TWI639675B - 多層異向型導電布膠及其製作方法 - Google Patents

多層異向型導電布膠及其製作方法 Download PDF

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TWI639675B
TWI639675B TW106130451A TW106130451A TWI639675B TW I639675 B TWI639675 B TW I639675B TW 106130451 A TW106130451 A TW 106130451A TW 106130451 A TW106130451 A TW 106130451A TW I639675 B TWI639675 B TW I639675B
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layer
conductive
conductive particles
metal conductive
metal
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TW106130451A
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TW201835268A (zh
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林志銘
李建輝
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亞洲電材股份有限公司
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Abstract

一種多層異向型導電布膠及其製作方法，該多層異向型導電布膠包括上導電黏著劑層、導電布層及下導電黏著劑層；其中，該導電布層之至少一面鍍有金屬層，且該多層異向型導電布膠之總厚度為45至100微米；於軟性印刷電路板之主要應用方面，該導電布膠與鋼片或聚醯亞胺型之補強板貼合後，所組成加強部件可有效防止因彎折致使安裝部位出現形變，且能確保良好的填孔性，並具有直接接地及屏蔽外來信號干擾之效果。因此，本發明多層異向型導電布膠具有良好的電氣特性、接著強度佳、焊錫性好、信賴度高及耐燃性佳等特性。

Description

多層異向型導電布膠及其製作方法
本發明係關於印刷電路板用之導電膠，尤係關於一種多層異向型導電布膠。
隨著電子及通訊產品的發展，電路基板元件朝向輕薄短小及高集成化發展，傳輸信號頻率帶越來越寬，導致電磁干擾越來越嚴重；此外，電子電路元件的使用安全性亦列入考量，針對電子產品中電路元件接地可靠度及電路板設計自由度又提出了新要求，目前市面上普及的導電膠產品常有因導電膠將接地孔填充太滿進而影響其他組件的設計安裝，出現爆板之問題，又或是導電膠未填滿導致回流焊時連接部分存在空隙，產生遮罩效果不佳等缺陷。
另外，目前市場中流通的導電膠產品大都是直接將導電性顆粒分散在黏著劑中，且其黏著劑層通常偏厚，若固化不充分，壓合條件不均勻，則會導致產品貼合至印刷電路板時出現粉體分佈不均，進而影響導通性能等。
為此，本發明提供一種由多種形態之複數金屬粒子及 導電布層所構成之高導通性多層異向型導電布膠。
本發明主要解決的技術問題是提供一種多層異向型導電布膠，具有良好的電氣特性、接著強度佳、焊錫性好、信賴度高及耐燃性佳等特性，相較於一般的導電膠具有更好的導通效果、接著強度，且生產易於實現，市場應用前景廣泛；於軟性印刷電路板之主要應用方面，該導電布膠與鋼片或聚醯亞胺型之補強板貼合後，所組成加強部件可有效防止因彎折致使安裝部位出現形變，且能確保良好的填孔性，並具有直接接地屏蔽外來信號干擾之效果。
為解決上述技術問題，本發明提供一種多層異向型導電布膠，包括：上導電黏著劑層，其厚度為20至40微米；下導電黏著劑層，其厚度為20至40微米，其中，該上導電黏著劑層和下導電黏著劑層皆包括粒徑為2至50微米之複數金屬導電粒子，且該複數金屬導電粒子具有選自樹枝狀、針狀、片狀和球狀所組成群組之至少兩種形狀；以及5至30微米厚且具上下兩面之導電布層，係形成於所述上導電黏著劑層與所述下導電黏著劑層之間，俾令該多層異向型導電布膠的總厚度為45至100微米，其中，該導電布層之至少一面鍍有金屬層。
