TWI436700B - Crimping device, crimping method, structure and pressing plate - Google Patents
Crimping device, crimping method, structure and pressing plate Download PDFInfo
- Publication number
- TWI436700B TWI436700B TW098119562A TW98119562A TWI436700B TW I436700 B TWI436700 B TW I436700B TW 098119562 A TW098119562 A TW 098119562A TW 98119562 A TW98119562 A TW 98119562A TW I436700 B TWI436700 B TW I436700B
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- pressing portion
- rheologically
- electronic component
- pressed
- substrate
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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Description
本發明係關於一種壓接裝置、壓接方法、構裝體及按壓板。本發明特別係關於一種即便將高度相異的電子零件壓接構裝於基板上的情況、或是在背面已構裝有電子零件的基板上壓接構裝其他電子零件的情況,亦可施加均勻的壓力於壓接部上之壓接裝置、壓接方法、構裝體及按壓板。又,本申請案係與下述日本申請案相關。對於承認可藉由文獻的參照而加入的指定國,藉由參照而將被記載於下述申請案中的內容加入本申請案中,而作為本申請案的一部分。
日本專利申請案特願2008-206217申請日2008年8月8日
日本專利申請案特願2008-242946申請日2008年9月22日
先前,已提出一種壓接裝置,在該壓接裝置的頭或承台,具備矽橡膠等的彈性體(例如,專利文獻1以及專利文獻2)。具備彈性體之壓接裝置,可使高度相異的複數個電子零件,對於基板,一起地壓接,因此,亦可用於因電子零件的凹凸而無法使用先前的金屬製的頭的情況。藉由採用具備彈性體之壓接裝置來進行壓接,亦提高電子零件與基板的連接可靠度。
【專利文獻1】日本專利公開公報特開2007-227622號
【專利文獻2】日本專利特許3921459號
但是,最近細節距連接被加速發展,且針對構裝方法,亦期待一種能對應細節距連接的連接方法。最近,IC的高密度構裝持續發展,於基板電極的背面具備零件的狀態下,進行壓接步驟的情況多。如此的情況下,亦期待實現可靠度高的連接。
為了解決上述問題,本發明的第一形態中,提供一種壓接裝置,其係具備第一按壓部與第二按壓部,按壓被夾於前述第一按壓部以及前述第二按壓部之間的第一被壓接物以及第二被壓接物,來壓接前述第一被壓接物以及前述第二被壓接物,其中前述第一按壓部或第二按壓部,係具有流變增黏性流體。或是,亦可提供一種壓接裝置,其係具備第一按壓部與第二按壓部,使用前述第一按壓部以及前述第二按壓部來進行壓接,其中前述第一按壓部或第二按壓部,係具有流變增黏性流體。
上述壓接裝置中,前述第一按壓部或前述第二按壓部,亦可具有加熱部。此時,前述加熱部可加熱第一按壓部或第二按壓部。上述壓接裝置中,前述第一按壓部以及前述第二按壓部係被配置成大約水平,前述第一按壓部係具有前述流變增黏性流體,前述第二按壓部係被配置於較前述第一按壓部更上方。上述壓接裝置中,可更具備:被覆膜,用以被覆前述流變增黏性流體的頂面;搬送部,用以搬送前述被覆膜;以及切齊部,其被配置於前述第一按壓部的端部,用以抑制前述流變增黏性流體與前述被覆膜一起被搬送;前述第一按壓部以及前述第二按壓部,係隔著前述被覆膜進行來前述壓接。前述第一按壓部以及前述第二按壓部,可按壓被夾於該第一按壓部以及該第二按壓部之間的第一被壓接物以及第二被壓接物。
