JP4916494B2 - 圧着装置、圧着方法、および押圧板 - Google Patents
圧着装置、圧着方法、および押圧板 Download PDFInfo
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- JP4916494B2 JP4916494B2 JP2008242946A JP2008242946A JP4916494B2 JP 4916494 B2 JP4916494 B2 JP 4916494B2 JP 2008242946 A JP2008242946 A JP 2008242946A JP 2008242946 A JP2008242946 A JP 2008242946A JP 4916494 B2 JP4916494 B2 JP 4916494B2
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Description
102 下部押圧部
104 上部押圧部
106 可動部
108 被覆シート
110 搬送部
111 電源
112 制御部
114 押え部材
116 ダイラタンシー流体
118 基台
120 加熱部
122 擦り切り部
202 基板
204 導電部
206 第1電子部品
208 導電部
210 第2電子部品
212 導電部
214 電子部品
216 導電部
220 異方性導電膜
222 結着樹脂
224 導電性粒子
300 実装体
402 導電部
404 フレキシブルプリント回路
406 導電膜
500 実装体
600 圧着装置
602 上部押圧部
604 ダイラタンシー流体
606 被覆バッグ
608 基台
702 導電部
704 電子部品
706 導電部
800 実装体
Claims (8)
- ダイラタンシー流体を有する第1押圧部と、
前記第1押圧部より上方に配される第2押圧部と、
前記ダイラタンシー流体の上面を覆う被覆シートと、
前記被覆シートを搬送する搬送部と、
前記第1押圧部の端部に配され、前記ダイラタンシー流体が、前記被覆シートとともに搬送されることを抑制する摺り切り部と、
を備え、
前記第1押圧部および前記第2押圧部は、略水平に配され、
前記第1押圧部は、前記被覆シートを介して、第1被圧着物または第2被圧着物を挟み、
前記第1押圧部および前記第2押圧部に挟まれた、第1被圧着物および第2被圧着物を押圧して、前記第1被圧着物と前記第2被圧着物とを圧着する、
圧着装置。 - ダイラタンシー流体を有する第1押圧部と、
前記第1押圧部より上方に配される第2押圧部と、
前記ダイラタンシー流体の上面を覆う被覆シートと、
前記被覆シートを搬送する搬送部と、
前記第1押圧部の端部に配され、前記ダイラタンシー流体が、前記被覆シートとともに搬送されることを抑制する摺り切り部と、
を備え、
前記第1押圧部および前記第2押圧部は、略水平に配され、
前記第1押圧部は、前記被覆シートを介して、第1被圧着物または第2被圧着物を挟み、
前記第1押圧部および前記第2押圧部に挟まれた、第1被圧着物および第2被圧着物を押圧して、前記第1被圧着物と前記第2被圧着物とを圧着することにより、前記第1被圧着物の導電部と前記第2被圧着物の導電部とを電気的に接続する、
圧着装置。 - 前記第1押圧部または前記第2押圧部は、前記第1被圧着物または前記第2被圧着物を加熱する加熱部を有する、
請求項1または請求項2に記載の圧着装置。 - 第1被圧着物および第2被圧着物を準備する段階と、
前記第1被圧着物と前記第2被圧着物との相対的な位置関係を調整する段階と、
前記第1被圧着物および前記第2被圧着物を、被覆シートを介して第1押圧部および第2押圧部の間に挟み、押圧し、前記第1被圧着物と前記第2被圧着物とを圧着する段階と、
前記被覆シートを搬送する段階と、
を備える圧着方法であって、
前記第1押圧部および第2押圧部は、略水平に配され、
前記第1押圧部は、ダイラタンシー流体を有し、
前記第2押圧部は、前記第1押圧部より上方に配され、
前記被覆シートは、前記ダイラタンシー流体の上面を覆い、
前記被覆シートを搬送する段階は、前記第1押圧部の端部に配された摺り切り部が、前記被覆シートとともに前記ダイラタンシー流体が搬送されることを抑制する段階を含む、
圧着方法。 - 第1被圧着物および第2被圧着物を準備する段階と、
前記第1被圧着物と前記第2被圧着物との相対的な位置関係を調整する段階と、
前記第1被圧着物および前記第2被圧着物を、被覆シートを介して第1押圧部および第2押圧部の間に挟み、押圧し、前記第1被圧着物の導電部と前記第2被圧着物の導電部とを電気的に接続する段階と、
前記被覆シートを搬送する段階と、
を備える圧着方法であって、
前記第1押圧部および第2押圧部は、略水平に配され、
前記第1押圧部は、ダイラタンシー流体を有し、
前記第2押圧部は、前記第1押圧部より上方に配され、
前記被覆シートは、前記ダイラタンシー流体の上面を覆い、
前記被覆シートを搬送する段階は、前記第1押圧部の端部に配された摺り切り部が、前記被覆シートとともに前記ダイラタンシー流体が搬送されることを抑制する段階を含む、
圧着方法。 - 前記第1押圧部または前記第2押圧部は、前記第1被圧着物または前記第2被圧着物を加熱する加熱部を有し、
前記第1被圧着物および前記第2被圧着物を、被覆シートを介して第1押圧部および第2押圧部の間に挟み、押圧する段階は、前記第1被圧着物および前記第2被圧着物を、被覆シートを介して第1押圧部および第2押圧部の間に挟み、押圧および加熱する段階を含む、
請求項4または請求項5に記載の圧着方法。 - 前記位置関係を調整する段階の後に、
前記第1被圧着物と、異方性導電膜と、前記第2被圧着物とを、この順に配する段階を、さらに備える、
請求項4から請求項6までの何れか一項に記載の圧着方法。 - ダイラタンシー流体と、
前記ダイラタンシー流体を保持する基台と、
前記ダイラタンシー流体の上面を覆う被覆シートと、
前記基台の端部に配され、前記ダイラタンシー流体が前記被覆シートとともに搬送されることを抑制する摺り切り部と、
を備え、
複数の電子部品を圧着して電気的に結合する圧着装置に用いられる押圧板。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
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JP2008242946A JP4916494B2 (ja) | 2008-08-08 | 2008-09-22 | 圧着装置、圧着方法、および押圧板 |
CN2009800004033A CN101810067B (zh) | 2008-08-08 | 2009-04-24 | 压接装置、压接方法、实装体及按压板 |
PCT/JP2009/001901 WO2010016170A1 (ja) | 2008-08-08 | 2009-04-24 | 圧着装置、圧着方法、実装体および押圧板 |
KR1020097025760A KR20110039510A (ko) | 2008-08-08 | 2009-04-24 | 압착 장치, 압착 방법, 실장체 및 압압판 |
