WO2009044732A1 - 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 - Google Patents

接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 Download PDF

Info

Publication number
WO2009044732A1
WO2009044732A1 PCT/JP2008/067742 JP2008067742W WO2009044732A1 WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1 JP 2008067742 W JP2008067742 W JP 2008067742W WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
connection structure
same
members
Prior art date
Application number
PCT/JP2008/067742
Other languages
English (en)
French (fr)
Inventor
Masaru Tanaka
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009536053A priority Critical patent/JP5126233B2/ja
Priority to KR1020127013159A priority patent/KR101403282B1/ko
Priority to KR1020117012448A priority patent/KR101376002B1/ko
Priority to CN2008801101962A priority patent/CN101815769B/zh
Publication of WO2009044732A1 publication Critical patent/WO2009044732A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01044—Ruthenium [Ru]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01045—Rhodium [Rh]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Abstract

本発明の接着剤組成物は、回路部材同士を接着するとともにそれぞれの回路部材が有する回路電極同士を電気的に接続するために用いられるものであって、エポキシ樹脂、エポキシ樹脂硬化剤、及び、架橋構造を有し且つ重量平均分子量が３００００～８００００であるアクリル系共重合体を含む接着剤成分を含有する。
PCT/JP2008/067742 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 WO2009044732A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009536053A JP5126233B2 (ja) 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物
KR1020127013159A KR101403282B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
KR1020117012448A KR101376002B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
CN2008801101962A CN101815769B (zh) 2007-10-05 2008-09-30 粘接剂组合物和使用该组合物的电路连接材料,以及电路部件的连接方法和电路连接体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007261995 2007-10-05
JP2007-261995 2007-10-05
JP2008009673 2008-01-18
JP2008-009673 2008-01-18

Publications (1)

Publication Number Publication Date
WO2009044732A1 true WO2009044732A1 (ja) 2009-04-09

Family

ID=40526159

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067742 WO2009044732A1 (ja) 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体

Country Status (5)

