MY155097A - Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate - Google Patents

Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

Info

Publication number
MY155097A
MY155097A MYPI2010001142A MYPI20101142A MY155097A MY 155097 A MY155097 A MY 155097A MY PI2010001142 A MYPI2010001142 A MY PI2010001142A MY PI20101142 A MYPI20101142 A MY PI20101142A MY 155097 A MY155097 A MY 155097A
Authority
MY
Malaysia
Prior art keywords
semiconductor chips
coordinates
substrate
picking
wafer table
Prior art date
Application number
MYPI2010001142A
Inventor
Behler Stefan
Blessing Patrick
Original Assignee
Esec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Ag filed Critical Esec Ag
Publication of MY155097A publication Critical patent/MY155097A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

THE INVENTION RELATES TO A METHOD FOR PICKING UP SEMICONDUCTOR CHIPS (2) FROM A WAFER TABLE (1) AND, OPTIONALLY, THEIR MOUNTING ON A SUBSTRATE (4) BY MEANS OF A PICK-AND-PLACE SYSTEM (5). THE POSITION AND ORIENTATION OF THE SEMICONDUCTOR CHIP (2) TO BE MOUNTED NEXT ARE DETERMINED BY MEANS OF A FIRST CAMERA (6) AND MADE AVAILABLE IN THE FORM OF POSITIONAL DATA RELATING TO A FIRST SYSTEM OF COORDINATES. THE POSITION AND ORIENTATION OF THE SUBSTRATE PLACE ON WHICH THE SEMICONDUCTOR CHIP (2) WILL BE MOUNTED ARE DETERMINED BY MEANS OF A SECOND CAMERA (7) AND MADE AVAILABLE IN THE FORM OF POSITIONAL DATA RELATING TO A SECOND SYSTEM OF COORDINATES. THE CONVERSION OF COORDINATES OF THE FIRST OR SECOND SYSTEM OF COORDINATES INTO COORDINATES OF MOTION OF THE PICK-AND-PLACE SYSTEM (5) OCCURS BY MEANS OF TWO FIXED MAPPING FUNCTIONS AND TWO CHANGEABLE CORRECTION VECTORS. THE CORRECTION VECTORS ARE READJUSTED ON THE OCCURRENCE OF A PREDETERMINED EVENT.
MYPI2010001142A 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate MY155097A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH15622007 2007-10-09
CH11362008A CH698334B1 (en) 2007-10-09 2008-07-17 A process for the removal and installation of a wafer table provided on the semiconductor chip on a substrate.

Publications (1)

Publication Number Publication Date
MY155097A true MY155097A (en) 2015-09-15

Family

ID=40908817

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010001142A MY155097A (en) 2007-10-09 2008-10-03 Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

Country Status (8)

Country Link
JP (1) JP5258068B2 (en)
KR (1) KR101503556B1 (en)
CN (1) CN101861637B (en)
CH (1) CH698334B1 (en)
DE (1) DE112008002467B4 (en)
HK (1) HK1144235A1 (en)
MY (1) MY155097A (en)
TW (1) TWI464820B (en)

