ATE555177T1 - Elektrisch leitende haftklebstoffe - Google Patents

Elektrisch leitende haftklebstoffe

Info

Publication number
ATE555177T1
ATE555177T1 AT07799694T AT07799694T ATE555177T1 AT E555177 T1 ATE555177 T1 AT E555177T1 AT 07799694 T AT07799694 T AT 07799694T AT 07799694 T AT07799694 T AT 07799694T AT E555177 T1 ATE555177 T1 AT E555177T1
Authority
AT
Austria
Prior art keywords
electrically conductive
methods
conductive adhesives
zero
carbon atoms
Prior art date
Application number
AT07799694T
Other languages
English (en)
Inventor
Jeffrey W Mccutcheon
Jeanne M Bruss
John D Le
Jennifer L Sawyer
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE555177T1 publication Critical patent/ATE555177T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
AT07799694T 2006-07-24 2007-07-19 Elektrisch leitende haftklebstoffe ATE555177T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82017406P 2006-07-24 2006-07-24
PCT/US2007/073838 WO2008014169A1 (en) 2006-07-24 2007-07-19 Electrically conductive pressure sensitive adhesives

Publications (1)

Publication Number Publication Date
ATE555177T1 true ATE555177T1 (de) 2012-05-15

Family

ID=38981795

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07799694T ATE555177T1 (de) 2006-07-24 2007-07-19 Elektrisch leitende haftklebstoffe

Country Status (8)

Country Link
US (1) US20090311502A1 (de)
EP (1) EP2044163B1 (de)
JP (1) JP2009544815A (de)
KR (1) KR101331679B1 (de)
CN (1) CN101495587B (de)
AT (1) ATE555177T1 (de)
TW (1) TW200813185A (de)
WO (1) WO2008014169A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011063217A2 (en) 2009-11-20 2011-05-26 3M Innovative Properties Company Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making
US20120288710A1 (en) * 2010-01-07 2012-11-15 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US8698394B2 (en) 2010-03-31 2014-04-15 3M Innovative Properties Company Electronic articles for displays and methods of making same
CN102477269A (zh) * 2010-11-26 2012-05-30 上海恩意材料科技有限公司 一种导电性胶黏剂组合物
JP2013014734A (ja) * 2011-07-06 2013-01-24 Nitto Denko Corp 導電性粘着テープ
DE102011080724A1 (de) 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
KR102061585B1 (ko) * 2013-04-19 2020-01-03 디아이씨 가부시끼가이샤 도전성 점착 시트, 그 제조 방법 및 그것을 사용하여 얻은 전자 단말
WO2015073346A1 (en) * 2013-11-15 2015-05-21 3M Innovative Properties Company An electrically conductive article containing shaped particles and methods of making same
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
CN107567486A (zh) 2015-05-01 2018-01-09 洛德公司 用于橡胶粘接的粘合剂
JP6486192B2 (ja) * 2015-05-19 2019-03-20 マクセルホールディングス株式会社 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器
JP2018053137A (ja) * 2016-09-29 2018-04-05 日東電工株式会社 導電性粘着テープ及び導電性粘着テープの製造方法
WO2018205127A1 (en) 2017-05-09 2018-11-15 3M Innovative Properties Company Electrically conductive adhesive
US10058014B1 (en) 2017-12-13 2018-08-21 International Business Machines Corporation Conductive adhesive layer for gasket assembly
KR102148860B1 (ko) 2018-11-26 2020-08-28 주식회사 엘엠에스 접착시트 및 이를 포함하는 투명 전극

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JPS5153595A (ja) * 1974-09-17 1976-05-12 Haarmann & Reimer Gmbh Noboratsukujushinoseizohoho
JPS61285608A (ja) * 1985-06-12 1986-12-16 岩井　謙治 貴金属被覆微粒体およびその製造方法
US5070161A (en) * 1988-05-27 1991-12-03 Nippon Paint Co., Ltd. Heat-latent, cationic polymerization initiator and resin compositions containing same
US4942201A (en) * 1988-08-29 1990-07-17 Illinois Tool Works, Inc. Adhesive for low temperature applications
KR930701561A (ko) * 1990-06-08 1993-06-12 게리 엘. 그리스울드 전자 용품용 재처리가능한 접착제
JPH05298913A (ja) * 1991-07-19 1993-11-12 Ajinomoto Co Inc 光硬化性導電性ペースト
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
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WO1997003143A1 (en) * 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
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JP2000169474A (ja) * 1998-12-07 2000-06-20 Kotobuki Seiyaku Kk イソキヌクリジン誘導体及びその製造方法並びにこれを含有する高コレステロール血症治療剤
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP2001207150A (ja) * 2000-01-26 2001-07-31 Sony Chem Corp 接着剤組成物
US6699351B2 (en) * 2000-03-24 2004-03-02 3M Innovative Properties Company Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it
JP4499889B2 (ja) * 2000-08-10 2010-07-07 株式会社スリオンテック 無基材導電性粘着テープ・シート及びその製造方法
JP2003031028A (ja) * 2001-07-17 2003-01-31 Shin Etsu Chem Co Ltd 導電性組成物
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US20050256230A1 (en) * 2002-04-01 2005-11-17 Hiroaki Yamaguchi Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US6773474B2 (en) * 2002-04-19 2004-08-10 3M Innovative Properties Company Coated abrasive article
JP2004189938A (ja) * 2002-12-12 2004-07-08 Nippon Sheet Glass Co Ltd 導電性樹脂成形部品
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
DE10310722A1 (de) * 2003-03-10 2004-09-23 Tesa Ag Elektrisch erwärmbare Haftklebemasse
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US20050126697A1 (en) * 2003-12-11 2005-06-16 International Business Machines Corporation Photochemically and thermally curable adhesive formulations
US20060110600A1 (en) * 2004-11-19 2006-05-25 3M Innovative Properties Company Anisotropic conductive adhesive composition
CN1277893C (zh) * 2005-07-11 2006-10-04 大连轻工业学院 一种光固化导电胶及其制法
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions

Also Published As

Publication number Publication date
WO2008014169A1 (en) 2008-01-31
CN101495587B (zh) 2011-08-10
TW200813185A (en) 2008-03-16
EP2044163B1 (de) 2012-04-25
JP2009544815A (ja) 2009-12-17
EP2044163A4 (de) 2010-11-24
KR101331679B1 (ko) 2013-11-20
KR20090031923A (ko) 2009-03-30
EP2044163A1 (de) 2009-04-08
CN101495587A (zh) 2009-07-29
US20090311502A1 (en) 2009-12-17

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