WO2016158760A1 - 電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法 - Google Patents
電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法 Download PDFInfo
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- WO2016158760A1 WO2016158760A1 PCT/JP2016/059641 JP2016059641W WO2016158760A1 WO 2016158760 A1 WO2016158760 A1 WO 2016158760A1 JP 2016059641 W JP2016059641 W JP 2016059641W WO 2016158760 A1 WO2016158760 A1 WO 2016158760A1
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- 239000011342 resin composition Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- An object of the present invention is to provide a resin sheet for electronic parts that improves the hollow maintainability by improving flexibility and film strength, and further has a low water vapor permeability.
- the (a) acrylic copolymer in the present invention has functions such as flexibility of the resin sheet, relaxation of thermal stress, and improvement of insulation due to low water absorption. Further, by containing 30 mol%, preferably 35 mol% or more of acrylonitrile units in the constituent monomer units, the water vapor permeability of the resin sheet for electronic parts can be effectively reduced without impairing the flexibility of the resin sheet for electronic parts. In addition, the insulation can be improved.
- the acrylonitrile unit is a monomer unit having hydrophobicity. As the acrylonitrile unit in the polymer increases, the hydrophobicity of the polymer increases and the water vapor permeability can be suppressed.
- the acrylonitrile unit means a structural unit derived from acrylonitrile in a raw material monomer when a monomer is polymerized to obtain an acrylic copolymer.
- the structural unit other than the acrylonitrile unit refers to a structural unit derived from a monomer other than acrylonitrile in the raw material monomer.
- a curing agent may be used in combination with (b) the thermosetting resin.
- the curing agent preferably used in the present invention is not particularly limited as long as it is cured by reacting with an epoxy resin. Specific examples thereof include phenol novolac resins, cresol novolac resins, various novolak resins synthesized from bisphenol A and resorcin, acid anhydrides such as maleic anhydride and pyromellitic anhydride, and aromatic amines such as diaminodiphenyl sulfone. Is mentioned.
- these curing agents those that are preferably used are phenol novolac resin, cresol novolac resin, bisphenol A, and diaminodiphenyl sulfone from the viewpoint of heat resistance and moisture resistance.
- the content of the (d) amino group-containing silane coupling agent is (c) the minimum covering area (m 2 / g) of the silane coupling agent used for the specific surface area of the inorganic filler.
- the ratio is preferably 0.4 to 3.0.
- the lower limit is more preferably 0.8 or more, and the upper limit is more preferably 2.0 or less.
- the resin sheet for electronic parts of the present invention may further contain various additives.
- flame retardants such as halogen compounds and phosphorus compounds, carbon black, olefin copolymers, various elastomers such as modified nitrile rubber, modified butadiene rubber and modified polybutadiene rubber, filler surface treatment agents such as titanate coupling agents, hydro Examples include ion scavengers such as talcite.
- ⁇ Acrylic copolymer 1> Under a nitrogen atmosphere in a reactor equipped with a mixer and a cooler, 106 g (2.00 mol) of acrylonitrile (manufactured by Wako Pure Chemical Industries, Ltd., special grade), 231 g (1. 80 mol), 28 g (0.20 mol) of glycidyl methacrylate (manufactured by Wako Pure Chemical Industries, Ltd.), 2900 g of methyl ethyl ketone (manufactured by Wako Pure Chemical Industries, Ltd., first grade) as a solvent, and heated to 85 ° C. under atmospheric pressure (1013 hPa).
- the gas remaining in the hollow hole expands during heating at 150 ° C., and spreads the resin sheet for electronic parts surrounding the hollow part. That is, it is possible to measure how much the resin sheet for electronic parts is deformed by gas expansion during heating by measuring the increase in diameter of the hollow hole after heating. It can be said that the smaller the increase in diameter, the higher the initial shape is maintained and the higher the maintenance performance of the hollow structure.
- the laminate is the same as the laminate (electronic component resin sheet thickness 50 ⁇ m) except that the thickness after drying is 100 ⁇ m when the adhesive solution is applied. Was made.
