JP6228734B2 - 電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法 - Google Patents
電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法 Download PDFInfo
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- JP6228734B2 JP6228734B2 JP2013026935A JP2013026935A JP6228734B2 JP 6228734 B2 JP6228734 B2 JP 6228734B2 JP 2013026935 A JP2013026935 A JP 2013026935A JP 2013026935 A JP2013026935 A JP 2013026935A JP 6228734 B2 JP6228734 B2 JP 6228734B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
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Description
なお、厚さが250μmではない場合には、下記式1により換算して、温度85℃、湿度85%、168時間の条件下における、厚さ250μmにした際の透湿度とする。
(式1) A−(250−D)×0.101
(A:透湿度、D:サンプル厚み(μm))
なお、厚さが250μmではない場合には、下記式2により換算して、温度60℃、湿度90%、168時間の条件下における、厚さ250μmにした際の透湿度とする。
(式2) A−(250−D)×0.010
(A:透湿度、D:サンプル厚み(μm)
図1で示されるように、電子部品封止用樹脂シート2は、シート状の形態を有している。電子部品封止用樹脂シート2は、樹脂封止型半導体装置(例えば、図6に示す樹脂封止型半導体装置50)の製造に使用される。
A成分:エポキシ樹脂
B成分:フェノール樹脂
C成分:エラストマー
D成分:無機充填剤
E成分:硬化促進剤
エポキシ樹脂(A成分)としては、特に限定されるものではない。例えば、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、変性ビスフェノールA型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、変性ビスフェノールF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、フェノキシ樹脂等の各種のエポキシ樹脂を用いることができる。これらエポキシ樹脂は単独で用いてもよいし2種以上併用してもよい。
フェノール樹脂(B成分)は、エポキシ樹脂(A成分)との間で硬化反応を生起するものであれば特に限定されるものではない。例えば、フェノールノボラック樹脂、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ジシクロペンタジエン型フェノール樹脂、クレゾールノボラック樹脂、レゾール樹脂、等が用いられる。これらフェノール樹脂は単独で用いてもよいし、2種以上併用してもよい。
エポキシ樹脂(A成分)及びフェノール樹脂(B成分)とともに用いられるエラストマー(C成分)は、電子部品封止用樹脂シートをシート状にした場合の半導体チップ5の封止に必要な可撓性を樹脂組成物に付与するものであり、このような作用を奏するものであれば特にその構造を限定するものではない。例えば、ポリアクリル酸エステル等の各種アクリル系共重合体、スチレンアクリレート系共重合体、ブタジエンゴム、スチレン−ブタジエンゴム(SBR)、エチレン−酢酸ビニルコポリマー(EVA)、イソプレンゴム、アクリロニトリルゴム等のゴム質重合体を用いることができる。中でも、エポキシ樹脂(A成分)へ分散させやすく、またエポキシ樹脂(A成分)との反応性も高いために、得られる電子部品封止用樹脂シートの耐熱性や強度を向上させることができるという観点から、アクリル系共重合体を用いることが好ましい。これらは単独で用いてもよいし、2種以上併せて用いてもよい。
無機質充填剤(D成分)は、特に限定されるものではなく、従来公知の各種充填剤を用いることができ、例えば、石英ガラス、タルク、シリカ(溶融シリカや結晶性シリカ等)、アルミナ、窒化アルミニウム、窒化珪素等の粉末が挙げられる。これらは単独で用いてもよいし、2種以上併用してもよい。
