TWI464820B - Method for mounting semiconductor chips on a substrate - Google Patents

Description

Method for mounting a semiconductor wafer on a substrate

The present invention is directed to a method of the class described in the preamble of claim 1 for picking up a semiconductor wafer disposed on a wafer table. The invention further relates to a method for arranging a removed semiconductor wafer on a substrate.

Assembly machinery for assembling semiconductor wafers are known in the art of die bonding machines. The assembly mechanism is used to mount a plurality of wafers of the same type disposed adjacent to each other on a wafer carrier one after another on a substrate, such as a metal lead frame. The die bonder includes a wafer stage on which the wafer carrier is disposed; a transport system for providing the substrate and a pick-up system for removing the semiconductor wafers from the wafer carrier And place it on the substrate. The pick-up system includes a bond head having a wafer holder that is moved back and forth by a drive system. The wafer holder is rotated by a vertical axis so that the rotational position of the semiconductor wafers can be changed if necessary. The wafer holder includes an exchangeable gripping member that is a suction member on which a vacuum is applied, which is a "pickup tool" or "die jacket" as is known in the art.

There is a very high demand for such assembly mechanisms. For further processing of the assembled wafers, the wafers need to be placed at a precise location on the substrate. Two cameras are placed on the die bonder to ensure that the semiconductor wafers are properly placed on the substrate in the micrometer range. The first camera measures the position of the semiconductor wafer to be picked up by the wafer holder and provides location information about a first coordinate system. The second camera measures the location of the substrate on which the semiconductor wafers need to be placed and provides location information about a second coordinate system. According to the information provided by the cameras, the pick-up system controls the bond head in such a manner that the wafer holder can remove the semiconductor wafer from the wafer stage and can place the semiconductor wafer in a precise position The correct location of the substrate location. The location of the access system is associated with a third coordinate system that is independent of the camera's coordinate system.

During the operation of the die bonder, the relative position of the three coordinate systems may change due to different conditions. The temperature of the die bonder at different locations is often intentionally or unintentionally changed. This mostly results in the conversion of the target coordinates determined by the coordinate system of the first camera or the coordinate system of the second camera to the motion coordinates of the access system, without the exact consequences as required.

The present invention is based on the object of providing a method for picking up and assembling a semiconductor wafer in which high accuracy in the placement of the semiconductor wafers is ensured regardless of the external environment and variations. This object is achieved in accordance with the features of claim 1 of the present invention.

The present invention relates to a method for picking up and optionally assembling a semiconductor wafer on a substrate, wherein:

- supplying the semiconductor wafers on a wafer stage;

- a semiconductor wafer is subsequently supplied to a substrate stage after the other;

- a first camera detects the position and positioning of the semiconductor wafer provided on the wafer stage and assembled as the next;

- a second camera detects the location and location of the semiconductor wafer to be mounted on the substrate at the location of the substrate;

- a wafer holder picking up the semiconductor wafer provided on the wafer stage and assembling the semiconductor wafer on the substrate, wherein the wafer holder is fixed to a bonding head and preferably having two linear driving means The system is configured to transport the bonding head having the wafer holder back and forth between the wafer table and the substrate.

According to the present invention, under the first camera by a detected position of the assembly is a semiconductor wafer in the form of lines on a position of the first coordinate system KS ₁ information is provided, the assembly of the semiconductor wafer on the substrate The position of the substrate is provided in the form of positional information about a second coordinate system KS ₂ , and the position of the joint head is related to a third coordinate system KS ₃ .

The present invention provides a marker provided on the bond head, wherein the position of the marker is known by the cameras. Since the marking is not configurable in the focal plane of the camera because of the structural burying, the present invention further proposes to attach a lens above the marking in a preferred embodiment, the lens ensures that the marking is also imaged in a clear manner. .

