CN107400491A - A kind of transparent epoxy adhesive and its application - Google Patents
A kind of transparent epoxy adhesive and its application Download PDFInfo
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- CN107400491A CN107400491A CN201710590433.0A CN201710590433A CN107400491A CN 107400491 A CN107400491 A CN 107400491A CN 201710590433 A CN201710590433 A CN 201710590433A CN 107400491 A CN107400491 A CN 107400491A
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- transparent epoxy
- epoxy adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of transparent epoxy adhesive and its application, the adhesive it include following parts by weight of component：30~40 parts of cycloaliphatic epoxy resin, 3~6 parts of HHPA, 50~70 parts of toughener, 6~20 parts of printing opacity powder.The present invention can avoid rubber from influenceing xanthochromia performance；Polyurethane-base is avoided to influence xanthochromia performance and can be epoxy resin toughened.Epoxy systems and flexible polyester system are combined together by the present invention, give full play to their own advantage, solve the problems, such as their consistency problem and color inhibition, invent the flexible and transparent adhesive of high transparency, high-fire resistance and high cohesive force.
Description
【Technical field】
The present invention relates to a kind of transparent epoxy adhesive and its application.
【Background technology】
In recent years in electronic product towards under multi-functional, lightening and diversified trend, flexible printed wiring board obtains
Fast development, material flexibility coat copper plate, the cover layer of flexible printed wiring board are also rapidly developed, and it is by adhesive handle
Kapton or polyester film and copper foil or release liners fitting form.In optical component, touch screen products and system
Making process contraposition etc. needs the application of flexible printed wiring board (FPC) high grade of transparency more and more, the research of transparent adhesive
It is more and more.
However, the flexibility coat copper plate in flexible printed wiring board, cover layer and pure glue is applied to need high cohesive force, height
Heat resistance and flexural property etc..In order to meet these performances, much study and rubber or polyurethane are added in epoxy adhesive
The toughener such as resin and filler, this can influence the transparency of adhesive, and glue-line easily turns white and xanthochromia；Or add saturation and gather
Ester resin, this can influence the heat resistance and cohesive force of adhesive；Or add clear polyimides resin, this and asphalt mixtures modified by epoxy resin lipid phase
Capacitive is poor, and it is very high to influence cohesive force and the cost of adhesive, can not meet requirement in the application.
【The content of the invention】
The purpose of the present invention is overcome the deficiencies in the prior art, there is provided there is one kind the high grade of transparency, high-fire resistance and height to glue
The transparent epoxy adhesive of power is tied, suitable for the making of flexibility coat copper plate, cover layer and pure glued membrane.
It is a further object of the present invention to provide a kind of application of above-mentioned transparent adhesive, clear flexible copper-clad plate are transparent to cover
Epiphragma, transparent pure glued membrane.
The present invention to achieve the above object, using following technical scheme：
A kind of transparent epoxy adhesive, it is characterised in that including following parts by weight of component：
Cycloaliphatic epoxy resin in the present invention, preferably TTA21, TTA26 model cycloaliphatic epoxy resin.
HHPA (HHPA) is curing agent in the present invention.
Toughener selects the high-molecular-weight poly ester fiber containing carboxyl in the present invention, and the molecular weight of polyester fiber is 10000
~50000.
Printing opacity powder is a kind of silicates mineral matter in the present invention, and Main Ingredients and Appearance is silica, index of refraction and asphalt mixtures modified by epoxy resin
The index of refraction of fat is very close, does not interfere with the transparency of resin, while reduces the cost of adhesive and improve heat resistance, preferably
Addition is 6~12 parts by weight.
The compositions such as curing accelerator, antioxidant can also be added in the transparent epoxy adhesive of the present invention, they are together
It is stirred the adhesive in organic solvent, being made that solid content is 30~60%, organic solvent can be butanone, acetone, different
Propyl alcohol, ethanol, it preferentially can be used alone, can also be used in mixed way from butanone, acetone, these solvents.
A kind of application of transparent epoxy adhesive of the present invention, main application cover copper for the clear flexible of transparent epoxy adhesive
Plate, transparent mulch film and transparent pure glued membrane.
Clear flexible copper-clad plate in the present invention includes transparent polyimide film or transparent polyester film, transparent epoxy glue
Adhesive layer and copper foil.Copper foil can be electrolytic copper foil or rolled copper foil.
The preparation method of clear flexible copper-clad plate is：Above-mentioned transparent epoxy adhesive is applied on transparent insulation film,
The insulation film for scribbling the transparent epoxy adhesive passes through the dry 100S~500S of 120~180 DEG C of baking oven, then by the compound
Pressed at 80~130 DEG C with copper foil, flexibility coat copper plate is made and solidifies at 150~180 DEG C, clear flexible copper-clad plate is made.
Transparent mulch film in the present invention has a dielectric film, the gluing oxidant layer of transparent epoxy and and release liners, dielectric film it is preferred
Transparent polyimide film or transparent polyester film, the transparent epoxy adhesive described in the coated on one side of the transparent membrane, separately
Simultaneously press release liners.