本發明的第二形態中,提供一種壓接方法,其係具備:準備第一被壓接物以及第二被壓接物的階段;調整第一被壓接物與第二被壓接物的相對位置關係的階段;以及將前述第一被壓接物以及前述第二被壓接物夾於第一按壓部以及第二按壓部之間而按壓的階段,其中,前述第一按壓部或前述第二按壓部,係具有流變增黏性流體。或是,亦可被提供一種壓接方法,其係具備調整第一被壓接物與第二被壓接物的相對位置關係的階段;以及將前述第一被壓接物以及前述第二被壓接物,夾於第一按壓部以及第二按壓部之間而按壓的階段;其中,前述第一按壓部或前述第二按壓部,係具有流變增黏性流體。上述壓接方法中,在前述調整位置關係的階段之後,可更具備將前述第一被壓接物、異方性導電膜、以及前述第二被壓接物,依此順序配置的階段。
本發明的第三形態中,提供一種構裝體,其係具備第一電子零件、以及第二電子零件,是先調整前述第一電子零件與前述第二電子零件的相對位置關係,並將前述第一電子零件以及前述第二電子零件,夾於其至少一側具有流變增黏性流體之第一按壓部以及第二按壓部之間,並經按壓而獲得。
本發明的第四形態中,提供一種構裝體,其係具備第一電子零件、異方性導電膜、以及第二電子零件,是先調整前述第一電子零件與前述第二電子零件的相對位置關係,並將前述第一電子零件、前述異方性導電膜、以及前述第二電子零件依此順序配置,而將前述第一電子零件以及前述第二電子零件,夾於其至少一側具有流變增黏性流體的第一按壓部以及第二按壓部之間,並經按壓而獲得。
本發明的第五形態中,提供一種構裝體,其係具備基板、以及被構裝於前述基板上的複數個電子零件,其中前述複數個電子零件,係於大致平行於前述基板的主面的方向,依順序具有第一電子零件、第二電子零件、以及第三電子零件,在大致垂直於前述基板的主面的方向中的前述第一電子零件以及前述第三電子零件,與前述第二電子零件之間的距離的最大值係1mm以上,大致平行於前述基板的主面的方向中的前述第一電子零件與前述第三電子零件之間的距離的最小值係0.8mm以下。
本發明的第六形態中,提供一種按壓板,其係具備:流變增黏性流體;以及基台,用以保持前述流變增黏性流體;其係被用於壓接複數個電子零件來使其電性結合之壓接裝置中。
另外,上述的發明的概要並非列舉本發明的必要的特徵的全部。又,這些特徵群的副組合亦另可成為發明。
以下,透過發明的實施形態來說明本發明,但以下的實施形態並非用以限定申請專利範圍之發明。又,實施形態之中所說明的特徵的組合的全部,並不一定是發明的解決手段所必須。
第1圖係表示本實施形態的壓接裝置100的一例。壓接裝置100,係將複數個電子零件壓接於基板,使基板與電子零件電性結合。另外,在本說明書中,「電子零件」的詞句中亦包含「配線基板」。配線基板,可例示出:在玻纖環氧樹脂、電木板等的絕緣板、或聚醯亞胺等的可撓絕緣薄片上,具有銅箔等導電膜的配線者。第1圖中,以下方為重力方向來記載。
壓接裝置100,具備下部按壓部102、上部按壓部104、可動部106、被覆薄片108、搬送部110、電源111、控制部112以及按壓構件114。下部按壓部102係具有流變增黏性(Dilatancy)流體116、基台118以及加熱器120。
下部按壓部102,可為第一按壓部的一例,發揮作為被用於壓接裝置100中的按壓板的機能。位於下部按壓部102的流變增黏性流體116,可為若受到剪應力(shear stress)則會從液體狀態變化為固體狀態的物質。若為小的剪應力則帶有流動性,但若剪應力變大則成為固體狀,因此,可配合被壓接物的形狀而變形,且亦可成為被壓接物的承台。流變增黏性流體116係粒徑均勻的粉體,以真球度於1.5μm以下、平均粒徑0.05μm~30μm的粉體為較佳。真球度可藉由被規定於JIS B1501中的滾珠軸承用鋼珠的測定方法來測定。