- Examples 2 to 11 and Comparative Examples 1 to 5 Except for changing the type and amount of each composition as described in Tables 1 and 2, in the same manner as in Example 1, a 38 ⁇ m thick polyethylene terephthalate film with a silicone release agent (PET38 manufactured by Lintec Corporation), electronic component A laminated body (resin sheet thickness for electronic parts 50 ⁇ m) and a laminated body (resin sheet thickness for electronic parts 100 ⁇ m) in which resin sheets and protective films (“Film Binner” GT manufactured by Fujimori Kogyo Co., Ltd.) are laminated in this order are prepared. did.
- PET38 polyethylene terephthalate film with a silicone release agent
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
また、本発明の電子部品用樹脂シートは、電子部品において中空構造を形成する場合に、好適に用いることができる。本発明の電子部品用樹脂シートは、硬化前の状態における可撓性、膜強度が優れている。そのため本発明の電子部品用樹脂シートを、中空構造を有する電子部品の貼り合せや保護に用いた場合、中空部分に残存した気体が熱硬化時に膨張したとしても、形状の変化が少ないという効果を有する。
混合機及び冷却器を備えた反応器に窒素雰囲気下にて、アクリロニトリル(和光純薬社製、特級)106g(2.00モル)、ブチルアクリレート(和光純薬社製、特級)231g(1.80モル)、グリシジルメタクリレート(和光純薬社製、特級)28g(0.20モル)、溶媒としてメチルエチルケトン(和光純薬社製、一級)を2900g入れ、大気圧(1013hPa)下、85℃に加熱し、さらに連鎖移動剤として2―エチルヘキシルメルカプトアセテート(和光純薬社製)を0.001g、重合開始剤としてアゾビスイソブチロニトリル(和光純薬社製、V-60)を0.002g加え、重量平均分子量が70万となるまで重合した。重量平均分子量は、GPC(ゲルパーミエーションクロマトグラフィー)法(装置:東ソー社製GELPERMEATION CHROMATOGRAPH、カラム:東ソー社製TSK-GEL GMHXL7.8×300mm)により測定し、ポリスチレン換算で算出した。
混合機及び冷却器を備えた反応器に窒素雰囲気下にて、アクリロニトリル(和光純薬社製、特級)106g(2.00モル)、ブチルアクリレート(和光純薬社製、特級)505g(3.94モル)、グリシジルメタクリレート(和光純薬社製、特級)44g(0.31モル)、溶媒としてメチルエチルケトン(和光純薬社製、一級)を6600g入れ、大気圧(1013hPa)下、85℃に加熱し、さらに連鎖移動剤として2―エチルヘキシルメルカプトアセテート(和光純薬社製)を0.001g、重合開始剤としてアゾビスイソブチロニトリル(和光純薬社製、V-60)を0.002g加え、重量平均分子量が86万となるまで重合した。重量平均分子量の測定方法は上記アクリル系共重合体1と同様の方法で行った。