EP09804657.6A EP2309834B1 (en) | 2008-08-08 | 2009-04-24 | Compression bonding device, compression bonding method and pressing plate |
TW098119562A TWI436700B (zh) | 2008-08-08 | 2009-06-11 | Crimping device, crimping method, structure and pressing plate |
US12/635,651 US8296939B2 (en) | 2008-08-08 | 2009-12-10 | Mounting method using dilatancy fluid |
HK10109179.2A HK1143023A1 (en) | 2008-08-08 | 2010-09-26 | Compression bonding device, compression bonding method, package and pressurizing plate |
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JP2008206217 | 2008-08-08 | ||
JP2008206217 | 2008-08-08 | ||
JP2008242946A JP4916494B2 (ja) | 2008-08-08 | 2008-09-22 | 圧着装置、圧着方法、および押圧板 |
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JP2010062504A JP2010062504A (ja) | 2010-03-18 |
JP4916494B2 true JP4916494B2 (ja) | 2012-04-11 |
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US (1) | US8296939B2 (ja) |
EP (1) | EP2309834B1 (ja) |
JP (1) | JP4916494B2 (ja) |
KR (1) | KR20110039510A (ja) |
CN (1) | CN101810067B (ja) |
HK (1) | HK1143023A1 (ja) |
TW (1) | TWI436700B (ja) |
WO (1) | WO2010016170A1 (ja) |
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JP2011109046A (ja) * | 2009-11-20 | 2011-06-02 | Sony Chemical & Information Device Corp | 実装装置および電子モジュールの製造方法 |
JP6041463B2 (ja) * | 2009-12-25 | 2016-12-07 | デクセリアルズ株式会社 | エポキシ樹脂組成物及びそれを用いた接合体の製造方法、並びに接合体 |
DE102010039749A1 (de) * | 2010-08-25 | 2012-03-01 | Robert Bosch Gmbh | Verfahren zur Bestückung einer Leiterplatte mit mehreren Bauteilen und elektrische Schaltung mit einer Leiterplatte und darauf montierten mehreren Bauteilen |
CN112863732B (zh) * | 2014-10-29 | 2023-01-17 | 迪睿合株式会社 | 连接结构体的制造方法、连接结构体以及导电材料 |
TWI581942B (zh) | 2015-04-08 | 2017-05-11 | 韋僑科技股份有限公司 | 跨橋裝置與系統及其軟性電路元件跨橋方法 |
TWI681701B (zh) * | 2018-09-03 | 2020-01-01 | 活躍科技股份有限公司 | 節能式壓板機 |
CN109335675A (zh) * | 2018-11-09 | 2019-02-15 | 东莞市若渝电子科技有限公司 | 自动贴球顶机及其工作方法 |
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US3529117A (en) * | 1969-09-11 | 1970-09-15 | Argus Eng Co | Soldering apparatus |
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US5414298A (en) * | 1993-03-26 | 1995-05-09 | Tessera, Inc. | Semiconductor chip assemblies and components with pressure contact |
JPH08146451A (ja) * | 1994-11-16 | 1996-06-07 | Sony Corp | 回路装置の製造装置 |
JPH10150297A (ja) * | 1996-11-18 | 1998-06-02 | Toyo Commun Equip Co Ltd | 電子部品装着用サポート治具 |
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JP2004322490A (ja) * | 2003-04-25 | 2004-11-18 | Konica Minolta Photo Imaging Inc | 積層体の製造方法及び積層体の製造装置 |
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JP4274126B2 (ja) * | 2005-01-18 | 2009-06-03 | パナソニック株式会社 | 圧着装置および圧着方法 |
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TW201018329A (en) | 2010-05-01 |
HK1143023A1 (en) | 2010-12-17 |
JP2010062504A (ja) | 2010-03-18 |
EP2309834A1 (en) | 2011-04-13 |
US8296939B2 (en) | 2012-10-30 |
TWI436700B (zh) | 2014-05-01 |
EP2309834B1 (en) | 2015-02-25 |
KR20110039510A (ko) | 2011-04-19 |
CN101810067A (zh) | 2010-08-18 |
WO2010016170A1 (ja) | 2010-02-11 |
EP2309834A4 (en) | 2011-09-14 |
CN101810067B (zh) | 2013-07-10 |
US20100085723A1 (en) | 2010-04-08 |
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