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CN103367208B (en) * 2013-07-02 2015-10-28 华中科技大学 A kind of back bonding platform for superchip
SG11201610297UA (en) * 2014-06-11 2017-01-27 Universal Instruments Corp Test device for establishing, verifying, and/or managing accuracy
CN104362120B (en) * 2014-10-30 2017-04-19 深圳市大能智造科技有限公司 Camera position adjustment method of visual positioning system of crystal plate pickup device
US10223589B2 (en) 2015-03-03 2019-03-05 Cognex Corporation Vision system for training an assembly system through virtual assembly of objects
JP6510838B2 (en) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 Bonding apparatus and bonding method
JP6438826B2 (en) * 2015-04-02 2018-12-19 ファスフォードテクノロジ株式会社 Bonding apparatus and bonding method
JP6470088B2 (en) * 2015-04-02 2019-02-13 ファスフォードテクノロジ株式会社 Bonding apparatus and bonding method
DE102015106224B4 (en) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Process for repeated measurement of a component carrier located in a placement area of a placement machine, as well as placement machine and computer program for carrying out this method
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
CH711536B1 (en) * 2015-08-31 2019-02-15 Besi Switzerland Ag Method for mounting bumped semiconductor chips on substrate sites of a substrate.
JP6584234B2 (en) * 2015-08-31 2019-10-02 ファスフォードテクノロジ株式会社 Die bonder, bonding method and semiconductor device manufacturing method
KR102080214B1 (en) * 2016-02-01 2020-02-24 시바우라 메카트로닉스 가부시끼가이샤 Mounting apparatus and mounting method of an electronic component, and the manufacturing method of a package part
CN106409746A (en) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 Chip upright patching equipment
CN108575053B (en) * 2017-03-08 2020-03-27 台达电子电源(东莞)有限公司 Electronic component inserting and positioning device and automatic component inserting machine
CN106829469A (en) * 2017-03-30 2017-06-13 武汉库柏特科技有限公司 A kind of unordered grabbing device of robot based on double camera and method
JP6649316B2 (en) * 2017-03-31 2020-02-19 平田機工株式会社 Transfer method and transfer system
WO2018207462A1 (en) * 2017-05-11 2018-11-15 村田機械株式会社 Conveyance system and conveyance method
TWI651795B (en) * 2017-06-20 2019-02-21 梭特科技股份有限公司 Image assist method for placing chip and chip apparatus using the method
JP7018341B2 (en) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 Manufacturing method of die bonding equipment and semiconductor equipment
CN110767577A (en) * 2019-10-24 2020-02-07 苏师大半导体材料与设备研究院(邳州)有限公司 Semiconductor material attaching method
CN112308919B (en) * 2020-10-28 2024-04-09 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Correction method and device for clamping position of chip in clamp

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DE59813989D1 (en) 1997-12-07 2007-06-14 Oerlikon Assembly Equipment Ag Semiconductor mounting device with a reciprocating chip gripper
JP2001015992A (en) * 1999-06-29 2001-01-19 Sony Corp Calibration method in component mounting device
JP4046030B2 (en) * 2002-08-30 2008-02-13 株式会社村田製作所 Component mounting method and component mounting apparatus
DE10300518B4 (en) * 2003-01-09 2005-06-23 Siemens Ag Device for loading substrates with components and method for calibrating such a device
DE50304286D1 (en) 2003-05-21 2006-08-31 Unaxis Int Trading Ltd Semiconductor assembly equipment
CH696103A5 (en) 2003-06-06 2006-12-15 Esec Trading Sa Semiconductor assembly equipment.
JP4343710B2 (en) * 2004-01-09 2009-10-14 ヤマハ発動機株式会社 Surface mount machine
JP4111160B2 (en) * 2004-03-26 2008-07-02 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
JP4029855B2 (en) * 2004-03-26 2008-01-09 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
EP1612843A1 (en) 2004-07-02 2006-01-04 Unaxis International Trading Ltd Method and apparatus for mounting semiconductors
DE102004036990A1 (en) * 2004-07-30 2006-03-23 Siemens Ag Calibration method for assembling machine, involves recording component and marker by camera, and determining actual position of component relative to marker by camera
EP1841570A1 (en) * 2005-01-26 2007-10-10 Abb Ab Device and method for calibrating the center point of tool mounted on a robot by means of a camera
JP2007173801A (en) 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd Method of fitting flip chip to substrate
EP2126645B1 (en) * 2006-12-22 2012-07-04 Kulicke & Soffa Die Bonding GmbH Method for calibrating the x-y positioning of a positioning tool, and apparatus with such a positioning tool

Also Published As

Publication number Publication date
KR20100085027A (en) 2010-07-28
CH698334B1 (en) 2011-07-29
CN101861637A (en) 2010-10-13
TW200929425A (en) 2009-07-01
DE112008002467B4 (en) 2013-08-22
DE112008002467T5 (en) 2010-08-26
CN101861637B (en) 2012-07-18
KR101503556B1 (en) 2015-03-17
CH698334A1 (en) 2009-07-15
TWI464820B (en) 2014-12-11
JP2010541293A (en) 2010-12-24
JP5258068B2 (en) 2013-08-07
HK1144235A1 (en) 2011-02-02

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