TWI366592B - Epoxy resin adhesion composition and adhesive for optical semiconductor - Google Patents
Epoxy resin adhesion composition and adhesive for optical semiconductorInfo
- Publication number
- TWI366592B TWI366592B TW095140647A TW95140647A TWI366592B TW I366592 B TWI366592 B TW I366592B TW 095140647 A TW095140647 A TW 095140647A TW 95140647 A TW95140647 A TW 95140647A TW I366592 B TWI366592 B TW I366592B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- epoxy resin
- optical semiconductor
- resin adhesion
- adhesion composition
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005323742A JP4802667B2 (en) | 2005-11-08 | 2005-11-08 | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200730598A TW200730598A (en) | 2007-08-16 |
TWI366592B true TWI366592B (en) | 2012-06-21 |
Family
ID=38082032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095140647A TWI366592B (en) | 2005-11-08 | 2006-11-03 | Epoxy resin adhesion composition and adhesive for optical semiconductor |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4802667B2 (en) |
CN (1) | CN1962798B (en) |
TW (1) | TWI366592B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI447939B (en) * | 2007-06-15 | 2014-08-01 | Namics Corp | Conductive die attach adhesive for LED |
JP5748937B2 (en) * | 2008-04-01 | 2015-07-15 | 日立化成株式会社 | Film sealing adhesive for semiconductor sealing and manufacturing method of semiconductor device |
JP5599561B2 (en) * | 2008-07-22 | 2014-10-01 | 日立化成株式会社 | Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
JP5550230B2 (en) * | 2008-07-22 | 2014-07-16 | 日立化成株式会社 | Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
CN102598235B (en) * | 2009-09-30 | 2014-12-03 | 积水化学工业株式会社 | Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
JP5544843B2 (en) * | 2009-11-27 | 2014-07-09 | 住友金属鉱山株式会社 | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
JP5555038B2 (en) * | 2010-04-13 | 2014-07-23 | デクセリアルズ株式会社 | Light-reflective anisotropic conductive adhesive and light-emitting device |
JP2014162885A (en) * | 2013-02-27 | 2014-09-08 | Sumitomo Metal Mining Co Ltd | Semiconductor element adhesion silicone resin composition and silicon-containing cured product using the same |
KR102325095B1 (en) * | 2014-10-01 | 2021-11-11 | 나믹스 가부시끼가이샤 | Resin composition |
CN108139286B (en) | 2016-03-10 | 2021-06-25 | 积水化学工业株式会社 | Adhesive for mounting semiconductor and semiconductor sensor |
CN107400491A (en) * | 2017-07-19 | 2017-11-28 | 中山市东溢新材料有限公司 | A kind of transparent epoxy adhesive and its application |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5763351A (en) * | 1980-10-03 | 1982-04-16 | Kanegafuchi Chem Ind Co Ltd | Composition having improved pot life |
JP2796187B2 (en) * | 1990-10-01 | 1998-09-10 | 日東電工株式会社 | Optical semiconductor device |
JPH083452A (en) * | 1994-06-17 | 1996-01-09 | Kansai Paint Co Ltd | Thermosetting composition and method for curing it |
JP3550198B2 (en) * | 1994-11-17 | 2004-08-04 | 積水化学工業株式会社 | One-part room temperature curable adhesive composition |
EP1550701B1 (en) * | 2002-10-02 | 2014-06-25 | Kaneka Corporation | One-part curable composition |
JP4079006B2 (en) * | 2003-02-25 | 2008-04-23 | 住友金属鉱山株式会社 | Epoxy resin composition and adhesive for optical semiconductor using the same |
JP2005093724A (en) * | 2003-09-17 | 2005-04-07 | Tokuyama Corp | Primer composition for sealing light emitting diode |
-
2005
- 2005-11-08 JP JP2005323742A patent/JP4802667B2/en active Active
-
2006
- 2006-10-30 CN CN 200610150389 patent/CN1962798B/en active Active
- 2006-11-03 TW TW095140647A patent/TWI366592B/en active
Also Published As
Publication number | Publication date |
---|---|
JP2007131678A (en) | 2007-05-31 |
JP4802667B2 (en) | 2011-10-26 |
TW200730598A (en) | 2007-08-16 |
CN1962798B (en) | 2012-07-18 |
CN1962798A (en) | 2007-05-16 |
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