WO2009008471A1 - 誘電層付銅箔 - Google Patents

誘電層付銅箔 Download PDF

Info

Publication number
WO2009008471A1
WO2009008471A1 PCT/JP2008/062466 JP2008062466W WO2009008471A1 WO 2009008471 A1 WO2009008471 A1 WO 2009008471A1 JP 2008062466 W JP2008062466 W JP 2008062466W WO 2009008471 A1 WO2009008471 A1 WO 2009008471A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
dielectric layer
layer
resin
dielectric
Prior art date
Application number
PCT/JP2008/062466
Other languages
English (en)
French (fr)
Inventor
Yoshinori Kanao
Tetsuro Sato
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to JP2008534806A priority Critical patent/JPWO2009008471A1/ja
Publication of WO2009008471A1 publication Critical patent/WO2009008471A1/ja

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04Epoxynovolacs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

 内層コア材の内層回路表面と誘電層との密着性を向上させ、低い誘電正接を備えるキャパシタ回路層を形成するための誘電層付銅箔を提供することを目的とする。この目的を達成するため、回路上面と基材表面とが略同一の平面内に位置するよう回路を基材樹脂内に埋設配置した埋設回路付プリント配線板の表面に張り合わせてキャパシタ回路層を形成するための誘電層付銅箔で上記目的を達成するため、当該誘電層付銅箔1は、銅箔2の片面に誘電体粉末3を含有する半硬化樹脂で形成した誘電層4を備えるものであり、当該誘電層は、エポキシ樹脂、活性エステル樹脂、ポリビニルアセタール樹脂、硬化促進剤を含む樹脂組成物に誘電体粉末を分散含有させ半硬化状態とした誘電体粉末含有樹脂層であることを特徴としたプリント配線板製造用の誘電層付銅箔を採用する。
PCT/JP2008/062466 2007-07-10 2008-07-10 誘電層付銅箔 WO2009008471A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008534806A JPWO2009008471A1 (ja) 2007-07-10 2008-07-10 誘電層付銅箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007180820 2007-07-10
JP2007-180820 2007-07-10

Publications (1)

Publication Number Publication Date
WO2009008471A1 true WO2009008471A1 (ja) 2009-01-15

Family

ID=40228642

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062466 WO2009008471A1 (ja) 2007-07-10 2008-07-10 誘電層付銅箔

Country Status (3)

Country Link
JP (1) JPWO2009008471A1 (ja)
TW (1) TW200915932A (ja)
WO (1) WO2009008471A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
JP2018502438A (ja) * 2014-10-15 2018-01-25 ロジャーズ コーポレーション 磁気誘電体基材、回路材料、及びそれらを有するアセンブリ
WO2018168718A1 (ja) * 2017-03-14 2018-09-20 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
WO2019150994A1 (ja) * 2018-02-01 2019-08-08 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US11419210B2 (en) 2012-04-27 2022-08-16 Mitsui Mining & Smelting Co., Ltd. Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2023189300A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャパシタ内蔵型プリント配線板及び多層プリント配線板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470197B (zh) * 2012-12-20 2015-01-21 Ind Tech Res Inst 電容式剪力感測器及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940933A (ja) * 1995-07-26 1997-02-10 Toshiba Chem Corp 銅箔用接着剤
JP2004210941A (ja) * 2002-12-27 2004-07-29 Tdk Corp 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240213A (ja) * 1993-02-19 1994-08-30 Mitsui Mining & Smelting Co Ltd 接着剤塗布銅箔及びそれを用いた銅張積層板
JP4618662B2 (ja) * 2002-03-07 2011-01-26 Dic株式会社 エポキシ樹脂組成物、その予備硬化物及び硬化物
KR20070042560A (ko) * 2004-08-10 2007-04-23 미쓰이 긴조꾸 고교 가부시키가이샤 다층 프린트 배선판의 제조 방법 및 그 제조 방법으로얻어진 다층 프린트 배선판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940933A (ja) * 1995-07-26 1997-02-10 Toshiba Chem Corp 銅箔用接着剤
JP2004210941A (ja) * 2002-12-27 2004-07-29 Tdk Corp 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
US11419210B2 (en) 2012-04-27 2022-08-16 Mitsui Mining & Smelting Co., Ltd. Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP2018502438A (ja) * 2014-10-15 2018-01-25 ロジャーズ コーポレーション 磁気誘電体基材、回路材料、及びそれらを有するアセンブリ
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US9839124B2 (en) 2015-02-06 2017-12-05 Jx Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
JP7013444B2 (ja) 2017-03-14 2022-01-31 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
KR20190122644A (ko) 2017-03-14 2019-10-30 미쓰이금속광업주식회사 수지 조성물, 수지를 구비한 구리박, 유전체층, 동장 적층판, 캐패시터 소자 및 캐패시터 내장 프린트 배선판
JPWO2018168718A1 (ja) * 2017-03-14 2020-01-16 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US11310910B2 (en) 2017-03-14 2022-04-19 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
WO2018168718A1 (ja) * 2017-03-14 2018-09-20 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JPWO2019150994A1 (ja) * 2018-02-01 2020-04-02 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
KR20200116450A (ko) 2018-02-01 2020-10-12 미쓰이금속광업주식회사 수지 조성물, 수지를 구비하는 구리박, 유전체층, 동장 적층판, 커패시터 소자 및 커패시터 내장 프린트 배선판
WO2019150994A1 (ja) * 2018-02-01 2019-08-08 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JP2022058356A (ja) * 2018-02-01 2022-04-12 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JP7061632B2 (ja) 2018-02-01 2022-04-28 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
WO2023189300A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャパシタ内蔵型プリント配線板及び多層プリント配線板の製造方法

