CN108913057B - 一种多层异向型导电布胶及其制作方法 - Google Patents

一种多层异向型导电布胶及其制作方法 Download PDF

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CN108913057B
CN108913057B CN201710188042.6A CN201710188042A CN108913057B CN 108913057 B CN108913057 B CN 108913057B CN 201710188042 A CN201710188042 A CN 201710188042A CN 108913057 B CN108913057 B CN 108913057B
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Prior art keywords
layer
conductive
cloth
conductive adhesive
adhesive layer
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CN108913057A (zh
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王影
周敏
林志铭
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Kunshan Aplus Tec Corp
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Kunshan Aplus Tec Corp
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Priority to CN201710188042.6A priority Critical patent/CN108913057B/zh
Priority to TW106130451A priority patent/TWI639675B/zh
Priority to US15/854,935 priority patent/US10822529B2/en
Priority to KR1020180013101A priority patent/KR102115652B1/ko
Priority to JP2018055444A priority patent/JP7071184B2/ja
Publication of CN108913057A publication Critical patent/CN108913057A/zh
Priority to US17/034,002 priority patent/US11634612B2/en
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • C09J201/00—Adhesives based on unspecified macromolecular compounds
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    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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    • C25D3/02—Electroplating: Baths therefor from solutions
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    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K1/028—Bending or folding regions of flexible printed circuits
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Abstract

