JPH03104252A - Manufacture of tape carrier - Google Patents

Abstract

PURPOSE:To improve the yield of production and reduce production cost by indicating acceptance test results of carrier tape to an alignment mark and mounting a semiconductor element only with a good quality of carrier tape. CONSTITUTION:An inner lead bonder takes in an image of binary alignment marks, calculates the area of a round hole to obtain a gravity coordinates of the round hole, and then calculates the deviation against the gravity coordinates 8 of the round hole, moves the position of a carrier tape or a semiconductor element, aligns an inner lead with an electrode of the semiconductor element, and carriers out bonding operation. The carrier tape where the round hole of the alignment mark is expanded because it is decided as defective by a carrier tape tester results in a larger hole compared with the round hole of an alignment mark formed on a non defective carrier tape. Therefore, it is possible to bond a semiconductor element only with a non defective carrier tape during alignment by providing a boundary value of non defective and defective articles to the area of the round hole, thereby attaining enhanced yield and cost reduction of carrier tape.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for mounting semiconductor elements only on good quality carrier tapes when manufacturing tape carriers.

[Prior Art] Conventionally, when semiconductor elements were mounted on a carrier tape, semiconductor elements were mounted on all accepted carrier tapes.

Normally, carrier tapes are inspected at the manufacturing factory before shipping, but if it is a sampling inspection, there is a possibility that defects may be mixed in, and even in the case of a 100% inspection, handling and transportation after inspection may be difficult. Occasionally, defects such as bending of the inner lead of the carrier tape occurred.

When such a carrier tape is sent to the bonding process of a semiconductor element, the inner lead bonder recognizes the alignment mark 1 as shown in Fig. 2 and aligns the electrode of the semiconductor element and the inner lead 5 for bonding. Since either part of the inner lead 5 is recognized and bonded, the semiconductor element is bonded even if there is a defect in the unrecognized part of the inner lead or in the wiring pattern. Although a semiconductor device bonded to a defective carrier tape is ultimately determined to be a defective tape carrier, it is treated as a non-defective product until the testing process.

[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, a good semiconductor element is mounted on a defective carrier wave, resulting in a decrease in retention. In addition, semiconductor elements bonded to defective carrier tapes undergo subsequent processes such as resin encapsulation, solder plating, and testing, resulting in wasted man-hours and increased costs.

Therefore, an object of the present invention is to improve retention and reduce costs by bonding semiconductor elements only to good carrier tapes and ignoring defective carrier tapes in the subsequent process to manufacture tape carriers. The purpose is to measure the down.

[Means for Solving the Problems] A method for manufacturing a tape carrier of the present invention is a method for manufacturing a tape carrier in which a carrier tape is inspected and a semiconductor element is later mounted thereon. The present invention is characterized in that it shows the pass/fail determination results of carrier tape inspection, and that semiconductor elements are mounted only on non-defective carrier tapes.

[Example] The details of the present invention will be shown below with reference to Examples.

FIG. 1(a) is an enlarged view of an alignment mark formed on a carrier tape used in an embodiment of the present invention. Moreover, FIG. 2B is an enlarged view of an alignment mark on a defective carrier tape. In carrier tapes that are determined to be defective by the carrier tape inspection machine, the round holes 3 are enlarged. To enlarge the round hole, either pass a needle through it or use punching.

The inner lead bonder binarizes this alignment mark, captures the image, calculates the area of the nine holes 3, and obtains the coordinates of the center of gravity of the nine holes. After that, the electrodes 7 of the semiconductor element 6 and the inner leads 5 of the carrier tape 2 shown in FIG.
Calculate the deviation from Kyushu University's center of gravity coordinate 8, which was set in advance, so that the inner lead and the electrode of the semiconductor element are aligned by moving the carrier tape or the position of the semiconductor element. and perform bonding.

A carrier tape that is determined to be defective by the carrier tape inspection machine and whose alignment mark has been expanded has a round hole area that is calculated when alignment is performed by the inner lead bonder and is formed on a non-defective carrier tape. This results in a large result compared to the area of the nine alignment marks. Therefore, by setting and storing a boundary value between good and defective products in the area of the round hole, it is possible to ignore defective carrier tapes during alignment and bond semiconductor elements only to good carrier tapes. .

In this way, defective carrier tapes to which semiconductor elements have not been bonded are ignored in subsequent processes such as resin sealing, solder plating, and testing, thereby eliminating unnecessary man-hours.

Next, a method for detecting a defective carrier tape using an inner lead bonder that recognizes and aligns a part of the inner lead during bonding will be described.

For carrier tapes that are determined to be defective by the carrier tape inspection machine, some inner lead portions recognized by the inner lead bonder are bent or cut off.

The inner lead ponder recognizes a part of the inner lead and performs alignment by pattern matching, so if the part of the inner lead is bent or cut off by the carrier tape inspection machine, it will cause mismatching and alignment will not be possible, so it will be ignored. bonding is not performed. In this way, even if some inner leads are used, they can be used in place of alignment marks.

The carrier tape inspection machine and inner lead bonder described above can be configured as separate machines and bond semiconductor elements in two processes, but by incorporating the carrier tape inspection machine into the inner lead bonder, it is possible to bond semiconductor devices in two steps. Carrier tape inspection and semiconductor element bonding can be performed efficiently.

[Effects of the Invention] As described above, according to the present invention, semiconductor elements can be bonded only to good carrier tapes, so that the yield of tape carriers after mounting can be improved. Furthermore, since defective carrier tapes are not handled in the same way as good products, the number of man-hours can be reduced. therefore,
The cost of the completed tape carrier can be reduced. recent years,
As semiconductor devices become more highly integrated and functional, and the cost of semiconductor devices increases, improving yields will greatly contribute to lowering the cost of tape carriers. FIG. 1(b) is a plan view of the alignment mark of a defective carrier tape used in the manufacture of the tape carrier of the present invention, and FIG. FIG. 3 is a plan view of the aligned carrier tape and semiconductor element.

1... Alignment mark 2...Carrier tape 5...In early lead 6...Semiconductor element that's all

Claims (1)

[Claims] In a method for manufacturing tape carriers in which a carrier tape is inspected and semiconductor elements are later mounted, the alignment mark used when bonding semiconductor elements indicates the pass/fail judgment result of the carrier tape inspection, and only good carrier tapes are manufactured. A method for manufacturing a tape carrier, characterized in that a semiconductor element is mounted thereon.