WO2009075160A1 - 電気部品の実装方法及び実装装置 - Google Patents

電気部品の実装方法及び実装装置 Download PDF

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Publication number
WO2009075160A1
WO2009075160A1 PCT/JP2008/070691 JP2008070691W WO2009075160A1 WO 2009075160 A1 WO2009075160 A1 WO 2009075160A1 JP 2008070691 W JP2008070691 W JP 2008070691W WO 2009075160 A1 WO2009075160 A1 WO 2009075160A1
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WO
WIPO (PCT)
Prior art keywords
electric component
chip
wiring board
less
mounting apparatus
Prior art date
Application number
PCT/JP2008/070691
Other languages
English (en)
French (fr)
Inventor
Kazunori Hamazaki
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to US12/747,129 priority Critical patent/US8486212B2/en
Priority to KR1020127010090A priority patent/KR101398307B1/ko
Priority to EP08858733A priority patent/EP2224473A1/en
Priority to CN2008801195813A priority patent/CN101889336B/zh
Publication of WO2009075160A1 publication Critical patent/WO2009075160A1/ja
Priority to HK10111414.3A priority patent/HK1144734A1/xx

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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　厚みが２００μｍ以下の薄い電気部品を配線基板上に実装する際に、導電性粒子を含み且つ最低溶融粘度が低い導電性接着剤を用いて熱圧着した場合に生じる電気部品の反り量を大幅に低減させることができる電気部品の実装装置を提供する。 　実装装置においては、基台１１の上に載置された配線基板１００の上に、最低溶融粘度が１．０×１０３Ｐａ・ｓ以下の異方性導電接着フィルム３００を載置するとともに当該異方性導電接着フィルム３００の上に厚みが２００μｍ以下のＩＣチップ２００を載置する。そして、実装装置においては、ゴム硬度が６０以下のエラストマーからなる圧着部１４を有する熱圧着ヘッド１２によってＩＣチップ２００を加圧し、当該ＩＣチップ２００を配線基板１００の上に熱圧着する。
PCT/JP2008/070691 2007-12-10 2008-11-13 電気部品の実装方法及び実装装置 WO2009075160A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US12/747,129 US8486212B2 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
KR1020127010090A KR101398307B1 (ko) 2007-12-10 2008-11-13 전기 부품의 실장 방법 및 실장 장치
EP08858733A EP2224473A1 (en) 2007-12-10 2008-11-13 Method and apparatus for mounting electric component
CN2008801195813A CN101889336B (zh) 2007-12-10 2008-11-13 电气元件的安装方法和安装装置
HK10111414.3A HK1144734A1 (en) 2007-12-10 2010-12-08 Method and apparatus for mounting electric component

Applications Claiming Priority (2)

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JP2007-318751 2007-12-10
JP2007318751A JP2009141269A (ja) 2007-12-10 2007-12-10 電気部品の実装方法及び実装装置

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JP (1) JP2009141269A (ja)
KR (2) KR20100102648A (ja)
CN (1) CN101889336B (ja)
HK (1) HK1144734A1 (ja)
TW (1) TWI390647B (ja)
WO (1) WO2009075160A1 (ja)

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US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8651359B2 (en) * 2010-08-23 2014-02-18 International Business Machines Corporation Flip chip bonder head for forming a uniform fillet
US8104666B1 (en) 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
US8177862B2 (en) 2010-10-08 2012-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Thermal compressive bond head
JP5732239B2 (ja) * 2010-11-30 2015-06-10 デクセリアルズ株式会社 熱圧着ヘッド、熱圧着装置、実装方法
DE102011109938A1 (de) 2011-03-29 2012-10-04 Oliver Wiesener Klebstoffhärten bei gleichzeitiger Fixierung von Bauteilen auf einem Träger
JP5965185B2 (ja) * 2012-03-30 2016-08-03 デクセリアルズ株式会社 回路接続材料、及びこれを用いた半導体装置の製造方法
JP6212011B2 (ja) * 2014-09-17 2017-10-11 東芝メモリ株式会社 半導体製造装置
KR20200135586A (ko) * 2019-05-22 2020-12-03 삼성디스플레이 주식회사 연성 회로 필름 본딩 장치 및 이를 이용한 연성 회로 필름 부착 방법
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US8486212B2 (en) 2013-07-16
EP2224473A1 (en) 2010-09-01
KR20100102648A (ko) 2010-09-24
US20100288416A1 (en) 2010-11-18
TW200939374A (en) 2009-09-16
JP2009141269A (ja) 2009-06-25
CN101889336B (zh) 2013-05-01
CN101889336A (zh) 2010-11-17
KR20120060888A (ko) 2012-06-12
KR101398307B1 (ko) 2014-05-27
TWI390647B (zh) 2013-03-21

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