WO2009140709A3 - Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte - Google Patents

Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte Download PDF

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Publication number
WO2009140709A3
WO2009140709A3 PCT/AT2009/000210 AT2009000210W WO2009140709A3 WO 2009140709 A3 WO2009140709 A3 WO 2009140709A3 AT 2009000210 W AT2009000210 W AT 2009000210W WO 2009140709 A3 WO2009140709 A3 WO 2009140709A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
producing
interconnected
component
Prior art date
Application number
PCT/AT2009/000210
Other languages
English (en)
French (fr)
Other versions
WO2009140709A2 (de
Inventor
Günther WEICHSLBERGER
Johannes Stahr
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority to CN2009801184071A priority Critical patent/CN102037793A/zh
Priority to US12/736,916 priority patent/US20110067908A1/en
Priority to JP2011509813A priority patent/JP2011521458A/ja
Priority to EP09749320A priority patent/EP2283714A2/de
Publication of WO2009140709A2 publication Critical patent/WO2009140709A2/de
Publication of WO2009140709A3 publication Critical patent/WO2009140709A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
    • A47F11/00—Arrangements in shop windows, shop floors or show cases
    • A47F11/06—Means for bringing about special optical effects
    • A47F11/10—Arrangements of light sources
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
    • A47F3/00—Show cases or show cabinets
    • A47F3/001—Devices for lighting, humidifying, heating, ventilation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053—Fe as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Bei einem Verfahren zur Festlegung einer Komponente (6) an bzw. in einer Leiterplatte (1) und/oder zur Verbindung von einzelnen Elementen einer Leiterplatte ist vorgesehen, daß miteinander zu verbindende bzw. aneinander festzulegende Bereiche einer Komponente (6) und/oder einer Leiterplatte (1) jeweils mit wenigstens einer Lotschicht (4, 5, 9, 10) versehen werden, daß die Lotschichten (4, 5, 9, 10) miteinander kontaktiert werden und unter Anwendung von gegenüber Umgebungsbedingungen erhöhtem Druck und erhöhter Temperatur unter Ausbildung einer intermetallischen Diffusionsschicht (12) untereinander verbunden werden, wodurch eine hochfeste Verbindung erzielbar ist. Darüber hinaus werden eine Verwendung eines derartigen Verfahrens sowie eine Leiterplatte (1) zur Verfügung gestellt.
PCT/AT2009/000210 2008-05-21 2009-05-20 Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte WO2009140709A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2009801184071A CN102037793A (zh) 2008-05-21 2009-05-20 用于制造印刷电路板的方法及其应用以及印刷电路板
US12/736,916 US20110067908A1 (en) 2008-05-21 2009-05-20 Method for producing a printed circuit board and use and printed circuit board
JP2011509813A JP2011521458A (ja) 2008-05-21 2009-05-20 プリント回路基板の製造方法および使用ならびにプリント回路基板
EP09749320A EP2283714A2 (de) 2008-05-21 2009-05-20 Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0029308U AT10735U1 (de) 2008-05-21 2008-05-21 Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte
ATGM293/2008 2008-05-21

Publications (2)

Publication Number Publication Date
WO2009140709A2 WO2009140709A2 (de) 2009-11-26
WO2009140709A3 true WO2009140709A3 (de) 2010-03-04

Family

ID=40846026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2009/000210 WO2009140709A2 (de) 2008-05-21 2009-05-20 Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte

Country Status (7)

Country Link
US (1) US20110067908A1 (de)
EP (1) EP2283714A2 (de)
JP (1) JP2011521458A (de)
KR (1) KR20110014598A (de)
CN (1) CN102037793A (de)
AT (1) AT10735U1 (de)
WO (1) WO2009140709A2 (de)

