TWI366592B - Epoxy resin adhesion composition and adhesive for optical semiconductor - Google Patents

Epoxy resin adhesion composition and adhesive for optical semiconductor

Info

Publication number
TWI366592B
TWI366592B TW095140647A TW95140647A TWI366592B TW I366592 B TWI366592 B TW I366592B TW 095140647 A TW095140647 A TW 095140647A TW 95140647 A TW95140647 A TW 95140647A TW I366592 B TWI366592 B TW I366592B
Authority
TW
Taiwan
Prior art keywords
adhesive
epoxy resin
optical semiconductor
resin adhesion
adhesion composition
Prior art date
Application number
TW095140647A
Other languages
Chinese (zh)
Other versions
TW200730598A (en
Inventor
Masashi Tanaka
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW200730598A publication Critical patent/TW200730598A/en
Application granted granted Critical
Publication of TWI366592B publication Critical patent/TWI366592B/en

Links

TW095140647A 2005-11-08 2006-11-03 Epoxy resin adhesion composition and adhesive for optical semiconductor TWI366592B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323742A JP4802667B2 (en) 2005-11-08 2005-11-08 Epoxy resin adhesive composition and optical semiconductor adhesive using the same

Publications (2)

Publication Number Publication Date
TW200730598A TW200730598A (en) 2007-08-16
TWI366592B true TWI366592B (en) 2012-06-21

Family

ID=38082032

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140647A TWI366592B (en) 2005-11-08 2006-11-03 Epoxy resin adhesion composition and adhesive for optical semiconductor

Country Status (3)

Country Link
JP (1) JP4802667B2 (en)
CN (1) CN1962798B (en)
TW (1) TWI366592B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447939B (en) * 2007-06-15 2014-08-01 Namics Corp Conductive die attach adhesive for LED
JP5748937B2 (en) * 2008-04-01 2015-07-15 日立化成株式会社 Film sealing adhesive for semiconductor sealing and manufacturing method of semiconductor device
JP5599561B2 (en) * 2008-07-22 2014-10-01 日立化成株式会社 Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device
JP5550230B2 (en) * 2008-07-22 2014-07-16 日立化成株式会社 Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device
CN102598235B (en) * 2009-09-30 2014-12-03 积水化学工业株式会社 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
JP5544843B2 (en) * 2009-11-27 2014-07-09 住友金属鉱山株式会社 Epoxy resin adhesive composition and optical semiconductor adhesive using the same
JP5555038B2 (en) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 Light-reflective anisotropic conductive adhesive and light-emitting device
JP2014162885A (en) * 2013-02-27 2014-09-08 Sumitomo Metal Mining Co Ltd Semiconductor element adhesion silicone resin composition and silicon-containing cured product using the same
KR102325095B1 (en) * 2014-10-01 2021-11-11 나믹스 가부시끼가이샤 Resin composition
CN108139286B (en) 2016-03-10 2021-06-25 积水化学工业株式会社 Adhesive for mounting semiconductor and semiconductor sensor
CN107400491A (en) * 2017-07-19 2017-11-28 中山市东溢新材料有限公司 A kind of transparent epoxy adhesive and its application

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763351A (en) * 1980-10-03 1982-04-16 Kanegafuchi Chem Ind Co Ltd Composition having improved pot life
JP2796187B2 (en) * 1990-10-01 1998-09-10 日東電工株式会社 Optical semiconductor device
JPH083452A (en) * 1994-06-17 1996-01-09 Kansai Paint Co Ltd Thermosetting composition and method for curing it
JP3550198B2 (en) * 1994-11-17 2004-08-04 積水化学工業株式会社 One-part room temperature curable adhesive composition
EP1550701B1 (en) * 2002-10-02 2014-06-25 Kaneka Corporation One-part curable composition
JP4079006B2 (en) * 2003-02-25 2008-04-23 住友金属鉱山株式会社 Epoxy resin composition and adhesive for optical semiconductor using the same
JP2005093724A (en) * 2003-09-17 2005-04-07 Tokuyama Corp Primer composition for sealing light emitting diode

Also Published As

Publication number Publication date
JP2007131678A (en) 2007-05-31
JP4802667B2 (en) 2011-10-26
TW200730598A (en) 2007-08-16
CN1962798B (en) 2012-07-18
CN1962798A (en) 2007-05-16

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