本发明公开了一种多层异向型导电布胶，包括上导电粘着剂层、导电布层、下导电粘着剂层，导电布层形成于上导电粘着剂层与下导电粘着剂层之间，导电布层的上下两面或其中之一面镀有金属层，上导电粘着剂层、导电布层和下导电粘着剂层的总厚度为40‑60μm。本发明具有电气特性好、接着强度佳、焊锡性佳、信赖度佳，耐燃性佳等特性，相比一般的导电胶具有更好的导通效果与接着强度，且生产易于实现，市场应用前景广泛；主要应用于FPC中与钢片或者PI(聚酰亚胺)型补强板等贴合后组成加强部件，可有效防止因弯折等原因使安装部位出现变形，并能保证产品良好的填孔性，可以起到直接接地与屏蔽外来信号干扰的作用。

Description

一种多层异向型导电布胶及其制作方法
技术领域
本发明属于印刷线路板用导电布胶技术领域，特别涉及一种多层异向型导电布胶。
背景技术
电子及通讯产品的发展趋势要求电路基板组件朝向轻薄短小及高集成化发展，传输信号频率带越来越宽，导致电磁干扰越来越严重；同时考虑到电子电路组件的使用安全性，对电子产品中电路组件接地可靠度与电路板设计自由度又提出了新要求，目前市场中使用较普遍的导电胶产品会出现因导电胶将接地孔径填充太满影响其他组件的设计安装或填充不满导致回流焊时连接部分存在空隙而出现爆板等缺陷。
另外目前市场中流通的导电胶产品大都是直接将导电性颗粒分散在粘着剂中，粘着剂层一般较厚，如果固化不充分，压合条件不均匀，会导致产品贴合至印刷电路板时出现粉体分布不均，进而影响导通性能等。
目前也有一些新技术及专利提及将薄金属层埋于导电粘着剂层中来提高导电胶产品的导通性，减少粉体含量以降低成本，理论上完全成立，但实际生产过程中由于金属本身柔韧性不佳，压合后产品填孔性并不能达到预期效果，有可能更糟，同时金属层因其透气性不佳，在FPC（柔性线路板），制程中经过SMT（表面贴装技术）会发生爆板隐患。
为此我们设计了一种由多种形态金属粉构成的包含导电布层之异向型高导通性多层导电布胶。
发明内容
本发明主要解决的技术问题是提供一种多层异向型导电布胶，具有电气特性好、接着强度佳、焊锡性佳、信赖度佳，耐燃性佳等特性，相比一般的导电胶具有更好的导通效果与接着强度，且生产易于实现，市场应用前景广泛；主要应用于FPC中与钢片或者PI（聚酰亚胺）型补强板等贴合后组成加强部件，可有效防止因弯折等原因使安装部位出现变形，并能保证产品良好的填孔性，可以起到直接接地与屏蔽外来信号干扰的作用。
为解决上述技术问题，本发明采用的一个技术方案是:提供一种多层异向型导电布胶，包括上导电粘着剂层、导电布层和下导电粘着剂层，所述导电布层形成于所述上导电粘着剂层与所述下导电粘着剂层之间；
所述上导电粘着剂层的厚度为20-40μm，所述下导电粘着剂层的厚度为20-40μm，所述上导电粘着剂层和所述下导电粘着剂层皆包括金属导电粒子，所述金属导电粒子为树枝状金属粉末、针状金属粉末、片状金属粉末和球状金属粉末中的至少两种，所述金属导电粒子的粒径为2-50μm；
所述导电布层的厚度为5-30μm，所述导电布层的上下两面或其中之一面镀有金属层，所述上导电粘着剂层、所述导电布层和所述下导电粘着剂层的总厚度为40-60μm。
进一步地说，所述金属导电粒子的粒径为5-45μm。
优选地，所述金属导电粒子的粒径为10-45μm。
进一步地说，所述上导电粘着剂层和所述下导电粘着剂层皆为包括胶粘剂树脂和所述金属导电粒子的热固性胶层，所述胶粘剂树脂的比例为20-75%（重量比），所述金属导电粒子的比例为25-70%（重量比），所述金属导电粒子与所述胶粘剂树脂比例为1:1-4:1（重量比）。
进一步地说，所述导电布层为纤维布，所述纤维布为网格布、平织布或无纺布, 所述纤维布的微孔的尺寸至少允许所述上导电粘着剂层和所述下导电粘着剂层中最小的金属导电粒子通过。
优选的，所述纤维布的微孔的尺寸≥5μm。
进一步地说，所述导电布层表面的金属层为镀铜镍层、镀铜钴层、镀铜锡层、镀铜银层、镀铜铁镍层、 镀铜金层或镀铜层。
进一步地说，所述的金属导电粒子为树枝状金属粉末、针状金属粉末和片状金属粉末的三种混合，其中所述树枝状金属粉末与针状金属粉末的比例为1:5-5:1（重量比），所述针状金属粉末与片状金属粉末的比例为1:4-4:1（重量比）。
进一步地说，所述金属导电粒子包括合金导电粒子。
进一步地说，所述胶粘剂树脂为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对二甲苯系树脂、双马来酰亚胺系树脂、酚树脂、三聚氰胺树脂和聚酰亚胺树脂中的至少一种。
进一步地说，所述下导电粘着剂层的下方和所述上导电粘着剂层的上方分别形成有离型膜层或载体膜层，所述离型膜层或载体膜层的厚度为25-100μm；所述离型膜层为PET氟塑离型膜层、PET含硅油离型膜层、PET亚光离型膜层、PE离型膜层或PE淋膜纸层；所述离型膜层为双面离型膜层或单面离型膜层。
所述的一种多层异向型导电布胶的制作方法，包括如下步骤：