The present invention further proposes to use a first fixed mapping function F and a first variable correction vector K ₁ for converting the coordinates of the first coordinate system KS ₁ into the third coordinate system KS _{3 of} the access system. And a second fixed mapping function G and a second variable correction vector K ₂ for converting the coordinates of the second coordinate system KS _{2 to} the third coordinate system KS _{3 of} the pick-up system. When the die bonder is set for the first time or in the case of a general new setting of the die bonder, on the one hand, the mapping functions F and G and their inverse functions are determined, and on the other hand, the two correction vectors K ₁ are K _{2 is} set to zero. The correction vectors K ₁ and K ₂ are readjusted by the occurrence of a predetermined event, but the mapping functions F and G are not changed until the next new setting of the die bonder. It will be appreciated that a predetermined event is an event that can be expected with a high probability, wherein the relative positions of the three coordinate systems KS ₁ , KS ₂ and KS ₃ change relative to each other to a range that reduces the accuracy of the configuration.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing an assembly mechanism for assembling a semiconductor wafer, which is a so-called die bonder, which is necessary for understanding the scope of the present invention. Figure 2 shows a portion of the assembly mechanism in a side view. The die bonder comprises a wafer table 1 on which the semiconductor wafers 2 to be mounted are provided; a substrate table 3 on which the assembled substrate 4 is mounted by a transport device (not shown) Provided; and a pickup system 5 that picks up and places the semiconductor wafers 2 from the wafer table 1 on the substrate 4, and two cameras 6 and 7. The pick-up system 5 includes a bond head 8 (Fig. 2) having an exchangeable wafer holder 9 and two linear position control drivers for moving the joint in two orthogonal directions designated as the x-direction and the y-direction. Head 8. A third drive (not shown) is used to lift or lower the bond head 8 or the wafer holder 9 in the z direction, wherein the z-direction extends perpendicular to the plane of the drawing. The first camera 6 is used to determine the position at which the next semiconductor wafer 2 will be removed. The second camera 7 is for determining that the semiconductor wafer 2 is to be placed on the substrate 4 at the location of the substrate. The first camera 6 is typically configured in a fixed manner. The second camera 7 is also arranged in a fixed manner or can be independently driven to extend in at least one or two directions parallel to the surface of the substrate 4. The detachment system 5 can be, for example, a system in the conventional TW125280, TW231561, TW237297, and TW287841.

A mark 10 (Fig. 2) is laterally connected to the joint head 8 in the following manner: when the joint head 8 is disposed in the field of view of the first camera 6, the image that can be supplied by the first camera 6 It is seen, and when the joint head 8 is placed in the field of view of the second camera 7, it can be seen in the image supplied by the second camera 7.

FIG. 2 shows a side view of the first camera 6, the bonding head 8, and the wafer stage 1. The field of view in the drawing is defined by the line 6a facing the wafer table 1 such that the next semiconductor wafer 2 to be removed is imaged in a clearly defined manner in the image supplied therefrom. The focal plane of the first camera 6 is in the plane defined by the semiconductor wafer 2 to be removed. The focal plane (Fig. 1) of the second camera 7 is located in a plane defined by the surface of the substrate 4 to be assembled. Attaching the marker 10 to the bond head 8 makes it possible to image in a clearly defined manner by the two cameras 6 and 7 without adjusting the focal plane. In order to still ensure that the indicia 10 is imaged in a clearly defined manner, it is helpful to attach a lens 10 to the bonding head 8 above the indicia 10. The lens 11 is disposed between the indicia 10 and the respective cameras 6 and 7, and ensures that the indicia 10 is imaged in a sufficiently sharply defined manner in the images of the respective cameras 6 and 7. In order to ensure that the indicia 10 are imaged in a clearly defined manner, it is also possible to pre-adjust the focal planes of the cameras in place of the arrangement of the lenses 11. Due to the lens 11, as a result, the lens systems of the cameras 6 and 7 have a small adjustment range, so the solution of the lens 11 is simpler, faster and more economical.

The first camera 6 provides its image data to a first image processing unit, from which it determines the position and positioning of the semiconductor wafer 2 to be assembled, and relates it to a first coordinate system KS ₁ The location information is provided in the form of information. The position data is composed of three numbers (p, q, φ), wherein the two numbers p and q specify the position of the reference point of the semiconductor wafer 2, and the value φ determines the set point along the semiconductor wafer 2. The angle at which the position is rotated.

The second camera 7 supplies its image data to a second image processing unit, which determines from the image data the semiconductor wafer 2 to be mounted on the substrate, where it is located and positioned, and A form of location information about a second coordinate system KS ₂ is provided. These position data are composed of three numbers (u, v, Ψ), where the values u and v specify the position of the reference point of the substrate location, and the value Ψ is the angle of rotation of the set point position along the substrate location. .

