WO2009069696A1 - ソースドライバ、ソースドライバの製造方法、および液晶モジュール - Google Patents

ソースドライバ、ソースドライバの製造方法、および液晶モジュール Download PDF

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Publication number
WO2009069696A1
WO2009069696A1 PCT/JP2008/071539 JP2008071539W WO2009069696A1 WO 2009069696 A1 WO2009069696 A1 WO 2009069696A1 JP 2008071539 W JP2008071539 W JP 2008071539W WO 2009069696 A1 WO2009069696 A1 WO 2009069696A1
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Prior art keywords
source driver
semiconductor chip
terminals
wiring region
liquid crystal
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PCT/JP2008/071539
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English (en)
French (fr)
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Tatsuya Katoh
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Sharp Kabushiki Kaisha
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Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to US12/734,844 priority Critical patent/US8373262B2/en
Priority to CN2008801183252A priority patent/CN101878524B/zh
Priority to KR1020107013699A priority patent/KR101158380B1/ko
Publication of WO2009069696A1 publication Critical patent/WO2009069696A1/ja

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

　フィルム基材の表面に、外部と接続可能な端子が複数設けられた半導体チップが実装され、半導体チップの入力端子と接続される配線が形成されている入力端子配線領域、および半導体チップの出力端子と接続される配線が形成されている出力端子配線領域が設けられてなるフィルム実装型のソースドライバにおいて、フィルム基材の両端に、連続した穴と表面に銅箔とが形成されてなるスプロケット部を有し、入力端子配線領域および出力端子配線領域は、スプロケット部が設けられていない側に向かって互いに逆向きに設けられており、半導体チップの端子のうち入力端子および出力端子以外の端子とスプロケット部の銅箔とを接続する熱伝導パターンが形成されている。これにより、放熱量を増加させることができるソースドライバ、ソースドライバの製造方法、および液晶モジュールを提供する。
PCT/JP2008/071539 2007-11-30 2008-11-27 ソースドライバ、ソースドライバの製造方法、および液晶モジュール WO2009069696A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/734,844 US8373262B2 (en) 2007-11-30 2008-11-27 Source driver, method for manufacturing same, and liquid crystal module
CN2008801183252A CN101878524B (zh) 2007-11-30 2008-11-27 源极驱动器、源极驱动器的制造方法和液晶模块
KR1020107013699A KR101158380B1 (ko) 2007-11-30 2008-11-27 소스 드라이버, 소스 드라이버의 제조 방법, 및 액정 모듈

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-311627 2007-11-30
JP2007311627A JP4344766B2 (ja) 2007-11-30 2007-11-30 ソースドライバ、ソースドライバの製造方法、および液晶モジュール

Publications (1)

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WO2009069696A1 true WO2009069696A1 (ja) 2009-06-04

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US (1) US8373262B2 (ja)
JP (1) JP4344766B2 (ja)
KR (1) KR101158380B1 (ja)
CN (1) CN101878524B (ja)
TW (1) TWI416640B (ja)
WO (1) WO2009069696A1 (ja)

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JPWO2013051236A1 (ja) * 2011-10-05 2015-03-30 パナソニック株式会社 表示装置

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JP5325684B2 (ja) 2009-07-15 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
JP2012073388A (ja) * 2010-09-28 2012-04-12 Hitachi Displays Ltd 液晶表示装置
TWI615925B (zh) * 2013-03-04 2018-02-21 盧森堡商經度半導體責任有限公司 半導體裝置
JP5657767B2 (ja) * 2013-10-30 2015-01-21 ルネサスエレクトロニクス株式会社 半導体装置
JP6711582B2 (ja) * 2015-10-14 2020-06-17 ホシデン株式会社 プラグコネクタ及びアダプタ
KR102392683B1 (ko) * 2015-11-30 2022-05-02 엘지디스플레이 주식회사 터치스크린 내장형 표시장치
JP2018085522A (ja) * 2017-12-21 2018-05-31 ルネサスエレクトロニクス株式会社 半導体装置
CN110323198B (zh) * 2019-07-26 2024-04-26 广东气派科技有限公司 非接触式上下芯片封装结构及其封装方法

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JP2004111996A (ja) * 1996-03-26 2004-04-08 Canon Inc 接続構造体及び表示装置
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JPWO2013051236A1 (ja) * 2011-10-05 2015-03-30 パナソニック株式会社 表示装置

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US8373262B2 (en) 2013-02-12
TWI416640B (zh) 2013-11-21
US20100302474A1 (en) 2010-12-02
JP4344766B2 (ja) 2009-10-14
JP2009135340A (ja) 2009-06-18
TW200947570A (en) 2009-11-16
CN101878524B (zh) 2012-10-03
CN101878524A (zh) 2010-11-03
KR101158380B1 (ko) 2012-06-22

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