JP5055097B2 - 検査用粘着シート - Google Patents
検査用粘着シート Download PDFInfo
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- JP5055097B2 JP5055097B2 JP2007291252A JP2007291252A JP5055097B2 JP 5055097 B2 JP5055097 B2 JP 5055097B2 JP 2007291252 A JP2007291252 A JP 2007291252A JP 2007291252 A JP2007291252 A JP 2007291252A JP 5055097 B2 JP5055097 B2 JP 5055097B2
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- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Description
即ち、本発明の検査用粘着シートは、基材フィルム及び粘着剤層が共に導電性を有しており、両者の間に導通経路が設けられた構成であるので、半導体ウェハ又は半導体チップを検査用粘着シートに固定した状態で、導通検査を行うことができる。その結果、従来、導通検査で生じていた半導体ウェハの変形(反り)や破損の問題を回避することができ、また裏面にキズやスクラッチのない半導体ウェハ又は半導体チップをスループットを向上させて製造することができる。
メチルアクリレート70重量部、ブチルアクリレート30重量部、及びアクリル酸5重量部を酢酸エチル中で共重合させて数平均分子量80万のアクリル系ポリマーを含む溶液を得た。当該溶液に、ジペンタエリスリトールヘキサアクリレート(カヤラッドDPHA、日本化薬株式会社製)60重量部、ラジカル重合開始剤(イルガキュア651、チバ・スペシャルティ・ケミカルズ社製)5重量部、及びポリイソシアネート化合物(コロネートL、日本ポリウレタン社製)2重量部を加えて紫外線硬化型アクリル系粘着剤を調製した。この粘着剤溶液に導電性粒子としてインコスペシャルプロダクツ製ニッケルパウダー(商品名タイプ123、スパイク状、粒径3〜7μmφ)200重量部を加え、導電性粘着剤溶液Aを作製した。
本実施例においては、基材フィルムとして(株)日鉱マテリアルズ製圧延銅箔(厚み50μm)を使用した以外は実施例1と同様にして本実施例に係る検査用粘着シートを作製した。
実施例1で作製した紫外線硬化型アクリル系粘着剤溶液に、導電性粒子としてインコスペシャルプロダクツ製ニッケルパウダー(商品名タイプ123、スパイク状、粒径3〜7μmφ)50重量部を加え、導電性粘着剤溶液Cを作製した。
合成したアクリル系ポリマーの数平均分子量は以下の方法で測定した。アクリル系ポリマーをTHFに0.1wt%で溶解させて、GPC(ゲルパーミエーションクロマトグラフィー)を用いてポリスチレン換算により数平均分子量を測定した。詳しい測定条件は以下の通りである。
GPC装置:東ソー製、HLC−8120GPC
カラム:東ソー製、(GMHHR−H)+(GMHHR−H)+(G2000HHR)
流量:0.8ml/min
濃度:0.1wt%
注入量:100μl
カラム温度:40℃
溶離液:THF
実施例、及び参考例で得られた検査用粘着シート等に対しセパレータを剥離し、粘着剤層表面の導電性を評価した。ダイシング処理は粘着シート単体で行い、すべての粘着シートにおいてそれぞれ基材フィルムがその厚さの1/2の深さまで切り込まれるよう条件を設定した。導電性評価は、三菱化学製Lorester MP MCP−T350を用いて、JIS K7194に準じて行い、粘着シートにおける粘着剤層の表面抵抗率及び体積抵抗率を求めた。尚、抵抗率補正係数RCFは4.532として、表面抵抗率及び体積抵抗率の算出を行った。
実施例、及び参考例で得られた検査用粘着シートを、20mm幅で短冊状に切断し、23±3℃(室温)でシリコンミラーウェハ面(信越半導体株式会社製;CZN<100>2.5−3.5(4インチ))に貼付けた。次に、室温雰囲気下で30分間静置した後、23±3℃の恒温室で90°引き剥がし粘着力を測定した(剥離点移動速度300mm/sec)。
実施例、及び参考例で得られた検査用粘着シートに、裏面研削された厚さ100μmの半導体ウェハ(6インチ)を温度23±3℃でマウントした後、以下の条件でダイシングした。ダイシング時のチップ飛び、ダイシング後のチップの欠けや割れの発生の有無を評価した。評価は、20個の半導体チップのうち、一つでもチップ飛び、チップの欠けや割れが発生した場合を×とし、発生しなかった場合を○とした。
ダイサー:DISCO社製、DFD−651ブレード:DISCO社製、27HECCブレード回転数:35000rpm、ダイシング速度:50mm/sec、ダイシングサイズ:10mm×10mm