混合機及び冷却器を備えた反応器に窒素雰囲気下にて、エチルアクリレート(和光純薬社製、特級)200g(2.00モル)、ブチルアクリレート(和光純薬社製、特級)118g(0.920モル)、グリシジルメタクリレート(和光純薬社製、特級)22g(0.155モル)、溶媒としてメチルエチルケトン(和光純薬社製、一級)を3000g入れ、大気圧(1013hPa)下、85℃に加熱し、さらに連鎖移動剤として2―エチルヘキシルメルカプトアセテート(和光純薬社製)を0.001g、重合開始剤としてアゾビスイソブチロニトリル(和光純薬社製、V-60)を0.001g加え、重量平均分子量が120万となるまで重合した。重量平均分子量の測定方法は上記アクリル系共重合体1と同様の方法で行った。
ビスフェノールA型エポキシ樹脂(jER-828、エポキシ当量:190、三菱化学株式会社製、常温で液状、25℃での粘度:14Pa・s)。
ノボラックフェノール(H-1、明和化成株式会社製)。
2-ヘプタデシルイミダゾール(C17Z、四国化成株式会社製)。
溶融球状シリカ(FB-5D、平均粒径5.0μm、電気化学工業株式会社製)
溶融球状シリカ(SO-C2、平均粒径0.5μm、株式会社アドマテックス製)。
N-フェニル-3-アミノプロピルトリメトキシシラン(KBM-573、信越化学工業株式会社製)
N-2-(アミノエチル)-3-アミノプロピルメチルジメトキシシラン(KBM-602、信越化学工業株式会社製)
ビニルトリス(2-メトキシエトキシ)シラン(V0048、東京化成工業株式会社製)。
各実施例・比較例で得られた積層体(電子部品用樹脂シート厚み50μm)を直径が3インチのコア、直径が6インチのコアに巻き取らせて、シート化膜評価を行った。評価基準は下記のとおりである。なお巻き取りの際に、樹脂シート中に1mm以上のピンホール状の穴が開いた場合は、巻き取れなかったものとして評価した。
◎:直径が3インチのコアにも直径が6インチのコアにもロール状に巻き取れたもの。
○:直径が3インチのコアにはロール状に巻き取れなかったが、直径が6インチのコアにロール状に巻き取れたもの。
×:直径が3インチのコアにも直径が6インチのコアにもロール状に巻き取れなかったもの。
各実施例・比較例で得られた積層体(電子部品用樹脂シート厚み100μm)のシリコーン離型剤付き厚さ38μmのポリエチレンテレフタレートフィルム(リンテック株式会社製PET38)および保護フィルム(藤森工業(株)製“フィルムバイナ”GT)を剥がし、170℃で2時間加熱硬化し、得られた電子部品用樹脂シートの硬化物についてJIS Z 0208(カップ法)の規定に従って、水蒸気透過度測定を行った。測定条件は40℃/90%RH、96時間とした。
各実施例・比較例で得られた積層体(電子部品用樹脂シート厚み50μm)を20mm角に切り出し、中央に5mmの丸穴を金型で打ち抜いた。この穴の空いた積層体(電子部品用樹脂シート厚み50μm)から、シリコーン離型剤付き厚さ38μmのポリエチレンテレフタレートフィルム(リンテック株式会社製PET38)および保護フィルム(藤森工業(株)製“フィルムバイナ”GT)を剥がし、穴の空いた電子部品用樹脂シート単膜とした。これを2枚のカバーグラス(松浪硝子工業株式会社製:マイクロカバーグラス No.4)で挟み、60℃、0.3MPaで1分間プレスし2枚のカバーグラスと穴の空いた電子部品用樹脂シート単膜を貼りあわせ、中空封止試験用試験片とした。この試験片を150℃で2時間加熱し、2枚のカバーグラスと電子部品用樹脂シートで囲まれた中空の穴の辺の長さを測定し、初期値である5mmを超えた長さを記録した。
まず35mm角のセラミック基板を用意し、この中央に2層フレキシブル基板(東レフィルム加工株式会社製:メタロイヤル、ポリイミド樹脂層25μm、銅箔8μm)を用いてL/S=15/15μmのくし型電極を作製した。
溶融球状シリカ(SO-C2、平均粒径0.5μm、株式会社アドマテックス製)28.8g、溶融球状シリカ(FB-5D、平均粒径5.0μm、電気化学工業株式会社製)51.9gをミキサー内で入れ、メチルイソブチルケトンを40g加えた。続いてN-フェニル-3-アミノプロピルトリメトキシシラン(KBM-573、信越化学工業株式会社製)0.8gを霧吹きで噴射し、ミキサー内で混合した。これにアクリル系共重合体1を2.5g、ビスフェノールA型エポキシ樹脂(jER-828、エポキシ当量:190、三菱化学株式会社製、常温で液状、25℃での粘度:14Pa・s)11.9g、ノボラックフェノール(H-1、明和化成株式会社製)4g、2-ヘプタデシルイミダゾール(C17Z、四国化成株式会社製)0.1gを加えて、固形分濃度70重量%となるようにメチルイソブチルケトンを加え、30℃で撹拌、ホモミキサーで処理をして接着剤溶液を作製した。
