CN110767577A - Semiconductor material attaching method - Google Patents
Semiconductor material attaching method Download PDFInfo
- Publication number
- CN110767577A CN110767577A CN201911017819.8A CN201911017819A CN110767577A CN 110767577 A CN110767577 A CN 110767577A CN 201911017819 A CN201911017819 A CN 201911017819A CN 110767577 A CN110767577 A CN 110767577A
- Authority
- CN
- China
- Prior art keywords
- substrate
- degree
- mechanical claw
- freedom mechanical
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/80122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
Abstract
The invention provides a semiconductor material attaching method, and relates to the technical field of material attachment. The semiconductor material attaching method includes the steps of: s1, preparing a semiconductor substrate, washing the substrate by using an HCl solution, repeatedly washing for 3-5 times, taking out the substrate, removing solution components on the surface of the substrate by using distilled water, and finally sending the substrate into a vacuum environment for drying treatment; s2, preparing a workbench, the multi-degree-of-freedom mechanical claw, the image acquisition head, the pressure sensor and the PLC, wherein the multi-degree-of-freedom mechanical claw, the image acquisition head and the PLC are all arranged on the workbench. The semiconductor chip is clamped by the multi-degree-of-freedom mechanical claw, then the PLC calculates the walking route and the walking distance of the multi-degree-of-freedom mechanical claw, the semiconductor chip is accurately conveyed to a specified position, the problem that the position of the semiconductor chip is in error is greatly reduced, the defective rate is reduced, and the later normal use of the semiconductor material is guaranteed.
Description
Technical Field
The invention relates to the technical field of material attachment, in particular to a semiconductor material attachment method.
Background
Semiconductor device manufacturers are constantly striving to improve the versatility and performance of their products while reducing their manufacturing costs, an important aspect in semiconductor device manufacturing is packaging semiconductor chips, as those skilled in the art know, fabricating integrated circuits on a wafer, and then singulating the wafer to produce semiconductor chips, one or more semiconductor chips being disposed in a package to protect them from environmental and physical influences, the package also involving electrically coupling the semiconductor chip electrodes to external terminals of the semiconductor device.
In the past, the semiconductor industry used various packaging structures to increase the packing density of semiconductor dies in a system, and the increased demand for electronic devices increased the demand for smaller, lighter, yet more functional semiconductor devices and led to a demand for semiconductor packages having increased semiconductor packing density with smaller profiles and mounting footprints, in some embodiments, semiconductor dies vertically stacked on one another with an adhesive interposer attached to the semiconductor dies for coupling the semiconductor dies together, the dies attached to a substrate of a glass epoxy type printed circuit board or other similar substrate, and then the semiconductor dies wire bonded to the substrate to form electrical interconnections between the substrate and the semiconductor dies.
At present, the semiconductor chip and the substrate are generally placed on the substrate manually, and the manual mode easily causes errors in the position of the semiconductor chip, thereby affecting later use of semiconductor materials.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a semiconductor material attaching method, which solves the problem that the position of a semiconductor chip is easy to generate errors in a manual mode, so that the later use of a semiconductor material is influenced.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a semiconductor material attachment method comprising the steps of:
s1, preparing a semiconductor substrate, washing the substrate by using an HCl solution, repeatedly washing for 3-5 times, taking out the substrate, removing solution components on the surface of the substrate by using distilled water, and finally sending the substrate into a vacuum environment for drying treatment;
s2, preparing a workbench, a multi-degree-of-freedom mechanical claw, an image acquisition head, a pressure sensor and a PLC (programmable logic controller), wherein the multi-degree-of-freedom mechanical claw, the image acquisition head and the PLC are all arranged on the workbench, the pressure sensor, the multi-degree-of-freedom mechanical claw and the image acquisition head are all electrically connected with the PLC, and the pressure sensor is arranged at the tail end of the multi-degree-of-freedom mechanical claw;
s3, placing the substrate on a work table and fixing the substrate, arranging an attachment area and a carrier on the surface of the substrate, clamping the semiconductor chip by the multi-degree-of-freedom mechanical claw, acquiring an image of the substrate by using the image acquisition head, sending the acquired image to the PLC, analyzing the position of the attachment area in the image by the PLC, and calculating a traveling route and a traveling distance of the multi-degree-of-freedom mechanical claw;
s4, the multi-degree-of-freedom mechanical claw moves to a designated position along with the semiconductor chip, the pressure sensor transmits the pressure of the multi-degree-of-freedom mechanical claw on the semiconductor chip to the PLC controller in the whole process, the PLC controller controls the clamping force of the multi-degree-of-freedom mechanical claw on the semiconductor chip, when the semiconductor chip reaches the designated attachment area, the semiconductor chip is immediately attached to the substrate, then the multi-degree-of-freedom mechanical claw resets, and the operation is repeated until all the semiconductor chips are attached;
s5, after the attachment is finished, the image acquisition head acquires the substrate image again, the PLC analyzes whether the attachment position of the semiconductor chip has deviation or not, if the semiconductor chip has the deviation problem, the reason of the deviation is analyzed, and if the semiconductor chip does not have the deviation problem, the semiconductor chips are electrically connected;
and S6, detecting whether the semiconductor material is qualified or not by utilizing the electric performance detection device on the base plate which is finally attached.