The first linear drive of the pick-up system provides a value x _M to which the second linear drive of the pick-up system provides a value y _M which is formed together with respect to the third coordinate system KS ₃ to represent the mark The position of the position of 10 (x _M , y _M ).

The wafer holder 9 is rotatable about a rotating shaft 12 (Fig. 2). The suction port of the wafer holder 9 defines the position of the jig axis 13 (Fig. 2) of the wafer holder 9. The position (x _G , x _G ) of the clamp shaft 13 at the third coordinate system KS ₃ is given by:

(x _G , y _G )=(x _M ,y _M )+D+E

Wherein vector D indicates the position of the axis of rotation 12 associated with the position (x _M , y _M ) of the marker 10, and the vector E is the position of the clamp axis 13 associated with the position of the axis of rotation 12. Vector D is a fixed vector that is immediately determined. The vector E is a vector that rotates together with the wafer holder 9: its length has a fixed amount, but when the wafer holder 9 is rotated about the rotating shaft 12, its direction changes. Ideally, the axis of rotation 12 is always coincident with the axis of the clamp 13, i.e., E = 0, regardless of the rotational position of the wafer holder 9.

Figure 3 illustrates the correlation between the three coordinate systems KS ₁ , KS ₂ and KS ₃ . In order to ensure that the semiconductor wafers 2 can be placed on the substrate 4 in a correctly placed manner, it is necessary to calculate the wafer holder 9 in both the first coordinate system KS ₁ and the second coordinate system KS ₂ . The current position of the clamp shaft 13. Therefore, a first mapping function F is determined during the first setting or a general new setting of the assembly mechanism, wherein the function F maps the first coordinate system KS ₁ to the third coordinate system KS ₃ . This mapping takes place by means of the marking 10: the two linear drives of the handling system 5 move the bonding head 8 with the marking 10 together to k different positions within the field of view of the first camera 6 (x _n , y _n ), where n=1 to k, and the first image processing unit determines the image supplied by the first camera 6 as the relevant position (p _n , q _n ) of the marker 10. The first mapping function F is calculated from the obtained data record. Then apply the following formula:

(x,y)=F(p,q)

Then calculating the inverse function F ^{-1 of} the mapping function F, so that

(p,q)=F ^-1 (x,y)

Further, a first correction vector K _{1 is} set to K ₁ =0.

Similarly, it is determined that the second coordinate system KS _{2 is} mapped to a second mapping function G of the third coordinate system KS ₃ and an inverse function G ^{-1 thereof} . Then apply the following formula:

(x,y)=G(u,v)

And vice versa

(u,v)=G ^-1 (x,y)

Further, a second correction vector K _{2 is} set to K ₂ =0.

Using the first camera 6 and the first coordinate system KS ₁ to determine a target coordinate with respect to the first coordinate system KS ₁ , wherein the pick-up system 5 must move the joint head 8 to the first coordinate system KS ₁ such that The wafer holder 9 can be picked up to pick up the semiconductor wafer 2 provided on the wafer stage 1. Using the second camera 7 and the second coordinate system KS ₂ to determine a target coordinate with respect to the second coordinate system KS ₂ , wherein the picking system 5 must move the joint head 8 to the second coordinate system KS ₂ such that The wafer holder 9 can be placed in the correct placement to place the semiconductor wafer 2. All calculations are performed in these two coordinate systems KS ₁ and KS ₂ . The determined target coordinates are converted to the motion coordinates of the third coordinate system KS ₃ by the respective mapping functions F and G only after all calculations have been completed. Accordingly vector D and E are determined to be _1, and on the second coordinate system KS vector of D ₂ and E ₂ with respect to the first coordinate system KS ₁ vector of D ₁ and E _2. Therefore, the third coordinate system KS ₃ is used only to move the joint head 8 and no calculation is made in the third coordinate system KS ₃ . The third coordinate system KS ₃ is specified by the mechanism of the pick-up system 5, that is, the coordinates x and y are the position values supplied by the encoders of the two linear drive devices, and thus it is not a Accurate orthogonal coordinate system.