Country Link
JP (2) JP5126233B2 (ja)
KR (3) KR101376002B1 (ja)
CN (3) CN101815769B (ja)
TW (2) TWI394810B (ja)
WO (1) WO2009044732A1 (ja)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011055588A1 (ja) * 2009-11-09 2011-05-12 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤組成物
WO2011129372A1 (ja) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
US20120043118A1 (en) * 2009-04-30 2012-02-23 Sumitomo Electric Printed Circuits, Inc. Adhesive resin composition, and laminate and flexible printed wiring board using the same
CN102549097A (zh) * 2009-10-07 2012-07-04 索尼化学&信息部件株式会社 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
CN102533170A (zh) * 2010-12-27 2012-07-04 第一毛织株式会社 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜
CN102702988A (zh) * 2011-03-25 2012-10-03 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
WO2012165003A1 (ja) * 2011-05-27 2012-12-06 三洋電機株式会社 太陽電池モジュール及びその製造方法
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
CN104403610A (zh) * 2014-11-24 2015-03-11 苏州斯迪克新材料科技股份有限公司 高阻燃性压敏胶黏剂及其制造工艺
JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
CN104673111A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 环氧树脂基各向异性导电胶膜的配方及制备方法
WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
WO2020096011A1 (ja) * 2018-11-09 2020-05-14 日立化成株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
WO2020110785A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体用フィルム状接着剤、半導体装置及びその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2693081B1 (en) 2011-03-31 2018-06-06 Kubota Corporation Speed change transmission device and driving transmission device
JP5844588B2 (ja) * 2011-09-21 2016-01-20 デクセリアルズ株式会社 回路接続材料及びそれを用いた接続方法並びに接続構造体
JP6292808B2 (ja) * 2013-09-13 2018-03-14 デクセリアルズ株式会社 接着剤、及び発光装置
CN106062114A (zh) * 2014-03-05 2016-10-26 3M创新有限公司 亲肤型(甲基)丙烯酸类压敏粘合剂
WO2016186099A1 (ja) * 2015-05-20 2016-11-24 積水化学工業株式会社 導電性粘着材及び導電性基材付き導電性粘着材
WO2017040072A1 (en) 2015-08-31 2017-03-09 3M Innovative Properties Company Articles comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces
CN107920923A (zh) 2015-08-31 2018-04-17 3M创新有限公司 包含对湿表面具有增强的粘附性的(甲基)丙烯酸酯压敏粘合剂的负压伤口治疗敷料
FR3066385B1 (fr) 2017-05-19 2020-01-17 Laboratoires M&L Composition cosmetique biphasique
CN109735276B (zh) * 2019-01-11 2021-03-26 华玻视讯(珠海)科技有限公司 一种微米铜片-聚苯醚-环氧树脂导电胶及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249087A (ja) * 1988-08-11 1990-02-19 Toray Ind Inc 接着剤組成物
JP2000509425A (ja) * 1996-05-16 2000-07-25 ミネソタ マイニング アンド マニュファクチャリング カンパニー 接着剤組成物と使用方法
JP2002212525A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP2004247657A (ja) * 2003-02-17 2004-09-02 Hitachi Chem Co Ltd 接着シート及びそれを用いた半導体装置
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6487996A (en) * 1995-07-10 1997-02-10 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
JPH10178054A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
CN1213442C (zh) * 1999-04-01 2005-08-03 三井化学株式会社 各向异性导电性糊
JP3617417B2 (ja) * 1999-06-18 2005-02-02 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001212525A (ja) * 2000-02-01 2001-08-07 Kubota Corp 粉粒体検査装置
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4869517B2 (ja) * 2001-08-21 2012-02-08 リンテック株式会社 粘接着テープ
JP4487473B2 (ja) * 2002-07-08 2010-06-23 日立化成工業株式会社 接着剤組成物、これを用いた接着フィルム、及びこの接着フィルムを用いた半導体装置
JP4238124B2 (ja) 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
WO2005004216A1 (ja) * 2003-07-08 2005-01-13 Lintec Corporation ダイシング・ダイボンド用粘接着シートおよび半導体装置の製造方法
JP4265397B2 (ja) * 2003-12-22 2009-05-20 日立化成工業株式会社 半導体装置および半導体装置の製造方法
JP4890063B2 (ja) * 2006-03-20 2012-03-07 新日鐵化学株式会社 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249087A (ja) * 1988-08-11 1990-02-19 Toray Ind Inc 接着剤組成物
JP2000509425A (ja) * 1996-05-16 2000-07-25 ミネソタ マイニング アンド マニュファクチャリング カンパニー 接着剤組成物と使用方法
JP2002212525A (ja) * 2001-01-22 2002-07-31 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体チップ搭載用基板及び半導体装置
JP2003238925A (ja) * 2002-02-19 2003-08-27 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム
JP2004247657A (ja) * 2003-02-17 2004-09-02 Hitachi Chem Co Ltd 接着シート及びそれを用いた半導体装置
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120043118A1 (en) * 2009-04-30 2012-02-23 Sumitomo Electric Printed Circuits, Inc. Adhesive resin composition, and laminate and flexible printed wiring board using the same
CN105331308A (zh) * 2009-10-07 2016-02-17 迪睿合电子材料有限公司 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
CN102549097A (zh) * 2009-10-07 2012-07-04 索尼化学&信息部件株式会社 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
US20120168814A1 (en) * 2009-11-09 2012-07-05 Sony Chemical & Information Device Corporation Adhesive composition
WO2011055588A1 (ja) * 2009-11-09 2011-05-12 ソニーケミカル＆インフォメーションデバイス株式会社 接着剤組成物
CN102598236A (zh) * 2009-11-09 2012-07-18 索尼化学&信息部件株式会社 粘合剂组合物
JP2011100927A (ja) * 2009-11-09 2011-05-19 Sony Chemical & Information Device Corp 接着剤組成物
WO2011129372A1 (ja) * 2010-04-13 2011-10-20 ソニーケミカル＆インフォメーションデバイス株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
CN102533170A (zh) * 2010-12-27 2012-07-04 第一毛织株式会社 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜
CN102702988B (zh) * 2011-03-25 2014-02-26 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
CN102702988A (zh) * 2011-03-25 2012-10-03 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
JP2012248654A (ja) * 2011-05-27 2012-12-13 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
WO2012165003A1 (ja) * 2011-05-27 2012-12-06 三洋電機株式会社 太陽電池モジュール及びその製造方法
JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
US10887999B2 (en) 2013-12-16 2021-01-05 Dexerials Corporation Mounting body manufacturing method and anisotropic conductive film
WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
JP2015135949A (ja) * 2013-12-16 2015-07-27 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
CN104673111A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 环氧树脂基各向异性导电胶膜的配方及制备方法
JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
CN104403610A (zh) * 2014-11-24 2015-03-11 苏州斯迪克新材料科技股份有限公司 高阻燃性压敏胶黏剂及其制造工艺
WO2020096011A1 (ja) * 2018-11-09 2020-05-14 日立化成株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
JPWO2020096011A1 (ja) * 2018-11-09 2021-10-07 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
JP7151782B2 (ja) 2018-11-09 2022-10-12 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
WO2020110785A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体用フィルム状接着剤、半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20110066235A (ko) 2011-06-16
KR20120073354A (ko) 2012-07-04
KR101376002B1 (ko) 2014-03-19
JP2013058764A (ja) 2013-03-28
CN101815769B (zh) 2012-11-07
CN102850982A (zh) 2013-01-02
CN102876277B (zh) 2014-12-10
CN102876277A (zh) 2013-01-16
KR101403282B1 (ko) 2014-06-02
KR20100009538A (ko) 2010-01-27
TW200932860A (en) 2009-08-01
JPWO2009044732A1 (ja) 2011-02-10
TWI394810B (zh) 2013-05-01
CN101815769A (zh) 2010-08-25
JP5126233B2 (ja) 2013-01-23
TW201309770A (zh) 2013-03-01

