DE602006013734D1 - Spannungsarmer leitfaehiger Klebstoff - Google Patents
Spannungsarmer leitfaehiger KlebstoffInfo
- Publication number
- DE602006013734D1 DE602006013734D1 DE602006013734T DE602006013734T DE602006013734D1 DE 602006013734 D1 DE602006013734 D1 DE 602006013734D1 DE 602006013734 T DE602006013734 T DE 602006013734T DE 602006013734 T DE602006013734 T DE 602006013734T DE 602006013734 D1 DE602006013734 D1 DE 602006013734D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive film
- low
- conductive adhesive
- voltage conductive
- adhesion strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01C—PLANTING; SOWING; FERTILISING
- A01C1/00—Apparatus, or methods of use thereof, for testing or treating seed, roots, or the like, prior to sowing or planting
- A01C1/02—Germinating apparatus; Determining germination capacity of seeds or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G31/00—Soilless cultivation, e.g. hydroponics
- A01G31/02—Special apparatus therefor
- A01G31/06—Hydroponic culture on racks or in stacked containers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- Chemical & Material Sciences (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/073,778 US7326369B2 (en) | 2005-03-07 | 2005-03-07 | Low stress conductive adhesive |
Publications (1)
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DE602006013734D1 true DE602006013734D1 (de) | 2010-06-02 |
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DE602006013734T Active DE602006013734D1 (de) | 2005-03-07 | 2006-03-06 | Spannungsarmer leitfaehiger Klebstoff |
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EP (1) | EP1701361B1 (de) |
JP (1) | JP4875386B2 (de) |
KR (1) | KR101325083B1 (de) |
CN (1) | CN1831073B (de) |
AT (1) | ATE465497T1 (de) |
DE (1) | DE602006013734D1 (de) |
TW (1) | TWI382076B (de) |
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US20100044088A1 (en) * | 2006-07-05 | 2010-02-25 | Ablestik (Japan) Co. Ltd. | Conductive adhesive |
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CN101323759B (zh) * | 2007-06-15 | 2014-10-08 | 清华大学 | 导电胶带及其制造方法 |
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JP5339284B2 (ja) | 2008-03-04 | 2013-11-13 | リンテック株式会社 | 粘着剤組成物及び粘着シート |
JP5390881B2 (ja) * | 2008-03-04 | 2014-01-15 | リンテック株式会社 | 粘着剤組成物及び粘着シート |
KR101410447B1 (ko) * | 2008-03-06 | 2014-06-20 | 김종현 | 전도성이 우수한 전자부품 실장용 전도성 페이스트 및 그제조방법 |
DE102008014690A1 (de) * | 2008-03-18 | 2009-09-24 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung von Schaltungsträgern |
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CN102153976B (zh) * | 2011-03-01 | 2013-05-08 | 华南理工大学 | 一种石墨烯/纳米银环氧导电胶的制备方法 |
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CN104804687B (zh) * | 2015-04-13 | 2017-03-15 | 深圳广恒威科技有限公司 | 导电固晶粘结胶液、导电固晶粘接胶膜、制备方法及应用 |
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CN105567112B (zh) * | 2016-01-18 | 2018-06-19 | 杨宜丰 | 一种各向异性导电胶及其制备方法 |
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EP0892027B1 (de) | 1997-07-17 | 2003-05-21 | Raytheon Company | Leitfähiger Epoxidharzklebstoff mit verbessertem Fallwiderstand |
US6246123B1 (en) * | 1998-05-04 | 2001-06-12 | Motorola, Inc. | Transparent compound and applications for its use |
AU4688699A (en) | 1998-06-22 | 2000-01-10 | Loctite Corporation | Thermosetting resin compositions useful as underfill sealants |
JP2003055583A (ja) * | 1998-12-08 | 2003-02-26 | Taiyo Ink Mfg Ltd | 光硬化型異方性導電組成物及びそれを用いて形成した異方性導電パターン |
US6344155B1 (en) * | 1999-04-06 | 2002-02-05 | Tomoegawa Paper Co., Ltd. | Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof |
JP4172257B2 (ja) * | 2002-11-21 | 2008-10-29 | 日立化成工業株式会社 | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
KR100987683B1 (ko) | 2003-03-10 | 2010-10-13 | 디아이씨 가부시끼가이샤 | 도전성 수지 조성물, 그 제조 방법 및 연료 전지용세퍼레이터 |
WO2005056675A1 (en) | 2003-11-21 | 2005-06-23 | Lord Corporation | Dual-stage wafer applied underfills |
-
2005
- 2005-03-07 US US11/073,778 patent/US7326369B2/en active Active
-
2006
- 2006-03-03 JP JP2006057140A patent/JP4875386B2/ja active Active
- 2006-03-03 CN CN2006100583710A patent/CN1831073B/zh active Active
- 2006-03-06 EP EP06004488A patent/EP1701361B1/de active Active
- 2006-03-06 AT AT06004488T patent/ATE465497T1/de not_active IP Right Cessation
- 2006-03-06 TW TW095107344A patent/TWI382076B/zh active
- 2006-03-06 DE DE602006013734T patent/DE602006013734D1/de active Active
- 2006-03-06 KR KR1020060020908A patent/KR101325083B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1701361B1 (de) | 2010-04-21 |
EP1701361A1 (de) | 2006-09-13 |
CN1831073B (zh) | 2012-01-18 |
TW200704743A (en) | 2007-02-01 |
KR101325083B1 (ko) | 2013-11-06 |
US20060197066A1 (en) | 2006-09-07 |
US7326369B2 (en) | 2008-02-05 |
JP4875386B2 (ja) | 2012-02-15 |
JP2006249426A (ja) | 2006-09-21 |
ATE465497T1 (de) | 2010-05-15 |
CN1831073A (zh) | 2006-09-13 |
KR20060097610A (ko) | 2006-09-14 |
TWI382076B (zh) | 2013-01-11 |
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