ATE524533T1 - Anisotrope leitfähige klebstoffe - Google Patents

Anisotrope leitfähige klebstoffe

Info

Publication number
ATE524533T1
ATE524533T1 AT06827563T AT06827563T ATE524533T1 AT E524533 T1 ATE524533 T1 AT E524533T1 AT 06827563 T AT06827563 T AT 06827563T AT 06827563 T AT06827563 T AT 06827563T AT E524533 T1 ATE524533 T1 AT E524533T1
Authority
AT
Austria
Prior art keywords
anisotropic conductive
conductive adhesives
resin
optionally
core
Prior art date
Application number
AT06827563T
Other languages
English (en)
Inventor
Glen Connell
Michael A Kropp
Eric G Larson
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE524533T1 publication Critical patent/ATE524533T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
AT06827563T 2005-11-23 2006-11-07 Anisotrope leitfähige klebstoffe ATE524533T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73956905P 2005-11-23 2005-11-23
PCT/US2006/043198 WO2007061613A1 (en) 2005-11-23 2006-11-07 Anisotropic conductive adhesive compositions

Publications (1)

Publication Number Publication Date
ATE524533T1 true ATE524533T1 (de) 2011-09-15

Family

ID=38067528

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06827563T ATE524533T1 (de) 2005-11-23 2006-11-07 Anisotrope leitfähige klebstoffe

Country Status (8)

Country Link
US (1) US20070116961A1 (de)
EP (1) EP1951836B1 (de)
JP (1) JP2009517498A (de)
KR (1) KR20080070680A (de)
CN (1) CN101313045A (de)
AT (1) ATE524533T1 (de)
TW (1) TW200722497A (de)
WO (1) WO2007061613A1 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2674986B1 (de) * 2006-04-26 2018-04-04 Hitachi Chemical Co., Ltd. Klebeband und Solarzellenmodul damit
ATE555177T1 (de) * 2006-07-24 2012-05-15 3M Innovative Properties Co Elektrisch leitende haftklebstoffe
WO2008016889A1 (en) * 2006-07-31 2008-02-07 Henkel Ag & Co. Kgaa Curable epoxy resin-based adhesive compositions
KR101040002B1 (ko) * 2006-08-29 2011-06-09 히다치 가세고교 가부시끼가이샤 도전성 접착 필름 및 태양 전지 모듈
EP2076578A4 (de) * 2006-10-06 2011-01-19 Henkel Ag & Co Kgaa Abwaschresistente pumpfähige epoxidpastenklebstoffe
JP2008135654A (ja) * 2006-11-29 2008-06-12 Sanyo Electric Co Ltd 太陽電池モジュール
US20080152921A1 (en) * 2006-12-20 2008-06-26 3M Innovative Properties Company Thermally B-Stageable Composition for Rapid Electronic Device Assembly
JP5350384B2 (ja) 2007-09-13 2013-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 導電性組成物
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
US20110003946A1 (en) * 2008-01-18 2011-01-06 Klaus-Volker Schuett Curable reaction resin system
KR100934549B1 (ko) * 2008-01-23 2009-12-29 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름
GB0806434D0 (en) * 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
US20120080418A1 (en) * 2008-05-15 2012-04-05 Atsunobu Sakamoto Impulse sealer including ceramic-covered heater
CN101508878B (zh) * 2009-03-30 2012-08-15 汕头市骏码凯撒有限公司 一种邦定胶及其制备方法
CN102471651B (zh) 2009-07-08 2013-07-17 汉高股份有限及两合公司 导电粘合剂
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
KR101056435B1 (ko) * 2009-10-05 2011-08-11 삼성모바일디스플레이주식회사 이방성 도전 필름 및 이를 포함하는 표시 장치
BR112012011798B1 (pt) * 2009-11-17 2020-12-08 Hitachi Chemical Company, Ltd. material para conexão de circuito, estrutura para conexão que usa o mesmo e método de ligação por pressão temporária
US9096039B2 (en) 2010-03-04 2015-08-04 Zephyros, Inc. Structural composite laminates
US20130146816A1 (en) * 2010-04-19 2013-06-13 Trillion Science Inc. One part epoxy resin including acrylic block copolymer
JP5761639B2 (ja) * 2010-09-30 2015-08-12 日本発條株式会社 接着剤樹脂組成物、その硬化物、及び接着剤フィルム
JP2011181525A (ja) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp 異方性導電材料
KR101355854B1 (ko) * 2011-12-16 2014-01-29 제일모직주식회사 이방성 도전 필름
CN102719199A (zh) * 2012-04-23 2012-10-10 苏州异导光电材料科技有限公司 三维单向导电胶膜的制备方法
JP5776621B2 (ja) * 2012-04-26 2015-09-09 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及び接着シート
ES2588362T3 (es) * 2012-08-23 2016-11-02 3M Innovative Properties Company Película adhesiva estructural
WO2014123849A1 (en) * 2013-02-07 2014-08-14 Trillion Science, Inc. One part epoxy resin including acrylic block copolymer
KR101432438B1 (ko) * 2013-03-29 2014-08-20 삼성전기주식회사 압전진동모듈
DE202014011009U1 (de) 2013-07-26 2017-06-02 Zephyros Inc. Wärmehärtende Klebstofffolien mit einem Faserträger
JP6049606B2 (ja) * 2013-12-25 2016-12-21 株式会社ノリタケカンパニーリミテド 加熱硬化型導電性ペースト
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
JP2018131569A (ja) * 2017-02-16 2018-08-23 パナソニックＩｐマネジメント株式会社 導電性粒子を含む樹脂組成物
CN108913057B (zh) * 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
JP2019156964A (ja) * 2018-03-13 2019-09-19 パナソニックＩｐマネジメント株式会社 樹脂組成物およびこれを含む異方導電性フィルム、並びに電子装置
US10696839B2 (en) 2018-09-07 2020-06-30 Pipefusion Cipp Corporation Curable composition for cured in place pipes
AU2018440151B2 (en) * 2018-09-07 2024-04-18 Pipefusion Cipp Corporation Curable composition for cured in place pipes
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
CN110938402A (zh) * 2019-12-18 2020-03-31 湖南省和祥润新材料有限公司 一种阻燃型光固化胶及其制备方法
BR112023026586A2 (pt) * 2021-06-21 2024-03-05 Nippon Steel Corp Composição adesiva para laminação de chapa de aço eletromagnética
EP4373915A1 (de) * 2021-07-23 2024-05-29 Clara Foods Co. Proteinzusammensetzungen und herstellungsverfahren