Once these have been determined mapping function F and G, and its inverse function F ^-1 G ^-1 such vectors, and D _1, E _1, D ₂ and E _2, is in the production phase, connected to a semiconductor wafer 2 The other is assembled later,

- taking an image of the next semiconductor wafer 2 from the first camera 6, and calculating position data (p _W , q _W , φ _W ) about the first coordinate system KS ₁ of the semiconductor wafer 2 from the image, wherein When the semiconductor wafer 2 is not rotated at its set point position, φ _W =0;

a position (x _W , y _W ) of the third coordinate system KS ₃ , wherein the third coordinate system needs to be photographed by the mark 10 such that the clamp shaft 13 of the wafer holder 9 passes the reference of the semiconductor wafer 2 Point, which is calculated as:

(x _W , y _W )=F[(p _W ,q _W )-D ₁ -E ₁ +K ₁ ]

- the calculated position (x _W , y _W ) is an approximation and the semiconductor wafer 2 is picked up by the wafer holder 9;

- capturing, by the second camera 7, the semiconductor wafer 2 to be mounted on the substrate, the image of the substrate at the location of the substrate, and calculating the location information of the substrate location of the second coordinate system KS ₂ from the image (u) _S , v _S , Ψ _S ), wherein when the substrate location is not rotated for its set point position, Ψ _S =0;

a position (x _S , y _S ) of the third coordinate system KS ₃ , wherein the third coordinate system needs to be photographed by the mark 10 such that the clamp shaft 13 of the wafer holder 9 passes the reference point of the substrate location , which is calculated as:

(x _S , y _S )=G[(u _S ,v _S )-D ₂ -E ₂ +K ₂ ]

- The calculated position (x _S , y _S ) is an approximation, and the wafer holder 9 is selectively rotatable at an angle of Ψ _S - φ _S , and the semiconductor wafer 2 is placed on the substrate.

In order to maintain the placement accuracy of the die bonder at the same high level during all production periods, the readjustment of the first correction vector K ₁ and the second correction vector K ₂ is performed during a predetermined event occurrence. Using the mark provided on the bonding head 8 of 10, the tag line is brought into the field of view of the first camera 6 to re-adjust the first correction vector K _1, and is brought into the field of view of the second camera 7 To re-adjust the second correction vector K ₂ . The re-adjustment of the first correction vector K ₁ occurs by:

- moving the joint head 8 to a set point position R = (x _R , y _R ), wherein the mark 10 is in the same position as the coordinates (x _R , y _R ) of the third coordinate system KS ₃ In the field of view of a camera 6;

- calculating the set point position (p _R , q _R ) of the marker 10 relative to the first coordinate system KS ₁ as (p _R , q _R )=F ^-1 (x _R , y _R );

- taking the image of the marker 10 with the first camera 6, using the image of the first camera 6 to determine the true position (p _M , q _M ) of the marker 10 relative to the first coordinate system KS ₁ ;

- calculating the first correction vector K ₁ as the difference between the approximate set point position and the measured true position:

K ₁ = (p _R , q _R )-(p _M , q _M ).

It can be clearly seen that the first correction vector K _{1 is} associated with the first coordinate system KS ₁ .

The re-adjustment of the second correction vector K ₂ occurs in a similar manner:

- moving the joint head 8 to a set point position T = (x _T , y _T ), wherein the mark 10 is in the same position as the coordinates (x _T , y _T ) of the third coordinate system KS ₃ In the field of view of the second camera 7;

Calculating a position (u _T , v _T ) of the marker 10 relative to the second coordinate system KS ₂ to (u _T , v _T )=G ⁻¹ (x _T , y _T );

- taking the image of the marker 10 with the second camera 7, using the image of the second camera 7 to determine the true position (u _M , v _M ) of the marker 10 relative to the second coordinate system KS ₂ , and

- calculating the second correction vector K ₂ as the difference between the approximate set point position and the measured true position:

K ₂ =(u _T ,v _T )-(u _M ,v _M ),

It can be clearly seen that the second correction vector K _{2 is} associated with the second coordinate system KS ₂ .