Transparent pure glued membrane in the present invention has mould release membrance, the gluing oxidant layer of transparent epoxy and release liners.Mould release membrance is preferably non-
Silicon mould release membrance, the transparent epoxy adhesive described in the coated on one side of the non-silicon mould release membrance, another side pressing release liners.
The preparation method of transparent mulch film and transparent pure glued membrane is：Above-mentioned transparent epoxy adhesive is applied in transparent membrane
Or on mould release membrance, by 120~180 DEG C of dry 100S~500S of baking oven, then by the compound at 50~100 DEG C with it is release
Letterweight closes, and cover layer is made or pure glued membrane solidifies at 30~80 DEG C, and the transparent mulch film of semi-solid preparation and pure glued membrane is made.
Beneficial effects of the present invention are as follows：
The present invention in order to realize high light transmittance, color inhibition characteristic, from cycloaliphatic epoxy resin and structure without double bond
HHPA curing agent, solidfied material are water white transparency, and cycloaliphatic epoxy resin is free of phenyl ring, and its epoxide equivalent is small, crosslink density
Greatly, plus the good alicyclic ring of heat endurance, therefore its is heat-resist, non yellowing, but bonding force is low and poor toughness.Increased by adding
Tough dose of polyester fiber increase toughness and bonding force is improved, polyester fiber is a kind of carboxylic polyester resin of HMW, polyester
The carboxyl of fiber can react with the epoxide group of cycloaliphatic epoxy resin, realize toughness reinforcing, color inhibition and both have it is good
Compatibility, by add printing opacity powder reduce adhesive cost and improve heat resistance, without influence transparency.Rubber is contrasted to increase
Tough epoxy-resin systems, the present invention can avoid rubber from influenceing xanthochromia performance；Contrast cured with isocyanates polyester system, the present invention
Polyurethane-base can be avoided to influence xanthochromia performance and can be epoxy resin toughened.The present invention is by epoxy systems and flexible polyester body
Tying is combined, and gives full play to their own advantage, is solved the problems, such as their consistency problem and color inhibition, is invented height
The flexible and transparent adhesive of the transparency, high-fire resistance and high cohesive force.
【Embodiment】
A kind of transparent epoxy adhesive of the present invention includes following parts by weight necessity component：
A. cycloaliphatic epoxy resin, B. curing agent, C. toughener, D. fillers.
Composition includes above-mentioned A~D necessity component, can also contain some inessential components, such as curing accelerator, antioxygen
The compositions such as agent, they are stirred the adhesive in organic solvent, being made that solid content is 30~60%, organic solvent together
It can be butanone, acetone, isopropanol, ethanol, preferentially can be used alone, can also mix from butanone, acetone, these solvents
Use.
Wherein, toughener selects the high-molecular-weight poly ester fiber containing carboxyl, and the molecular weight 10000 of polyester fiber~
50000。
The application of transparent epoxy adhesive of the present invention, main application are clear flexible copper-clad plate, transparent mulch film and transparent
Pure glued membrane.Transparent epoxy adhesive of the present invention is as gluing oxidant layer using wherein.
With reference to specific embodiment, the invention will be further described, and table 1 is each of embodiment 1-4 and comparative example 1-4
Ingredients weight parts dosage.
Table 1：
Embodiment 1-4 and comparative example 1-2 preparation method are as follows：
Each component is added according to the ratio in table 1, adds quantitative butanone stirring, 40% transparent adhesive is made.It is (real
That applies a 1-4 is easy to description preparation method for transparent epoxy adhesive, hereafter referred to collectively as transparent adhesive.)
By embodiment 1-4 and comparative example 1-2, application prepares clear flexible copper-clad plate, transparent mulch film and transparent pure glue respectively
Film.
The preparation method of clear flexible copper-clad plate is as follows：
Transparent adhesive is coated on transparent polyimide film using coating machine, is 12 μm after coating thickness drying, so
Make to be cured to semi-cured state in 150 DEG C of oven drying 5min afterwards, then with 100 DEG C of temperature and pressure 0.3MaP on stitching wheel
It is lower to press the one side for scribbling transparent adhesive and copper foil mat surface.Gained composite is solidified：180 DEG C solidify 2 hours,
Clear flexible copper-clad plate Application Example 11,21,31,41 is obtained, contrasts application examples 11 and 21.
The preparation method of transparent mulch film is as follows：
Obtained transparent adhesive is coated on Kapton using coating machine, is 15 μm after coating thickness drying,
Then transparent adhesive is cured to semi-cured state in 150 DEG C of oven drying 5min, temperature 70 C is then used on stitching wheel
The one side for scribbling transparent adhesive and release liners are pressed with pressure 0.1MaP, obtained transparent mulch film Application Example 12,
22nd, 32,42 and contrast application examples 12 and 22.