Similar Documents

Publication Publication Date Title
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009051067A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
AU2003296145A1 (en) Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
ATE524533T1 (de) Anisotrope leitfähige klebstoffe
DE602006013734D1 (de) Spannungsarmer leitfaehiger Klebstoff
EP1754762A4 (en) ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING CONSTRUCTION FOR CIRCUIT ELEMENT AND SEMICONDUCTOR DEVICE
TW200624530A (en) Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
WO2008127925A3 (en) Structural epoxy resins containing core-shell rubbers
EP2048209A4 (en) ADHESIVE COMPOSITION AND CONNECTION STRUCTURE FOR CIRCUIT ELEMENT
WO2009031472A1 (ja) 接着剤及びそれを用いた接続構造体
EP0914027A4 (en) ADHESIVE FILM FOR CONNECTING A CIRCUIT AND A PCB
EP1193280A4 (en) POLYIMIDE RESIN, RESISTANCE COMPOSITION HAVING IMPROVED MOISTURE RESISTANCE COMPRISING SAME, ADHESIVE SOLUTION, ADHESIVE LAYERED ADHESIVE FILM AND METHODS OF PRODUCING THE SAME
WO2007149377A3 (en) Epoxy adhesive composition and use thereof
MX2010004855A (es) Adhesivos de pasta epoxi resistentes al lavado.
EP2053108A4 (en) FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME
TW200600562A (en) An anisotropic conductive adhesive and an adhesive film using the same
SG133607A1 (en) Dicing/die bonding sheet
EP1170346A3 (en) Die attach adhesives with epoxy resin having allyl or vinyl groups
TW200718769A (en) Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
AU2003280815A1 (en) Curing resin composition, cured film and antireflection film
TW200708584A (en) Die attach adhesives with improved stress performance
WO2005067607A3 (en) Radiation curable laminating adhesives based on cycloaliphatic carboxylic acid functional monomers
WO2008143253A1 (ja) 接着剤組成物及びこれを用いた接着フィルム
TW200718764A (en) Adhesive composition, circuit connecting material, connection structure of circuit connectors, and semiconductor devices
JP2007224228A5 (ja)

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880110196.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08834752

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009536053

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 1020097018997

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08834752

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020117012448

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 1020127013159

Country of ref document: KR