There are a number of different events that can trigger the re-adjustment of the correction vectors K ₁ and K ₂ , in particular the following four events:

- a predetermined number of semiconductor wafers 2 have been assembled due to the final correction;

- due to this final correction, the temperature measured at the predetermined position of the handling system 5 has been changed by a value greater than a predetermined value;

- production is stopped;

- The actual position of the assembled semiconductor wafer detected and calculated by the second camera 7 after assembly is offset from the set point position by more than a predetermined amount.

After completion of such a correction vector K ₁ and K ₂ readjust, the assembly can continue such a semiconductor wafer according to step 2 of the mentioned above, but now updates the correction vector K ₁ and K ₂ may be different from 0.

The present invention can be used in a conventional pick-and-place system in which the wafer table 1 and the platform 3 of the substrate 4 are arranged in a parallel plane, and in the pick-up system described in EP 1 480 507, wherein the wafer table 1 is The platform 3 of the substrate is configured to be obliquely associated with each other, and wherein the bonding head 8 performs a pivoting motion about a horizontal axis in addition to the movement in the x and y directions.

The above specific embodiment is a preferred embodiment, wherein the joint head is moved to the first set point position R and to the second set point position T, respectively, for adjustment and readjustment, and the first The coordinates of the first set point position R of the _three coordinate system KS ₃ and the second set point position T are used to readjust the two correction vectors K ₁ and K ₂ . In this illustration, the respective setpoint positions of the marker 10 are calculated by the inverse functions F ^-1 and G ^-1 , respectively. Next, another embodiment is described in which when the joint head 8 is in the first or second set point position, the coordinates of the mark 10 about the first coordinate system KS ₁ are additionally stored (or the joint) Any other random reference point on the head 8 or the coordinates of the mark 10 of the second coordinate system KS ₂ (or any other random reference point on the bond head 8), followed by the two correction vectors K ₁ and K ₂ re-adjustment.

One portion of the pick-up system includes the pick-up system for picking up the semiconductor wafers from the wafer station. The third coordinate system KS _{3 is} the internal coordinate system of the pick-up system or the pick-up system, and thus will hereinafter be referred to as the KS coordinate system. In order to ensure that the readjustment can be performed, an adjustment is first performed in a set phase, wherein the bond head 8 is moved to a first set point position (which is within the field of view of the first camera 6), and determined and stored. The coordinates (x _SP1 , y _SP1 ) of the first set point position of the coordinate system KS and the coordinates (p _SP1 , q _SP1 ) of the first set point position of the coordinate system KS ₁ of the first camera 6 . The re-adjustment occurs in the production phase in that the bond head 8 is moved to the coordinates of the first set point position (x _SP1 , y _SP1 ) and the coordinate system for the first camera 6 is again determined. The coordinates of the set point position of KS ₁ (p _SP1 ', q _SP1 '). The vector difference of (p _SP1 ',q _SP1 ')-(p _SP1 ,q _SP1 ) contains information about the displacement of the first coordinate system KS ₁ with respect to the coordinate system KS, wherein the coordinate system KS is set in the setting phase It has happened in the future. At any random point on the reference of the bonding head 8 can be used to define with respect to the first coordinate system KS ₁ of the first set point position of the head 8 is engaged. As noted above, the indicia 10 is preferably used to define the reference point.

Similarly, the position of the second coordinate system KS ₂ of the second camera 7 relative to the coordinate system KS of the bonding head 8 is detected and corrected, so that further adjustment is performed during the setting phase, wherein the bonding head 8 is Moving to a second set point position within the field of view of the second camera 7, and determining and storing a coordinate (x _SP2 , y _SP2 ) about the second set point position of the coordinate system KS with respect to the second camera The coordinate of the second set point position of the coordinate system KS ₂ of 7 (u _SP2 , v _SP2 ). The re-adjustment in the production phase occurs in that the bond head 8 is moved to the coordinates of the second set point position (x _SP2 , y _SP2 ) and the coordinate system for the second camera 7 is again determined. The coordinates of the second set point position of KS ₂ (u _SP2 ', v _SP2 '). The vector difference of (u _SP2 ', v _SP2 ') - (u _SP2 , v _SP2 ) contains information about the position of the second coordinate system KS ₂ with respect to the coordinate system KS, wherein the coordinate system KS is in the setting phase This has happened since the setting was made. Also, in this case, any random reference point at the bond head 8 can be used to define a second set point position of the bond head 8 relative to the second coordinate system KS ₂ . As noted above, the indicia 10 is preferably used to define the reference point.

