CN102549097A - 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 - Google Patents
热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 Download PDFInfo
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- CN102549097A CN102549097A CN2010800452475A CN201080045247A CN102549097A CN 102549097 A CN102549097 A CN 102549097A CN 2010800452475 A CN2010800452475 A CN 2010800452475A CN 201080045247 A CN201080045247 A CN 201080045247A CN 102549097 A CN102549097 A CN 102549097A
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- Prior art keywords
- thermoset
- epoxy resin
- bonding composition
- acrylic copolymer
- thermoset adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/24—Derivatives of hydrazine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510763270.2A CN105331308B (zh) | 2009-10-07 | 2010-07-26 | 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-233278 | 2009-10-07 | ||
JP2009233278A JP5728804B2 (ja) | 2009-10-07 | 2009-10-07 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
PCT/JP2010/062492 WO2011043119A1 (ja) | 2009-10-07 | 2010-07-26 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510763270.2A Division CN105331308B (zh) | 2009-10-07 | 2010-07-26 | 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102549097A true CN102549097A (zh) | 2012-07-04 |
CN102549097B CN102549097B (zh) | 2015-12-02 |
Family
ID=43856599
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080045247.5A Active CN102549097B (zh) | 2009-10-07 | 2010-07-26 | 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 |
CN201510763270.2A Active CN105331308B (zh) | 2009-10-07 | 2010-07-26 | 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510763270.2A Active CN105331308B (zh) | 2009-10-07 | 2010-07-26 | 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5728804B2 (zh) |
KR (1) | KR101702694B1 (zh) |
CN (2) | CN102549097B (zh) |
HK (2) | HK1169135A1 (zh) |
TW (1) | TWI565772B (zh) |
WO (1) | WO2011043119A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102533170A (zh) * | 2010-12-27 | 2012-07-04 | 第一毛织株式会社 | 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜 |
CN105102570A (zh) * | 2013-06-19 | 2015-11-25 | 大日本印刷株式会社 | 粘合剂组合物和使用其的粘合膜 |
CN106105404A (zh) * | 2014-03-18 | 2016-11-09 | 迪睿合株式会社 | 可挠性安装模块体的制造方法 |
CN106867435A (zh) * | 2015-12-11 | 2017-06-20 | 华烁科技股份有限公司 | 一种挠性印制电路聚酰亚胺补强板用改性丙烯酸酯胶粘剂及其应用 |
CN107109162A (zh) * | 2014-11-12 | 2017-08-29 | 迪睿合株式会社 | 热固化性粘合组合物和热固化性粘合片 |
CN107109161A (zh) * | 2014-11-12 | 2017-08-29 | 迪睿合株式会社 | 热固化性粘合组合物 |
CN107408540A (zh) * | 2015-03-31 | 2017-11-28 | 东丽株式会社 | 电子部件用树脂片材、带有保护膜的电子部件用树脂片材以及半导体器件及其制造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5770995B2 (ja) * | 2010-12-01 | 2015-08-26 | デクセリアルズ株式会社 | 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
JP5946688B2 (ja) * | 2011-04-26 | 2016-07-06 | 積水化学工業株式会社 | 後硬化テープ及び接合部材の接合方法 |
JP6239223B2 (ja) * | 2011-11-18 | 2017-11-29 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
CN102585745A (zh) * | 2012-02-21 | 2012-07-18 | 绵阳艾萨斯电子材料有限公司 | 封框胶及其制备方法与应用 |
JP5978782B2 (ja) * | 2012-06-06 | 2016-08-24 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート及び補強フレキシブルプリント配線板 |
JP5842736B2 (ja) * | 2012-06-06 | 2016-01-13 | デクセリアルズ株式会社 | 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
CN103509509A (zh) * | 2013-01-16 | 2014-01-15 | 上海都为电子有限公司 | 硅块切割用室温快速固化单组份厌氧胶 |