於一具體實施態樣中，該複數金屬導電粒子的粒徑為5至45微米。
於另一具體實施態樣中，該複數金屬導電粒子的粒徑為10至45微米。
於一具體實施態樣中，所述上導電黏著劑層和下導電黏著劑層皆為熱固性膠層，包括膠黏劑樹脂及該複數金屬導電粒子，其中，各該上導電黏著劑層和下導電黏著劑層之該膠黏劑樹脂含量為20至75重量%，該複數金屬導電粒子含量為25至70重量%，且所述複數金屬導電粒子與所述膠黏劑樹脂的重量比為1：1至4：1。
於一具體實施態樣中，所述導電布層為纖維布，且該纖維布可選自網格布、平織布及無紡布所組成群組之其中一種，其中，該纖維布具有複數微孔，且其尺寸容許該上導電黏著劑層和下導電黏著劑層中之最小的金屬導電粒子通過該纖維布。
於另一具體實施態樣中，該導電布層之微孔的尺寸大於等於5微米。
於一具體實施態樣中，該導電布層表面之金屬層可為鍍銅鎳層、鍍銅鈷層、鍍銅錫層、鍍銅銀層、鍍銅鐵鎳層、鍍銅金層或鍍銅層。
於一具體實施態樣中，所述複數金屬導電粒子係由複數樹枝狀金屬導電粒子、複數針狀金屬導電粒子及複數片狀金屬導電粒子混合而成，且該複數樹枝狀金屬導電粒子與該複數針狀金屬導電粒子的重量比為1：5至5：1，該複數針狀金屬導電粒子與該複數片狀金屬導電粒子的重量比為1：4至4：1。
於一具體實施態樣中，形成該複數金屬導電粒子之材質包括合金導電粒子。
於一具體實施態樣中，所述膠黏劑樹脂係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、酚樹脂、三聚氰胺樹脂及聚醯亞胺樹脂所組成群組之至少一種。
於一具體實施態樣中，該下導電黏著劑層之下方和該上導電黏著劑層之上方，可分別形成25至100微米厚之離型層，該離型層可為單面離型膜或雙面離型膜，且該離型層可為氟素塗佈聚酯離型膜層、矽油塗佈聚酯離型膜層、啞光聚酯離型膜層、聚乙烯離型膜層或聚乙烯淋膜紙層。
本發明復提供一種製備多層異向型導電布膠之方法，包括：以1：1至4：1之重量比混合粒徑為2至50微米之複數金屬導電粒子及膠黏劑樹脂，以形成混合物，其中，該複數金屬導電粒子係具有選自樹枝狀、針狀、片狀和球狀所組成群組之至少二種形狀；將該混合物塗佈於離型層之指定離型面，形成下導電黏著劑層；於該下導電黏著劑層之表面貼合導電布層；於該導電布層之另一面塗佈以1：1至4：1之重量比混合粒徑為2至50微米之複數金屬導電粒子及膠黏劑樹脂之另一混合物，以形成上導電黏著劑層；以及於該上導電黏著劑層的表面貼合離型層。
於一具體實施態樣中，復包括在貼合該導電布層後，預固化該下導電黏著劑層，以及在該上導電黏著劑層的表面貼合離型層後，預固化該上導電黏著劑層。
於一具體實施態樣中，該混合物和另一混合物係為相同。
於一具體實施態樣中，復包括進行收卷和分條，即得成品。
根據本發明之多層異向型導電布膠，至少具有以下優點：一、本發明的上導電黏著劑層和下導電黏著劑層中包括至少兩種形狀的複數金屬導電粒子，由於該複數金屬導電粒子係為多種形狀，因此在加工受到熱壓產生形變時會趨向多方向流動，使壓合後複數金屬導電粒子在導電膠層中的分佈具有多方向性和高分散性，進而與軟板上的接地孔形成導通電路，使得上導電黏著劑層和下導電黏著劑層具有良好的異向導通性，大幅提升導電性能，並降低軟板的接地阻抗值；二、本發明的導電布層因其纖維狀或網狀結構有利於上導電黏著劑層及下導電黏著劑層中的複數金屬導電粒子通過其孔洞，實現上下導電黏著劑層的導通，同時因該導電布層具良好的透氣性，故在軟性印刷電路板之表面貼裝技術製程不會出現爆板現象，可有效解決現有導電膠及導入金屬層之導電膠會遇到的爆板問題；三、由於本發明的導電布層以纖維布為基材，具有良好的柔韌性與耐磨性，如此可以避免導電膠因硬度過大在軟性電路板受熱壓時產生形變，影響性能，同時該上導電黏著劑層及下導電黏著劑層之複數金屬導電粒子經熱壓致使該膠黏劑樹脂材料產生形變流動而實現異向導通，可有效避免傳統導電膠及導入導電布層之導電膠導通效果不佳 