TW200730598A - Epoxy resin adhesion composition and adhesive for optical semiconductor - Google Patents
Epoxy resin adhesion composition and adhesive for optical semiconductorInfo
- Publication number
- TW200730598A TW200730598A TW095140647A TW95140647A TW200730598A TW 200730598 A TW200730598 A TW 200730598A TW 095140647 A TW095140647 A TW 095140647A TW 95140647 A TW95140647 A TW 95140647A TW 200730598 A TW200730598 A TW 200730598A
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- optical semiconductor
- epoxy resin
- resin adhesion
- adhesion composition
- Prior art date
Links
Abstract
The present invention relates to an epoxy resin adhesion composition and an optical semiconductor using the said composition. The said composition can inhibit the absorption of short wave length, and is excellent in ultraviolet-resistance, weatherabiluty, transmittance and stability of storage, which can be used to assemble the semiconductor device disposing optical semiconductor chip and to adhere a variety of parts, and has excellent coating ability and transmittance of wave emitted from the said optical semiconductor. The present invention provides an epoxy resin adhesion composition, which comprises alicyclic epoxy compound (A), silane compound (B) containing hydrolysis group directly binding to silicon atom, 2-valent organic tin compound (c1), 4-valent organic tin compound (c2) and transmitting inorganic filler (D) as necessary ingredients, which is characterized by, the each content of ingredients is that (A) is 30~95wt%, (B) is 0.1~15wt%, (c1) is 0.01~5wt%, (c2) is 0.01~5wt%, (D) is 0.1~50wt%, based onthe total content of the composition.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005323742A JP4802667B2 (en) | 2005-11-08 | 2005-11-08 | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200730598A true TW200730598A (en) | 2007-08-16 |
| TWI366592B TWI366592B (en) | 2012-06-21 |
Family
ID=38082032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095140647A TWI366592B (en) | 2005-11-08 | 2006-11-03 | Epoxy resin adhesion composition and adhesive for optical semiconductor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4802667B2 (en) |
| CN (1) | CN1962798B (en) |
| TW (1) | TWI366592B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI447939B (en) * | 2007-06-15 | 2014-08-01 | Namics Corp | Conductive die attach adhesive for LED |
| JP5748937B2 (en) * | 2008-04-01 | 2015-07-15 | 日立化成株式会社 | Film sealing adhesive for semiconductor sealing and manufacturing method of semiconductor device |
| JP5599561B2 (en) * | 2008-07-22 | 2014-10-01 | 日立化成株式会社 | Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
| JP5550230B2 (en) * | 2008-07-22 | 2014-07-16 | 日立化成株式会社 | Thermosetting resin composition, optical semiconductor element mounting substrate using the same, method for producing the same, and optical semiconductor device |
| US8692394B2 (en) * | 2009-09-30 | 2014-04-08 | Sekisui Chemical Co., Ltd. | Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
| JP5544843B2 (en) * | 2009-11-27 | 2014-07-09 | 住友金属鉱山株式会社 | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
| JP5555038B2 (en) * | 2010-04-13 | 2014-07-23 | デクセリアルズ株式会社 | Light-reflective anisotropic conductive adhesive and light-emitting device |
| JP2014162885A (en) * | 2013-02-27 | 2014-09-08 | Sumitomo Metal Mining Co Ltd | Semiconductor element adhesion silicone resin composition and silicon-containing cured product using the same |
| CN107075258B (en) * | 2014-10-01 | 2020-03-06 | 纳美仕有限公司 | Resin composition |
| JP6322336B2 (en) | 2016-03-10 | 2018-05-09 | 積水化学工業株式会社 | Adhesive for semiconductor mounting and semiconductor sensor |
| CN107400491A (en) * | 2017-07-19 | 2017-11-28 | 中山市东溢新材料有限公司 | A kind of transparent epoxy adhesive and its application |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5763351A (en) * | 1980-10-03 | 1982-04-16 | Kanegafuchi Chem Ind Co Ltd | Composition having improved pot life |
| JP2796187B2 (en) * | 1990-10-01 | 1998-09-10 | 日東電工株式会社 | Optical semiconductor device |
| JPH083452A (en) * | 1994-06-17 | 1996-01-09 | Kansai Paint Co Ltd | Thermosetting composition and method for curing it |
| JP3550198B2 (en) * | 1994-11-17 | 2004-08-04 | 積水化学工業株式会社 | One-part room temperature curable adhesive composition |
| WO2004031299A1 (en) * | 2002-10-02 | 2004-04-15 | Kaneka Corporation | One-part curable composition |
| JP4079006B2 (en) * | 2003-02-25 | 2008-04-23 | 住友金属鉱山株式会社 | Epoxy resin composition and adhesive for optical semiconductor using the same |
| JP2005093724A (en) * | 2003-09-17 | 2005-04-07 | Tokuyama Corp | Primer composition for sealing light emitting diode |
-
2005
- 2005-11-08 JP JP2005323742A patent/JP4802667B2/en active Active
-
2006
- 2006-10-30 CN CN 200610150389 patent/CN1962798B/en active Active
- 2006-11-03 TW TW095140647A patent/TWI366592B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1962798B (en) | 2012-07-18 |
| JP4802667B2 (en) | 2011-10-26 |
| CN1962798A (en) | 2007-05-16 |
| JP2007131678A (en) | 2007-05-31 |
| TWI366592B (en) | 2012-06-21 |
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