KR101702694B1 - 열경화성 접착 조성물, 열경화성 접착 시트, 그 제조 방법 및 보강 플렉시블 인쇄 배선판 - Google Patents
열경화성 접착 조성물, 열경화성 접착 시트, 그 제조 방법 및 보강 플렉시블 인쇄 배선판 Download PDFInfo
- Publication number
- KR101702694B1 KR101702694B1 KR1020127009008A KR20127009008A KR101702694B1 KR 101702694 B1 KR101702694 B1 KR 101702694B1 KR 1020127009008 A KR1020127009008 A KR 1020127009008A KR 20127009008 A KR20127009008 A KR 20127009008A KR 101702694 B1 KR101702694 B1 KR 101702694B1
- Authority
- KR
- South Korea
- Prior art keywords
- thermosetting adhesive
- epoxy resin
- mass
- adhesive composition
- adhesive layer
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4035—Hydrazines; Hydrazides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/24—Derivatives of hydrazine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009233278A JP5728804B2 (ja) | 2009-10-07 | 2009-10-07 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
JPJP-P-2009-233278 | 2009-10-07 | ||
PCT/JP2010/062492 WO2011043119A1 (ja) | 2009-10-07 | 2010-07-26 | 熱硬化性接着組成物、熱硬化性接着シート、その製造方法及び補強フレキシブルプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20120092594A KR20120092594A (ko) | 2012-08-21 |
KR101702694B1 true KR101702694B1 (ko) | 2017-02-06 |
Family
ID=43856599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127009008A KR101702694B1 (ko) | 2009-10-07 | 2010-07-26 | 열경화성 접착 조성물, 열경화성 접착 시트, 그 제조 방법 및 보강 플렉시블 인쇄 배선판 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5728804B2 (zh) |
KR (1) | KR101702694B1 (zh) |
CN (2) | CN102549097B (zh) |
HK (2) | HK1169135A1 (zh) |
TW (1) | TWI565772B (zh) |
WO (1) | WO2011043119A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5770995B2 (ja) | 2010-12-01 | 2015-08-26 | デクセリアルズ株式会社 | 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
KR101374365B1 (ko) * | 2010-12-27 | 2014-03-17 | 제일모직주식회사 | 반도체용 접착 조성물 및 이를 포함하는 접착 필름 |
JP5946688B2 (ja) * | 2011-04-26 | 2016-07-06 | 積水化学工業株式会社 | 後硬化テープ及び接合部材の接合方法 |
JP6239223B2 (ja) * | 2011-11-18 | 2017-11-29 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
CN102585745A (zh) * | 2012-02-21 | 2012-07-18 | 绵阳艾萨斯电子材料有限公司 | 封框胶及其制备方法与应用 |
JP5842736B2 (ja) * | 2012-06-06 | 2016-01-13 | デクセリアルズ株式会社 | 熱硬化性樹脂組成物、熱硬化性接着シート及び熱硬化性接着シートの製造方法 |
JP5978782B2 (ja) * | 2012-06-06 | 2016-08-24 | デクセリアルズ株式会社 | 熱硬化性接着組成物、熱硬化性接着シート及び補強フレキシブルプリント配線板 |
CN103509509A (zh) * | 2013-01-16 | 2014-01-15 | 上海都为电子有限公司 | 硅块切割用室温快速固化单组份厌氧胶 |
JP6429103B2 (ja) * | 2013-06-19 | 2018-11-28 | 大日本印刷株式会社 | 粘着剤組成物およびそれを用いた粘着フィルム |
JP6243764B2 (ja) | 2014-03-18 | 2017-12-06 | デクセリアルズ株式会社 | 可撓性実装モジュール体の製造方法 |
CN107109161B (zh) * | 2014-11-12 | 2019-07-02 | 迪睿合株式会社 | 热固化性粘合组合物 |
JP6542526B2 (ja) * | 2014-11-12 | 2019-07-10 | デクセリアルズ株式会社 | 熱硬化性接着組成物、及び熱硬化性接着シート |
JP6517032B2 (ja) * | 2015-02-06 | 2019-05-22 | デクセリアルズ株式会社 | 熱硬化性接着組成物、及び熱硬化性接着シート |
WO2016153069A1 (ja) | 2015-03-26 | 2016-09-29 | デクセリアルズ株式会社 | 可撓性実装モジュール体の製造方法 |
WO2016158760A1 (ja) * | 2015-03-31 | 2016-10-06 | 東レ株式会社 | 電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法 |
ES2754201T3 (es) | 2015-05-25 | 2020-04-16 | Antolin Grupo Ing Sa | Proceso de fabricación de guarnecidos de techo para vehículos |
CN106867435B (zh) * | 2015-12-11 | 2019-03-08 | 华烁科技股份有限公司 | 一种挠性印制电路聚酰亚胺补强板用改性丙烯酸酯胶粘剂及其应用 |