The preparation method of transparent pure glued membrane is as follows：
Above-mentioned transparent adhesive is coated on mould release membrance using coating machine, is 12 μm after coating thickness drying, then 150
DEG C oven drying 5min makes transparent adhesive be cured to semi-cured state, and temperature 70 C and pressure are then used on stitching wheel
Under 0.1MaP will scribble transparent adhesive one side and release liners pressing, be made transparent pure glued membrane Application Example 13,23,33,
43 and contrast application examples 13 and 23.
Application is prepared for clear flexible copper-clad plate, transparent mulch film and transparent pure glue to embodiment 1-4 and comparative example 1-2 respectively
Film, and its feature is detected, as a result as shown in table 2.
Table 2：
As can be seen from Table 2, the transparent epoxy adhesive of the embodiment of the present invention 1~4 all has the high grade of transparency, and light transmittance can
To reach more than 85%, weather resistance is good, and cost is relatively low.And with the adhesive make flexibility coat copper plate, cover layer and
Pure glued membrane has the high grade of transparency, high-fire resistance and high cohesive force.
Claims (8)
1. a kind of transparent epoxy adhesive, it is characterised in that including following parts by weight of component：
2. a kind of transparent epoxy adhesive according to claim 1, it is characterised in that described toughener, which is selected, contains carboxylic
The high-molecular-weight poly ester fiber of base, the molecular weight of polyester fiber is 10000~50000.
3. a kind of transparent epoxy adhesive according to claim 1, it is characterised in that described printing opacity powder is a kind of silicic acid
Saline minerals matter, Main Ingredients and Appearance are silica, and the index of refraction of index of refraction and epoxy resin approaches.The transparent of resin is not interfered with
Property.
A kind of 4. application of transparent epoxy adhesive any one of claim 1-3.
5. the application of a kind of transparent epoxy adhesive according to claim 4, it is characterised in that gluing using transparent epoxy
The clear flexible copper-clad plate of agent, transparent mulch film and transparent pure glued membrane.
6. the application of a kind of transparent epoxy adhesive according to claim 5, it is characterised in that described clear flexible is covered
Copper coin includes transparent polyimide film or transparent polyester film, the gluing oxidant layer of transparent epoxy and copper foil.
A kind of 7. application of transparent epoxy adhesive according to claim 5, it is characterised in that described transparent mulch film
With dielectric film, the gluing oxidant layer of transparent epoxy and and release liners.
A kind of 8. application of transparent epoxy adhesive according to claim 5, it is characterised in that described transparent pure glued membrane
With mould release membrance, the gluing oxidant layer of transparent epoxy and release liners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590433.0A CN107400491A (en) | 2017-07-19 | 2017-07-19 | A kind of transparent epoxy adhesive and its application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710590433.0A CN107400491A (en) | 2017-07-19 | 2017-07-19 | A kind of transparent epoxy adhesive and its application |
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| Publication Number | Publication Date |
|---|---|
| CN107400491A true CN107400491A (en) | 2017-11-28 |
Family
ID=60402240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710590433.0A Pending CN107400491A (en) | 2017-07-19 | 2017-07-19 | A kind of transparent epoxy adhesive and its application |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112898926A (en) * | 2021-01-21 | 2021-06-04 | 西安航天三沃化学有限公司 | Epoxy resin glue solution and preparation method and application thereof |
| CN114231229A (en) * | 2021-12-14 | 2022-03-25 | 南亚新材料科技(江西)有限公司 | Halogen-free high-Tg yellowing-resistant copper-clad plate adhesive applicable to LED packaging field and preparation method and application thereof |
Citations (1)
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| CN1962798A (en) * | 2005-11-08 | 2007-05-16 | 住友金属矿山株式会社 | Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
-
2017
- 2017-07-19 CN CN201710590433.0A patent/CN107400491A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962798A (en) * | 2005-11-08 | 2007-05-16 | 住友金属矿山株式会社 | Epoxy resin adhesive composition and optical semiconductor adhesive adopting same |
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|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112898926A (en) * | 2021-01-21 | 2021-06-04 | 西安航天三沃化学有限公司 | Epoxy resin glue solution and preparation method and application thereof |
| CN114231229A (en) * | 2021-12-14 | 2022-03-25 | 南亚新材料科技(江西)有限公司 | Halogen-free high-Tg yellowing-resistant copper-clad plate adhesive applicable to LED packaging field and preparation method and application thereof |
| CN114231229B (en) * | 2021-12-14 | 2023-08-04 | 南亚新材料科技(江西)有限公司 | Halogen-free high-Tg yellowing-resistant adhesive for copper-clad plate in field of LED packaging, and preparation method and application thereof |
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Address after: 528400 No. 22 Changsheng Road, South District, Zhongshan, Guangdong Applicant after: Guangdong Dongyi new Mstar Technology Ltd Address before: 528400 No. 22 Changsheng Road, South District, Zhongshan, Guangdong Applicant before: Zhongshan Dongyi High-tech Material Co., Ltd. |
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