流變增黏性流體116,在緩和地加壓的情況時,對應被壓接物的形狀,接觸面的形狀會變化,另一方面,若適當地選擇加壓力,則適度地變硬,而產生對於加壓力的抗力。因此,流變增黏性流體116,不會使被壓接物的整體沉入流變增黏性流體116中,而能施加均勻的壓力於被壓接物上。
基台118,係保持流變增黏性流體116。基台118只要將流變增黏性流體116保持在可發揮作為承台的機能的狀態即可,可為不使流變增黏性流體116劣化且不因流變增黏性流體116而劣化的材料,例如金屬。基台118也可在端部包含切齊部122。切齊部122,可抑制流變增黏性流體116隨著被覆薄片108被搬送,該被覆薄片108係被按壓構件114按壓,並在交換被覆薄片108時進行搬送。
加熱部120加熱被壓接物。加熱部120可為例如藉由電阻加熱的加熱器、藉由燈加熱的鹵素燈。加熱部120,係藉由電源111而被供給電力,電源111係藉由控制部112而被控制。本實施形態中,加熱部120係被配置於基台118的內部,經由流變增黏性流體116來加熱被壓接物。或是,加熱部120係可被配置於流變增黏性流體116的內部,經由流變增黏性流體116來加熱被壓接物。此時,流變增黏性流體116必須具備耐熱性。因將加熱部120設置於下部按壓部102中,因此不需在上部按壓部104中設置加熱部,可將上部按壓部104的機構簡略化。上部按壓部104上下移動時,機構的簡略化的優點大。
上部按壓部104可為第二壓接部的一例,藉由可動部106而於上下方向移動。上部按壓部104,可為例如金屬等的非彈性體、或是亦可為合成橡膠等的彈性體。上部按壓部104,被配置於較下部按壓部102更上方,下部按壓部102及上部按壓部104被配置成大約水平狀。下部按壓部102及上部按壓部104,按壓被夾於下部按壓部102及上部按壓部104之間的被壓接物,來壓接被壓接物。
被壓接物也就是基板的背面已構裝有電子零件的情況,上部按壓部104亦可具有對應要被構裝於基板背面上的電子零件的形狀之凹凸。另外,本實施形態中,於下部按壓部102具有加熱部120,但亦可於下部按壓部102或上部按壓部104的任一方,具有加熱部120。於上部按壓部104未具備加熱部的情況,可於上部按壓部104的按壓面,採用缺乏耐熱性的彈性體材。藉由採用彈性體材,即便被壓接物有凹凸的情況,亦可均勻地按壓被壓接物。下部按壓部102或上部按壓部104亦可具有冷卻部。
可動部106可使上部按壓部104往上下方向移動。可動部106使上部按壓部104可往下方向動作,藉此,下部按壓部102以及上部按壓部104夾住被壓接物來按壓被壓接物。
被覆薄片108係覆蓋流變增黏性流體116的頂面。藉由於流變增黏性流體116與電子零件之間插入被覆薄片108,可防止流變增黏性流體的粉體附著於被壓接物也就是電子零件上。下部按壓部102,係隔著被覆薄片108,與上部按壓部104一起夾住被壓接物,被覆薄片108係對應被壓接物的形狀而延伸。被覆薄片108係可選擇出一種能對應被壓接物的形狀而延伸且不會破損的材料以及厚度。例如,可例示鐵氟龍(Polytetrafluoroethylene;PTFE)薄片,厚度可例示為0.05mm。被覆薄片108係可於每次壓接操作交換,此時,亦可如圖式上的箭號A1方向的長薄片狀。
搬送部110係藉由往例如箭號A2方向捲取被覆薄片108而搬送。搬送部110,可於每次壓接時,交換覆蓋於流變增黏性流體116的頂面上的被覆薄片108。交換時,切齊部122係抑制流變增黏性流體116與被覆薄片108一起被搬送。
控制部112,係控制可動部106、搬送部110、以及電源111的動作。第1圖中,控制部112,係與可動部106以及搬送部110的一側連接,但亦控制未被連接於控制部112之可動部106以及搬送部110的另一側的動作。