Also Published As

Publication number Publication date
JPWO2009008471A1 (ja) 2010-09-09
TW200915932A (en) 2009-04-01

Similar Documents

Publication Publication Date Title
WO2009008471A1 (ja) 誘電層付銅箔
JP2007129124A5 (ja)
TW200610647A (en) Printed circuit board material for embedded passive devices
EP1484952A4 (en) MULTILAYER CONDUCTOR PLATE, BASE FOR A MULTIPLE PCB, PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
TW200742540A (en) Metal base circuit board, led, and led light source unit
WO2008078739A1 (ja) 多層回路基板およびモータ駆動回路基板
TW200721932A (en) Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
TW200509368A (en) Circuit module and manufacturing method thereof
WO2006091463A8 (en) Method of making multilayered construction for use in resistors and capacitors
GB2473982A (en) Circuit materials, circuits laminates and method of manufacture thereof
TW200740334A (en) Multilayer printed wiring board and its manufacturing method
EP1220588A4 (en) METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
EP2222144A3 (en) Noise suppressing structure and printed wiring board
EP1580235A4 (en) RESIN COMPOSITION, CURED RESIN, CURED RESIN SHEET, LAMINATE, PREIMPREGNE, ELECTRONIC COMPONENT, AND MULTILAYER SUBSTRATE
MX2007011790A (es) Tarjeta de circuito de capas multiples con componentes embebidos y metodo de fabricacion.
MY159854A (en) Resin coated copper foil and method for manufacturing resin coated copper foil
WO2012072212A3 (de) Elektronisches bauteil, verfahren zu dessen herstellung und leiterplatte mit elektronischem bauteil
TW200606194A (en) Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and method for manufacturing multi-layer printed wiring board
WO2008117513A1 (ja) 導電性バンプとその製造方法および電子部品実装構造体
MX2009010232A (es) Una tarjeta gradual y metodo para fabricar una tarjeta gradual.
JP2009283739A5 (ja)
WO2008153185A1 (ja) プリント配線板製造用の埋設銅めっき方法及びその埋設銅めっき方法を用いて得られるプリント配線板
WO2011140141A3 (en) Printed circuit board with embossed hollow heatsink pad
WO2008060256A3 (en) Three-dimensional printed circuit board and manufacturing method thereof
EP1599079A4 (en) METHOD FOR PRODUCING A CIRCUIT BOARD AND MATERIAL FOR MANUFACTURING A CIRCUIT BOARD

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2008534806

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08778026

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08778026

Country of ref document: EP

Kind code of ref document: A1