JP6721325B2 (ja) * | 2015-12-14 | 2020-07-15 | デクセリアルズ株式会社 | 熱硬化性接着シート、及び半導体装置の製造方法 |
JP7074033B2 (ja) * | 2018-11-22 | 2022-05-24 | 三菱ケミカル株式会社 | 粘接着剤層、粘接着シート及び積層体 |
JP7447565B2 (ja) * | 2020-03-10 | 2024-03-12 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着剤、粘接着シート及び積層体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004238634A (ja) * | 1999-06-18 | 2004-08-26 | Hitachi Chem Co Ltd | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01113476A (ja) * | 1987-10-28 | 1989-05-02 | Nissan Motor Co Ltd | エポキシ系接着剤組成物 |
JPH0793497B2 (ja) | 1991-06-19 | 1995-10-09 | 信越化学工業株式会社 | ボンディングシート |
JP3292437B2 (ja) * | 1995-11-16 | 2002-06-17 | 松下電器産業株式会社 | 導通接着方法 |
JP3807808B2 (ja) * | 1996-03-29 | 2006-08-09 | ソマール株式会社 | コイル固着用一液性エポキシ樹脂組成物 |
CA2254883A1 (en) * | 1996-05-16 | 1997-11-20 | Christopher A. Haak | Adhesive compositions and methods of use |
JP3543613B2 (ja) * | 1998-04-10 | 2004-07-14 | 株式会社スリーボンド | 一液加熱硬化型水性エポキシ樹脂組成物 |
WO2000078887A1 (fr) * | 1999-06-18 | 2000-12-28 | Hitachi Chemical Company, Ltd. | Adhesif, element adhesif, substrat de circuit pour montage de semi-conducteur presentant un element adhesif, et dispositif a semi-conducteur contenant ce dernier |
JP2005089629A (ja) * | 2003-09-18 | 2005-04-07 | Ricoh Co Ltd | 導電性接着剤 |
JP2005281553A (ja) * | 2004-03-30 | 2005-10-13 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
JP4733444B2 (ja) | 2005-06-30 | 2011-07-27 | 日東電工株式会社 | 接着組成物及び接着シート |
US7982322B2 (en) * | 2006-10-06 | 2011-07-19 | Hitachi Chemical Co., Ltd. | Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same |
JP2008308682A (ja) * | 2007-05-15 | 2008-12-25 | Hitachi Chem Co Ltd | 回路接続材料 |
WO2009044732A1 (ja) * | 2007-10-05 | 2009-04-09 | Hitachi Chemical Company, Ltd. | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP4631979B2 (ja) * | 2009-02-16 | 2011-02-16 | 日立化成工業株式会社 | 回路部材接続用接着剤並びに回路板及びその製造方法 |
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2009
- 2009-10-07 JP JP2009233278A patent/JP5728804B2/ja active Active
-
2010
- 2010-07-26 CN CN201080045247.5A patent/CN102549097B/zh active Active
- 2010-07-26 CN CN201510763270.2A patent/CN105331308B/zh active Active
- 2010-07-26 KR KR1020127009008A patent/KR101702694B1/ko active IP Right Grant
- 2010-07-26 WO PCT/JP2010/062492 patent/WO2011043119A1/ja active Application Filing
- 2010-08-12 TW TW099126891A patent/TWI565772B/zh active
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2012
- 2012-10-10 HK HK12109993.4A patent/HK1169135A1/zh unknown
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2016
- 2016-08-12 HK HK16109624.7A patent/HK1221481A1/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004238634A (ja) * | 1999-06-18 | 2004-08-26 | Hitachi Chem Co Ltd | 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
CN105331308A (zh) | 2016-02-17 |
CN102549097B (zh) | 2015-12-02 |
HK1221481A1 (zh) | 2017-06-02 |
CN102549097A (zh) | 2012-07-04 |
WO2011043119A1 (ja) | 2011-04-14 |
JP2011079959A (ja) | 2011-04-21 |
TW201113340A (en) | 2011-04-16 |
KR20120092594A (ko) | 2012-08-21 |
CN105331308B (zh) | 2017-11-28 |
TWI565772B (zh) | 2017-01-11 |
JP5728804B2 (ja) | 2015-06-03 |
HK1169135A1 (zh) | 2013-01-18 |
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