第2圖係表示壓接步驟中的構裝體的剖面例。基板202可為第一被壓接物的一例。基板202係於與主面略平行方向,被配置第一電子零件206、第二電子零件210、以及第三電子零件214。基板202可為例如塑膠、高分子膠片、矽基板、玻璃、以及由這些材質積層積層而成者。基板202可具有將基板202與其他電子零件等電性連接的導電部204。
第一電子零件部206可為第二被壓接物的一例。第一電子零件206係被接合於基板202等之上而發揮機能。第一電子零件206可具有將第一電子零件206與基板202等電性連接的導電部208。
第二電子零件部210可為第二被壓接物的一例。第二電子零件210係被接合於基板202等之上而發揮機能。第二電子零件210可具有將第二電子零件210與基板202等電性連接的導電部212。
第三電子零件部214可為第二被壓接物的一例。第三電子零件214係被接合於基板202等之上而發揮機能。第三電子零件214可具有將第三電子零件214與基板202等電性連接的導電部216。
第一電子零件206、第二電子零件210、以及第三電子零件214,可為以分配器將由銲錫而成的球狀電極排列成格子狀的球格陣列(Ball grid array;BGA)、或是以格子狀地排列平面電極墊而成的地柵陣列(Land grid array;LGA)來取代BGA的球狀電極。大致垂直於基板202的主面的方向中,第一電子零件206及第三電子零件214,與第二電子零件210的距離的最大值,係1mm以上,例如可為1mm~1.5mm。
平行於基板202的主面的方向中,第一電子零件206與第二電子零件210之間的距離的最小值、以及第二電子零件210與第三電子零件214之間的距離的最小值,可為約0.05mm。大約平行於基板202的主面的方向中的第二電子零件210的寬度為0.2mm的情況時,第一電子零件206與第三電子零件214之間的距離可為約0.3mm,例如可為0.3mm~0.8mm。但是,若可實現寬度的最小值為未滿0.2mm的電子零件的情況時,平行於基板202的主面的方向中的第一電子零件206與第三電子零件214之間的距離的最小值,可為小於0.3mm的值。
異方性導電膜220係可藉由被加壓以及被加熱,電性以及物理性接合例如基板202與第一電子零件206、第二電子零件210、以及第三電子零件214。異方性導電膜220只要具有於壓接被壓接構件時,以接著樹脂222充滿於被壓接構件間的充分的厚度即可。異方性導電膜220,只要具有作為接著劑機能的接著樹脂222、以及被分散於接著樹脂222中的導電性粒子224即可。異方性導電膜220,可為例如異方性導電膜(Anisotropic conductive film;ACF)以及異方性導電膠(Anisotropic conductive paste;ACP)。
異方性導電膜220,係藉由於基板202與第一電子零件206、第二電子零件210、以及第三電子零件214之間被加壓而壓潰,於是導電性粒子224係電性連接基板202與第一電子零件206、第二電子零件210、以及第三電子零件214。異方性導電膜220,若於基板202與第一電子零件206、第二電子零件210、以及第三電子零件214之間被加熱,則藉由接著樹脂222硬化,物理性接合基板202與第一電子零件206、第二電子零件210、以及第三電子零件214。在基板202與第一電子零件206、第二電子零件210、以及第三零件214之間,亦可配置未混入導電性粒子的環氧樹脂膜等的非導電膠膜(Non-conductive film;NCF)可連接的構件,以取代異方性導電膜220。
第2圖係表示準備基板202與第一電子零件206、第二電子零件210、以及第三電子零件214的階段;調整基板202與第一電子零件206、第二電子零件210、以及第三電子零件214的相對位置關係的階段;以及將基板202、異方性導電膜220、第一電子零件206、第二電子零件210、以及第三電子零件214,依此順序配置的的階段的經過狀態。
