JP2009517498A - 異方性の導電性接着剤組成物 - Google Patents
異方性の導電性接着剤組成物 Download PDFInfo
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2463/00—Presence of epoxy resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
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Abstract
Description
本出願は、米国特許仮出願番号60/739,569(2005年11月23日出願)の利益を請求し、この開示内容全体が本明細書に参考として組み込まれる。
本発明は、異方性導電接着剤および接着剤組成物に関する。
電気抵抗
ミネソタ州ミネアポリスにあるフレキシブルサーキットテクノロジー社(Flexible Circuit Technologies Incorporated)から得た、銅の上にニッケル、ニッケルの上に金を有するトレースを101個有する幅28mm、長さ22mm、厚み25μmのポリイミドフレキシブル回路を80℃に設定した乾燥オーブンから出した。これらのトレースは、幅100μm、空間100μmであり、高さは18μmを超えない。約30mm長の試験対象のフィルム組成物片を、フィルムの両側にライナーを備えるフィルムサンプルから切り取った。ライナーの1つを外し、ローラーでローリングして平滑に塗布し、中に含まれる空気を全て排除することによってフィルムの露出した側面をフレキシブル回路にくっつけた。過剰のサンプルフィルムをフレキシブル回路の縁にそろえて切断し、フィルム/フレキシブル回路積層体を作製した。残ったライナーは、フレキシブル回路に対するフィルムの結合を妨害しないように注意深く取り除いた。
スイッチングマトリックス=ケイトレーインスツルメンツ社(Keithley Instruments, Inc.)から入手可能なインテグラシリーズスイッチ/コントロールモジュールモデル7001(Integra Series Switch/Control Module Model 7001)
プローブステーション=ミネソタ州メープルグローブにあるサーキットチェック社(Circuit Check Inc)から入手可能なサーキットチェックPCB−PET(Circuit Check PCB−PET)
PCソフトウェア=LabVIEW
試験電流=100ミリアンペア(mA)
センスコンプライアンス(Sense compliance)(ボルト)=2,000
測定可能な最大抵抗=20,000Ω
結合したサンプルをプローブステーションに置き、各サンプルについて15回測定した。
「電気抵抗」試験法について上述のように、結合したサンプルを調製した。
「電気抵抗」試験法について上述のように、結合したサンプルを調製した。各サンプルの結合領域をオリンパス立体顕微鏡モデルSZX9(Olympus stereomicroscope model SZX9)を用いて50倍拡大で調べた。空隙および気泡を計測し、各サンプルを1〜5にランク分けした。1=ほぼすべての結合トレースに大きな空隙あり〜5=結合トレースのいずれにも空隙または気泡が存在しない。
以下の表1に示す材料を用いて以下の実施例を行なった。
密閉容器で、インケムレッツPKHJ(INCHEMREZ PKHJ)樹脂をメチルエチルケトン(MEK)溶媒に溶解した。開放容器で、コア−シェルポリマーをイーポン828(EPON 828)樹脂に分散させた。開放容器で、これらの2つの溶液を混合し、均一な分散物になるまで混合した(それぞれの量はサンプルごとに表2に記載)。最後に、キュレゾール2MZアジン(CUREZOL 2 MZ Azine)および金コーティングされたニッケル粒子(7GNM8−Ni)を添加し、コーティング用の均一な分散物になるまで混合を続けた。
Claims (12)
- 多官能グリシジルエーテルエポキシ樹脂と;
フェノキシ樹脂と;
コア相ポリマーおよびシェル相ポリマーを含み、シェル相ポリマーがカルボン酸官能基を有する非ゴム状ポリマーを含む、コア−シェルポリマーと;
所望により、熱可塑性樹脂と;
熱によって活性化する硬化剤と;
電気導電性粒子との混合物を含む、接着剤組成物。 - 前記熱によって活性化する硬化剤が室温では固体である、請求項1に記載の接着剤組成物。
- 前記熱によって活性化する硬化剤が120℃以上の温度に加熱すると活性化する、請求項2に記載の接着剤組成物。
- 前記熱によって活性化する硬化剤が置換イミダゾールである、請求項2に記載の接着剤組成物。
- 前記熱によって活性化する硬化剤が、2−[β−[2’−メチルイミダゾリル−(1’)}]−エチル−4.6−ジアミノ−s−トリアジン;2,4−ジアミノ−6−6[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌレート付加物;および4,5−ジフェニルイミダゾールまたはこれらの組み合わせである、請求項1に記載の接着剤組成物。
- 前記コア−シェルポリマーが、組成物中に約15pbw〜約30pbwの濃度で存在する、請求項1に記載の接着剤組成物。
- 前記コア−シェルポリマーが、組成物中に約20pbw〜約30pbwの濃度で存在する、請求項1に記載の接着剤組成物。
- 請求項1に記載の接着剤組成物を含む硬化性接着フィルム。
- 前記接着フィルムの厚みが約5〜約100μmである、請求項8に記載の硬化性接着フィルム。
- ライナー上に請求項8に記載の硬化性接着フィルムを備えるテープ。
- ライナー上に請求項8に記載の硬化性接着フィルムを備えるシート。
- フレキシブルプリント回路と、このフレキシブルプリント回路に接着した請求項1に記載の接着剤組成物とを備える、フレキシブル回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73956905P | 2005-11-23 | 2005-11-23 | |
PCT/US2006/043198 WO2007061613A1 (en) | 2005-11-23 | 2006-11-07 | Anisotropic conductive adhesive compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009517498A true JP2009517498A (ja) | 2009-04-30 |
JP2009517498A5 JP2009517498A5 (ja) | 2010-01-07 |
Family