Determining the coordinates of the reference points of the first coordinate system KS ₁ and the second coordinate system KS ₂ includes capturing images by the cameras 6 and 7, and determining the coordinates of the reference point by conventional image evaluation.

The assembly of the semiconductor wafers then preferably takes place in the following manner:

- the position of the semiconductor wafer 2 to be assembled by the first camera 6 and then to be assembled in the form of information on the position of the first coordinate system KS ₁ ;

- detected by the second camera 7 to be mounted on the substrate in the form of the semiconductor wafer 2 at the location of the substrate, in the form of information on the position of the second coordinate system KS ₂ ;

- in the setting phase, a first mapping function maps the first coordinate system KS ₁ to the coordinate system KS and determines its inverse function, and sets a first correction vector to a value of 0, a second mapping function The two coordinate system KS _{2 is} mapped to the coordinate system KS and determines its inverse function, and sets a second correction vector to a value of 0;

- at the production stage, a semiconductor wafer 2 is connected to another assembly, such that

- taking an image of the semiconductor wafer 2 to be mounted next to the camera 6 and determining the position of the semiconductor wafer 2 relative to the first coordinate system KS ₁ and by considering the first mapping function and considering the first correction a vector from which the pick-up system 5 is required to move the bond head 8 to pick up the position of the semiconductor wafer 2 associated with the KS coordinate system;

- taking the second camera 7 to capture the semiconductor wafer 2 to be mounted on the substrate, its image at the location of the substrate, and determining the position of the substrate relative to the second coordinate system KS ₂ , and by means of the a second mapping function and considering the second correction vector, from which it is calculated that the accommodating system 5 needs to move the bonding head 8 to assemble the semiconductor wafer 2 at a position of the substrate relative to the KS coordinate system;

And re-adjusting at the production stage includes re-adjusting the first correction vector and the second correction vector by the following steps:

- moving the bonding head 8 to the first set point position;

- taking the image of the marker 10 with the first camera 6, and determining the actual position of the marker 10 relative to the first coordinate system KS ₁ from the image of the first camera 6, and

Calculating the first correction vector K ₁ as the difference between the stored set point position and the determined actual position;

- moving the joint head 8 to the second set point position;

- taking the image of the marker 10 with the second camera 7, and determining the actual position of the marker 10 relative to the second coordinate system KS ₂ from the image of the second camera 7, and

- calculating the second correction vector K ₂ as the difference between the stored set point position and the determined actual position.

Although the specific embodiments and applications of the present invention have been shown and described, it will be apparent to those skilled in the art that As feasible. Therefore, the invention is not limited except as to the scope of the claims and the equivalents thereof.

The present invention is intended to be illustrative of the principles and embodiments of the present invention, which are incorporated in and constitute a part of the specification. These drawings are not shown in true scale.

1. . . Wafer table

2. . . Semiconductor wafer

3. . . Substrate table

4. . . Substrate

5. . . Access system

6. . . First camera

7. . . Second camera

8. . . Bonding head

9. . . Wafer fixture

10. . . mark

11. . . lens

12. . . Rotary axis

13. . . Fixture axis

KS ₁ . . . Coordinate system of the first camera

KS ₂ . . . Second camera coordinate system

KS ₃ . . . Joint head coordinate system

F, G. . . Mapping function

F ^-1 , G ^-1 . . . Inverse function of mapping function

D, E. . . vector

Figure 1 is a plan view showing an assembly machine for assembling a semiconductor wafer;

Figure 2 is a side view showing a camera, a bonding head and a wafer table, and

Figure 3 shows a top view of the bond head and three different coordinate systems.