第3圖係表示壓接步驟中的構裝體的剖面例。第3圖係表示將基板202與第一電子零件206、第二電子零件210、以及第三電子零件214夾於下部按壓部102以及上部按壓部104之間而按壓的階段。構裝體300係藉由先夾於具有流變增黏性流體116之下部按壓部102以及上部按壓部104之間,並進行加壓以及加熱而獲得。
第4圖係表示其他的壓接步驟中的構裝體的剖面例。基板202具有的導電部402係具有導電性,將基板202與其他的電子零件等電性連接。可撓性電路404可為第一被壓接物以及第二被壓接物的一例。可撓性電路404係能以具有例如12μm~50μm的厚度的薄膜狀的絕緣體作為基材。可撓性電路404可具有將可撓性電路404與基板202等電性連接的導電膜406。導電膜406例如可為銅。
第4圖係表示準備基板202以及可撓性電路404的階段;調整基板202與可撓性電路404的相對位置關係的階段;以及將基板202、異方性導電膜220、以及可撓性電路404,依此順序配置的階段的經過狀態。
第5圖係表示其他的壓接步驟中的構裝體的剖面例。第5圖係表示將基板202以及可撓性電路404夾於下部按壓部102以及上部按壓部104之間而按壓的階段。構裝體500係藉由先夾於具有流變增黏性流體116之下部按壓部102以及上部按壓部104之間,並進行加壓以及加熱而獲得。
第6圖係表示本實施形態的壓接裝置600的變化例的概要。壓接裝置600中所具備的上部按壓部602,係具有流變增黏性流體604、被覆袋606、以及基台608。
流變增黏性流體604可與流變增黏性流體116同樣地製作。被覆袋606可為利用與第一實施形態的被覆膜108同樣的材料被製作出來的袋狀構件。被覆袋606,只要流變增黏性流體604被封入袋內部,且流變增黏性流體604不會漏出袋外部即可。基台608,係與第一實施形態的基台118同樣地,只要將流變增黏性流體604保持成可發揮作為上部按壓部602的機能的狀態即可。
第7圖係表示使用壓接裝置600的壓接步驟中的構裝體的剖面例。基板202所具有的導電部702,係具有導電性,將基板202與其他電子零件等電性連接。電子零件704可為第一被壓接物以及第二被壓接物的一例。電子零件704係被接合於基板202上而發揮機能。電子零件704可具有電性連接電子零件704與基板202等之導電部706。
第7圖係表示在使用壓接裝置600的壓接步驟中,準備基板200以及複數個電子零件704的階段;調整基板202與複數個電子零件704的相對位置關係的階段;以及將基板202、異方性導電膜220、以及複數個電子零件704,依此順序配置的階段的經過狀態。
第8圖係表示使用壓接裝置600的壓接步驟的構裝體的剖面例。第8圖係表示將基板202以及複數個電子零件704夾於下部按壓部102以及上部按壓部602之間而按壓的階段。構裝體800,係藉由先夾於具有流變增黏性流體116之下部按壓部102、以及具有流變增黏性流體604之上部按壓部602之間,並進行加壓以及加熱而獲得。
[實施例1]
第9圖係表示實施例1的構裝體300的剖面例。構裝體300係將基板202、第一電子零件206、第二電子零件210、以及第三電子零件214壓接而製成。準備一種耐熱性玻璃基材環氧樹脂積層板來作為基板202。準備一種以耐熱性玻璃基材環氧樹脂積層板為材料之具有3×2mm2
的表面積以及1.35mm的高度的仿真(dummy)元件,作為第一電子元件206以及第三電子元件214。準備一種具有高度0.35mm的1005尺寸的0Ω跳線電阻體來作為第二電子零件210。第二電子零件210的寬度係0.5mm。準備一種異方性導電膜(Anisotropic conductive film;ACF)來作為異方性導電膜220。
使用填砂承台作為基台118,用砂作為流變增黏性流體116。將砂填充於填砂承台中,作為下部按壓部102。填充於填砂承台的砂的平均粒徑係0.25mm。使用金屬頭來作為上部按壓部104。