(III) advantageous effects
The invention provides a semiconductor material attaching method. The method has the following beneficial effects:
1. according to the semiconductor material attaching method, the semiconductor chip is clamped by the multi-degree-of-freedom mechanical claw, then the PLC calculates the walking route and the walking distance of the multi-degree-of-freedom mechanical claw, the semiconductor chip is accurately conveyed to the specified position, the problem that the position of the semiconductor chip has errors is greatly reduced, the defective rate is reduced, and the later normal use of the semiconductor material is guaranteed.
2. According to the semiconductor material attaching method, ions on the surface of the substrate are effectively removed by basically cleaning the substrate with the HCl solution, so that the corrosion resistance of the substrate is further improved.
Detailed Description
The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
the embodiment of the invention provides a semiconductor material attaching method, which comprises the following steps:
s1, preparing a semiconductor substrate, washing the substrate by using HCl solution, repeatedly washing for 3-5 times, taking out the substrate, removing solution components on the surface of the substrate by using distilled water, finally sending the substrate into a vacuum environment for drying treatment, and effectively removing ions on the surface of the substrate by using the HCl solution to basically wash the substrate, thereby further improving the corrosion resistance of the substrate;
s2, preparing a workbench, a multi-degree-of-freedom mechanical claw, an image acquisition head, a pressure sensor and a PLC (programmable logic controller), wherein the multi-degree-of-freedom mechanical claw, the image acquisition head and the PLC are all arranged on the workbench, the pressure sensor, the multi-degree-of-freedom mechanical claw and the image acquisition head are all electrically connected with the PLC, and the pressure sensor is arranged at the tail end of the multi-degree-of-freedom mechanical claw;
s3, placing the substrate on a work table and fixing the substrate, arranging an attachment area and a carrier on the surface of the substrate, clamping the semiconductor chip by the multi-degree-of-freedom mechanical claw, acquiring an image of the substrate by using the image acquisition head, sending the acquired image to the PLC, analyzing the position of the attachment area in the image by the PLC, and calculating a traveling route and a traveling distance of the multi-degree-of-freedom mechanical claw;
s4, the multi-degree-of-freedom mechanical claw moves to a designated position along with the semiconductor chip, the pressure sensor transmits the pressure of the multi-degree-of-freedom mechanical claw on the semiconductor chip to the PLC controller in the whole process, the PLC controller controls the clamping force of the multi-degree-of-freedom mechanical claw on the semiconductor chip, when the semiconductor chip reaches the designated attachment area, the semiconductor chip is immediately attached to the substrate, then the multi-degree-of-freedom mechanical claw resets, and the operation is repeated until all the semiconductor chips are attached;
s5, after the attachment is finished, the image acquisition head acquires the substrate image again, the PLC analyzes whether the attachment position of the semiconductor chip has deviation or not, if the semiconductor chip has the deviation problem, the reason of the deviation is analyzed, and if the semiconductor chip does not have the deviation problem, the semiconductor chips are electrically connected;
and S6, detecting whether the semiconductor material is qualified or not by utilizing the electric performance detection device on the base plate which is finally attached.