硬化促進剤(E成分)は、エポキシ樹脂とフェノール樹脂の硬化を進行させるものであれば特に限定されるものではないが、硬化性と保存性の観点から、トリフェニルホスフィンやテトラフェニルホスホニウムテトラフェニルボレート等の有機リン系化合物や、イミダゾール系化合物が好適に用いられる。これら硬化促進剤は、単独で用いても良いし、他の硬化促進剤と併用しても構わない。
また、樹脂組成物には、A成分からE成分に加えて、難燃剤成分を加えてもよい。難燃剤組成分としては、例えばホスファゼンなどの有機リン系難燃剤、水酸化アルミニウム、水酸化マグネシウム、水酸化鉄、水酸化カルシウム、水酸化スズ、複合化金属水酸化物等の各種金属水酸化物などを用いることができる。樹脂組成物中での分散性の観点から有機リン系難燃剤が好ましいが、場合によっては、比較的少ない添加量で難燃性を発揮できる観点や、コスト的な観点から水酸化アルミニウム又は水酸化マグネシウムを用いる場合もある。これらは単独で用いても、組合せで用いても良い。
電子部品封止用樹脂シート2の作製方法について、電子部品封止用樹脂シート2がシート状熱硬化型樹脂層である場合の手順を以下に説明する。
次に、本実施形態に係る樹脂封止型半導体装置の製造方法について、図2〜図6を参照しながら以下に説明する。図2〜図6は、本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。
先ず、図2で示されるように、基材31上に粘着剤層32が積層されたダイシングテープ3の粘着剤層32上に半導体ウエハ4を貼着して、これを接着保持させ固定する(マウント工程)。粘着剤層32は、半導体ウエハ4の裏面に貼着される。半導体ウエハ4の裏面とは、回路面とは反対側の面(非回路面、非電極形成面などとも称される)を意味する。貼着方法は特に限定されないが、圧着による方法が好ましい。圧着は、通常、圧着ロール等の押圧手段により押圧しながら行われる。なお、ダイシングテープ3としては、従来公知のものを使用することができる。
次に、図3で示されるように、半導体ウエハ4のダイシングを行う。これにより、半導体ウエハ4を所定のサイズに切断して個片化(小片化)し、半導体チップ5を製造する。ダイシングは、例えば、半導体ウエハ4の回路面側から常法に従い行われる。本工程で用いるダイシング装置としては特に限定されず、従来公知のものを用いることができる。
ダイシングテープ3に接着固定された半導体チップ5を回収する為に、図4で示されるように、半導体チップ5のピックアップを行って、半導体チップ5をダイシングテープ3より剥離させる。ピックアップの方法としては特に限定されず、従来公知の種々の方法を採用できる。例えば、個々の半導体チップ5を基材31側からニードルによって突き上げ、突き上げられた半導体チップ5をピックアップ装置によってピックアップする方法等が挙げられる。
ピックアップした半導体チップ5は、図5で示されるように、基板等の被着体に、フリップチップボンディング方式(フリップチップ実装方式)により固定させる。具体的には、半導体チップ5を、半導体チップ5の回路面(表面、回路パターン形成面、電極形成面などとも称される)が被着体6と対向する形態で、被着体6に常法に従い固定させる。例えば、半導体チップ5の回路面側に形成されているバンプ51を、被着体6の接続パッドに被着された接合用の導電材(半田など)61に接触させて押圧しながら導電材を溶融させることにより、半導体チップ5と被着体6との電気的導通を確保し、半導体チップ5を被着体6に固定させることができる(フリップチップボンディング工程)。このとき、半導体チップ5と被着体6との間には空隙が形成されており、その空隙間距離は、一般的に15μm〜300μm程度である。尚、半導体チップ5を被着体6上にフリップチップボンディング(フリップチップ接続)した後は、半導体チップ5と被着体6との対向面や間隙を洗浄してもよい。また、該空隙は、半導体装置の用途に応じて封止材(封止樹脂など)を充填させて封止してもよく、空隙のままとしておいてもよい。ただし、加速度センサ、圧力センサ、ジャイロセンサ等のMEMSや表面弾性波フィルター(SAWフィルター)においては、構造上、被着体と半導体チップとの間に空隙が形成されている必要があるため、このような用途においては、空隙のままとしておく。
電子部品封止用樹脂シートの積層工程では、半導体チップ5を覆うように半導体チップ5側から電子部品封止用樹脂シート2を被着体6上に積層する(図6参照)。この電子部品封止用樹脂シート2は、半導体チップ5及びそれに付随する要素を外部環境から保護するための封止樹脂として機能する。
(実施例1)
以下の成分を2軸混練り機により、120℃で5分間混練し、混練物を調製した。
B成分(フェノール樹脂):ビフェニルアラルキル骨格を有するフェノール樹脂(明和化成社製、MEH7851SS) 3.58部