JP6517032B2 (ja) * | 2015-02-06 | 2019-05-22 | デクセリアルズ株式会社 | 熱硬化性接着組成物、及び熱硬化性接着シート |
CN107409470B (zh) | 2015-03-26 | 2019-07-30 | 迪睿合株式会社 | 挠性安装模块体的制造方法 |
EP3098058B1 (en) * | 2015-05-25 | 2019-10-30 | Grupo Antolin-Ingenieria, S.A. | Process for manufacturing vehicle headliners |
JP6721325B2 (ja) * | 2015-12-14 | 2020-07-15 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
JP7074033B2 (ja) * | 2018-11-22 | 2022-05-24 | 三菱ケミカル株式会社 | 粘接着剤層、粘接着シート及び積層体 |
JP7447565B2 (ja) * | 2020-03-10 | 2024-03-12 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着剤、粘接着シート及び積層体 |
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JPH01113476A (ja) * | 1987-10-28 | 1989-05-02 | Nissan Motor Co Ltd | エポキシ系接着剤組成物 |
WO1997043352A1 (en) * | 1996-05-16 | 1997-11-20 | Minnesota Mining And Manufacturing Company | Adhesive compositions and methods of use |
JPH09316171A (ja) * | 1996-03-29 | 1997-12-09 | Somar Corp | 一液性エポキシ樹脂組成物 |
US20030145949A1 (en) * | 1999-06-18 | 2003-08-07 | Yuko Tanaka | Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
WO2009044732A1 (ja) * | 2007-10-05 | 2009-04-09 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
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JPH0793497B2 (ja) | 1991-06-19 | 1995-10-09 | 信越化学工業株式会社 | ボンディングシート |
JP3292437B2 (ja) * | 1995-11-16 | 2002-06-17 | 松下電器産業株式会社 | 導通接着方法 |
JP3543613B2 (ja) * | 1998-04-10 | 2004-07-14 | 株式会社スリーボンド | 一液加熱硬化型水性エポキシ樹脂組成物 |
JP4556472B2 (ja) * | 1999-06-18 | 2010-10-06 | 日立化成工業株式会社 | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
JP2005089629A (ja) * | 2003-09-18 | 2005-04-07 | Ricoh Co Ltd | 導電性接着剤 |
JP2005281553A (ja) * | 2004-03-30 | 2005-10-13 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
JP4733444B2 (ja) | 2005-06-30 | 2011-07-27 | 日東電工株式会社 | 接着組成物及び接着シート |
KR101031151B1 (ko) * | 2006-10-06 | 2011-04-27 | 히다치 가세고교 가부시끼가이샤 | 전자 부품 밀봉용 액상 수지 조성물 및 이것을 이용한 전자 부품 장치 |
JP2008308682A (ja) * | 2007-05-15 | 2008-12-25 | Hitachi Chem Co Ltd | 回路接続材料 |
JP4631979B2 (ja) * | 2009-02-16 | 2011-02-16 | 日立化成工業株式会社 | 回路部材接続用接着剤並びに回路板及びその製造方法 |
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2009
- 2009-10-07 JP JP2009233278A patent/JP5728804B2/ja active Active
-
2010
- 2010-07-26 CN CN201080045247.5A patent/CN102549097B/zh active Active
- 2010-07-26 WO PCT/JP2010/062492 patent/WO2011043119A1/ja active Application Filing
- 2010-07-26 KR KR1020127009008A patent/KR101702694B1/ko active IP Right Grant
- 2010-07-26 CN CN201510763270.2A patent/CN105331308B/zh active Active
- 2010-08-12 TW TW099126891A patent/TWI565772B/zh active
-
2012
- 2012-10-10 HK HK12109993.4A patent/HK1169135A1/zh unknown
-
2016
- 2016-08-12 HK HK16109624.7A patent/HK1221481A1/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01113476A (ja) * | 1987-10-28 | 1989-05-02 | Nissan Motor Co Ltd | エポキシ系接着剤組成物 |
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CN102549097B (zh) | 2015-12-02 |
WO2011043119A1 (ja) | 2011-04-14 |
KR101702694B1 (ko) | 2017-02-06 |
CN105331308B (zh) | 2017-11-28 |
CN105331308A (zh) | 2016-02-17 |
TW201113340A (en) | 2011-04-16 |
TWI565772B (zh) | 2017-01-11 |
HK1221481A1 (zh) | 2017-06-02 |
HK1169135A1 (zh) | 2013-01-18 |
KR20120092594A (ko) | 2012-08-21 |
JP5728804B2 (ja) | 2015-06-03 |
JP2011079959A (ja) | 2011-04-21 |
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