的缺陷；四、由於本發明之導電布層之表面係以電鍍金屬鍍層處理形成金屬層，故在同樣導通力的情況下，上導電黏著劑層及下導電黏著劑層之複數金屬導電粒子之使用量可相應降低，有降低粉塵污染，減少成本，且大幅度提高產品接著強度；五、經一段時間高溫熟化壓合後，多方向性的複數金屬導電粒子可提升膠黏劑樹脂達到完全交聯固化後的電氣性及機械物性；六、當使用本發明之導電膠層與鋼片等金屬部件覆貼於印刷電路板上形成加強部件之時，因具有良好的接地穩定性可有效遮蔽外來電磁波干擾；七、本發明之金屬粒子可包含複數合金導電粒子，其具有極佳的抗氧化性及傳導性，利於存儲搬運，不影響產品物性，使產品具穩定性佳及信賴度高之特性；上述說明僅是本發明技術之概述，為了能夠更清楚瞭解本發明之技術手段，並可依照說明書的內容予以實施，以下以本發明的具體實施態樣並配合附圖詳細說明如後。
100‧‧‧多層異向型導電布膠
101‧‧‧上導電黏著劑層
102‧‧‧導電布層
103‧‧‧下導電黏著劑層
104‧‧‧離型層
200‧‧‧鍍鎳鋼片
300‧‧‧印刷線路板
400‧‧‧單面銅箔基板
1011‧‧‧金屬導電粒子
1012‧‧‧膠黏劑樹脂
透過例示性之參考附圖說明本發明的實施方式：第1圖係本發明之結構示意圖；第2圖係本發明之多層異向型導電布膠之導通性分析示意圖；以及第3圖係本發明之多層異向型導電布膠之剝離力分析 示意圖。
以下係藉由特定的具體實施例說明本發明之實施方式，熟習此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之優點及功效。
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「一」、「下」及「上」亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。
此外，本文所有範圍和值都係包含及可合併的。落在本文中所述的範圍內之任何數值或點，例如任何整數都可以作為最小值或最大值以導出下位範圍等。
請參閱第1圖，一種多層異向型導電布膠100，包括：上導電黏著劑層101，其厚度為20至40微米；下導電黏著劑層103，其厚度為20至40微米，其中，該上導電黏著劑層和下導電黏著劑層皆包括複數金屬導電粒子1011，該複數金屬導電粒子之粒徑為2至50微米，且具有選自樹枝狀、針狀、片狀和球狀所組成群組之至少兩種形 狀的金屬導電粒子；以及5至30微米厚且具上下兩面之導電布層102，係形成於該上導電黏著劑層101與該下導電黏著劑層103之間，其中，該導電布層之至少一面鍍有金屬層；且該多層異向型導電布膠的總厚度為45至100微米。
典型之上導電黏著劑層和下導電黏著劑層中僅有單一形狀的導電粒子，在分散和壓合流動時皆趨於同一方向流動和分布，俾使該導電膠層在導通性上趨於同一方向，造成整體導電膠層之導通性不佳，進而影響導電膠層之遮罩效果，本發明採用的多種形狀的複數金屬導電粒子在分散至膠黏劑層時經熱壓產生形變而呈多方向性流動和高分散性分布，從而使導電膠層具有較好的異向導通性，提升遮罩性能。
該導電布層102具厚度為5至30微米，且厚度適宜，若其厚度太厚會導致上導電黏著劑層及下導電黏著劑層中的複數金屬導電粒子無法接觸，上下接觸不良；若其厚度太薄則不利於生產，大幅增加生產成本，且導電布層具有極佳的柔韌性與耐磨性，可提升信賴度與遮罩性能。
上述之多層異向型導電布膠的總厚度為45至100微米，若導電黏著劑層太薄，則遮罩效果不佳；若導電黏著劑層太厚，則不符合薄型化要求，且不利塗佈加工性，間接增加生產成本。
該上導電黏著劑層101和該下導電黏著劑層103皆為熱固性膠層，包括膠黏劑樹脂1012及該複數金屬導電粒子1011，其中，各該上導電黏著劑層和下導電黏著劑層之該 膠黏劑樹脂含量為20至75重量%，該複數金屬導電粒子含量為25至70重量%，且該複數金屬導電粒子與該膠黏劑樹脂的重量比為1：1至4：1。若其比例低於1：1時，則導通性不佳，膠黏劑含量多亦會造成下游操作有容易黏板等問題；若其比例高於4：1時，粉體比例較高，不利於粉體分散，且其密著性與接著強度都會收到影響。此外，本發明之上導電黏著劑層和下導電黏著劑層中復包括一些輔料(例如硬化劑或黏稠劑等)和非金屬導電粒子(例如石墨或導電化合物等)。