C成分(エラストマー):熱可塑性エラストマー((株)カネカ社製、製品名:SIBSTER 072T) 3.04部
D成分(無機充填剤):球状シリカ(電気化学工業社製、製品名FB−9454FC、平均粒子径20μm) 88部
E成分(硬化促進剤):硬化触媒としてのイミダゾール系触媒(四国化成工業(株)製2PHZ−PW) 0.119部
その他成分1:カーボンブラック(三菱化学社製、#3030B) 0.3部
その他成分2:難燃剤(フェノキシホスファゼンオリゴマー、製品名:FP−100、伏見製薬所製) 1.58部
配合量を表1の通りに変更した以外は、実施例1と同様にして実施例2〜6、及び、比較例1に係るに電子部品封止用樹脂シートを得た。その後、150℃で1時間加熱し、硬化させた。
以下の成分を400重量部のメチルエチルケトンに溶解し、ホモジナイザーにて均一になるように配合した。
A成分2(エポキシ樹脂2):ノボラック型エポキシ樹脂(大日本インキ社製、EPPN501HY) 1.53部
B成分(フェノール樹脂):(群栄化学製、GS−200) 1.84部
C成分(エラストマー):アクリル酸ブチル86部、アクリロニトリル7部、メタクリル酸グリシジル7部からなる重量平均分子量75万のアクリル系共重合体
17.02部
D成分(無機充填剤):球状シリカ(アドマテックス社製、SO−E2、平均粒子径0.5μm) 75部
E成分(硬化促進剤):硬化触媒としてのイミダゾール系触媒(四国化成工業(株)製2PHZ−PW) 0.25部
その他成分:カーボンブラック(三菱化学社製、#20) 0.74部
配合量を表2の通りに変更した以外は、参考例1と同様にして比較例2、及び、比較例3に係るに電子部品封止用樹脂シートを得た。その後、150℃で1時間加熱し、硬化させた。
JIS Z 0208(カップ法)の規定に準じて、実施例、比較例で作成した電子部品封止用樹脂シート(熱硬化後)の透湿度を測定した。測定条件は下記の通りとした。結果を表1、及び、表2に示す。
(測定条件1)
温度85℃、湿度85%、168時間、電子部品封止用樹脂シートの厚さ:250μm
(測定条件2)
温度60℃、湿度90%、168時間、電子部品封止用樹脂シートの厚さ:250μm
厚さ0.5mmのアルミナ基板に、1mmx1mmx0.2mmtサイズのSiチップ25個(5列×5列、チップ間隔は0.5mmとした)が、金バンプによって超音波接続されたもの(チップ下面と基板とのギャップ:20μm)を準備した。
次に、実施例、及び、比較例にて作製した電子部品封止用樹脂シートを用いて、真空プレスにより上記Siチップの封止を行い(封止条件:50℃、1MPa、1分、真空度1000Pa)、150℃で1時間硬化させた。これにより各チップの下部に空隙が形成された状態の硬化物を得た。その後、ダイシングにより個別のパッケージに分割した。これをJEDECのMSL1(Moisture Sensitivity Level)試験に準拠した手法で、85℃、85%、168時間の条件にて吸湿させた。その後、IRリフロー装置にて260℃×3回の吸湿リフロー試験を行った。試験後のパッケージを超音波顕微鏡で観察し、基板、樹脂間に剥離が観察されたものを×、観察されなかったものを○とした。結果を表1、及び、表2に示す。
3 ダイシングテープ
31 基材
32 粘着剤層
4 半導体ウエハ
5 半導体チップ
51 半導体チップ5の回路面側に形成されているバンプ
52 空隙
6 被着体
61 被着体6の接続パッドに被着された接合用の導電材
Claims (5)
- 樹脂封止型半導体装置の製造に使用され、被着体上にフリップチップ接続された半導体チップを、半導体チップと被着体との間の空隙を残しつつ埋め込むための電子部品封止用樹脂シートであって、
無機充填剤を電子部品封止用樹脂シート全体に対して、70〜93重量%含み、
さらに、フェノールノボラック樹脂、フェノールアラルキル樹脂、及び、ビフェニルアラルキル樹脂の群から選ばれる1または2以上のフェノール樹脂と、エラストマーとを含み、
混練押出により製造されており、
厚さ250μmにした際の熱硬化後の透湿度が、温度85℃、湿度85%、168時間の条件下において、300g/m2・24時間以下であることを特徴とする電子部品封止用樹脂シート(ただし、下記の一般式(1)で表される多面体形状の複合化金属水酸化物を含む場合を除く。)
m(MaOb)・n(QdOe)・cH2O ・・・(1)
〔上記式(1)において、MとQは互いに異なる金属元素であり、Qは、周期律表のIVa,Va,VIa,VIIa,VIII,Ib,IIbから選ばれた族に属する金属元素である。また、m,n,a,b,c,d,eは正数であって、互いに同一の値であってもよいし、異なる値であってもよい。〕。 - 厚さ250μmにした際の熱硬化後の透湿度が、温度60℃、湿度90%、168時間の条件下において、100g/m2・24時間以下であることを特徴とする請求項1に記載の電子部品封止用樹脂シート。