各実施例1、2及び参考例1の検査用粘着シートにおいては何れも第1導電性粘着剤層及び第2導電性粘着剤層と、基材フィルムとの間に導通経路が形成されており、これらの検査用粘着シートに半導体ウェハや半導体チップを貼り合わせた状態でも、ダイシング工程の前後で導通検査が可能であることが確認された。更に、実施例1及び2の検査用粘着シートではダイシングの際のチップ飛び、チップの欠けや割れは発生せず、極めて良好なダイシング性を示した。
3 粘着剤層
5 導電性粒子
9 半導体ウェハ
10 ダイシング用粘着シート
11 半導体チップ
13 導通検査ステージ
15 回路形成面
17 ダイシングリング
Claims (6)
- 基材フィルム上に粘着剤層が設けられた検査用粘着シートであって、
半導体ウェハ又は半導体チップの電気的な導通検査に用いられ、
前記基材フィルム及び粘着剤層は導電性を有し、両者の間は電気的な導通が確保され、
前記粘着剤層は前記基材フィルム側から第1導電性粘着剤層及び第2導電性粘着剤層が順次積層された積層構造を有し、
前記第1導電性粘着剤層の表面抵抗率は1×10 −2 Ω/□以上、1Ω/□以下、第2導電性粘着剤層の表面抵抗率は1×10 −1 Ω/□以上、1×10 1 Ω/□以下であり、 前記第1導電性粘着剤層の粘着力は1N/20mm以下、第2導電性粘着剤層の粘着力は1N/20mm以上であり、第1導電性粘着剤層の粘着力は第2導電性粘着剤層の粘着力よりも小さいことを特徴とする検査用粘着シート。 - 前記基材フィルムは、基材上に導電性蒸着層が設けられた構造であることを特徴とする請求項1に記載の検査用粘着シート。
- 前記基材フィルムは、金属箔からなることを特徴とする請求項1に記載の検査用粘着シート。
- 前記第1導電性粘着剤層及び第2導電性粘着剤層中にはそれぞれ導電性粒子が含まれており、導電性粒子の含有量はそれぞれの粘着剤層を構成するベースポリマー成分100重量部に対し1〜500重量部の範囲内であり、かつ、第1導電性粘着剤層における導電性粒子の含有量が第2導電性粘着剤層における導電性粒子の含有量よりも大きいことを特徴とする請求項1〜3の何れか1項に記載の検査用粘着シート。
- 請求項1〜4の何れか1項に記載の検査用粘着シートにおける前記粘着剤層上に、回路形成面とは反対側の面を貼り合わせ面として半導体ウェハを貼り合わせる工程と、
前記半導体ウェハが固定された状態で、導通可能な検査ステージ上に前記検査用粘着シートを載置し、前記半導体ウェハにおける回路形成面に一方の接続端子を当接すると共に、前記粘着剤層に他方の接続端子を当接して電気的接続を図ることにより、前記半導体ウェハの導通検査をする工程と、
前記半導体ウェハを回路形成面側からダイシングし、少なくとも前記基材フィルムの一部を残した状態で半導体チップを形成する工程と、
前記半導体チップを前記検査用粘着シートからピックアップする工程とを有することを特徴とする半導体装置の製造方法。 - 請求項1〜4の何れか1項に記載の検査用粘着シートにおける前記粘着剤層上に、ダイシングリング、及び回路形成面とは反対側の面を貼り合わせ面として半導体ウェハを貼り合わせる工程と、
前記半導体ウェハを回路形成面側からダイシングし、少なくとも前記基材フィルムの一部を残した状態で半導体チップを形成する工程と、
ダイシング直後の半導体チップがそれぞれ固定された状態で、導通可能な検査ステージ上に前記検査用粘着シートを載置し、前記半導体チップにおける回路形成面に一方の接続端子を当接すると共に、前記粘着剤層、ダイシングリング又は導通検査ステージに他方の接続端子を当接して電気的接続を図ることにより、前記半導体チップの導通検査をする工程と、
前記半導体チップを前記検査用粘着シートからピックアップする工程とを有することを特徴とする半導体装置の製造方法。
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JP2007291252A JP5055097B2 (ja) | 2007-11-08 | 2007-11-08 | 検査用粘着シート |
CN200880001162XA CN101568610B (zh) | 2007-11-08 | 2008-10-09 | 检查用粘合片 |
US12/513,230 US8146438B2 (en) | 2007-11-08 | 2008-10-09 | Pressure-sensitive adhesive sheet for testing |
KR1020097007260A KR20100074082A (ko) | 2007-11-08 | 2008-10-09 | 검사용 점착 시트 |
EP08846263.5A EP2206757A4 (en) | 2007-11-08 | 2008-10-09 | ADHESIVE SHEET FOR INSPECTION |
PCT/JP2008/068338 WO2009060686A1 (ja) | 2007-11-08 | 2008-10-09 | 検査用粘着シート |
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