HK1143023A1 - Compression bonding device, compression bonding method, package and pressurizing plate - Google Patents

Compression bonding device, compression bonding method, package and pressurizing plate

Info

Publication number
HK1143023A1
HK1143023A1 HK10109179.2A HK10109179A HK1143023A1 HK 1143023 A1 HK1143023 A1 HK 1143023A1 HK 10109179 A HK10109179 A HK 10109179A HK 1143023 A1 HK1143023 A1 HK 1143023A1
Authority
HK
Hong Kong
Prior art keywords
compression bonding
pressurizing section
package
substrate
pressurizing plate
Prior art date
Application number
HK10109179.2A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1143023A1 publication Critical patent/HK1143023A1/xx

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
HK10109179.2A 2008-08-08 2010-09-26 Compression bonding device, compression bonding method, package and pressurizing plate HK1143023A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008206217 2008-08-08
JP2008242946A JP4916494B2 (ja) 2008-08-08 2008-09-22 圧着装置、圧着方法、および押圧板
PCT/JP2009/001901 WO2010016170A1 (ja) 2008-08-08 2009-04-24 圧着装置、圧着方法、実装体および押圧板

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EP (1) EP2309834B1 (ja)
JP (1) JP4916494B2 (ja)
KR (1) KR20110039510A (ja)
CN (1) CN101810067B (ja)
HK (1) HK1143023A1 (ja)
TW (1) TWI436700B (ja)
WO (1) WO2010016170A1 (ja)

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DE102010039749A1 (de) * 2010-08-25 2012-03-01 Robert Bosch Gmbh Verfahren zur Bestückung einer Leiterplatte mit mehreren Bauteilen und elektrische Schaltung mit einer Leiterplatte und darauf montierten mehreren Bauteilen
CN112863732B (zh) * 2014-10-29 2023-01-17 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
TWI581942B (zh) 2015-04-08 2017-05-11 韋僑科技股份有限公司 跨橋裝置與系統及其軟性電路元件跨橋方法
TWI681701B (zh) * 2018-09-03 2020-01-01 活躍科技股份有限公司 節能式壓板機
CN109335675A (zh) * 2018-11-09 2019-02-15 东莞市若渝电子科技有限公司 自动贴球顶机及其工作方法

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JP4916494B2 (ja) 2012-04-11
EP2309834A1 (en) 2011-04-13
CN101810067A (zh) 2010-08-18
EP2309834B1 (en) 2015-02-25
US8296939B2 (en) 2012-10-30
JP2010062504A (ja) 2010-03-18
TW201018329A (en) 2010-05-01
EP2309834A4 (en) 2011-09-14
WO2010016170A1 (ja) 2010-02-11
US20100085723A1 (en) 2010-04-08
CN101810067B (zh) 2013-07-10
TWI436700B (zh) 2014-05-01
KR20110039510A (ko) 2011-04-19

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