　基台
１２０　加熱部
１２２　擦り切り部
２０２　基板
２０４　導電部
２０６　第１電子部品
２０８　導電部
２１０　第２電子部品
２１２　導電部
２１４　電子部品
２１６　導電部
２２０　異方性導電膜
２２２　結着樹脂
２２４　導電性粒子
３００　実装体
４０２　導電部
４０４　フレキシブルプリント回路
４０６　導電膜
５００　実装体
６００　圧着装置
６０２　上部押圧部
６０４　ダイラタンシー流体
６０６　被覆バッグ
６０８　基台
７０２　導電部
７０４　電子部品
７０６　導電部
８００　実装体

Claims (11)

  1. 　第１押圧部と第２押圧部とを備え、
    　前記第１押圧部および前記第２押圧部を用いて圧着を行う圧着装置であって、
    　前記第１押圧部または前記第２押圧部がダイラタンシー流体を有する、
    　圧着装置。
  2. 　前記第１押圧部または前記第２押圧部が加熱部を有する、
    　請求項１に記載の圧着装置。
  3. 　前記第１押圧部および前記第２押圧部は、略水平に配され、
    　前記第１押圧部は、前記ダイラタンシー流体を有し、
    　前記第２押圧部は、前記第１押圧部より上方に配される、
    　請求項１または請求項２に記載の圧着装置。
  4. 　前記ダイラタンシー流体の上面を覆う被覆シートと、
    　前記被覆シートを搬送する搬送部と、
    　前記第１押圧部の端部に配され、前記ダイラタンシー流体が、前記被覆シートとともに搬送されることを抑制する摺り切り部と、
    　を、さらに備え、
    　前記第１押圧部および前記第２押圧部は、前記被覆シートを介して、前記圧着を行う、
    　請求項３に記載の圧着装置。
  5. 　前記第１押圧部および前記第２押圧部が、当該第１押圧部および当該第２押圧部に挟まれた第１被圧着物および第２被圧着物を押圧する、請求項１から４のいずれかに記載の圧着装置。
  6. 　第１被圧着物と第２被圧着物との相対的な位置関係を調整する段階と、
    　前記第１被圧着物および前記第２被圧着物を、第１押圧部および第２押圧部の間に挟み、押圧する段階と、
    　を備える圧着方法であって、
    　前記第１押圧部または前記第２押圧部は、ダイラタンシー流体を有する、
    　圧着方法。
  7. 　前記位置関係を調整する段階の後に、
    　前記第１被圧着物と、異方性導電膜と、前記第２被圧着物とを、この順に配する段階を、さらに備える、
    　請求項６に記載の圧着方法。
  8. 　第１電子部品と、第２電子部品とを備える実装体であって、
    　前記第１電子部品と前記第２電子部品との相対的な位置関係を調整して、前記第１電子部品および前記第２電子部品を、少なくとも一方がダイラタンシー流体を有する第１押圧部および第２押圧部の間に挟み、押圧して得られた実装体。
  9. 　第１電子部品と、異方性導電膜と、第２電子部品とを備える実装体であって、
    　前記第１電子部品と前記第２電子部品との相対的な位置関係を調整して、前記第１電子部品と、前記異方性導電膜と、前記第２電子部品とをこの順に配して、前記第１電子部品および前記第２電子部品を、少なくとも一方がダイラタンシー流体を有する第１押圧部および第２押圧部の間に挟み、押圧して得られた実装体。
  10. 　基板と、前記基板に実装される複数の電子部品とを備える実装体であって、
    　前記複数の電子部品は、第１電子部品、第２電子部品および第３電子部品を、前記基板の主面に略平行な方向に、この順に有し、
    　前記基板の主面に略垂直な方向における、前記第１電子部品および前記第３電子部品と、前記第２電子部品との距離の最大値は、１ｍｍ以上であり、
    　前記基板の主面に略平行な方向における、前記第１電子部品と前記第３電子部品との距離の最小値は、０．８ｍｍ以下である、
    　実装体。
  11. 　ダイラタンシー流体と、
    　前記ダイラタンシー流体を保持する基台と、
    　を備える、複数の電子部品を圧着して電気的に結合する圧着装置に用いられる押圧板。
PCT/JP2009/001901 2008-08-08 2009-04-24 圧着装置、圧着方法、実装体および押圧板 WO2010016170A1 (ja)

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CN2009800004033A CN101810067B (zh) 2008-08-08 2009-04-24 压接装置、压接方法、实装体及按压板
EP09804657.6A EP2309834B1 (en) 2008-08-08 2009-04-24 Compression bonding device, compression bonding method and pressing plate
US12/635,651 US8296939B2 (en) 2008-08-08 2009-12-10 Mounting method using dilatancy fluid
HK10109179.2A HK1143023A1 (en) 2008-08-08 2010-09-26 Compression bonding device, compression bonding method, package and pressurizing plate

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