步骤一：将各形状的金属导电粒子的粉体分别经过筛分筛选得到所需粒径后，将各形状的金属导电粒子混合均匀，得到金属导电粒子混合物；
步骤二：按比例添加金属导电粒子与胶粘剂树脂，使其充分混合均匀；
步骤三：在离型膜层或载体膜层指定离形面涂布步骤二制得的混合物即下导电粘着剂层；
步骤四：将导电布层的一面贴合固化于步骤三所述的下导电粘着剂层的表面；
步骤五：在导电布层的另外一面再次涂布步骤二制得的混合物即上导电粘着剂层，再在上导电粘着剂层的表面贴合离型膜层或载体膜层；
步骤六：固化、收卷、分条，即得成品。
本发明的有益效果是：本发明的至少具有以下优点：
一、本发明的上导电粘着剂层和下导电粘着剂层中包括至少两种形状的金属导电粒子，由于金属导电粒子具有多种形状，因此在受到热压产生形变时会趋向多方向流动，使压合后金属导电粒子在导电粘着剂层中的分布具有多方向性和高分散性，进而与软板上的接地孔形成导通电路，使得上导电粘着剂层和下导电粘着剂层具有良好的异向导电性，大幅提升导电性能，能够降低软板的接地阻抗值；
二、本发明的导电布层因其纤维状或网状结构有利于上下导电粘着剂层中加入的金属导电粒子通过其中的微孔实现上下导电粘着剂层的接通，同时因其良好的透气性，在FPC下游制程中经过SMT不会出现爆板现象，可有效解决现在市场流通的导电胶以及埋金属层导电胶会遇到的爆板问题；
三、本发明的导电布层因以纤维布为基材，具有良好的柔韧性与耐磨性，这样在FPC受到热压时不会因硬度过大而变形，造成材料性能不好，同时上下导电粘着剂层中的金属导电粒子因胶粘剂树脂材料受到热压产生形变流动而实现异向导通，可有效避免传统导电胶及添加薄金属型导电胶导通效果不佳的缺陷；
四、由于本发明的导电布层本身经过电镀金属镀层处理，在同样导通力的情况下，上导电粘着剂层和下导电粘着剂层中加入的金属导电粒子比例可相应降低，可降低粉尘污染，减少成本，而且产品接着强度会大幅度提高；
五、压合后，经一段时间高温熟化，多方向性的金属导电粒子可提升胶粘剂树脂达到完全交联固化后的电气性及机械物性；
六、本发明的导电布胶与钢片等金属部件形成加强部件覆贴至印刷线路板上时，因具有良好的接地稳定性可实现有效屏蔽外来电磁波干扰的目的；
七、当本发明的金属导电粒子包含合金导电粒子时，具有极佳的抗氧化性及传导性，便于产品存储搬运，又不会影响产品物性，使产品稳定、信赖度更高；
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并配合附图详细说明如后。
附图说明
图1是本发明的结构示意图；
图2是本发明测试一的结构示意图；
图3本发明测试二的结构示意图；
附图标记说明：
100—导电布胶；
101—上导电粘着剂层；
1011-金属导电粒子；
1012-胶粘剂树脂；
102—导电布层；
103-下导电粘着剂层；
104-离型膜层或载体膜层；
200-镀镍钢片；
300-印刷线路板；
400-单面覆铜板。
具体实施方式
以下通过特定的具体实施例说明本发明的具体实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的优点及功效。本发明也可以其它不同的方式予以实施，即，在不背离本本发明所揭示的范畴下，能予不同的修饰与改变。
实施例：一种多层异向型导电布胶100，如图1所示，包括上导电粘着剂层101、导电布层102和下导电粘着剂层103，所述导电布层102形成于所述上导电粘着剂层101与所述下导电粘着剂层103之间；
所述上导电粘着剂层101的厚度为20-40μm，所述下导电粘着剂层103的厚度为20-40μm，所述上导电粘着剂层101和所述下导电粘着剂层103皆包括金属导电粒子1011，所述金属导电粒子为树枝状金属粉末、针状金属粉末、片状金属粉末和球状金属粉末中的至少两种，所述金属导电粒子的粒径为2-50μm；
所述导电布层102的厚度为5-30μm，所述导电布层102的上下两面或其中之一面镀有金属层，所述上导电粘着剂层101、所述导电布层102和所述下导电粘着剂层103的总厚为40-60μm。
传统上导电粘着剂层和下导电粘着剂层中只有单一形状的导电粒子，在分散和压合流动时皆趋于同一方向运动和排布，会使导电粘着剂层在导通性上趋于同一方向，造成导电粘着剂层整体导通性不佳，进而导致导电粘着剂层的屏蔽效果不佳，本发明采用的多种形状的金属导电粒子在分散至导电粘着剂层时以及受到热压产生形变后趋向多方向流动和排布，使压合后金属导电粒子在导电粘着剂层中的分部具有多方向性和高分散性，从而使导电粘着剂层具有较好的异向导通性，提升屏蔽性能。