The semiconductor chip is clamped by the multi-degree-of-freedom mechanical claw, then the PLC calculates the walking route and the walking distance of the multi-degree-of-freedom mechanical claw, the semiconductor chip is accurately conveyed to a specified position, the problem that the position of the semiconductor chip is in error is greatly reduced, the defective rate is reduced, and the later normal use of the semiconductor material is guaranteed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. A semiconductor material attachment method, characterized by: the method comprises the following steps:
s1, preparing a semiconductor substrate, washing the substrate by using an HCl solution, repeatedly washing for 3-5 times, taking out the substrate, removing solution components on the surface of the substrate by using distilled water, and finally sending the substrate into a vacuum environment for drying treatment;
s2, preparing a workbench, a multi-degree-of-freedom mechanical claw, an image acquisition head, a pressure sensor and a PLC (programmable logic controller), wherein the multi-degree-of-freedom mechanical claw, the image acquisition head and the PLC are all arranged on the workbench, the pressure sensor, the multi-degree-of-freedom mechanical claw and the image acquisition head are all electrically connected with the PLC, and the pressure sensor is arranged at the tail end of the multi-degree-of-freedom mechanical claw;
s3, placing the substrate on a work table and fixing the substrate, arranging an attachment area and a carrier on the surface of the substrate, clamping the semiconductor chip by the multi-degree-of-freedom mechanical claw, acquiring an image of the substrate by using the image acquisition head, sending the acquired image to the PLC, analyzing the position of the attachment area in the image by the PLC, and calculating a traveling route and a traveling distance of the multi-degree-of-freedom mechanical claw;
s4, the multi-degree-of-freedom mechanical claw moves to a designated position along with the semiconductor chip, the pressure sensor transmits the pressure of the multi-degree-of-freedom mechanical claw on the semiconductor chip to the PLC controller in the whole process, the PLC controller controls the clamping force of the multi-degree-of-freedom mechanical claw on the semiconductor chip, when the semiconductor chip reaches the designated attachment area, the semiconductor chip is immediately attached to the substrate, then the multi-degree-of-freedom mechanical claw resets, and the operation is repeated until all the semiconductor chips are attached;
s5, after the attachment is finished, the image acquisition head acquires the substrate image again, the PLC analyzes whether the attachment position of the semiconductor chip has deviation or not, if the semiconductor chip has the deviation problem, the reason of the deviation is analyzed, and if the semiconductor chip does not have the deviation problem, the semiconductor chips are electrically connected;
and S6, detecting whether the semiconductor material is qualified or not by utilizing the electric performance detection device on the base plate which is finally attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911017819.8A CN110767577A (en) | 2019-10-24 | 2019-10-24 | Semiconductor material attaching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911017819.8A CN110767577A (en) | 2019-10-24 | 2019-10-24 | Semiconductor material attaching method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110767577A true CN110767577A (en) | 2020-02-07 |
Family
ID=69333474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911017819.8A Pending CN110767577A (en) | 2019-10-24 | 2019-10-24 | Semiconductor material attaching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110767577A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005088681A1 (en) * | 2004-03-09 | 2005-09-22 | Cyberoptics Semiconductor, Inc. | Wireless substrate-like sensor |
| CN1783444A (en) * | 2004-11-30 | 2006-06-07 | 富士通株式会社 | Pressure apparatus and chip mounter |
| CN101861637A (en) * | 2007-10-09 | 2010-10-13 | Esec公司 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate |
| CN107424942A (en) * | 2016-05-23 | 2017-12-01 | 株式会社吉帝伟士 | Semiconductor- fabricating device and manufacture method |
-
2019
- 2019-10-24 CN CN201911017819.8A patent/CN110767577A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005088681A1 (en) * | 2004-03-09 | 2005-09-22 | Cyberoptics Semiconductor, Inc. | Wireless substrate-like sensor |
| CN1783444A (en) * | 2004-11-30 | 2006-06-07 | 富士通株式会社 | Pressure apparatus and chip mounter |
| CN101861637A (en) * | 2007-10-09 | 2010-10-13 | Esec公司 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate |
| CN107424942A (en) * | 2016-05-23 | 2017-12-01 | 株式会社吉帝伟士 | Semiconductor- fabricating device and manufacture method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207781575U (en) | Encapsulated electronic device | |
| US9087794B2 (en) | Manufacturing method of molded package | |
| JP2007221139A (en) | Integrated circuit package system having die on base package | |
| WO2018236930A1 (en) | Integrated circuit package with pre-wetted contact sidewall surfaces | |
| JP2962385B2 (en) | Method for manufacturing semiconductor device | |
| CN110767577A (en) | Semiconductor material attaching method | |
| KR100910218B1 (en) | Probe bonding apparatus and method using the same | |
| CN108140630B (en) | Integrated circuit chip with vertical connector | |
| US20170162479A1 (en) | Semiconductor device with frame having arms and related methods | |
| TW508703B (en) | Manufacturing method of semiconductor chip package structure | |
| CN101425468A (en) | Coated lead wire frame | |
| JP3854814B2 (en) | Manufacturing method of semiconductor device | |
| CN207818553U (en) | A kind of encapsulating structure and its carrying carrier of semiconductor product | |
| CN207690781U (en) | QFN encapsulating structures, the QFN encapsulating structures of fingerprint recognition and the smart mobile phone with it | |
| CN217316309U (en) | Packaging bonding wire clamp | |
| JPH03104252A (en) | Manufacture of tape carrier | |
| TWI685875B (en) | Package analysis method | |
| KR20150121490A (en) | Stacked package and method for manufacturing the same | |
| CN108012447A (en) | Semiconductor packages multilayer organic substrate attachment process | |
| KR102220327B1 (en) | Unit for measuring level of a nozzle and method for measuring thereby | |
| CN104181336A (en) | Test module | |
| CN218309710U (en) | Device for processing foreign matters on surface of chip packaging semi-finished product in large batch | |
| KR20070082316A (en) | Method for attaching solder ball using solder ball fixing plate | |
| CN209981193U (en) | Vacuum adsorption jig | |
| JP2002189055A (en) | Characteristics measuring method of leadless semiconductor device, and its device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200207 |