若膠黏劑樹脂太少，則黏度太低；若膠黏劑樹脂太多，生產出的產品黏性較強，且相對地該複數金屬導電粒子之含量降低，致使導通性不佳。
於一具體實施態樣中，各該上導電黏著劑層和該下導電黏著劑層之複數金屬導電粒子的比例為35至55重量%。
該導電布層為纖維布，且該纖維布可選自網格布、平織布及無紡布所組成群組之其中一種，其中，該纖維布之微孔的尺寸大於該上導電黏著劑層和下導電黏著劑層之尺寸最小金屬導電粒子，使該金屬導電粒子可通過該纖維布。
於另一具體實施態樣中，該導電布層之微孔尺寸大於等於5微米。
該導電布層102表面之金屬層可為鍍銅鎳層、鍍銅鈷層、鍍銅錫層、鍍銅銀層、鍍銅鐵鎳層、鍍銅金層或鍍銅層。
於一具體實施態樣中，該導電布層表面之金屬層為鍍 銅鎳層或鍍銅銀層。
於一具體實施態樣中，該複數金屬導電粒子之粒徑為5至45微米；於另一具體實施態樣中，該複數金屬導電粒子之粒徑為10至45微米；其中，該複數金屬導電粒子係由複數樹枝狀金屬導電粒子、複數針狀金屬導電粒子及複數片狀金屬導電粒子混合而成，且該複數樹枝狀金屬導電粒子與該複數針狀金屬導電粒子的重量比為1：5至5：1，該複數針狀金屬導電粒子與該複數片狀金屬導電粒子的重量比為1：4至4：1。
形成該複數金屬導電粒子之材質包括單金屬導電粒子和合金導電粒子中之至少一者，又，該複數金屬導電粒子尤以合金導電粒子為佳。
其中，該單金屬導電粒子可選自金粒子、銀粒子、銅粒子和鎳粒子所組成群組中之至少一種，但不限於此；該合金導電粒子係可選自鍍銀銅粒子、鍍銀金粒子、鍍銀鎳粒子、鍍金銅粒子及鍍金鎳粒子所組成群組中之至少一種，但不限於此。
合金導電粒子的抗氧化性和傳導性較好，且產品利於存儲搬運，對產品物性不造成影響，使產品具穩定性佳及信賴度高之特性。
該膠黏劑樹脂係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、酚樹脂、三聚氰胺樹脂及聚醯亞胺樹脂所組成群組之至少一種，其中尤以丙烯酸系樹脂為佳。
該下導電黏著劑層103之下方和該上導電黏著劑層101之上方，可分別形成25至100微米厚之離型層104，其厚度太薄或太厚皆不利於後續加工沖切；該離型層可為單面離型膜或雙面離型膜，尤以雙面離型膜為佳，且該離型層可為氟素塗佈聚酯離型膜層、矽油塗佈聚酯離型膜層、啞光聚酯離型膜層、聚乙烯離型膜層或聚乙烯淋膜紙層。
該離型層的離型膜顏色為純白色、乳白色或透明色，其中尤以純白色離型膜或乳白色離型膜為佳，由於數控自動化設備雕刻線路時，在紅外線感應下，純白色離型膜或乳白色離型膜無光反射之問題，可以快速精准定位，加工作業，且人工作業時，純白色或乳白色具識別作用，減少人為漏撕之情況。
本發明復提供一種製備多層異向型導電布膠之方法，包括：步驟一：以篩分篩選各形狀的金屬導電粒子的粉體得到所需粒徑後，使各形狀的金屬導電粒子混合均勻，混合時可選擇球磨方式，且球磨轉速不宜過高(轉速尤以200至300轉/分鐘為佳)，否則將破壞金屬粒子之表層合金層，或者選擇使用攪拌方式(轉速以700至2000轉/分鐘為佳)，然而攪拌之轉速高者混合均勻性佳，經混合後得到複數金屬導電粒子混合物；步驟二：按比例於膠黏劑樹脂加入上述的複數金屬導電粒子混合物並充分混合均勻，混合同時添加複數金屬導 電粒子混合物，其混合條件與步驟一相似；步驟三：將步驟二所得混合物塗佈在離型層的指定離型面，即形成下導電黏著劑層；步驟四：於下導電黏著劑層貼合附載體之導電布層並預固化該下導電黏著劑層，預固化溫度不宜超過膠黏劑樹脂本身之固化溫度，本發明中所選之預固化溫度位於80至100℃之間，於預固化後撕除載體，即形成導電布層；步驟五：於導電布層之另一面塗佈步驟二製得之混合物，形成上導電黏著劑層。當然，也可以另外調配不同組成和比例之另一混合物；步驟六：於上導電黏著劑層貼合離型層；步驟七：以步驟四的預固化條件固化該上導電黏著劑層後收卷，即得成品。
測試方法1：導通性分析
用高橋測試儀對撕除離型膜後的多層異向型導電布膠進行導通性測試。如第2圖所示，在上導電黏著劑層101和下導電黏著劑層103表面分別假貼鍍鎳鋼片200與印刷線路板300後，經壓合(壓力100公斤重，溫度180℃，預壓10秒，壓合120秒)固化(溫度160℃，時間1小時)後，分別測試樣片過回流焊前與過三次回流焊後導通性阻值，本發明作為實施例，以同樣方法測試一般產品的導電性能作為比較例，將測得的導通性結果記錄於表1中。