ID=38067528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008542330A Pending JP2009517498A (ja) | 2005-11-23 | 2006-11-07 | 異方性の導電性接着剤組成物 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20070116961A1 (ja) |
EP (1) | EP1951836B1 (ja) |
JP (1) | JP2009517498A (ja) |
KR (1) | KR20080070680A (ja) |
CN (1) | CN101313045A (ja) |
AT (1) | ATE524533T1 (ja) |
TW (1) | TW200722497A (ja) |
WO (1) | WO2007061613A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
JP2013227441A (ja) * | 2012-04-26 | 2013-11-07 | Toagosei Co Ltd | 接着剤組成物並びにこれを用いたカバーレイフィルム及び接着シート |
US10524364B2 (en) | 2009-07-08 | 2019-12-31 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
WO2022270154A1 (ja) * | 2021-06-21 | 2022-12-29 | シーカ・ハマタイト株式会社 | 電磁鋼板積層用接着剤組成物 |
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CN102942883B (zh) * | 2006-04-26 | 2015-08-26 | 日立化成株式会社 | 粘接带及使用其的太阳能电池模块 |
ATE555177T1 (de) * | 2006-07-24 | 2012-05-15 | 3M Innovative Properties Co | Elektrisch leitende haftklebstoffe |
ES2691528T3 (es) * | 2006-07-31 | 2018-11-27 | Henkel Ag & Co. Kgaa | Composiciones adhesivas basadas en resina epoxi curable |
EP2058868A4 (en) * | 2006-08-29 | 2010-01-27 | Hitachi Chemical Co Ltd | CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE |
CA2665551A1 (en) * | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
JP2008135654A (ja) * | 2006-11-29 | 2008-06-12 | Sanyo Electric Co Ltd | 太陽電池モジュール |
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JP2009096851A (ja) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 |
US20110003946A1 (en) * | 2008-01-18 | 2011-01-06 | Klaus-Volker Schuett | Curable reaction resin system |
KR100934549B1 (ko) * | 2008-01-23 | 2009-12-29 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
US20120080418A1 (en) * | 2008-05-15 | 2012-04-05 | Atsunobu Sakamoto | Impulse sealer including ceramic-covered heater |
CN101508878B (zh) * | 2009-03-30 | 2012-08-15 | 汕头市骏码凯撒有限公司 | 一种邦定胶及其制备方法 |
GB0916205D0 (en) | 2009-09-15 | 2009-10-28 | Zephyros Inc | Improvements in or relating to cavity filling |
KR101056435B1 (ko) * | 2009-10-05 | 2011-08-11 | 삼성모바일디스플레이주식회사 | 이방성 도전 필름 및 이를 포함하는 표시 장치 |
JP5944102B2 (ja) * | 2009-11-17 | 2016-07-05 | 日立化成株式会社 | 回路接続材料、それを用いた接続構造体 |
KR20130020772A (ko) | 2010-03-04 | 2013-02-28 | 제피로스, 인크. | 구조적 복합 라미네이트 |
US20130146816A1 (en) * | 2010-04-19 | 2013-06-13 | Trillion Science Inc. | One part epoxy resin including acrylic block copolymer |
JP5761639B2 (ja) * | 2010-09-30 | 2015-08-12 | 日本発條株式会社 | 接着剤樹脂組成物、その硬化物、及び接着剤フィルム |
KR101355854B1 (ko) * | 2011-12-16 | 2014-01-29 | 제일모직주식회사 | 이방성 도전 필름 |
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Also Published As
Publication number | Publication date |
---|---|
ATE524533T1 (de) | 2011-09-15 |
EP1951836B1 (en) | 2011-09-14 |
EP1951836A4 (en) | 2010-06-09 |
TW200722497A (en) | 2007-06-16 |
CN101313045A (zh) | 2008-11-26 |
US20070116961A1 (en) | 2007-05-24 |
WO2007061613A1 (en) | 2007-05-31 |
EP1951836A1 (en) | 2008-08-06 |
KR20080070680A (ko) | 2008-07-30 |
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