- 被着体と、
前記被着体にフリップチップ接続された半導体チップと、
前記半導体チップを封止する電子部品封止用樹脂シートと
を備え、
前記電子部品封止用樹脂シートは、
無機充填剤を電子部品封止用樹脂シート全体に対して、70〜93重量%含み、さらに、フェノールノボラック樹脂、フェノールアラルキル樹脂、及び、ビフェニルアラルキル樹脂の群から選ばれる1または2以上のフェノール樹脂と、エラストマーとを含み、混練押出により製造されており、厚さ250μmにした際の熱硬化後の透湿度が、温度85℃、湿度85%、168時間の条件下において、300g/m2・24時間以下であり、
前記被着体と前記半導体チップとの間には、空隙が形成されていることを特徴とする樹脂封止型半導体装置(ただし、前記電子部品封止用樹脂シートは、下記の一般式(1)で表される多面体形状の複合化金属水酸化物を含む場合を除く。)
m(MaOb)・n(QdOe)・cH2O ・・・(1)
〔上記式(1)において、MとQは互いに異なる金属元素であり、Qは、周期律表のIVa,Va,VIa,VIIa,VIII,Ib,IIbから選ばれた族に属する金属元素である。また、m,n,a,b,c,d,eは正数であって、互いに同一の値であってもよいし、異なる値であってもよい。〕。 - 請求項1又は2に記載の電子部品封止用樹脂シートを有する樹脂封止型半導体装置。
- 樹脂封止型半導体装置の製造方法であって、
被着体上にフリップチップ接続された半導体チップを覆うように、半導体チップ側から電子部品封止用樹脂シートを積層する工程であって、半導体チップと被着体との間の空隙を残しつつ埋め込む工程を具備し、
前記電子部品封止用樹脂シートは、
無機充填剤を電子部品封止用樹脂シート全体に対して、70〜93重量%含み、
さらに、フェノールノボラック樹脂、フェノールアラルキル樹脂、及び、ビフェニルアラルキル樹脂の群から選ばれる1または2以上のフェノール樹脂と、エラストマーとを含み、
混練押出により製造されており、
厚さ250μmにした際の熱硬化後の透湿度が、温度85℃、湿度85%、168時間の条件下において、300g/m2・24時間以下であることを特徴とする樹脂封止型半導体装置の製造方法(ただし、前記電子部品封止用樹脂シートは、下記の一般式(1)で表される多面体形状の複合化金属水酸化物を含む場合を除く。)
m(MaOb)・n(QdOe)・cH2O ・・・(1)
〔上記式(1)において、MとQは互いに異なる金属元素であり、Qは、周期律表のIVa,Va,VIa,VIIa,VIII,Ib,IIbから選ばれた族に属する金属元素である。また、m,n,a,b,c,d,eは正数であって、互いに同一の値であってもよいし、異なる値であってもよい。〕。
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JP2013026935A JP6228734B2 (ja) | 2013-02-14 | 2013-02-14 | 電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法 |
SG11201505837RA SG11201505837RA (en) | 2013-02-14 | 2014-02-13 | Resin sheet for sealing electronic component, resin-sealed semiconductor device, and production method for resin-sealed semiconductor device |
CN201480008390.5A CN105190867A (zh) | 2013-02-14 | 2014-02-13 | 电子部件密封用树脂片、树脂密封型半导体装置及树脂密封型半导体装置的制造方法 |
KR1020157025085A KR20150119265A (ko) | 2013-02-14 | 2014-02-13 | 전자 부품 봉지용 수지 시트, 수지 봉지형 반도체 장치, 및 수지 봉지형 반도체 장치의 제조 방법 |
PCT/JP2014/053318 WO2014126147A1 (ja) | 2013-02-14 | 2014-02-13 | 電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法 |