焊錫耐熱性：在上導電黏著劑層101和下導電黏著劑層103表面分別假貼鍍鎳鋼片200與印刷線路板300，經壓 合(壓力100公斤重，溫度180℃，預壓10秒，壓合120秒)固化(溫度160℃，時間1小時)後，置於高溫焊錫爐中，觀察是否有氣泡、花紋、融熔等現象，參考IPC-TM650 2.4.13焊錫測試方法。
測試方法2：剝離力分析
用萬能拉力機進行對撕除離型膜後的多層異向型導電布膠剝離力測試。如第3圖所示，在上導電黏著劑層和下導電黏著劑層表面分別假貼鍍鎳鋼片200與單面銅箔基板400後，經壓合固化後，取出樣片測試剝離力值，本發明作為實施例，以同樣方法測試一般產品的剝離力作為比較例，將測得的導通性結果記錄於表1中。
實施例1：多層異向型導電布膠之製備
以篩分篩選出D90粒徑約45微米之鍍銀銅球狀、鍍銀鎳針狀的金屬導電粒子的粉體，再以球磨轉速條件為250轉/分鐘攪拌混合上述金屬導電粒子，且該複數球狀金屬粒子與該複數針狀金屬導電粒子的重量比為1：1，製得異形金屬粒子混合物。
接著，於丙烯酸系膠黏劑樹脂(RD0351及RD0352，亞洲電材股份有限公司)加入上述的異形金屬粒子混合物並以球磨轉速條件250轉/分鐘充分混合均勻，且混合同時添加該異形金屬粒子混合物，製得55%丙烯酸系膠黏劑樹脂、25%上述異形金屬粒子混合物及其餘組成為輔助劑(RD0223及RD0339，亞洲電材股份有限公司)之塗佈混合物。其中RD-0223調節膠黏劑樹脂中分子間反應結合力及 分散均勻性，RD-0339調節膠黏劑樹脂混合物最終黏度，且RD-0223和RD-0339的添加量比约為1：1。
將該塗佈混合物塗佈在氟素塗佈聚酯離型層之指定面，即形成20微米厚度之下導電黏著劑層，並於該下導電黏著劑層貼合附載體之鍍銅鎳層之導電布層並預固化，其預固化溫度為80℃，於預固化後撕除載體，即形成2微米厚度之導電布層。
於該導電布層之另一面以相同塗佈及預固化方式形成與下導電黏著劑層相同組成之20微米厚度之上導電黏著劑層，成型後收卷，即得多層異向型導電布膠成品。
測試其多層異向型導電布膠之物性，並記錄於表1中。
實施例2至5及比較例1至2之多層異向型導電布膠之製備方法同實施例1，惟，僅異動金屬粉及膠黏劑樹脂比例、金屬粉體混合重量比、金屬粉類型、導電布金屬層類型及上、下導電黏著劑層之厚度如表1，測試其多層異向型導電布膠之物性，並記錄於表1中。
表1中上導電黏著劑層和下導電黏著劑層中的組成係為相同。
由上表可知，本發明之多層異向型導電布膠具有良好的導電效果及焊錫耐熱性，且具有良好的接著強度。
上述實施例僅為例示性說明，而非用於限制本發明。 任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修飾與改變。因此，本發明之權利保護範圍係由本發明所附之申請專利範圍所定義，只要不影響本發明之效果及實施目的，應涵蓋於此公開技術內容中。

Claims (10)

  1. 一種多層異向型導電布膠，包括：上導電黏著劑層，其厚度為20至40微米；下導電黏著劑層，其厚度為20至40微米，其中，該上導電黏著劑層和下導電黏著劑層皆為熱固性膠層，且各包括膠黏劑樹脂及粒徑為2至50微米之複數金屬導電粒子，且該複數金屬導電粒子係選自複數樹枝狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：5至5：1混合、複數針狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：4至4：1混合、複數球狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：1混合、及複數球狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：1混合所組成群組之其中一種；其中，各該上導電黏著劑層和下導電黏著劑層之該膠黏劑樹脂含量為20至75重量%，該複數金屬導電粒子含量為25至70重量%，且該複數金屬導電粒子與該膠黏劑樹脂的重量比為1：1至4：1；以及5至30微米厚且具上下兩面之導電布層，係形成於該上導電黏著劑層與該下導電黏著劑層之間，俾令該多層異向型導電布膠的總厚度為45至100微米，其中，該導電布層之至少一面鍍有金屬層。
