WO2009060686A1 - 検査用粘着シート - Google Patents
検査用粘着シート Download PDFInfo
- Publication number
- WO2009060686A1 WO2009060686A1 PCT/JP2008/068338 JP2008068338W WO2009060686A1 WO 2009060686 A1 WO2009060686 A1 WO 2009060686A1 JP 2008068338 W JP2008068338 W JP 2008068338W WO 2009060686 A1 WO2009060686 A1 WO 2009060686A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inspection
- semiconductor wafer
- adhesive sheet
- base film
- adhesive layer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/516—Oriented mono-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880001162XA CN101568610B (zh) | 2007-11-08 | 2008-10-09 | 检查用粘合片 |
EP08846263.5A EP2206757A4 (en) | 2007-11-08 | 2008-10-09 | ADHESIVE SHEET FOR INSPECTION |
US12/513,230 US8146438B2 (en) | 2007-11-08 | 2008-10-09 | Pressure-sensitive adhesive sheet for testing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-291252 | 2007-11-08 | ||
JP2007291252A JP5055097B2 (ja) | 2007-11-08 | 2007-11-08 | 検査用粘着シート |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009060686A1 true WO2009060686A1 (ja) | 2009-05-14 |
Family
ID=40625587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068338 WO2009060686A1 (ja) | 2007-11-08 | 2008-10-09 | 検査用粘着シート |
Country Status (6)
Country | Link |
---|---|
US (1) | US8146438B2 (ja) |
EP (1) | EP2206757A4 (ja) |
JP (1) | JP5055097B2 (ja) |
KR (1) | KR20100074082A (ja) |
CN (1) | CN101568610B (ja) |
WO (1) | WO2009060686A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011047782A (ja) * | 2009-08-27 | 2011-03-10 | Tokyo Electron Ltd | 半導体素子評価方法 |
JP2013173852A (ja) * | 2012-02-24 | 2013-09-05 | Denki Kagaku Kogyo Kk | 導電性粘着シート及び電子部品の製造方法 |
JPWO2012132520A1 (ja) * | 2011-03-31 | 2014-07-24 | リンテック株式会社 | 粘着シート |
TWI677555B (zh) * | 2014-08-28 | 2019-11-21 | 日商琳得科股份有限公司 | 導電性黏著薄片 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387631B (zh) * | 2004-05-18 | 2013-03-01 | Hitachi Chemical Co Ltd | 黏著片與使用此黏著片之半導體裝置以及其製造方法 |
US8048690B2 (en) * | 2007-11-08 | 2011-11-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same |
TWI430426B (zh) * | 2010-10-19 | 2014-03-11 | Univ Nat Chiao Tung | 使用共用傳導層傳送晶片間多重信號之系統 |
WO2012157615A1 (ja) * | 2011-05-19 | 2012-11-22 | 電気化学工業株式会社 | 粘着シートおよび電子部品の製造方法 |
JP5986452B2 (ja) * | 2011-08-10 | 2016-09-06 | バンドー化学株式会社 | 車両用床シート、車両の床構造体、車両の床構造体の施工方法 |
KR102427702B1 (ko) * | 2011-08-31 | 2022-08-03 | 애버리 데니슨 코포레이션 | 접착성 아크릴레이트-올레핀 코폴리머, 이것의 제조방법, 및 이것을 사용하는 조성물 |
US9221231B2 (en) | 2011-11-22 | 2015-12-29 | Samsung Display Co., Ltd. | Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same |
JP5607844B2 (ja) * | 2012-03-16 | 2014-10-15 | リンテック株式会社 | 導通検査用テープ及び該テープを用いた導通検査方法 |
KR102388869B1 (ko) * | 2014-08-28 | 2022-04-20 | 린텍 가부시키가이샤 | 도전성 점착 시트 |
CN104485294A (zh) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | 一种晶圆临时键合及分离方法 |
JP6429711B2 (ja) * | 2015-03-31 | 2018-11-28 | キヤノン株式会社 | 探触子、及びそれを用いた被検体情報取得装置 |
KR20170095655A (ko) * | 2016-02-15 | 2017-08-23 | (주)제이티 | 소자검사장치 및 그에 사용되는 소자가압툴 |
SG11201808374TA (en) * | 2016-03-30 | 2018-10-30 | Mitsui Chemicals Tohcello Inc | Method for manufacturing semiconductor device |
WO2018151139A1 (ja) * | 2017-02-17 | 2018-08-23 | 日立化成株式会社 | 接着剤フィルム |
KR102457667B1 (ko) * | 2017-02-17 | 2022-10-20 | 쇼와덴코머티리얼즈가부시끼가이샤 | 접착제 필름 |
CN108913057B (zh) * | 2017-03-27 | 2023-11-10 | 昆山雅森电子材料科技有限公司 | 一种多层异向型导电布胶及其制作方法 |