先調整耐熱性玻璃基材環氧樹脂積層板、仿真元件、以及0Ω跳線電阻體的相對位置關係,並將耐熱性玻璃基材環氧樹脂積層板、ACF、仿真元件、以及0Ω跳線電阻體,依此順序配置。將耐熱性玻璃基材環氧樹脂積層板、仿真元件、以及0Ω跳線電阻體,夾於填砂承台以及金屬頭之間,以180℃的溫度、2Mpa的壓力,熱壓接20秒,製作出構裝體300。作為比較例1,使用陶瓷製承台來作為下部按壓部102,使用彈性體來作為上部按壓部104,並以與實施例1同樣的條件,進行熱壓接來製作出構裝體。
對於將仿真元件與0Ω跳線電阻體的高度差調整於1.0mm的情況、以及調整於1.5mm的情況,評價0Ω跳線電阻體的導通接觸電阻。仿真元件與0Ω跳線電阻體的高度差H,係以第9圖的箭號H來表示。
第1表係表示實施例1的構裝體300以及比較例1的構裝體的導通接觸電阻的評價結果。「○」係表示導通接觸電阻於0.2Ω以下,判斷為可導通的情況,「×」係表示導通接觸電阻超過0.2Ω,判斷為無法導通的情況。
將仿真元件(第一電子零件206以及第三電子零件214)與0Ω跳線電阻體(第二電阻零件210)的高度差H調整於1.0mm的情況時,若不將仿真元件的間隔D1隔開1.3mm,亦即,不將仿真元件與0Ω跳線電阻體的間隔隔開0.4mm為止,則比較例1中係不導通。相對於此,實施例1中,即便將仿真元件的間隔D1縮小至0.9mm,亦即,將仿真元件與0Ω跳線電阻體的間隔縮小至0.2mm為止亦導通。將仿真元件與0Ω跳線電阻體的高度差H調整於1.5mm的情況時,相對於若不將仿真元件的間隔D1隔開1.5mm,亦即,不將仿真元件與0Ω跳線電阻體的間隔隔開0.5mm為止,則在比較例1中係不導通,而在實施例1中,即便將仿真元件的間隔D1縮小至0.9mm,亦即,將仿真元件與0Ω跳線電阻體的間隔縮小至0.2mm為止亦導通。第1表的評價結果,係表示若適用本實施形態的技術,則可防止要壓接於構裝體上的零件的壓接不良。
準備一種具有間距200μm的導電部之將耐熱性玻璃基材環氧樹脂積層而成的測試元件群(Test element group;TEG)基板,來作為基板202。基板202的底面,接合1005尺寸的電阻體。準備一種具有間距200μm的導電部之可撓性電路,來作為可撓性電路404。
準備一種厚度20μm的異方性導電膜220,此異方性導電膜220是先於苯氧樹脂(PKHH、Union Carbide Corporation製)30質量部;液狀環氧樹脂(EP828、Japan Epoxy Resins Co.,Ltd.製)10質量部;矽甲烷偶合劑(A-187、Momentive Performance Materials Inc.製)1質量部;橡膠成分(SG80H、Nagase ChemteX Corporation製)10質量部;導電性粒子(鍍Ni-Auψ 5μm、Sony Chemical & Information Device Corporation製)9質量部;硬化劑(HX3941HP旭化成化工公司製)40質量部中,添加甲苯,調整為固體成分50%的樹脂液,並利用桿塗佈裝置,塗佈於剝離PET膜(Sony Chemical & Information Device Corporation製)上之後,以80℃的烤爐使溶媒乾燥而製成。
使用填砂承台來作為基台118,並使用砂來作為流變增黏性流體116。將砂填充於填砂承台,作為下部按壓部102。填充於填砂承台內的砂的平均粒徑係0.25mm。使用金屬頭來作為上部按壓部104。
調整TEG基板與可撓性電路的相對位置關係,並將TEG基板、異方性導電膜220、以及可撓性電路,依此順序配置。將TEG基板以及可撓性基板,夾於填砂承台與金屬頭之間,以190℃的溫度、3Mpa的壓力,熱壓接10秒鐘,製作出構裝體500。作為比較例2,使用橡膠承台來作為下部按壓部102,並使用金屬頭來作為上部按壓部104,以與實施例2同樣的條件進行熱壓接,製作出構裝體。作為比較例3,使用一種具有對應已被接合於基板202的底面上之1005R尺寸的電阻體的形狀的凹凸之削入承台,來作為下部按壓部102,並使用金屬頭來作為上部按壓部104,以與實施例2同樣的條件進行熱壓接,製作出構裝體。作為比較例4,於電子零件未被接合於底面之TEG基板上,熱壓接可撓性電路,製作出構裝體。