  2. 如申請專利範圍第1項所述之多層異向型導電布膠，其中，該導電布層為纖維布，且該纖維布可選自網格布、平織布及無紡布所組成群組之其中一種，其中， 該纖維布具有複數微孔，且其尺寸容許該上導電黏著劑層和下導電黏著劑層中之最小的金屬導電粒子通過該纖維布。
  3. 如申請專利範圍第1項所述之多層異向型導電布膠，其中，該導電布層表面之金屬層可為鍍銅鎳層、鍍銅鈷層、鍍銅錫層、鍍銅銀層、鍍銅鐵鎳層、鍍銅金層或鍍銅層。
  4. 如申請專利範圍第1項所述之多層異向型導電布膠，其中，該複數金屬導電粒子之粒徑為5至45微米。
  5. 如申請專利範圍第1項所述之多層異向型導電布膠，其中，形成該複數金屬導電粒子之材質包括合金導電粒子。
  6. 如申請專利範圍第1項所述之多層異向型導電布膠，其中，該膠黏劑樹脂係選自環氧樹脂、丙烯酸系樹脂、胺基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、酚樹脂、三聚氰胺樹脂及聚醯亞胺樹脂所組成群組之至少一種。
  7. 如申請專利範圍第1項所述之多層異向型導電布膠，復包括分別形成於該下導電黏著劑層之下方和該上導電黏著劑層之上方之25至100微米厚之二離型層，各該離型層可為單面離型膜或雙面離型膜，且該離型層可為氟素塗佈聚酯離型膜層、矽油塗佈聚酯離型膜層、啞光聚酯離型膜層、聚乙烯離型膜層或聚乙烯淋膜紙層。
  8. 一種製備如申請專利範圍第1項所述之多層異向型導電布膠之方法，包括：以1：1至4：1之重量比混合粒徑為2至50微米之複數金屬導電粒子及膠黏劑樹脂，以形成混合物，其中，該膠黏劑樹脂含量為20至75重量%，該複數金屬導電粒子含量為25至70重量%，且該複數金屬導電粒子係選自複數樹枝狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：5至5：1混合、複數針狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：4至4：1混合、複數球狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：1混合、及複數球狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：1混合所組成群組之其中一種；將該混合物塗佈於離型層之指定離型面，形成下導電黏著劑層；於該下導電黏著劑層之表面貼合導電布層；於該導電布層之另一面塗佈以1：1至4：1之重量比混合粒徑為2至50微米之複數金屬導電粒子及膠黏劑樹脂之另一混合物，以形成上導電黏著劑層，其中，該膠黏劑樹脂含量為20至75重量%，該複數金屬導電粒子含量為25至70重量%，且該複數金屬導電粒子係選自複數樹枝狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：5至5：1混合、複數針狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：4至4：1混合、 複數球狀金屬導電粒子與複數針狀金屬導電粒子重量比為1：1混合、及複數球狀金屬導電粒子與複數片狀金屬導電粒子重量比為1：1混合所組成群組之其中一種；以及於該上導電黏著劑層的表面貼合離型層。
  9. 如申請專利範圍第8項所述之方法，復包括在貼合該導電布層後，預固化該下導電黏著劑層，以及在該上導電黏著劑層的表面貼合離型層後，預固化該上導電黏著劑層。
  10. 如申請專利範圍第8項所述之方法，其中，該混合物和另一混合物係為相同。
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CN112965308B (zh) * 2021-02-04 2022-07-29 豪威半导体（上海）有限责任公司 Lcos结构及其形成方法
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