WO2009069783A1 - 回路部材接続用接着剤及び半導体装置 - Google Patents

回路部材接続用接着剤及び半導体装置 Download PDF

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Publication number
WO2009069783A1
WO2009069783A1 PCT/JP2008/071727 JP2008071727W WO2009069783A1 WO 2009069783 A1 WO2009069783 A1 WO 2009069783A1 JP 2008071727 W JP2008071727 W JP 2008071727W WO 2009069783 A1 WO2009069783 A1 WO 2009069783A1
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WIPO (PCT)
Prior art keywords
circuit member
member connecting
connecting adhesive
semiconductor device
substrate
Prior art date
Application number
PCT/JP2008/071727
Other languages
English (en)
French (fr)
Inventor
Akira Nagai
Yasunori Kawabata
Shigeki Katogi
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009543887A priority Critical patent/JP5088376B2/ja
Priority to KR1020107011780A priority patent/KR101302933B1/ko
Priority to CN2008801131597A priority patent/CN101835866B/zh
Publication of WO2009069783A1 publication Critical patent/WO2009069783A1/ja

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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　本発明は、相対向する回路基板を接続するための回路部材接続用接着剤であって、熱可塑性樹脂、熱硬化性樹脂及び硬化剤を含む樹脂組成物と、該組成物中に分散された金属水酸化物粒子とからなる、回路部材接続用接着剤を提供する。本発明の回路部材接続用接着剤は、半導体チップと基板との接続信頼性に優れると共に、半導体チップと基板の位置合わせに用いられるアライメントマークの認識性を実用上十分なレベルまで向上させることを可能とするものである。
PCT/JP2008/071727 2007-11-29 2008-11-28 回路部材接続用接着剤及び半導体装置 WO2009069783A1 (ja)

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JP2009543887A JP5088376B2 (ja) 2007-11-29 2008-11-28 回路部材接続用接着剤及び半導体装置
KR1020107011780A KR101302933B1 (ko) 2007-11-29 2008-11-28 회로 부재 접속용 접착제 및 반도체 장치
CN2008801131597A CN101835866B (zh) 2007-11-29 2008-11-28 电路部件连接用粘接剂以及半导体装置

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JP2007-308668 2007-11-29

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Cited By (7)

* Cited by examiner, † Cited by third party
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JP2011052033A (ja) * 2009-08-31 2011-03-17 Hitachi Media Electoronics Co Ltd 光硬化型接着剤、光ピックアップ装置及びその製造方法
JP2011165758A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 回路部材接続用接着剤及びこれを用いた半導体装置
JP2011202073A (ja) * 2010-03-26 2011-10-13 Namics Corp 先供給型液状半導体封止樹脂組成物
JP2014045013A (ja) * 2012-08-24 2014-03-13 Bondtech Inc 基板上への対象物の位置決め方法及び装置
JP2014074181A (ja) * 2013-12-25 2014-04-24 Hitachi Chemical Co Ltd 半導体装置の製造方法及びこれを用いて製造されてなる半導体装置
WO2014156882A1 (ja) * 2013-03-26 2014-10-02 日東電工株式会社 アンダーフィル材、封止シート及び半導体装置の製造方法
WO2014162973A1 (ja) * 2013-04-04 2014-10-09 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104312471A (zh) * 2014-11-10 2015-01-28 深圳市飞世尔实业有限公司 一种含苯并恶嗪的异方性导电膜及其制备方法
CN208045473U (zh) * 2016-11-29 2018-11-02 Pep创新私人有限公司 芯片封装结构

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JP2003073641A (ja) * 2001-08-31 2003-03-12 Hitachi Chem Co Ltd 難燃性接着フィルム、半導体搭載用配線基板、半導体装置及び半導体装置の製造方法
JP2003206452A (ja) * 2002-01-10 2003-07-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
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JP2002371263A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp 多層フレキシブルプリント回路板用接着剤組成物およびそれを用いた多層フレキシブルプリント回路板
JP2003073641A (ja) * 2001-08-31 2003-03-12 Hitachi Chem Co Ltd 難燃性接着フィルム、半導体搭載用配線基板、半導体装置及び半導体装置の製造方法
JP2003206452A (ja) * 2002-01-10 2003-07-22 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP2006199778A (ja) * 2005-01-19 2006-08-03 Hitachi Chem Co Ltd 接着剤組成物、回路接続用接着剤及びこれを用いた回路接続方法、接続体
JP2007016088A (ja) * 2005-07-06 2007-01-25 Asahi Kasei Electronics Co Ltd 異方導電性接着シート及び微細接続構造体

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011052033A (ja) * 2009-08-31 2011-03-17 Hitachi Media Electoronics Co Ltd 光硬化型接着剤、光ピックアップ装置及びその製造方法
JP2011165758A (ja) * 2010-02-05 2011-08-25 Hitachi Chem Co Ltd 回路部材接続用接着剤及びこれを用いた半導体装置
JP2011202073A (ja) * 2010-03-26 2011-10-13 Namics Corp 先供給型液状半導体封止樹脂組成物
JP2014045013A (ja) * 2012-08-24 2014-03-13 Bondtech Inc 基板上への対象物の位置決め方法及び装置
WO2014156882A1 (ja) * 2013-03-26 2014-10-02 日東電工株式会社 アンダーフィル材、封止シート及び半導体装置の製造方法
JP2014192238A (ja) * 2013-03-26 2014-10-06 Nitto Denko Corp アンダーフィル材、封止シート及び半導体装置の製造方法
WO2014162973A1 (ja) * 2013-04-04 2014-10-09 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置
JP2014203971A (ja) * 2013-04-04 2014-10-27 日東電工株式会社 アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置
JP2014074181A (ja) * 2013-12-25 2014-04-24 Hitachi Chemical Co Ltd 半導体装置の製造方法及びこれを用いて製造されてなる半導体装置

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KR20100074312A (ko) 2010-07-01
CN102977809A (zh) 2013-03-20
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