8. . . Bonding head

10. . . mark

12. . . Rotary axis

13. . . Fixture axis

KS1. . . Coordinate system of the first camera

KS2. . . Second camera coordinate system

KS3. . . Joint head coordinate system

F, G. . . Mapping function

F ^-1 , G ^-1 . . . Inverse function of mapping function

D, E. . . vector

Claims (5)

A method for mounting a semiconductor wafer (2) on a substrate (4), the semiconductor wafer (2) disposed on the wafer table (1) by a pick-up system (5) having a bonding head (8) Mounted on the substrate (4), wherein the mark (10) is attached to the bond head (8), wherein the image of the semiconductor wafer (2) disposed on the wafer stage (1) is first camera ( 6) shooting, and the position of the semiconductor wafer (2) determined from the image is provided in the form of position data about the first coordinate system (KS ₁ ); the image at the substrate location is taken by the second camera (7) And the position of the substrate determined from the image is provided in the form of position data about the second coordinate system (KS ₂ ); and the position of the joint head (8) is inherent to the pick-up system (5) a third coordinate system (KS ₃ ); the method includes a set phase and a production phase, the set phase comprising: determining a first mapping function and an inverse function thereof, the first mapping function mapping the first coordinate system (KS ₁ ) To the third coordinate system (KS ₃ ); setting the first correction vector to a value of 0; determining the second mapping function and An inverse function, the second mapping function mapping the second coordinate system (KS ₂ ) to the third coordinate system (KS ₃ ); and setting the second correction vector to a value of 0; the production phase includes: another semiconductor Mounting a semiconductor wafer (2) after the wafer includes: capturing an image of the semiconductor wafer (2) to be mounted next time by the first camera (6); determining the semiconductor wafer from the image of the first camera (6) ( 2) relative to the position of the first coordinate system (KS ₁ ); by means of the first mapping function and by considering the first correction vector, calculating the relative coordinate to the third coordinate system (KS ₃ ) a semiconductor wafer (2) the pickup system (5) needs to move the bonding head (8) to a position; and the second camera (7) captures an image of the substrate where the semiconductor wafer (2) is to be mounted; Determining, from the image of the second camera (7), the position of the substrate relative to the second coordinate system (KS ₂ ); and calculating the relative position by using the second mapping function and by considering the second correction vector The third coordinate system (KS ₃ ) is used to mount the semiconductor wafer (2) The system (5) needs to move the position of the bonding head (8); and adjusts the first and second correction vectors when a predetermined event occurs, the adjustment of the first and second correction vectors includes: the bonding head (8) moving to a first set point position, wherein the mark (10) is in the field of view of the first camera (6); calculating the mark (10) relative to the first coordinate system (KS ₁ ) a first set point position; the image of the mark (10) is taken by the first camera (6); and the mark (10) is determined from the image of the first camera (6) relative to the first coordinate system (KS ₁ ) Actual position; calculating the first correction vector as a difference between the calculated set point position of the mark (10) and the determined actual position; moving the joint head (8) to a second set point position, wherein the marker (10) positioned within the second line camera (7) of the field of view; calculating the marker (10) relative to the second coordinate system (KS ₂₎ of the second set point position; to the second camera (7 Shooting the image of the mark (10); determining the mark (10) relative to the second coordinate system (KS ₂ ) from the image of the second camera (7) And calculating the second correction vector as a difference between the calculated setpoint position of the marker (10) and the determined actual location. The method of claim 1, wherein the predetermined event is at least one of the following events: - a predetermined number of semiconductor wafers (2) have been mounted due to the final correction; - due to the final correction, the acquisition is performed The measured temperature change at the predetermined position of the system (5) has exceeded a predetermined value; - production is stopped; - the actual position of the mounted semiconductor wafer detected and calculated by the second camera (7) after installation is greater than A predetermined amount deviates from the set point position. The method of claim 1, wherein the method is applied to the joint head (8) The mark (10) is imaged on the respective cameras (6 and 7) with sufficient sharpness by means of a lens (11) attached to the bond head (8). The method of claim 2, wherein the mark (10) applied to the bonding head (8) is imaged with sufficient sharpness by a lens (11) attached to the bonding head (8) On the respective cameras (6 and 7). The method of any one of claims 1 to 4, wherein the determining of the first mapping function comprises: moving the bonding head (8) to a plurality of different positions such that the marking (10) is in the Within the field of view of the first camera (6); capturing an image with the first camera; and determining a position associated with the marker (10) from the image supplied by the first camera (6); and determining the second mapping function The method includes: moving the bonding head (8) to a plurality of different positions such that the marking (10) is in the field of view of the second camera (7); capturing an image with the second camera (7); The image supplied by the second camera (7) determines the position of the mark (10).