於85℃的溫度以及85% RH的濕度的高溫高濕的狀況下,設定1000hr的老化期間。評價實施例2、比較例2、比較例3、以及比較例4的構裝體的基板與可撓性電路的導通電阻。導通電阻的評價係用四端子探針來進行。
第10圖係表示實施例2、比較例2、比較例3、以及比較例4的評價結果。比較例2以及比較例3,隨著老化時間的經過,導通電阻增大。亦即,比較例2以及比較例3的構裝體,其電性連接不安定。另一方面,實施例2係可將老化時間經過時的導通電阻的增大,抑制成與比較例4相同程度。實施例2的評價結果係表示藉由本實施形態的技術的適用,可使構裝體的電性連接安定。
在上述實施形態中,說明了所謂的面向下方式的壓接裝置100以及壓接裝置600。但是,壓接裝置100以及壓接裝置600不被限於面向下方式,例如,亦可採用一種在複數個電子裝置被配置於基板202的上側的狀態下進行按壓的面向上方式。又,亦可採用一種使下部按壓部102以及上部按壓部104在水平方向相對地配置,並將基板以垂直立起的狀態按壓的方式。
以上,使用實施形態說明了本發明,但本發明的技術範圍不限定於上述實施形態所記載的範圍。該業者顯然可對於上述實施形態作多樣的變更或改良。由申請專利範圍的記載可知,作如此的變更或改良的形態,亦可被包含於本發明的技術範圍中。
應留意申請專利範圍、說明書及圖式中所示的裝置、系統、程式、及方法中的動作、順序、步驟與階段等的各處理的實行順序,並未特別明示「之前」、「先」等;又,之前的處理的輸出不限於在之後的處理中使用,可依任意的順序而實現。關於申請專利範圍、說明書及圖式中的動作流程,即便為了說明方便而使用「首先」、「接著」等來說明,但並非意指必須以此種順序來實施。
100...壓接裝置
102...下部按壓部
104...上部按壓部
106...可動部
108...被覆膜
110...搬送部
111...電源
112...控制部
114...按壓構件
116...流變增黏性流體
118...基台
120...加熱部
122...切齊部
202...基板
204...導電部
206...第一電子零件
208...導電部
210...第二電子零件
212...導電部
214...第三電子零件
216...導電部
220...異方性導電膜
222...接著樹脂
224...導電性粒子
300...構裝體
402...導電部
404...可撓性電路
406...導電膜
500...構裝體
600...壓接裝置
602...上部按壓部
606...被覆袋
604...流變增黏性流體
608...基台
702...導電部
704...電子零件
706...導電部
800...構裝體
第1圖係表示本實施形態的壓接裝置100的概要。
第2圖係表示構裝體300的壓接步驟中的剖面例。
第3圖係表示構裝體300的壓接步驟中的剖面例。
第4圖係表示構裝體500的壓接步驟中的剖面例。
第5圖係表示構裝體500的壓接步驟中的剖面例。
第6圖係表示本實施形態的變化例的壓接裝置600的概要。
第7圖係表示構裝體800的壓接步驟中的剖面例。
第8圖係表示構裝體800的壓接步驟中的剖面例。
第9圖係表示實施例1的構裝體300的剖面例。
第10圖係表示實施例2的評價結果。
100...壓接裝置
102...下部按壓部
104...上部按壓部
106...可動部
108...被覆膜
110...搬送部
111...電源
112...控制部
114...按壓構件
116...流變增黏性流體
118...基台
120...加熱部
122...切齊部
Claims (6)
- 一種壓接裝置,其係具備:第一按壓部,具有前述流變增黏性流體;第二按壓部,被配置於較前述第一按壓部更上方;被覆膜,用以被覆前述流變增黏性流體的頂面;搬送部,用以搬送前述被覆膜;以及切齊部,其被配置於前述第一按壓部的端部,用以抑制前述流變增黏性流體與前述被覆膜一起被搬送;其中,前述第一按壓部以及前述第二按壓部係被配置成大約水平;前述第一按壓部以及前述第二按壓部係隔著前述被覆膜來進行壓接。