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070161A (en) * 1988-05-27 1991-12-03 Nippon Paint Co., Ltd. Heat-latent, cationic polymerization initiator and resin compositions containing same
US4942201A (en) * 1988-08-29 1990-07-17 Illinois Tool Works, Inc. Adhesive for low temperature applications
CA2083514A1 (en) * 1990-06-08 1991-12-09 Joyce B. Hall Reworkable adhesive for electronic applications
JP3197587B2 (ja) * 1991-09-04 2001-08-13 日産自動車株式会社 エポキシ樹脂系接着性組成物
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
US5362421A (en) * 1993-06-16 1994-11-08 Minnesota Mining And Manufacturing Company Electrically conductive adhesive compositions
US5620795A (en) * 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
US5443876A (en) * 1993-12-30 1995-08-22 Minnesota Mining And Manufacturing Company Electrically conductive structured sheets
WO1997003143A1 (en) * 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
AU711287B2 (en) * 1996-05-16 1999-10-07 Minnesota Mining And Manufacturing Company Adhesive compositions and methods of use
JP3777734B2 (ja) * 1996-10-15 2006-05-24 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JPH10178251A (ja) * 1996-10-15 1998-06-30 Toray Ind Inc 半導体集積回路接続用基板およびそれを構成する部品ならびに半導体装置
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
US6699351B2 (en) * 2000-03-24 2004-03-02 3M Innovative Properties Company Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
US20040266913A1 (en) * 2001-09-13 2004-12-30 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6773474B2 (en) * 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
JP4196160B2 (ja) * 2002-07-31 2008-12-17 株式会社スリーボンド アルミニウム合金用接着剤組成物
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
JP2005187508A (ja) * 2003-12-24 2005-07-14 Sumitomo Bakelite Co Ltd 半導体用接着フィルムおよび半導体装置
JP2006023419A (ja) * 2004-07-07 2006-01-26 Shin Etsu Chem Co Ltd 液晶表示セル用シール剤組成物
US20060110600A1 (en) * 2004-11-19 2006-05-25 3M Innovative Properties Company Anisotropic conductive adhesive composition

Also Published As

Publication number Publication date
EP1951836A1 (de) 2008-08-06
KR20080070680A (ko) 2008-07-30
US20070116961A1 (en) 2007-05-24
WO2007061613A1 (en) 2007-05-31
CN101313045A (zh) 2008-11-26
EP1951836A4 (de) 2010-06-09
JP2009517498A (ja) 2009-04-30
EP1951836B1 (de) 2011-09-14
TW200722497A (en) 2007-06-16

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