JP6506461B1 (ja) * | 2018-02-01 | 2019-04-24 | 積水化学工業株式会社 | 導電性粘着テープ |
US11604105B2 (en) * | 2018-12-05 | 2023-03-14 | 4Iiii Innovations Inc. | Adhesive strain sensing pods with improved protection |
JP7412082B2 (ja) * | 2019-02-06 | 2024-01-12 | 日東電工株式会社 | 粘着シートおよびその利用 |
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JPH1180682A (ja) * | 1997-09-11 | 1999-03-26 | Bridgestone Corp | 架橋型導電性粘着テープ |
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JPS6052039A (ja) * | 1983-08-31 | 1985-03-23 | Hitachi Chem Co Ltd | 半導体ウェハのチップ化方法 |
JPS6180834A (ja) * | 1984-09-27 | 1986-04-24 | Toshiba Corp | ウエハ保持シ−ト |
JPH0470937A (ja) | 1990-07-04 | 1992-03-05 | Matsushita Electric Ind Co Ltd | ファイル更新方式 |
DE19626081A1 (de) * | 1996-06-28 | 1998-01-02 | Siemens Ag | Halbleiter-Bauelement |
JP3226889B2 (ja) * | 1998-05-06 | 2001-11-05 | シンワ プロダクト カンパニー・リミテッド | 導電性粘着テープ |
US6344155B1 (en) | 1999-04-06 | 2002-02-05 | Tomoegawa Paper Co., Ltd. | Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof |
JP3535412B2 (ja) | 1999-04-06 | 2004-06-07 | 株式会社巴川製紙所 | 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。 |
JP4911839B2 (ja) | 2001-07-09 | 2012-04-04 | ソマール株式会社 | 難燃性に優れた導電性粘着剤組成物及びそれを用いた粘着加工品 |
JP2004251742A (ja) * | 2003-02-20 | 2004-09-09 | Denso Corp | センサ装置 |
JP2004281453A (ja) * | 2003-03-12 | 2004-10-07 | Tokyo Seimitsu Co Ltd | 半導体デバイス製造方法及びシステム |
JP2005263876A (ja) | 2004-03-16 | 2005-09-29 | Lintec Corp | 両面粘着シートおよび脆質部材の転写方法 |
US7270012B2 (en) * | 2004-10-01 | 2007-09-18 | Hitachi, Ltd. | Semiconductor device embedded with pressure sensor and manufacturing method thereof |
US7127948B2 (en) * | 2005-02-17 | 2006-10-31 | The Boeing Company | Piezoelectric sensor, sensor array, and associated method for measuring pressure |
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- 2007-11-08 JP JP2007291252A patent/JP5055097B2/ja not_active Expired - Fee Related
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- 2008-10-09 KR KR1020097007260A patent/KR20100074082A/ko not_active Application Discontinuation
- 2008-10-09 WO PCT/JP2008/068338 patent/WO2009060686A1/ja active Application Filing
- 2008-10-09 US US12/513,230 patent/US8146438B2/en not_active Expired - Fee Related
- 2008-10-09 EP EP08846263.5A patent/EP2206757A4/en not_active Withdrawn
- 2008-10-09 CN CN200880001162XA patent/CN101568610B/zh not_active Expired - Fee Related
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011047782A (ja) * | 2009-08-27 | 2011-03-10 | Tokyo Electron Ltd | 半導体素子評価方法 |
US8471585B2 (en) | 2009-08-27 | 2013-06-25 | Tokyo Electron Limited | Method for evaluating semiconductor device |
JPWO2012132520A1 (ja) * | 2011-03-31 | 2014-07-24 | リンテック株式会社 | 粘着シート |
JP5857037B2 (ja) * | 2011-03-31 | 2016-02-10 | リンテック株式会社 | 粘着シート |
JP2013173852A (ja) * | 2012-02-24 | 2013-09-05 | Denki Kagaku Kogyo Kk | 導電性粘着シート及び電子部品の製造方法 |
TWI677555B (zh) * | 2014-08-28 | 2019-11-21 | 日商琳得科股份有限公司 | 導電性黏著薄片 |
Also Published As
Publication number | Publication date |
---|---|
EP2206757A4 (en) | 2013-10-16 |
US8146438B2 (en) | 2012-04-03 |
JP2009114394A (ja) | 2009-05-28 |
EP2206757A1 (en) | 2010-07-14 |
US20100313667A1 (en) | 2010-12-16 |
CN101568610B (zh) | 2013-03-20 |
KR20100074082A (ko) | 2010-07-01 |
CN101568610A (zh) | 2009-10-28 |
JP5055097B2 (ja) | 2012-10-24 |
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