- 如申請專利範圍第1項所述之壓接裝置,其中前述第一按壓部或前述第二按壓部,係具有加熱部。
- 如申請專利範圍第1或2項所述之壓接裝置,其中前述第一按壓部以及前述第二按壓部,係按壓被夾於該第一按壓部以及該第二按壓部之間的第一被壓接物以及第二被壓接物。
- 一種壓接方法,其係具備:調整第一被壓接物與第二被壓接物的相對位置關係的階段;將前述第一被壓接物以及前述第二被壓接物,隔著前述被覆膜夾於第一按壓部以及第二按壓部之間而按壓的階段;以及 搬送前述被覆膜的階段;其中,前述第一按壓部或前述第二按壓部係被配置成大約水平;前述第一按壓部,具有流變增黏性流體;第二按壓部,被配置於較前述第一按壓部更上方;前述被覆膜,用以被覆前述流變增黏性流體的頂面;搬送前述被覆膜的階段,係藉由被配置於前述第一按壓部的端部之切齊部來抑制前述流變增黏性流體與前述被覆膜一起被搬送之階段。
- 如申請專利範圍第4項所述之壓接方法,其中在前述調整位置關係的階段之後,更具備將前述第一被壓接物、異方性導電膜、以及前述第二被壓接物,依此順序配置的階段。
- 一種按壓板,其係具備:流變增黏性流體;基台,用以保持前述流變增黏性流體;被覆膜,用以被覆前述流變增黏性流體的頂面;搬送部,用以搬送前述被覆膜;以及切齊部,其被配置於前述基台的端部,用以抑制前述流變增黏性流體與前述被覆膜一起被搬送;其係被用於壓接複數個電子零件來使其電性結合之壓接裝置中。
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TWI581942B (zh) * | 2015-04-08 | 2017-05-11 | 韋僑科技股份有限公司 | 跨橋裝置與系統及其軟性電路元件跨橋方法 |
US10014641B2 (en) | 2015-04-08 | 2018-07-03 | Securitag Assembly Group Co., Ltd. | Crimping apparatus and system for crimping a flexible printed circuit |
US11050207B2 (en) | 2015-04-08 | 2021-06-29 | Securitag Assembly Group Co., Ltd. | Crimping apparatus and system for crimping a flexible printed circuit |
Also Published As
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KR20110039510A (ko) | 2011-04-19 |
EP2309834B1 (en) | 2015-02-25 |
EP2309834A1 (en) | 2011-04-13 |
WO2010016170A1 (ja) | 2010-02-11 |
JP2010062504A (ja) | 2010-03-18 |
EP2309834A4 (en) | 2011-09-14 |
TW201018329A (en) | 2010-05-01 |
JP4916494B2 (ja) | 2012-04-11 |
CN101810067A (zh) | 2010-08-18 |
US8296939B2 (en) | 2012-10-30 |
US20100085723A1 (en) | 2010-04-08 |
HK1143023A1 (en) | 2010-12-17 |
CN101810067B (zh) | 2013-07-10 |
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