各組成の種類、配合量を表1、2に記載のとおり変更した以外は実施例1と同様にして、シリコーン離型剤付き厚さ38μmのポリエチレンテレフタレートフィルム(リンテック株式会社製PET38)、電子部品用樹脂シートおよび保護フィルム(藤森工業(株)製“フィルムバイナ”GT)がこの順に積層された積層体(電子部品用樹脂シート厚み50μm)および積層体(電子部品用樹脂シート厚み100μm)を作製した。
2 電子部品用樹脂シート
3 半導体チップ
4 中空部分
5 半田ボール
6 半導体チップ搭載用基板
7 電子部品用樹脂シート
8 半導体チップ
9 中空部分
10 中空構造形成用基板
Claims (9)
- (a)アクリル系共重合体、(b)熱硬化性樹脂、(c)無機充填材および(d)アミノ基を有するシランカップリング剤を含有し、(a)アクリル系共重合体が構成モノマー単位中アクリロニトリル単位を30モル%以上含有し、かつ電子部品用樹脂シート中の(a)アクリル系共重合体の含有率が2~5重量%であることを特徴とする電子部品用樹脂シート。
- 電子部品用樹脂シート中の前記(c)無機充填材の含有率が、60~90重量%であることを特徴とする請求項1に記載の電子部品用樹脂シート。
- 100μm厚の40℃/90%RHでの水蒸気透過度が、50g/(m2・24h)以下であることを特徴とする請求項1または2に記載の電子部品用樹脂シート。
- 中空構造を形成するために用いられることを特徴とする請求項1~3のいずれかに記載の電子部品用樹脂シート。
- 請求項1~4のいずれかに記載の電子部品用樹脂シートおよび保護フィルムを有することを特徴とする保護フィルム付電子部品用樹脂シート。
- 基板、前記基板上に形成された半導体チップおよび前記基板上に形成された半導体チップを覆うように積層された請求項1~4のいずれかに記載の電子部品用樹脂シートを有しており、前記基板と前記半導体チップとの間に中空構造が形成されていることを特徴とする半導体装置。
- 半導体チップ搭載面を囲む形状を有する半導体チップ搭載用基板、前記半導体チップ搭載用基板上に形成された半導体チップおよび中空構造形成用基板を有しており、前記半導体チップ搭載用基板と前記中空構造形成用基板が、請求項1~4のいずれかに記載の電子部品用樹脂シートを介して接続されていることを特徴とする半導体装置。
- (1)基板上に半導体チップを形成する工程、および(2)前記基板上に形成された半導体チップを覆うように、前記半導体チップ側から請求項1~4のいずれかに記載の電子部品用樹脂シートを積層する工程をこの順に含み、前記基板と前記半導体チップとの間に中空構造が形成されるように電子部品用樹脂シートを積層することを特徴とする半導体装置の製造方法。
- (1’)半導体チップ搭載面を囲む形状を有する半導体チップ搭載用基板上に半導体チップを形成する工程、(2’)半導体チップ搭載用基板の中空構造形成用基板との接続面または中空構造形成用基板の半導体チップ搭載用基板との接続面に、請求項1~4のいずれかに記載の電子部品用樹脂シートを積層する工程、および(3’)半導体チップ搭載用基板と中空構造形成用基板を、前記電子部品用樹脂シートを介して接続する工程、をこの順に含むことを特徴とする半導体装置の製造方法。
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CN113646170A (zh) * | 2019-03-28 | 2021-11-12 | 味之素株式会社 | 带有支承体的树脂片材 |
WO2022149521A1 (ja) | 2021-01-07 | 2022-07-14 | 東レ株式会社 | 中空構造体およびそれを用いた電子部品、ネガ型感光性樹脂組成物 |
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