WO2009025016A1 - 部品実装装置及び方法 - Google Patents

部品実装装置及び方法 Download PDF

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Publication number
WO2009025016A1
WO2009025016A1 PCT/JP2007/066017 JP2007066017W WO2009025016A1 WO 2009025016 A1 WO2009025016 A1 WO 2009025016A1 JP 2007066017 W JP2007066017 W JP 2007066017W WO 2009025016 A1 WO2009025016 A1 WO 2009025016A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
substrate
mounting component
component
component mounting
Prior art date
Application number
PCT/JP2007/066017
Other languages
English (en)
French (fr)
Inventor
Toru Nishino
Kazuyuki Ikura
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009528890A priority Critical patent/JP4883181B2/ja
Priority to PCT/JP2007/066017 priority patent/WO2009025016A1/ja
Priority to EP07792634.3A priority patent/EP2182791A4/en
Publication of WO2009025016A1 publication Critical patent/WO2009025016A1/ja
Priority to US12/699,958 priority patent/US8769810B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
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    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Abstract

　フェースアップアライメント実装で基板（１）に実装した第１の実装部品（３Ａ，３Ｂ）の上に、フェースダウンアライメント実装で第２の実装部品（２０）を実装する場合に、第２の実装部品（２０）の機能部分の位置にばらつきがあっても精度良く実装するために、第１及び第２の実装部品を基板（１）に実装する際に、第２の実装部品（２０）の形状を下方から画像認識して、第２の実装部品の形状の画像認識結果に基づいて、複数の第１の実装部品（３Ａ，３Ｂ）を基板（１）に実装し、第２の実装部品（２０）を基板に実装された第１の実装部品（３Ａ，３Ｂ）の上に実装する。
PCT/JP2007/066017 2007-08-17 2007-08-17 部品実装装置及び方法 WO2009025016A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009528890A JP4883181B2 (ja) 2007-08-17 2007-08-17 部品実装方法
PCT/JP2007/066017 WO2009025016A1 (ja) 2007-08-17 2007-08-17 部品実装装置及び方法
EP07792634.3A EP2182791A4 (en) 2007-08-17 2007-08-17 APPARATUS AND METHOD FOR MOUNTING COMPONENT
US12/699,958 US8769810B2 (en) 2007-08-17 2010-02-04 Part mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/066017 WO2009025016A1 (ja) 2007-08-17 2007-08-17 部品実装装置及び方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/699,958 Continuation US8769810B2 (en) 2007-08-17 2010-02-04 Part mounting method

Publications (1)

Publication Number Publication Date
WO2009025016A1 true WO2009025016A1 (ja) 2009-02-26

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ID=40377927

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/066017 WO2009025016A1 (ja) 2007-08-17 2007-08-17 部品実装装置及び方法

Country Status (4)

Country Link
US (1) US8769810B2 (ja)
EP (1) EP2182791A4 (ja)
JP (1) JP4883181B2 (ja)
WO (1) WO2009025016A1 (ja)

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WO2013168277A1 (ja) * 2012-05-10 2013-11-14 富士機械製造株式会社 実装用・検査用データ作成装置及び実装用・検査用データ作成方法
JP2016063230A (ja) * 2014-09-16 2016-04-25 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 半導体チップボンディング装置及びその動作方法
CN108430167A (zh) * 2017-02-13 2018-08-21 芝浦机械电子株式会社 电子零件的安装装置和显示用部件的制造方法
KR20190037103A (ko) * 2017-09-28 2019-04-05 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 표시용 부재의 제조 방법
KR20190120738A (ko) * 2017-02-13 2019-10-24 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 표시용 부재의 제조 방법
WO2020246339A1 (ja) * 2019-06-07 2020-12-10 株式会社ブイ・テクノロジー 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法

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JP5562659B2 (ja) * 2010-01-21 2014-07-30 オリンパス株式会社 実装装置および実装方法
JP2012195508A (ja) * 2011-03-17 2012-10-11 Juki Corp 電子部品実装装置
US20140082935A1 (en) * 2012-09-27 2014-03-27 Volex Plc Method for passive alignment of optical components to a substrate
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP5837015B2 (ja) * 2013-09-30 2015-12-24 沖電気工業株式会社 半導体レーザモジュール及びその製造方法
TWI545663B (zh) * 2014-05-07 2016-08-11 新川股份有限公司 接合裝置以及接合方法
US10223589B2 (en) * 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
KR102122038B1 (ko) * 2018-05-28 2020-06-11 세메스 주식회사 본딩 툴과 이를 포함하는 다이 본딩 장치 및 이를 이용하는 다이 본딩 방법
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
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KR102401706B1 (ko) * 2017-09-28 2022-05-26 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 표시용 부재의 제조 방법
WO2020246339A1 (ja) * 2019-06-07 2020-12-10 株式会社ブイ・テクノロジー 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法
JP2020202252A (ja) * 2019-06-07 2020-12-17 株式会社ブイ・テクノロジー 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法
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