导电布层太厚会导致上下导电粘着剂层中金属导电粒子无法接触，上下接触不良，太薄不利于生产，增加生产成本，且导电布层具有极佳的柔韧性与耐磨性，可以提高产品信赖度与屏蔽性能。
所述导电布层、上导电粘着剂层和下导电粘着剂层的总厚度为40-60um，导电粘着剂层太薄，屏蔽效果不佳，胶层太厚，不适应薄型化要求，且涂布加工性要求较高，间接增加生产成本。
所述上导电粘着剂层101和所述下导电粘着剂层103皆为包括胶粘剂树脂1012和所述金属导电粒子的热固性胶层，所述胶粘剂树脂的比例为20-75%（重量比），所述金属导电粒子的比例为25-70%（重量比），所述金属导电粒子与所述胶粘剂树脂比例为1:1-4:1（重量比）。本发明的上导电粘着剂层和下导电粘着剂层中可能还含有一些辅料（例如硬化剂或粘稠剂等）和非金属导电粒子（例如石墨或导电化合物等）。
胶粘剂树脂太少粘度太低，不利于上线生产，太多生产出的产品粘性较强，且金属导电粒子相对含量降低会导致导通性不佳。
优选的，所述上导电粘着剂层和所述下导电粘着剂层中金属导电粒子的比例为35-55%（重量比）。
所述导电布层为纤维布，所述纤维布为网格布、平织布或无纺布, 所述纤维布的微孔的尺寸至少允许所述上导电粘着剂层和所述下导电粘着剂层中最小的金属导电粒子通过。
优选的，所述纤维布的微孔的尺寸≥5μm。
所述导电布层102表面的金属层为镀铜镍层、镀铜钴层、镀铜锡层、镀铜银层、镀铜铁镍层、 镀铜金层或镀铜层。
优选的，所述导电布层表面的金属层为镀铜镍层或镀铜银层。
优选的，所述金属导电粒子的粒径为5-45μm；更优选的，所述金属导电粒子的粒径为10-45μm；所述的金属导电粒子为树枝状金属粉末、针状金属粉末和片状金属粉末的三种混合，其中所述树枝状金属粉末与针状金属粉末的比例为1:5-5:1（重量比），所述针状金属粉末与片状金属粉末的比例为1:4-4:1（重量比）。比例低于1:1时，导通性不佳，胶粘剂树脂较多会造成下游操作粘板等问题，比例高于4:1时，粉体比例较高，对粉体分散工艺要求较高，密着性与接着强度都会收到影响。
所述金属导电粒子包括合金导电粒子。所述金属导电粒子为单金属导电粒子和合金导电粒子中的至少一种。优选的，所述金属导电粒子包括合金导电粒子。
其中，所述的单金属导电粒子可以是金粒子、银粒子、铜粒子和镍粒子中的至少一种，但不限于此；所述合金导电粒子可以是镀银铜粒子、镀银金粒子、镀银镍粒子、镀金铜粒子和镀金镍粒子中的至少一种，但不限于此。
合金导电粒子的抗氧化性和传导性较好，且产品便于存储搬运，又不会影响产品物性，使产品稳定，信赖度高。
所述胶粘剂树脂为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对二甲苯系树脂、双马来酰亚胺系树脂、酚树脂、三聚氰胺树脂和聚酰亚胺树脂中的至少一种。优选丙烯酸系树脂。
所述下导电粘着剂层103的下方和所述上导电粘着剂层101的上方分别形成有离型膜层或载体膜层104，所述离型膜层或载体膜层104的厚度为25-100μm；所述离型膜层为PET（聚对苯二甲酸乙二醇酯）氟塑离型膜层、PET含硅油离型膜层、PET亚光离型膜层、PE（聚乙烯）离型膜层或PE淋膜纸层；所述离型膜层为双面离型膜层或单面离型膜层。
所述离型膜层可以双面或单面离型，以双面离型为佳，厚度以25-100μm为佳，太薄或太厚不利于后续加工冲切。
所述离形膜层颜色为纯白色、乳白色或透明色，优先选用纯白色或乳白色。数控自动化设备雕刻线路时，红外线感应，白色无反射光问题，可以快速精准定位,加工作业，且人工手工作业时，白色有识别作用，防止人为漏撕等。
所述的一种多层异向型导电布胶的制作方法，包括如下步骤：
步骤一：将各形状的金属导电粒子的粉体分别经过筛分筛选得到所需粒径后，将各形状的金属导电粒子混合均匀，混合时可采取球磨（球磨转速不易过高，否则会将金属导电粒子表层合金层破坏，优先选择200-300r/min）或搅拌方式（转速700-2000r/min，转速高些混合均匀性会较好），混合后得到金属导电粒子混合物；
步骤二：按比例添加金属导电粒子与胶粘剂树脂，使其充分混合均匀，需边添加金属导电粒子边混合，混合条件与步骤一类似；
步骤三：在离型膜层或载体膜层指定离形面涂布步骤二制得的混合物即下导电粘着剂层；
步骤四：将导电布层的一面贴合固化于步骤三所述的下导电粘着剂层的表面（预固化温度不宜超过胶粘剂树脂本身的固化温度，本发明中预固化温度选择在80-100℃中间，便于后续生产）之后撕除载体，即在下导电粘着剂层上形成导电布层；
步骤五：在导电布层的另外一面再次涂布步骤二制得的混合物即上导电粘着剂层，再在上导电粘着剂层的表面贴合离型膜层或载体膜层；
步骤六：参考步骤四预固化条件固化、收卷、分条，即得成品。