TW103104995A TWI624914B (zh) | 2013-02-14 | 2014-02-14 | Resin sheet for electronic component sealing, resin sealed semiconductor device, and method for manufacturing resin sealed semiconductor device |
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CN (1) | CN105190867A (ja) |
SG (1) | SG11201505837RA (ja) |
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JP5976073B2 (ja) * | 2014-11-07 | 2016-08-23 | 日東電工株式会社 | 半導体装置の製造方法 |
JP6237906B2 (ja) * | 2015-03-31 | 2017-11-29 | 東レ株式会社 | 電子部品用樹脂シート、保護フィルム付電子部品用樹脂シートならびに半導体装置およびその製造方法 |
JP7257731B2 (ja) * | 2016-12-28 | 2023-04-14 | 日東電工株式会社 | 樹脂シート |
CN107403771A (zh) * | 2017-08-21 | 2017-11-28 | 嘉盛半导体(苏州)有限公司 | 半导体封装结构及其封装方法 |
US11718770B2 (en) * | 2018-11-14 | 2023-08-08 | Nagase Chemtex Corporation | Curable resin composition and curable sheet |
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JP3022135B2 (ja) * | 1994-01-26 | 2000-03-15 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
JPH08255806A (ja) * | 1995-03-17 | 1996-10-01 | Toshiba Corp | 樹脂封止型半導体装置の製造方法 |
JP4150466B2 (ja) * | 1998-06-02 | 2008-09-17 | 日東電工株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置ならびに半導体装置の製法 |
JP4593187B2 (ja) * | 2004-07-13 | 2010-12-08 | 新日鐵化学株式会社 | 半導体装置の製造方法 |
KR101090562B1 (ko) * | 2006-02-27 | 2011-12-08 | 스미토모 베이클리트 컴퍼니 리미티드 | 접착 필름 |
JP5426511B2 (ja) * | 2009-11-30 | 2014-02-26 | パナソニック株式会社 | 封止用エポキシ樹脂組成物シート及びこれを用いて封止した中空型デバイス |
JP5861838B2 (ja) * | 2010-06-24 | 2016-02-16 | 日産化学工業株式会社 | 結晶化促進方法及び成形物の製造方法 |
JP5812993B2 (ja) * | 2010-08-12 | 2015-11-17 | 株式会社ダイセル | 低透湿性樹脂組成物及びその硬化物 |
JP2012046657A (ja) * | 2010-08-27 | 2012-03-08 | Idemitsu Kosan Co Ltd | 半導体封止用エポキシ樹脂成形材料及び蓄熱性成形体 |
JP2013007028A (ja) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | 封止用シートおよび電子部品装置 |
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TW201442166A (zh) | 2014-11-01 |
SG11201505837RA (en) | 2015-09-29 |
JP2014156516A (ja) | 2014-08-28 |
CN105190867A (zh) | 2015-12-23 |
WO2014126147A1 (ja) | 2014-08-21 |
KR20150119265A (ko) | 2015-10-23 |
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