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* Cited by examiner, † Cited by third party
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AT10735U1 (de) * 2008-05-21 2009-09-15 Austria Tech & System Tech Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte
US8498127B2 (en) * 2010-09-10 2013-07-30 Ge Intelligent Platforms, Inc. Thermal interface material for reducing thermal resistance and method of making the same
CN103203565B (zh) * 2012-01-12 2016-02-03 郑州大学 用于大功率半导体激光器列阵及叠阵的耐高温焊料
US9024205B2 (en) 2012-12-03 2015-05-05 Invensas Corporation Advanced device assembly structures and methods
DE102013103081A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Verfahren zum Verbinden von Fügepartnern und Anordnung von Fügepartnern
JP5874683B2 (ja) 2013-05-16 2016-03-02 ソニー株式会社 実装基板の製造方法、および電子機器の製造方法
WO2016039139A1 (ja) * 2014-09-09 2016-03-17 株式会社村田製作所 樹脂多層基板
US20160339538A1 (en) * 2015-05-18 2016-11-24 Toyota Motor Engineering & Manufacturing North America, Inc. High temperature bonding processes incorporating traces
DE102015108668B4 (de) * 2015-06-02 2018-07-26 Rogers Germany Gmbh Verfahren zur Herstellung eines Verbundmaterials
CN105397226B (zh) * 2015-12-14 2018-01-26 福建闽航电子有限公司 一种电热基板不镀金属层钎焊镍丝工艺
US10312429B2 (en) * 2016-07-28 2019-06-04 Eyob Llc Magnetoelectric macro fiber composite fabricated using low temperature transient liquid phase bonding
DE102017206930A1 (de) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil zum Diffusionslöten, Verfahren zu dessen Herstellung und Verfahren zu dessen Montage
CN108712823B (zh) * 2018-05-21 2020-07-24 武汉华星光电半导体显示技术有限公司 导电端子及其制作方法和绑定方法、电路板的绑定方法
EP3719466A1 (de) * 2019-04-01 2020-10-07 Heraeus Nexensos GmbH 3d-verbinderstruktur, verfahren zur herstellung einer 3d-verbinderstruktur und temperatursensor
EP3754706A1 (de) 2019-06-20 2020-12-23 IMEC vzw Verfahren zur elektrischen verbindung von halbleiterkomponenten
CN113163594B (zh) * 2020-01-07 2024-04-09 峻立科技股份有限公司 塑料组件与电路板的结合方法
TWI771197B (zh) * 2021-09-29 2022-07-11 昇貿科技股份有限公司 低溫焊錫的焊接結構及其製造方法
CN114928958A (zh) * 2022-06-24 2022-08-19 重庆中电天时精密装备技术有限公司 Pcb、pcba平面精度压装方法
CN117718609B (zh) * 2024-02-07 2024-05-10 蔚来电池科技(安徽)有限公司 用于极片分切系统的控制方法及极片分切系统

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DE2008588B1 (de) * 1970-02-24 1972-03-09 Siemens Ag Verfahren zur herstellung von lötverbindungen
EP0388011A2 (de) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Verfahren zum Herstellen einer Halbleiteranordnung
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AT10735U1 (de) * 2008-05-21 2009-09-15 Austria Tech & System Tech Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte

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DE2008588B1 (de) * 1970-02-24 1972-03-09 Siemens Ag Verfahren zur herstellung von lötverbindungen
EP0388011A2 (de) * 1989-03-14 1990-09-19 Kabushiki Kaisha Toshiba Verfahren zum Herstellen einer Halbleiteranordnung
US5075965A (en) * 1990-11-05 1991-12-31 International Business Machines Low temperature controlled collapse chip attach process
US5511719A (en) * 1993-06-01 1996-04-30 Nippondenso Co., Ltd. Process of joining metal members
EP0675531A2 (de) * 1994-03-28 1995-10-04 Robert Bosch Gmbh Verfahren zum elektrisch leitfähigen Verbinden von Kontakten
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AT10735U1 (de) * 2008-05-21 2009-09-15 Austria Tech & System Tech Verfahren zur herstellung einer leiterplatte sowie verwendung und leiterplatte

Also Published As

Publication number Publication date
US20110067908A1 (en) 2011-03-24
WO2009140709A2 (de) 2009-11-26
AT10735U1 (de) 2009-09-15
KR20110014598A (ko) 2011-02-11
JP2011521458A (ja) 2011-07-21
CN102037793A (zh) 2011-04-27
EP2283714A2 (de) 2011-02-16

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