测试一：对撕除离型膜层后的多层异向型导电布胶进行导通性分析测试：用高桥测试仪进行导通性分析测试，在上导电粘着剂层101和下导电粘着剂层103表面分别假贴镀镍钢片200与印刷线路板300后，压合固化分别测试样片过回流焊前后导通性阻值数据，将对本发明所作测试作为实施例，以同样方法测试一般产品的导电性能作为比较例，将测得的导通性结果记录于表1中。
测试二：同样对剥离双面离型膜后的多层异向型导电布胶进行剥离力分析测试：用万能拉力机进行剥离力分析测试，在上导电粘着剂层和下导电粘着剂层表面分别假贴镀镍钢片200与单面覆铜板400后，压合固化取出测试剥离力值，将对本发明所作测试作为实施例，以同样方法测试一般产品的剥离力作为比较例，将测得的导通性结果记录于表1。
表1
由上表可知，本发明的新型导电布胶相较于一般产品，确实具有良好的导电效果及焊锡耐热性且具有良好的接着强度。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (9)

1.一种多层异向型导电布胶，其特征在于：包括上导电粘着剂层、导电布层和下导电粘着剂层，所述导电布层形成于所述上导电粘着剂层与所述下导电粘着剂层之间；
所述上导电粘着剂层的厚度为20-40μm，所述下导电粘着剂层的厚度为20-40μm，所述上导电粘着剂层和所述下导电粘着剂层皆包括金属导电粒子，所述金属导电粒子的粒径为2-50μm；
所述的金属导电粒子为树枝状金属粉末、针状金属粉末和片状金属粉末的三种混合，其中所述树枝状金属粉末与针状金属粉末的重量比例为1:5-5:1，所述针状金属粉末与片状金属粉末的重量比例为1:4-4:1；
所述导电布层的厚度为5-30μm，所述导电布层的上下两面或其中之一面镀有金属层，所述上导电粘着剂层、所述导电布层和所述下导电粘着剂层的总厚度为40-60μm。
2.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述上导电粘着剂层和所述下导电粘着剂层皆为包括胶粘剂树脂和所述金属导电粒子的热固性胶层，所述胶粘剂树脂的重量比例为20-75%，所述金属导电粒子的重量比例为25-70%，所述金属导电粒子与所述胶粘剂树脂的重量比例为1:1-4:1。
3.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述导电布层为纤维布，所述纤维布为网格布、平织布或无纺布, 所述纤维布的微孔的尺寸至少允许所述上导电粘着剂层和所述下导电粘着剂层中最小的金属导电粒子通过。
4.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述导电布层表面的金属层为镀铜镍层、镀铜钴层、镀铜锡层、镀铜银层、镀铜铁镍层、 镀铜金层或镀铜层。
5.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述金属导电粒子的粒径为5-45μm。
6.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述金属导电粒子包括合金导电粒子。
7.根据权利要求2所述的一种多层异向型导电布胶，其特征在于：所述胶粘剂树脂为环氧树脂、丙烯酸系树脂、氨基甲酸酯系树脂、硅橡胶系树脂、聚对二甲苯系树脂、双马来酰亚胺系树脂、酚树脂、三聚氰胺树脂和聚酰亚胺树脂中的至少一种。
8.根据权利要求1所述的一种多层异向型导电布胶，其特征在于：所述下导电粘着剂层的下方和所述上导电粘着剂层的上方分别形成有离型膜层或载体膜层，所述离型膜层或载体膜层的厚度为25-100μm；所述离型膜层为PET氟塑离型膜层、PET含硅油离型膜层、PET亚光离型膜层、PE离型膜层或PE淋膜纸层；所述离型膜层为双面离型膜层或单面离型膜层。
9.根据权利要求1所述的一种多层异向型导电布胶的制作方法，其特征在于：包括如下步骤：
步骤一：将各形状的金属导电粒子的粉体分别经过筛分筛选得到所需粒径后，将各形状的金属导电粒子混合均匀，得到金属导电粒子混合物；
步骤二：按比例添加金属导电粒子与胶粘剂树脂，使其充分混合均匀；
步骤三：在离型膜层或载体膜层指定离形面涂布步骤二制得的混合物即下导电粘着剂层；
步骤四：将导电布层的一面贴合固化于步骤三所述的下导电粘着剂层的表面；
步骤五：在导电布层的另外一面再次涂布步骤二制得的混合物即上导电粘着剂层，再在上导电粘着剂层的表面贴合离型膜层或载体膜层；
步骤六：固化、收卷、分条，即得成品。
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